DE60037684D1 - Element zum Einkoppeln von elektrischer Energie in eine Bearbeitungskammer und Bearbeitungssystem mit einem solchen Element - Google Patents
Element zum Einkoppeln von elektrischer Energie in eine Bearbeitungskammer und Bearbeitungssystem mit einem solchen ElementInfo
- Publication number
- DE60037684D1 DE60037684D1 DE60037684T DE60037684T DE60037684D1 DE 60037684 D1 DE60037684 D1 DE 60037684D1 DE 60037684 T DE60037684 T DE 60037684T DE 60037684 T DE60037684 T DE 60037684T DE 60037684 D1 DE60037684 D1 DE 60037684D1
- Authority
- DE
- Germany
- Prior art keywords
- electrical energy
- coupling electrical
- processing system
- processing chamber
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
- H01L21/205—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy using reduction or decomposition of a gaseous compound yielding a solid condensate, i.e. chemical deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
- H01J37/32211—Means for coupling power to the plasma
- H01J37/3222—Antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/277,526 US6237526B1 (en) | 1999-03-26 | 1999-03-26 | Process apparatus and method for improving plasma distribution and performance in an inductively coupled plasma |
US277526 | 1999-03-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60037684D1 true DE60037684D1 (de) | 2008-02-14 |
DE60037684T2 DE60037684T2 (de) | 2009-01-02 |
Family
ID=23061252
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60037684T Expired - Lifetime DE60037684T2 (de) | 1999-03-26 | 2000-03-23 | Element zum Einkoppeln von elektrischer Energie in eine Bearbeitungskammer und Bearbeitungssystem mit einem solchen Element |
DE60008711T Expired - Lifetime DE60008711T2 (de) | 1999-03-26 | 2000-03-23 | Apparat zur verbesserung der verteilung und leistung eines induktiven gekoppelten plasmas |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60008711T Expired - Lifetime DE60008711T2 (de) | 1999-03-26 | 2000-03-23 | Apparat zur verbesserung der verteilung und leistung eines induktiven gekoppelten plasmas |
Country Status (8)
Country | Link |
---|---|
US (1) | US6237526B1 (de) |
EP (2) | EP1401008B1 (de) |
JP (2) | JP4982010B2 (de) |
KR (1) | KR100712762B1 (de) |
CN (1) | CN1201370C (de) |
DE (2) | DE60037684T2 (de) |
TW (1) | TW483064B (de) |
WO (1) | WO2000058995A2 (de) |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW403959B (en) * | 1996-11-27 | 2000-09-01 | Hitachi Ltd | Plasma treatment device |
US6474258B2 (en) * | 1999-03-26 | 2002-11-05 | Tokyo Electron Limited | Apparatus and method for improving plasma distribution and performance in an inductively coupled plasma |
US6523493B1 (en) * | 2000-08-01 | 2003-02-25 | Tokyo Electron Limited | Ring-shaped high-density plasma source and method |
US7801775B1 (en) * | 1999-03-29 | 2010-09-21 | Amazon.Com, Inc. | Method and system for authenticating users when conducting commercial transactions using a computer |
US6451161B1 (en) * | 2000-04-10 | 2002-09-17 | Nano-Architect Research Corporation | Method and apparatus for generating high-density uniform plasma |
US6502530B1 (en) * | 2000-04-26 | 2003-01-07 | Unaxis Balzers Aktiengesellschaft | Design of gas injection for the electrode in a capacitively coupled RF plasma reactor |
JP4504511B2 (ja) * | 2000-05-26 | 2010-07-14 | 忠弘 大見 | プラズマ処理装置 |
US6446572B1 (en) * | 2000-08-18 | 2002-09-10 | Tokyo Electron Limited | Embedded plasma source for plasma density improvement |
US6494998B1 (en) * | 2000-08-30 | 2002-12-17 | Tokyo Electron Limited | Process apparatus and method for improving plasma distribution and performance in an inductively coupled plasma using an internal inductive element |
CN100505975C (zh) * | 2002-05-08 | 2009-06-24 | Btu国际公司 | 等离子体辅助涂覆 |
US6842147B2 (en) * | 2002-07-22 | 2005-01-11 | Lam Research Corporation | Method and apparatus for producing uniform processing rates |
AU2002313941A1 (en) * | 2002-07-26 | 2004-02-16 | Plasmart Co. Ltd. | Inductively coupled plasma generator having lower aspect ratio |
KR100486724B1 (ko) * | 2002-10-15 | 2005-05-03 | 삼성전자주식회사 | 사행 코일 안테나를 구비한 유도결합 플라즈마 발생장치 |
US7273533B2 (en) * | 2003-11-19 | 2007-09-25 | Tokyo Electron Limited | Plasma processing system with locally-efficient inductive plasma coupling |
US7464662B2 (en) * | 2004-01-28 | 2008-12-16 | Tokyo Electron Limited | Compact, distributed inductive element for large scale inductively-coupled plasma sources |
KR100909750B1 (ko) | 2005-03-01 | 2009-07-29 | 가부시키가이샤 히다치 고쿠사이 덴키 | 기판 처리 장치 및 반도체 디바이스의 제조 방법 |
US20070029193A1 (en) * | 2005-08-03 | 2007-02-08 | Tokyo Electron Limited | Segmented biased peripheral electrode in plasma processing method and apparatus |
US20070068795A1 (en) * | 2005-09-26 | 2007-03-29 | Jozef Brcka | Hollow body plasma uniformity adjustment device and method |
US20080023146A1 (en) * | 2006-07-26 | 2008-01-31 | Advanced Energy Industries, Inc. | Inductively coupled plasma system with internal coil |
CN101345114B (zh) * | 2007-07-11 | 2011-09-14 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 电感耦合线圈及应用该线圈的电感耦合等离子体装置 |
US8933595B2 (en) | 2007-10-24 | 2015-01-13 | Nassim Haramein | Plasma flow interaction simulator |
US8073094B2 (en) * | 2007-10-24 | 2011-12-06 | Nassim Haramein | Device and method for simulation of magnetohydrodynamics |
US8994270B2 (en) | 2008-05-30 | 2015-03-31 | Colorado State University Research Foundation | System and methods for plasma application |
US8575843B2 (en) | 2008-05-30 | 2013-11-05 | Colorado State University Research Foundation | System, method and apparatus for generating plasma |
EP2297377B1 (de) | 2008-05-30 | 2017-12-27 | Colorado State University Research Foundation | Auf plasma basierende chemikalienquellenvorrichtung und verfahren zu ihrer verwendung |
WO2011123124A1 (en) | 2010-03-31 | 2011-10-06 | Colorado State University Research Foundation | Liquid-gas interface plasma device |
JP2010212321A (ja) * | 2009-03-09 | 2010-09-24 | Hitachi Kokusai Electric Inc | 半導体製造装置 |
KR100938782B1 (ko) * | 2009-07-06 | 2010-01-27 | 주식회사 테스 | 플라즈마 발생용 전극 및 플라즈마 발생장치 |
US8222822B2 (en) * | 2009-10-27 | 2012-07-17 | Tyco Healthcare Group Lp | Inductively-coupled plasma device |
EP2552340A4 (de) | 2010-03-31 | 2015-10-14 | Univ Colorado State Res Found | Plasmavorrichtung mit flüssig-gas-schnittstelle |
JP2013134835A (ja) * | 2011-12-26 | 2013-07-08 | Nissin Electric Co Ltd | プラズマ処理装置 |
WO2013099372A1 (ja) * | 2011-12-27 | 2013-07-04 | キヤノンアネルバ株式会社 | 放電容器及びプラズマ処理装置 |
JP6010305B2 (ja) * | 2012-02-07 | 2016-10-19 | 東京エレクトロン株式会社 | 誘導結合プラズマ用アンテナユニット、誘導結合プラズマ処理装置および誘導結合プラズマ処理方法 |
US20140097752A1 (en) * | 2012-10-09 | 2014-04-10 | Varian Semiconductor Equipment Associates, Inc. | Inductively Coupled Plasma ION Source Chamber with Dopant Material Shield |
US9532826B2 (en) | 2013-03-06 | 2017-01-03 | Covidien Lp | System and method for sinus surgery |
US9555145B2 (en) | 2013-03-13 | 2017-01-31 | Covidien Lp | System and method for biofilm remediation |
EP3128819A1 (de) * | 2014-03-31 | 2017-02-08 | SPP Technologies Co., Ltd. | Plasmabehandlungsvorrichtung und spule dafür |
DE102015003379A1 (de) * | 2015-03-17 | 2016-09-22 | Manz Ag | Plasmaerzeugungsvorrichtung mit einer Induktionsspule |
JP5977853B1 (ja) * | 2015-03-20 | 2016-08-24 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法、プログラム及び記録媒体 |
JP6053881B2 (ja) * | 2015-07-15 | 2016-12-27 | 東京エレクトロン株式会社 | プラズマ処理装置 |
TWI614780B (zh) * | 2015-12-21 | 2018-02-11 | 財團法人工業技術研究院 | 線圈組及無線傳能系統 |
KR101866210B1 (ko) * | 2016-11-04 | 2018-06-11 | 인베니아 주식회사 | 플라즈마 발생용 안테나 구조체 |
KR101866212B1 (ko) * | 2016-11-16 | 2018-06-12 | 인베니아 주식회사 | 플라즈마 처리 장치 |
US10510515B2 (en) * | 2017-06-22 | 2019-12-17 | Applied Materials, Inc. | Processing tool with electrically switched electrode assembly |
US20240087859A1 (en) * | 2022-09-08 | 2024-03-14 | Applied Materials, Inc. | Methods and apparatus for toroidal plasma generation |
Family Cites Families (67)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4431901A (en) | 1982-07-02 | 1984-02-14 | The United States Of America As Represented By The United States Department Of Energy | Induction plasma tube |
JPH0630463B2 (ja) | 1985-05-15 | 1994-04-20 | 八重洲無線株式会社 | 無線通信機 |
GB8629634D0 (en) | 1986-12-11 | 1987-01-21 | Dobson C D | Reactive ion & sputter etching |
KR920003789B1 (ko) * | 1988-02-08 | 1992-05-14 | 니뽄 덴신 덴와 가부시끼가이샤 | 플라즈마 스퍼터링을 이용한 박막 형성 장치 및 이온원 |
DE3905073A1 (de) | 1989-02-18 | 1990-08-23 | Schuler Gmbh L | Umsetzeinrichtung in einer transferpresse o. dgl. umformmaschine |
US5122251A (en) | 1989-06-13 | 1992-06-16 | Plasma & Materials Technologies, Inc. | High density plasma deposition and etching apparatus |
US5421891A (en) * | 1989-06-13 | 1995-06-06 | Plasma & Materials Technologies, Inc. | High density plasma deposition and etching apparatus |
US4948458A (en) | 1989-08-14 | 1990-08-14 | Lam Research Corporation | Method and apparatus for producing magnetically-coupled planar plasma |
US5304279A (en) | 1990-08-10 | 1994-04-19 | International Business Machines Corporation | Radio frequency induction/multipole plasma processing tool |
US5178739A (en) | 1990-10-31 | 1993-01-12 | International Business Machines Corporation | Apparatus for depositing material into high aspect ratio holes |
US5234529A (en) | 1991-10-10 | 1993-08-10 | Johnson Wayne L | Plasma generating apparatus employing capacitive shielding and process for using such apparatus |
US5280154A (en) | 1992-01-30 | 1994-01-18 | International Business Machines Corporation | Radio frequency induction plasma processing system utilizing a uniform field coil |
US5231334A (en) | 1992-04-15 | 1993-07-27 | Texas Instruments Incorporated | Plasma source and method of manufacturing |
US5226967A (en) | 1992-05-14 | 1993-07-13 | Lam Research Corporation | Plasma apparatus including dielectric window for inducing a uniform electric field in a plasma chamber |
US5277751A (en) * | 1992-06-18 | 1994-01-11 | Ogle John S | Method and apparatus for producing low pressure planar plasma using a coil with its axis parallel to the surface of a coupling window |
WO1994006263A1 (en) | 1992-09-01 | 1994-03-17 | The University Of North Carolina At Chapel Hill | High pressure magnetically assisted inductively coupled plasma |
DE4235064A1 (de) | 1992-10-17 | 1994-04-21 | Leybold Ag | Vorrichtung zum Erzeugen eines Plasmas mittels Kathodenzerstäubung |
US5587226A (en) | 1993-01-28 | 1996-12-24 | Regents, University Of California | Porcelain-coated antenna for radio-frequency driven plasma source |
US5309063A (en) | 1993-03-04 | 1994-05-03 | David Sarnoff Research Center, Inc. | Inductive coil for inductively coupled plasma production apparatus |
US5401350A (en) | 1993-03-08 | 1995-03-28 | Lsi Logic Corporation | Coil configurations for improved uniformity in inductively coupled plasma systems |
US5824158A (en) * | 1993-06-30 | 1998-10-20 | Kabushiki Kaisha Kobe Seiko Sho | Chemical vapor deposition using inductively coupled plasma and system therefor |
US5430355A (en) | 1993-07-30 | 1995-07-04 | Texas Instruments Incorporated | RF induction plasma source for plasma processing |
JP3290777B2 (ja) | 1993-09-10 | 2002-06-10 | 株式会社東芝 | 誘導結合型高周波放電方法および誘導結合型高周波放電装置 |
TW273067B (de) | 1993-10-04 | 1996-03-21 | Tokyo Electron Co Ltd | |
GB9321489D0 (en) | 1993-10-19 | 1993-12-08 | Central Research Lab Ltd | Plasma processing |
US5619103A (en) | 1993-11-02 | 1997-04-08 | Wisconsin Alumni Research Foundation | Inductively coupled plasma generating devices |
US5783492A (en) | 1994-03-04 | 1998-07-21 | Tokyo Electron Limited | Plasma processing method, plasma processing apparatus, and plasma generating apparatus |
JPH07245194A (ja) * | 1994-03-07 | 1995-09-19 | Matsushita Electric Ind Co Ltd | プラズマ処理方法及び装置 |
JP3328756B2 (ja) * | 1994-03-25 | 2002-09-30 | ▲靖▼浩 堀池 | プラズマ処理装置 |
JP2641390B2 (ja) | 1994-05-12 | 1997-08-13 | 日本電気株式会社 | プラズマ処理装置 |
EP0685873B1 (de) | 1994-06-02 | 1998-12-16 | Applied Materials, Inc. | Induktiv gekoppelter Plasmareaktor mit einer Elektrode zur Erleichterung der Plasmazündung |
US5587038A (en) | 1994-06-16 | 1996-12-24 | Princeton University | Apparatus and process for producing high density axially extending plasmas |
US5580385A (en) | 1994-06-30 | 1996-12-03 | Texas Instruments, Incorporated | Structure and method for incorporating an inductively coupled plasma source in a plasma processing chamber |
JP3105403B2 (ja) | 1994-09-14 | 2000-10-30 | 松下電器産業株式会社 | プラズマ処理装置 |
US5753044A (en) | 1995-02-15 | 1998-05-19 | Applied Materials, Inc. | RF plasma reactor with hybrid conductor and multi-radius dome ceiling |
GB9418658D0 (en) * | 1994-09-16 | 1994-11-02 | Central Research Lab Ltd | An apparatus for generating a glow discharge |
US5919382A (en) | 1994-10-31 | 1999-07-06 | Applied Materials, Inc. | Automatic frequency tuning of an RF power source of an inductively coupled plasma reactor |
US5589737A (en) | 1994-12-06 | 1996-12-31 | Lam Research Corporation | Plasma processor for large workpieces |
US5688357A (en) | 1995-02-15 | 1997-11-18 | Applied Materials, Inc. | Automatic frequency tuning of an RF power source of an inductively coupled plasma reactor |
US5688358A (en) | 1995-03-08 | 1997-11-18 | Applied Materials, Inc. | R.F. plasma reactor with larger-than-wafer pedestal conductor |
US5556521A (en) | 1995-03-24 | 1996-09-17 | Sony Corporation | Sputter etching apparatus with plasma source having a dielectric pocket and contoured plasma source |
US5710486A (en) | 1995-05-08 | 1998-01-20 | Applied Materials, Inc. | Inductively and multi-capacitively coupled plasma reactor |
US5888413A (en) | 1995-06-06 | 1999-03-30 | Matsushita Electric Industrial Co., Ltd. | Plasma processing method and apparatus |
US5650032A (en) | 1995-06-06 | 1997-07-22 | International Business Machines Corporation | Apparatus for producing an inductive plasma for plasma processes |
US5874704A (en) | 1995-06-30 | 1999-02-23 | Lam Research Corporation | Low inductance large area coil for an inductively coupled plasma source |
EP0756309A1 (de) | 1995-07-26 | 1997-01-29 | Applied Materials, Inc. | Plasmavorrichtungen zur Bearbeitung von Substraten |
US5907221A (en) | 1995-08-16 | 1999-05-25 | Applied Materials, Inc. | Inductively coupled plasma reactor with an inductive coil antenna having independent loops |
US5716451A (en) | 1995-08-17 | 1998-02-10 | Tokyo Electron Limited | Plasma processing apparatus |
JPH0982495A (ja) | 1995-09-18 | 1997-03-28 | Toshiba Corp | プラズマ生成装置およびプラズマ生成方法 |
JPH09106899A (ja) | 1995-10-11 | 1997-04-22 | Anelva Corp | プラズマcvd装置及び方法並びにドライエッチング装置及び方法 |
US5785878A (en) | 1995-11-02 | 1998-07-28 | Applied Materials, Inc. | RF antenna having high temperature, oxidation resistant coating |
US5763851A (en) | 1995-11-27 | 1998-06-09 | Applied Materials, Inc. | Slotted RF coil shield for plasma deposition system |
US6054013A (en) * | 1996-02-02 | 2000-04-25 | Applied Materials, Inc. | Parallel plate electrode plasma reactor having an inductive antenna and adjustable radial distribution of plasma ion density |
US5669975A (en) | 1996-03-27 | 1997-09-23 | Sony Corporation | Plasma producing method and apparatus including an inductively-coupled plasma source |
US5759280A (en) | 1996-06-10 | 1998-06-02 | Lam Research Corporation | Inductively coupled source for deriving substantially uniform plasma flux |
US5800619A (en) | 1996-06-10 | 1998-09-01 | Lam Research Corporation | Vacuum plasma processor having coil with minimum magnetic field in its center |
CA2207154A1 (en) | 1996-06-10 | 1997-12-10 | Lam Research Corporation | Inductively coupled source for deriving substantially uniform plasma flux |
US5897712A (en) | 1996-07-16 | 1999-04-27 | Applied Materials, Inc. | Plasma uniformity control for an inductive plasma source |
US6254737B1 (en) | 1996-10-08 | 2001-07-03 | Applied Materials, Inc. | Active shield for generating a plasma for sputtering |
US5846154A (en) | 1996-10-15 | 1998-12-08 | Handycare | Single speed gear assembly for a wheelchair |
US5824602A (en) * | 1996-10-21 | 1998-10-20 | The United States Of America As Represented By The United States Department Of Energy | Helicon wave excitation to produce energetic electrons for manufacturing semiconductors |
FR2755294A1 (fr) * | 1996-10-25 | 1998-05-01 | Pixtech Sa | Procede et dispositif d'assemblage d'un ecran plat de visualisation |
EP0840350A2 (de) | 1996-11-04 | 1998-05-06 | Applied Materials, Inc. | Plasmagerät und Verfahren mit Ausfilterung von, in der Plasmahülle erzeugten harmonische Schwingungen |
US5824607A (en) | 1997-02-06 | 1998-10-20 | Applied Materials, Inc. | Plasma confinement for an inductively coupled plasma reactor |
US5800688A (en) | 1997-04-21 | 1998-09-01 | Tokyo Electron Limited | Apparatus for ionized sputtering |
US5976334A (en) * | 1997-11-25 | 1999-11-02 | Applied Materials, Inc. | Reliable sustained self-sputtering |
GB2344930B (en) | 1998-12-17 | 2003-10-01 | Trikon Holdings Ltd | Inductive coil assembly |
-
1999
- 1999-03-26 US US09/277,526 patent/US6237526B1/en not_active Expired - Lifetime
-
2000
- 2000-03-23 DE DE60037684T patent/DE60037684T2/de not_active Expired - Lifetime
- 2000-03-23 DE DE60008711T patent/DE60008711T2/de not_active Expired - Lifetime
- 2000-03-23 KR KR1020017012294A patent/KR100712762B1/ko not_active IP Right Cessation
- 2000-03-23 JP JP2000608406A patent/JP4982010B2/ja not_active Expired - Fee Related
- 2000-03-23 EP EP03078472A patent/EP1401008B1/de not_active Expired - Lifetime
- 2000-03-23 CN CNB008080909A patent/CN1201370C/zh not_active Expired - Fee Related
- 2000-03-23 EP EP00918371A patent/EP1166324B1/de not_active Expired - Lifetime
- 2000-03-23 WO PCT/US2000/007902 patent/WO2000058995A2/en active IP Right Grant
- 2000-03-24 TW TW089105493A patent/TW483064B/zh not_active IP Right Cessation
-
2010
- 2010-08-02 JP JP2010173727A patent/JP2011018650A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2002540617A (ja) | 2002-11-26 |
DE60008711T2 (de) | 2005-03-17 |
KR20010110702A (ko) | 2001-12-13 |
WO2000058995B1 (en) | 2001-03-01 |
KR100712762B1 (ko) | 2007-05-02 |
EP1401008B1 (de) | 2008-01-02 |
CN1353859A (zh) | 2002-06-12 |
WO2000058995A2 (en) | 2000-10-05 |
WO2000058995A3 (en) | 2001-01-25 |
EP1166324B1 (de) | 2004-03-03 |
US6237526B1 (en) | 2001-05-29 |
DE60008711D1 (de) | 2004-04-08 |
EP1401008A1 (de) | 2004-03-24 |
JP2011018650A (ja) | 2011-01-27 |
DE60037684T2 (de) | 2009-01-02 |
EP1166324A2 (de) | 2002-01-02 |
TW483064B (en) | 2002-04-11 |
CN1201370C (zh) | 2005-05-11 |
JP4982010B2 (ja) | 2012-07-25 |
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