DE60038230D1 - Verfahren zur herstellung einer kontaktlosen chipk - Google Patents

Verfahren zur herstellung einer kontaktlosen chipk

Info

Publication number
DE60038230D1
DE60038230D1 DE60038230T DE60038230T DE60038230D1 DE 60038230 D1 DE60038230 D1 DE 60038230D1 DE 60038230 T DE60038230 T DE 60038230T DE 60038230 T DE60038230 T DE 60038230T DE 60038230 D1 DE60038230 D1 DE 60038230D1
Authority
DE
Germany
Prior art keywords
antenna
card
onto
support
contactless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60038230T
Other languages
English (en)
Other versions
DE60038230T2 (de
Inventor
Georges Kayanakis
Christophe Mathieu
Sebastien Delenne
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASK SA
Original Assignee
ASK SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASK SA filed Critical ASK SA
Publication of DE60038230D1 publication Critical patent/DE60038230D1/de
Application granted granted Critical
Publication of DE60038230T2 publication Critical patent/DE60038230T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
DE60038230T 1999-11-29 2000-11-28 Verfahren zur herstellung einer kontaktlosen chipkarte mit einem antennenträger aus fasermaterial Expired - Lifetime DE60038230T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9915019 1999-11-29
FR9915019A FR2801708B1 (fr) 1999-11-29 1999-11-29 Procede de fabrication d'une carte a puce sans contact avec un support d'antenne en materiau fibreux
PCT/FR2000/003321 WO2001041060A1 (fr) 1999-11-29 2000-11-28 Procede de fabrication d'une carte a puce sans contact avec un support d'antenne en materiau fibreux

Publications (2)

Publication Number Publication Date
DE60038230D1 true DE60038230D1 (de) 2008-04-17
DE60038230T2 DE60038230T2 (de) 2008-11-13

Family

ID=9552672

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60038230T Expired - Lifetime DE60038230T2 (de) 1999-11-29 2000-11-28 Verfahren zur herstellung einer kontaktlosen chipkarte mit einem antennenträger aus fasermaterial

Country Status (22)

Country Link
US (1) US6536674B2 (de)
EP (1) EP1183643B1 (de)
JP (1) JP4731779B2 (de)
KR (1) KR100817961B1 (de)
CN (1) CN1211759C (de)
AT (1) ATE388453T1 (de)
AU (1) AU776169B2 (de)
BR (1) BR0007790A (de)
CA (1) CA2360351C (de)
DE (1) DE60038230T2 (de)
FR (1) FR2801708B1 (de)
HK (1) HK1044398B (de)
ID (1) ID29989A (de)
IL (1) IL144301A (de)
MX (1) MXPA01007466A (de)
NO (1) NO20013405L (de)
PT (1) PT1183643E (de)
RU (1) RU2251744C2 (de)
TR (1) TR200102182T1 (de)
TW (1) TW513672B (de)
WO (1) WO2001041060A1 (de)
ZA (1) ZA200105716B (de)

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JP2003006594A (ja) * 2001-06-22 2003-01-10 Toppan Forms Co Ltd 両面テープを用いたｒｆ−ｉｄメディアの形成方法
FR2829857B1 (fr) * 2001-09-14 2004-09-17 A S K Carte a puce sans contact ou hybride contact-sans contact a tenue renforcee du module electronique
US7214569B2 (en) * 2002-01-23 2007-05-08 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same
US6840444B2 (en) 2002-10-18 2005-01-11 Pitney Bowes Inc. Method for field programming radio frequency identification return forms
US7176900B2 (en) * 2002-10-18 2007-02-13 Pitney Bowes Inc. Method and apparatus for field programming radio frequency identification devices
US6869020B2 (en) * 2002-10-18 2005-03-22 Pitney Bowes Inc. Method for field programmable radio frequency identification testing devices for transmitting user selected data
US20040075348A1 (en) * 2002-10-18 2004-04-22 Pitney Bowes Incorporated Method for field programmable radio frequency identification devices to perform switching functions
US7042336B2 (en) * 2002-10-18 2006-05-09 Pitney Bowes Inc. Methods for field programming radio frequency identification devices that control remote control devices
US6805291B2 (en) 2002-10-18 2004-10-19 Pitney Bowes Inc. Method for field programmable radio frequency document identification devices
US6869021B2 (en) 2002-10-18 2005-03-22 Pitney Bowes Inc. Method for field programming radio frequency identification labels
US7253735B2 (en) 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
CN1322467C (zh) * 2003-12-30 2007-06-20 上海东方磁卡工程有限公司 一种非接触式智能低频卡制造方法
EP1738303B1 (de) * 2004-03-25 2008-09-17 Bauer, Eric Verfahren zur herstellung eines elektronischen labels
US7216808B2 (en) * 2004-10-28 2007-05-15 Pitney Bowes Inc. Method for a user to answer questions or queries using electrical contacts
FR2877463B1 (fr) * 2004-11-03 2007-01-26 Gemplus Sa Dispositif a module electronique indemontable
US7615479B1 (en) * 2004-11-08 2009-11-10 Alien Technology Corporation Assembly comprising functional block deposited therein
US7385284B2 (en) * 2004-11-22 2008-06-10 Alien Technology Corporation Transponder incorporated into an electronic device
US7688206B2 (en) * 2004-11-22 2010-03-30 Alien Technology Corporation Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US20060109130A1 (en) * 2004-11-22 2006-05-25 Hattick John B Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US7347381B2 (en) * 2004-12-16 2008-03-25 Pitney Bowes Inc. Secure radio frequency identification documents
US20070031992A1 (en) * 2005-08-05 2007-02-08 Schatz Kenneth D Apparatuses and methods facilitating functional block deposition
US7193161B1 (en) * 2006-02-15 2007-03-20 Sandisk Corporation SiP module with a single sided lid
CA2678556C (en) 2007-02-23 2012-01-31 Newpage Wisconsin System Inc. Multifunctional paper identification label
HK1109708A2 (en) * 2007-04-24 2008-06-13 On Track Innovations Ltd Interface card and apparatus and process for the formation thereof
FR2917871B1 (fr) * 2007-06-21 2010-10-22 Smart Packaging Solutions Sps Insert securise notamment pour carte a puce
EP2014463B1 (de) 2007-06-22 2015-07-29 Agfa-Gevaert N.V. Intelligenter Informationsträger und dessen Herstellungsverfahren
US7744005B2 (en) * 2008-01-16 2010-06-29 Taiwan Name Plate Co., Ltd. Induction card with a printed antenna
TWI401838B (zh) * 2009-09-22 2013-07-11 Kuo Ching Chiang 薄膜天線之製造方法
DE102009058435A1 (de) * 2009-12-16 2011-06-22 Giesecke & Devrient GmbH, 81677 Befestigen und elektrisch leitendes Verbinden eines Chipmoduls mit einer Chipkarte
US8807437B2 (en) * 2011-03-04 2014-08-19 Visa International Service Association Payment card system and method
TWI478069B (zh) * 2012-04-20 2015-03-21 Smartdisplayer Technology Co Ltd A display card with a security check

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FR615285A (de) * 1927-01-04
FR2581480A1 (fr) 1985-04-10 1986-11-07 Ebauches Electroniques Sa Unite electronique notamment pour carte a microcircuits et carte comprenant une telle unite
EP0211360B1 (de) 1985-07-27 1993-09-29 Dai Nippon Insatsu Kabushiki Kaisha IC-Karte
FI94562C (fi) 1992-11-09 1995-09-25 Tapio Robertsson Rullan tunnistuslaite ja menetelmä sen valmistamiseksi
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US5495250A (en) * 1993-11-01 1996-02-27 Motorola, Inc. Battery-powered RF tags and apparatus for manufacturing the same
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FR2716281B1 (fr) 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
DE19601358C2 (de) 1995-01-20 2000-01-27 Fraunhofer Ges Forschung Papier mit integrierter Schaltung
DE19607212C1 (de) * 1996-02-26 1997-04-10 Richard Herbst Verbundkörper, Verfahren und Kunststoff-Spritzgießwerkzeug zur Herstellung eines solchen
IT240061Y1 (it) 1996-03-01 2001-03-26 Cruciani Andrea Adattatore
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US5898215A (en) * 1996-12-16 1999-04-27 Motorola, Inc. Microelectronic assembly with connection to a buried electrical element, and method for forming same
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JPH1178324A (ja) * 1997-07-18 1999-03-23 Tokyo Jiki Insatsu Kk プラスチックカードおよびその製造方法
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JPH1178317A (ja) * 1997-09-10 1999-03-23 Hitachi Chem Co Ltd Ｉｃカード
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FR2775533B1 (fr) * 1998-02-27 2003-02-14 Gemplus Sca Dispositif electronique a memoire electronique sans contact, et procede de fabrication d'un tel dispositif
FR2778475B1 (fr) 1998-05-11 2001-11-23 Schlumberger Systems & Service Carte a memoire du type sans contact, et procede de fabrication d'une telle carte
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JP2000094874A (ja) * 1998-09-22 2000-04-04 Canon Inc 電子部品内蔵カードとその製造方法
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JP2000113151A (ja) 1998-10-01 2000-04-21 Tomoegawa Paper Co Ltd ラベル状ｉｃカード
JP2000155821A (ja) 1998-11-19 2000-06-06 Dainippon Printing Co Ltd 非接触ｉｃカードおよびその製造方法

Also Published As

Publication number Publication date
CN1211759C (zh) 2005-07-20
US6536674B2 (en) 2003-03-25
US20010006194A1 (en) 2001-07-05
CN1338085A (zh) 2002-02-27
HK1044398B (zh) 2006-02-17
TW513672B (en) 2002-12-11
WO2001041060A1 (fr) 2001-06-07
HK1044398A1 (en) 2002-10-18
MXPA01007466A (es) 2003-03-12
NO20013405D0 (no) 2001-07-09
JP4731779B2 (ja) 2011-07-27
CA2360351C (fr) 2010-01-05
JP2003515848A (ja) 2003-05-07
KR20010110419A (ko) 2001-12-13
PT1183643E (pt) 2008-06-17
ATE388453T1 (de) 2008-03-15
FR2801708A1 (fr) 2001-06-01
DE60038230T2 (de) 2008-11-13
EP1183643A1 (de) 2002-03-06
NO20013405L (no) 2001-09-12
BR0007790A (pt) 2002-02-05
IL144301A (en) 2005-12-18
CA2360351A1 (fr) 2001-06-07
TR200102182T1 (tr) 2002-03-21
FR2801708B1 (fr) 2003-12-26
IL144301A0 (en) 2002-05-23
KR100817961B1 (ko) 2008-03-31
RU2251744C2 (ru) 2005-05-10
EP1183643B1 (de) 2008-03-05
ZA200105716B (en) 2002-02-21
AU776169B2 (en) 2004-09-02
AU2179301A (en) 2001-06-12
ID29989A (id) 2001-10-25

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Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication related to discontinuation of the patent is to be deleted
8364 No opposition during term of opposition