DE60040783D1 - Kühlsystem für impuls-leistungselektronik - Google Patents

Kühlsystem für impuls-leistungselektronik

Info

Publication number
DE60040783D1
DE60040783D1 DE60040783T DE60040783T DE60040783D1 DE 60040783 D1 DE60040783 D1 DE 60040783D1 DE 60040783 T DE60040783 T DE 60040783T DE 60040783 T DE60040783 T DE 60040783T DE 60040783 D1 DE60040783 D1 DE 60040783D1
Authority
DE
Germany
Prior art keywords
temperature
pcm
heat
dissipating
peak
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60040783T
Other languages
English (en)
Inventor
Abdolreza Langari
Seyed Hassan Hashemi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Skyworks Solutions Inc
Original Assignee
Skyworks Solutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Skyworks Solutions Inc filed Critical Skyworks Solutions Inc
Application granted granted Critical
Publication of DE60040783D1 publication Critical patent/DE60040783D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/902—Heat storage
DE60040783T 1999-03-11 2000-03-09 Kühlsystem für impuls-leistungselektronik Expired - Lifetime DE60040783D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/266,376 US6848500B1 (en) 1999-03-11 1999-03-11 Cooling system for pulsed power electronics
PCT/US2000/006506 WO2000054332A1 (en) 1999-03-11 2000-03-09 Cooling system for pulsed power electronics

Publications (1)

Publication Number Publication Date
DE60040783D1 true DE60040783D1 (de) 2008-12-24

Family

ID=23014321

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60040783T Expired - Lifetime DE60040783D1 (de) 1999-03-11 2000-03-09 Kühlsystem für impuls-leistungselektronik

Country Status (6)

Country Link
US (1) US6848500B1 (de)
EP (1) EP1166354B1 (de)
AT (1) ATE414327T1 (de)
AU (1) AU3741800A (de)
DE (1) DE60040783D1 (de)
WO (1) WO2000054332A1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10200318A1 (de) * 2002-01-07 2003-07-17 Merck Patent Gmbh Einsatz von paraffinhaltigen Pulvern als PCM in Polymercompositen in Kühlvorrichtungen
US7168853B2 (en) * 2003-01-10 2007-01-30 International Business Machines Corporation Digital measuring system and method for integrated circuit chip operating parameters
DE10324156A1 (de) * 2003-05-22 2004-12-16 Siemens Ag Verfahren und Anordnung zum thermischen Schutz elektronischer Einheiten in einem elektronischen Gerät
DE10347518A1 (de) * 2003-10-13 2005-05-25 Siemens Ag Elektronisches Bauelement, Schaltungsträgeraufbau und Elektronikeinheit mit Wärmespeicher
US20050280987A1 (en) * 2004-06-07 2005-12-22 Kwitek Benjamin J Phase change materials as a heat sink for computers
DE102004031889B4 (de) * 2004-06-30 2012-07-12 Infineon Technologies Ag Halbleiterbauteil mit einem Gehäuse und einem teilweise in eine Kunststoffgehäusemasse eingebetteten Halbleiterchip und Verfahren zur Herstellung desselben
AU2005270047B2 (en) * 2004-07-02 2011-06-02 Discus Dental, Llc. Dental light device having an improved heat sink
US7761181B2 (en) * 2005-11-29 2010-07-20 The Boeing Company Line replaceable systems and methods
US7433190B2 (en) * 2006-10-06 2008-10-07 Honeywell International Inc. Liquid cooled electronic chassis having a plurality of phase change material reservoirs
US20080101073A1 (en) * 2006-11-01 2008-05-01 Discus Dental, Llc Dental Light Devices Having an Improved Heat Sink
US20090109623A1 (en) * 2007-10-31 2009-04-30 Forcecon Technology Co., Ltd. Heat-radiating module with composite phase-change heat-radiating efficiency
US8631855B2 (en) * 2008-08-15 2014-01-21 Lighting Science Group Corporation System for dissipating heat energy
DE102008057963A1 (de) * 2008-11-19 2010-05-27 Lorenzen, Dirk, Dr. Strahlungsquelle mit einer Wärmeübertragungsvorrichtung und Verfahren zum Betrieb der Strahlungsquelle
US20120037337A1 (en) * 2010-08-16 2012-02-16 Zillmer Andrew J Heat transfer system, apparatus, and method therefor
KR101800437B1 (ko) * 2011-05-02 2017-11-22 삼성전자주식회사 반도체 패키지
US9265144B2 (en) 2011-11-21 2016-02-16 Panasonic Intellectual Property Management Co., Ltd. Electrical component resin, semiconductor device, and substrate
US8937384B2 (en) 2012-04-25 2015-01-20 Qualcomm Incorporated Thermal management of integrated circuits using phase change material and heat spreaders
US9226428B2 (en) * 2012-06-28 2015-12-29 Intel Corporation High heat capacity electronic components and methods for fabricating
US9210832B2 (en) * 2012-08-13 2015-12-08 Asustek Computer Inc. Thermal buffering element
US9537605B1 (en) * 2014-07-22 2017-01-03 Bae Systems Information And Electronic Systems Integration Inc. Ultra-wideband high-power solid-state transmitter for electronic warfare applications
IL258555B (en) 2018-03-29 2022-06-01 Elta Systems Ltd A heat spreader for an electric circuit
US10679923B1 (en) * 2019-01-09 2020-06-09 Toyota Motor Engineering & Manufacturing North America, Inc. Encapsulated phase change porous layer
EP3958305B1 (de) * 2020-08-17 2023-09-27 Infineon Technologies AG Leistungshalbleitermodulanordnung und verfahren zur herstellung davon
WO2023244663A1 (en) * 2022-06-14 2023-12-21 Tau Motors, Inc. Thermal management systems and methods for power devices

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3780356A (en) * 1969-02-27 1973-12-18 Laing Nikolaus Cooling device for semiconductor components
US4057101A (en) * 1976-03-10 1977-11-08 Westinghouse Electric Corporation Heat sink
US4178727A (en) * 1978-02-01 1979-12-18 Architectural Research Corporation Heat absorbing panel
US4612978A (en) * 1983-07-14 1986-09-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
US5007478A (en) * 1989-05-26 1991-04-16 University Of Miami Microencapsulated phase change material slurry heat sinks
US5245508A (en) * 1990-08-21 1993-09-14 International Business Machines Corporation Close card cooling method
US5455458A (en) 1993-08-09 1995-10-03 Hughes Aircraft Company Phase change cooling of semiconductor power modules
EP0732743A3 (de) 1995-03-17 1998-05-13 Texas Instruments Incorporated Wärmesenken
US6099894A (en) 1998-07-27 2000-08-08 Frisby Technologies, Inc. Gel-coated microcapsules

Also Published As

Publication number Publication date
EP1166354B1 (de) 2008-11-12
US6848500B1 (en) 2005-02-01
WO2000054332A1 (en) 2000-09-14
ATE414327T1 (de) 2008-11-15
AU3741800A (en) 2000-09-28
EP1166354A1 (de) 2002-01-02

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