DE60102674D1 - Vorrichtung zum auftragen einer entwicklungslösung auf eine halbleiterscheibe - Google Patents

Vorrichtung zum auftragen einer entwicklungslösung auf eine halbleiterscheibe

Info

Publication number
DE60102674D1
DE60102674D1 DE60102674T DE60102674T DE60102674D1 DE 60102674 D1 DE60102674 D1 DE 60102674D1 DE 60102674 T DE60102674 T DE 60102674T DE 60102674 T DE60102674 T DE 60102674T DE 60102674 D1 DE60102674 D1 DE 60102674D1
Authority
DE
Germany
Prior art keywords
applying
development solution
semiconductor disc
disc
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60102674T
Other languages
English (en)
Other versions
DE60102674T2 (de
Inventor
Lee Pike
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GlobalFoundries Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Application granted granted Critical
Publication of DE60102674D1 publication Critical patent/DE60102674D1/de
Publication of DE60102674T2 publication Critical patent/DE60102674T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
DE60102674T 2000-03-09 2001-02-27 Vorrichtung zum auftragen einer entwicklungslösung auf eine halbleiterscheibe Expired - Lifetime DE60102674T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/522,226 US6796517B1 (en) 2000-03-09 2000-03-09 Apparatus for the application of developing solution to a semiconductor wafer
US522226 2000-03-09
PCT/US2001/006517 WO2001066260A2 (en) 2000-03-09 2001-02-27 Apparatus for the application of developing solution to a semiconductor wafer

Publications (2)

Publication Number Publication Date
DE60102674D1 true DE60102674D1 (de) 2004-05-13
DE60102674T2 DE60102674T2 (de) 2005-03-31

Family

ID=24080003

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60102674T Expired - Lifetime DE60102674T2 (de) 2000-03-09 2001-02-27 Vorrichtung zum auftragen einer entwicklungslösung auf eine halbleiterscheibe

Country Status (4)

Country Link
US (1) US6796517B1 (de)
EP (1) EP1261434B1 (de)
DE (1) DE60102674T2 (de)
WO (1) WO2001066260A2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3898906B2 (ja) * 2001-05-22 2007-03-28 東京エレクトロン株式会社 基板の塗布装置
KR100450068B1 (ko) * 2001-11-23 2004-09-24 주성엔지니어링(주) Ｃｖｄ 장치의 멀티섹터 평판형 샤워헤드
WO2003105201A1 (ja) * 2002-06-07 2003-12-18 東京エレクトロン株式会社 基板処理装置、基板処理方法及び現像装置
KR100588410B1 (ko) 2004-09-17 2006-06-14 호서대학교 산학협력단 포토 레지스트 분사노즐 장치
US20060254625A1 (en) * 2005-05-16 2006-11-16 Innolux Display Corp. Sprayer and cleaning apparatus using the same
KR100673024B1 (ko) * 2006-01-16 2007-01-24 삼성전자주식회사 노즐 및 이를 가지는 기판 처리 장치
KR101204614B1 (ko) * 2008-02-20 2012-11-23 도쿄엘렉트론가부시키가이샤 가스 공급 장치, 성막 장치, 및 성막 방법
JP5287592B2 (ja) * 2009-08-11 2013-09-11 東京エレクトロン株式会社 成膜装置
JP5482196B2 (ja) * 2009-12-25 2014-04-23 東京エレクトロン株式会社 成膜装置、成膜方法及び記憶媒体
US10415880B2 (en) * 2017-05-19 2019-09-17 Korea Institute Of Energy Research Hybrid drying apparatus for high or medium viscosity materials
JP6994346B2 (ja) * 2017-10-11 2022-01-14 東京エレクトロン株式会社 現像処理装置、現像処理方法及び記憶媒体
US11747729B2 (en) * 2021-03-19 2023-09-05 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor developer tool and methods of operation

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US3116880A (en) * 1962-10-09 1964-01-07 Sam E Kuiken Spray head assembly
US3192989A (en) * 1962-11-26 1965-07-06 Avy L Miller Gas burner
US3695928A (en) 1970-12-07 1972-10-03 Western Electric Co Selective coating
US4056229A (en) * 1976-04-27 1977-11-01 Jones Genevieve M Car wash sprayer
JPS6053675B2 (ja) 1978-09-20 1985-11-27 富士写真フイルム株式会社 スピンコ−テイング方法
JPS57135066A (en) 1981-02-14 1982-08-20 Tatsumo Kk Rotary applying machine
JPS59112872A (ja) * 1982-12-16 1984-06-29 Matsushita Electric Ind Co Ltd 回転塗装装置
US4457259A (en) 1983-03-14 1984-07-03 Rca Corporation Apparatus for spraying a liquid on a spinning surface
JPS62286225A (ja) * 1986-06-04 1987-12-12 Nec Corp 半導体製造装置
JPS63136528A (ja) 1986-11-27 1988-06-08 Mitsubishi Electric Corp 処理液塗布装置
US5168887A (en) 1990-05-18 1992-12-08 Semitool, Inc. Single wafer processor apparatus
US5002008A (en) 1988-05-27 1991-03-26 Tokyo Electron Limited Coating apparatus and method for applying a liquid to a semiconductor wafer, including selecting a nozzle in a stand-by state
JPH03136232A (ja) 1989-08-31 1991-06-11 Dainippon Screen Mfg Co Ltd 基板の表面処理装置
US5094884A (en) 1990-04-24 1992-03-10 Machine Technology, Inc. Method and apparatus for applying a layer of a fluid material on a semiconductor wafer
US5156174A (en) 1990-05-18 1992-10-20 Semitool, Inc. Single wafer processor with a bowl
US5222310A (en) 1990-05-18 1993-06-29 Semitool, Inc. Single wafer processor with a frame
JP2843134B2 (ja) 1990-09-07 1999-01-06 東京エレクトロン株式会社 塗布装置および塗布方法
JP2892476B2 (ja) 1990-09-14 1999-05-17 東京エレクトロン株式会社 帯状液体ノズル及び液処理装置及び液処理方法
KR100230753B1 (ko) 1991-01-23 1999-11-15 도꾜 일렉트론 큐슈리미티드 액도포 시스템
US5275658A (en) 1991-12-13 1994-01-04 Tokyo Electron Limited Liquid supply apparatus
US5312039A (en) 1992-06-22 1994-05-17 Vlsi Technology, Inc. Electro-optic monitor for fluid spray pattern
US5421517A (en) * 1992-07-30 1995-06-06 United Technologies Corporation High pressure waterjet nozzle
US5429912A (en) 1993-08-02 1995-07-04 Chartered Semiconductor Manufacturing Pte Ltd. Method of dispensing fluid onto a wafer
US5571560A (en) 1994-01-12 1996-11-05 Lin; Burn J. Proximity-dispensing high-throughput low-consumption resist coating device
US5571337A (en) 1994-11-14 1996-11-05 Yieldup International Method for cleaning and drying a semiconductor wafer
TW386235B (en) 1995-05-23 2000-04-01 Tokyo Electron Ltd Method for spin rinsing
JP3257340B2 (ja) 1995-05-24 2002-02-18 松下電器産業株式会社 液体塗布方法、液体塗布装置およびスリットノズル
JP3227642B2 (ja) * 1995-10-13 2001-11-12 東京エレクトロン株式会社 塗布装置
US5922138A (en) 1996-08-12 1999-07-13 Tokyo Electron Limited Liquid treatment method and apparatus
JP3227595B2 (ja) 1996-08-20 2001-11-12 東京エレクトロン株式会社 現像処理方法及び現像処理装置
JP3254574B2 (ja) 1996-08-30 2002-02-12 東京エレクトロン株式会社 塗布膜形成方法及びその装置
JP3245812B2 (ja) 1996-08-30 2002-01-15 東京エレクトロン株式会社 液処理方法及びその装置
US5759335A (en) 1996-12-26 1998-06-02 Samsung Electronics Co., Ltd. Photoresist removing apparatus
US5954877A (en) 1997-03-24 1999-09-21 Micron Technology, Inc. Soft impact dispense nozzle
JPH10303106A (ja) 1997-04-30 1998-11-13 Toshiba Corp 現像処理装置およびその処理方法
AT407806B (de) 1997-05-23 2001-06-25 Sez Semiconduct Equip Zubehoer Anordnung zum behandeln wafer-förmiger gegenstände, insbesondere von siliziumwafern
US6287178B1 (en) * 1999-07-20 2001-09-11 International Business Machines Corporation Wafer carrier rinsing mechanism
US6830389B2 (en) * 2000-10-25 2004-12-14 Advanced Micro Devices, Inc. Parallel plate development with the application of a differential voltage

Also Published As

Publication number Publication date
WO2001066260A3 (en) 2002-03-21
DE60102674T2 (de) 2005-03-31
EP1261434B1 (de) 2004-04-07
US6796517B1 (en) 2004-09-28
EP1261434A2 (de) 2002-12-04
WO2001066260A2 (en) 2001-09-13

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Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication of lapse of patent is to be deleted
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: GLOBALFOUNDRIES INC. MAPLES CORPORATE SERVICES, KY