DE60103415D1 - Mikrofluidische vorrichtung zur wärmeübertragung - Google Patents

Mikrofluidische vorrichtung zur wärmeübertragung

Info

Publication number
DE60103415D1
DE60103415D1 DE60103415T DE60103415T DE60103415D1 DE 60103415 D1 DE60103415 D1 DE 60103415D1 DE 60103415 T DE60103415 T DE 60103415T DE 60103415 T DE60103415 T DE 60103415T DE 60103415 D1 DE60103415 D1 DE 60103415D1
Authority
DE
Germany
Prior art keywords
heat
microfluidic
heat transfer
microfluidic device
systems
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60103415T
Other languages
English (en)
Inventor
D O'connor
Eugene Dantsker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanostream Inc
Original Assignee
Nanostream Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanostream Inc filed Critical Nanostream Inc
Application granted granted Critical
Publication of DE60103415D1 publication Critical patent/DE60103415D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
    • G11B33/1406—Reducing the influence of the temperature
    • G11B33/1413—Reducing the influence of the temperature by fluid cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE60103415T 2000-09-29 2001-09-28 Mikrofluidische vorrichtung zur wärmeübertragung Expired - Lifetime DE60103415D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US23683800P 2000-09-29 2000-09-29
PCT/US2001/030659 WO2002028160A2 (en) 2000-09-29 2001-09-28 Microfluidic devices for heat transfer

Publications (1)

Publication Number Publication Date
DE60103415D1 true DE60103415D1 (de) 2004-06-24

Family

ID=22891178

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60103415T Expired - Lifetime DE60103415D1 (de) 2000-09-29 2001-09-28 Mikrofluidische vorrichtung zur wärmeübertragung

Country Status (6)

Country Link
US (1) US6501654B2 (de)
EP (1) EP1321015B1 (de)
AT (1) ATE267507T1 (de)
AU (1) AU2002211325A1 (de)
DE (1) DE60103415D1 (de)
WO (1) WO2002028160A2 (de)

Families Citing this family (93)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1266548B2 (de) * 2000-03-21 2015-07-29 Liebert Corporation Verfahren und gerät zur kühlung von elektronischen geräten
DE10017971A1 (de) * 2000-04-11 2001-10-25 Bosch Gmbh Robert Kühlvorrichtung zur Kühlung von Bauelementen der Leistungselektronik mit einem Mikrowärmeübertrager
SG105459A1 (en) * 2000-07-24 2004-08-27 Micron Technology Inc Mems heat pumps for integrated circuit heat dissipation
US6976527B2 (en) * 2001-07-17 2005-12-20 The Regents Of The University Of California MEMS microcapillary pumped loop for chip-level temperature control
US6529377B1 (en) * 2001-09-05 2003-03-04 Microelectronic & Computer Technology Corporation Integrated cooling system
US6942018B2 (en) * 2001-09-28 2005-09-13 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system
JP3896840B2 (ja) * 2001-12-13 2007-03-22 ソニー株式会社 冷却装置、電子機器装置及び冷却装置の製造方法
US7120022B2 (en) * 2002-02-12 2006-10-10 Hewlett-Packard Development Company, Lp. Loop thermosyphon with wicking structure and semiconductor die as evaporator
US6819561B2 (en) * 2002-02-22 2004-11-16 Satcon Technology Corporation Finned-tube heat exchangers and cold plates, self-cooling electronic component systems using same, and methods for cooling electronic components using same
DE10317580B4 (de) * 2002-04-18 2010-09-16 Hitachi, Ltd. Elektrische Wechselrichtervorrichtung mit einem Flüssigkeitskanal sowie Elektrofahrzeug mit einer derartigen Wechselrichtervorrichtung
US6827128B2 (en) * 2002-05-20 2004-12-07 The Board Of Trustees Of The University Of Illinois Flexible microchannel heat exchanger
FR2841077B1 (fr) * 2002-06-17 2004-11-19 Orange France Sa Systeme et procede de gestion sur un terminal de l'architecture dediee a un reseau de communication
US6977187B2 (en) 2002-06-19 2005-12-20 Foster-Miller, Inc. Chip package sealing method
JP2004037039A (ja) * 2002-07-05 2004-02-05 Sony Corp 冷却装置、電子機器装置、表示装置及び冷却装置の製造方法
KR100475098B1 (ko) * 2002-11-12 2005-03-11 한국과학기술연구원 단일 셀 조작을 위한 바이오 자동 조작 장치
US6819180B2 (en) * 2002-11-14 2004-11-16 Motorola, Inc. Radio frequency power amplifier adaptive bias control circuit
JP4034173B2 (ja) * 2002-11-28 2008-01-16 株式会社日立製作所 半導体集積回路装置及びその半導体集積回路チップ
US6785134B2 (en) * 2003-01-06 2004-08-31 Intel Corporation Embedded liquid pump and microchannel cooling system
US7126822B2 (en) * 2003-03-31 2006-10-24 Intel Corporation Electronic packages, assemblies, and systems with fluid cooling
US6801430B1 (en) * 2003-05-09 2004-10-05 Intel Corporation Actuation membrane to reduce an ambient temperature of heat generating device
US6937472B2 (en) * 2003-05-09 2005-08-30 Intel Corporation Apparatus for cooling heat generating components within a computer system enclosure
US7246940B2 (en) * 2003-06-24 2007-07-24 Halliburton Energy Services, Inc. Method and apparatus for managing the temperature of thermal components
TW591984B (en) * 2003-07-04 2004-06-11 Sentelic Corp Micro-circulating flow channel system and its manufacturing method
CN100364372C (zh) * 2003-07-22 2008-01-23 陞达科技股份有限公司 微型循环流道系统及其制造方法
US20050094706A1 (en) * 2003-10-30 2005-05-05 International Business Machines Corporation Transparent cooling duct
US6992381B2 (en) * 2003-10-31 2006-01-31 Intel Corporation Using external radiators with electroosmotic pumps for cooling integrated circuits
WO2005057097A2 (en) 2003-12-05 2005-06-23 Liebert Corporation Cooling system for high density heat load
US7273088B2 (en) * 2003-12-17 2007-09-25 Hewlett-Packard Development Company, L.P. One or more heat exchanger components in major part operably locatable outside computer chassis
US20050207116A1 (en) * 2004-03-22 2005-09-22 Yatskov Alexander I Systems and methods for inter-cooling computer cabinets
US7481337B2 (en) * 2004-04-26 2009-01-27 Georgia Tech Research Corporation Apparatus for fluid storage and delivery at a substantially constant pressure
US7142424B2 (en) * 2004-04-29 2006-11-28 Hewlett-Packard Development Company, L.P. Heat exchanger including flow straightening fins
US20060019273A1 (en) * 2004-05-12 2006-01-26 Connolly Dennis M Detection card for analyzing a sample for a target nucleic acid molecule, and uses thereof
US20060024702A1 (en) * 2004-05-12 2006-02-02 Connolly Dennis M Device, system, and method for detecting a target molecule in a sample
WO2006010822A2 (fr) * 2004-06-24 2006-02-02 TECHNOLOGIES DE L'ECHANGE THERMIQUE Société Anonyme Simplifiée Dispositifs de refroidissement perfectionnes pour applications diverses
JP4419742B2 (ja) * 2004-07-28 2010-02-24 ブラザー工業株式会社 電子部品搭載基板及びインクジェットヘッド
JP2008509550A (ja) * 2004-08-05 2008-03-27 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 電子基板用冷却システム
US20060094028A1 (en) * 2004-11-04 2006-05-04 Welch Allyn, Inc. Rapid diagnostic assay
US20060102353A1 (en) * 2004-11-12 2006-05-18 Halliburton Energy Services, Inc. Thermal component temperature management system and method
CN101044811A (zh) * 2004-11-14 2007-09-26 利伯特公司 用于立式板卡型计算机系统的机架中的集成式热交换器
US8024936B2 (en) * 2004-11-16 2011-09-27 Halliburton Energy Services, Inc. Cooling apparatus, systems, and methods
WO2006060708A1 (en) * 2004-12-03 2006-06-08 Halliburton Energy Services, Inc. Switchable power allocation in a downhole operation
WO2006060673A1 (en) * 2004-12-03 2006-06-08 Halliburton Energy Services, Inc. Rechargeable energy storage device in a downhole operation
CN101133232B (zh) 2004-12-03 2012-11-07 哈里伯顿能源服务公司 井底操作中的加热和冷却电气元件
US7265977B2 (en) * 2005-01-18 2007-09-04 International Business Machines Corporation Active liquid metal thermal spreader
US20060213645A1 (en) * 2005-03-24 2006-09-28 Wintersteen Douglas C Integral liquid cooling unit for a computer
EP1707267A1 (de) * 2005-03-30 2006-10-04 F. Hoffman-la Roche AG Vorrichtung mit selbstdichtendem EInlass
US7259965B2 (en) * 2005-04-07 2007-08-21 Intel Corporation Integrated circuit coolant microchannel assembly with targeted channel configuration
CA2610875A1 (en) 2005-06-06 2006-12-14 Decision Biomarkers, Inc. Assays based on liquid flow over arrays
CN101238766B (zh) 2005-08-04 2011-04-13 力博特公司 具有整体高性能的冷却系统和备用通风系统的电子设备机柜
US20070029070A1 (en) * 2005-08-05 2007-02-08 Kenichi Yamamoto Sheet type fluid circulating apparatus and electronic device cooler structure using the same
US20090145576A1 (en) * 2005-08-11 2009-06-11 Eksigent Technologies, Llc Microfluid based apparatus and method for thermal regulation and noise reduction
US8020573B2 (en) * 2006-08-10 2011-09-20 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Microfluidic channels and reservoirs in portable electronic devices
US7679916B2 (en) * 2006-12-08 2010-03-16 GE Intelligent Platforms Embedded Systems, Inc. Method and system for extracting heat from electrical components
US7901131B2 (en) * 2006-12-22 2011-03-08 Hewlett-Packard Development Company, L.P. Apparatus state determination method and system
TW200839495A (en) * 2007-03-30 2008-10-01 Cooler Master Co Ltd Structure of water cooling head
TW200847901A (en) * 2007-05-18 2008-12-01 Cooler Master Co Ltd Water-cooling heat-dissipation system
US8016260B2 (en) * 2007-07-19 2011-09-13 Formulatrix, Inc. Metering assembly and method of dispensing fluid
US20090074615A1 (en) * 2007-09-17 2009-03-19 Ysi Incorporated Microfluidic module including an adhesiveless self-bonding rebondable polyimide
US8650886B2 (en) 2008-09-12 2014-02-18 Rockwell Collins, Inc. Thermal spreader assembly with flexible liquid cooling loop having rigid tubing sections and flexible tubing sections
US8616266B2 (en) * 2008-09-12 2013-12-31 Rockwell Collins, Inc. Mechanically compliant thermal spreader with an embedded cooling loop for containing and circulating electrically-conductive liquid
US20100085708A1 (en) * 2008-10-07 2010-04-08 Liebert Corporation High-efficiency, fluid-cooled ups converter
US8100293B2 (en) * 2009-01-23 2012-01-24 Formulatrix, Inc. Microfluidic dispensing assembly
US8077460B1 (en) 2010-07-19 2011-12-13 Toyota Motor Engineering & Manufacturing North America, Inc. Heat exchanger fluid distribution manifolds and power electronics modules incorporating the same
US9273554B2 (en) * 2010-08-03 2016-03-01 Carol E. Mungas High efficiency energy conversion
US8199505B2 (en) 2010-09-13 2012-06-12 Toyota Motor Engineering & Manufacturing Norh America, Inc. Jet impingement heat exchanger apparatuses and power electronics modules
US8659896B2 (en) 2010-09-13 2014-02-25 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules
US9170028B1 (en) 2010-10-06 2015-10-27 Lawrence Livermore National Security, Llc Methods and compositions for rapid thermal cycling
US8986303B2 (en) 2010-11-09 2015-03-24 Biosense Webster, Inc. Catheter with liquid-cooled control handle
US8427832B2 (en) 2011-01-05 2013-04-23 Toyota Motor Engineering & Manufacturing North America, Inc. Cold plate assemblies and power electronics modules
US8391008B2 (en) 2011-02-17 2013-03-05 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics modules and power electronics module assemblies
JP5628067B2 (ja) * 2011-02-25 2014-11-19 株式会社荏原製作所 研磨パッドの温度調整機構を備えた研磨装置
US8482919B2 (en) 2011-04-11 2013-07-09 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics card assemblies, power electronics modules, and power electronics devices
US8902591B2 (en) * 2011-05-11 2014-12-02 Microjet Technology Co., Ltd. Heat dissipation device
JP2013113679A (ja) * 2011-11-28 2013-06-10 Sony Corp マイクロチップ及びマイクロチップの製造方法
US8643173B1 (en) 2013-01-04 2014-02-04 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features
US9131631B2 (en) 2013-08-08 2015-09-08 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having enhanced heat transfer assemblies
US10100822B2 (en) 2015-04-20 2018-10-16 Hewlett-Packard Development Company, L.P. Pump having freely movable member
WO2016171659A1 (en) * 2015-04-20 2016-10-27 Hewlett-Packard Development Company, L.P. Pump having freely movable member
US10684662B2 (en) 2015-04-20 2020-06-16 Hewlett-Packard Development Company, L.P. Electronic device having a coolant
US10136563B2 (en) * 2015-06-25 2018-11-20 International Business Machines Corporation Active perforation for advanced server cooling
US9907210B2 (en) 2015-06-25 2018-02-27 International Business Machines Corporation Active perforation for advanced server cooling
JP2017040434A (ja) * 2015-08-20 2017-02-23 富士通株式会社 冷却装置及び電子機器
US10009570B2 (en) * 2016-02-24 2018-06-26 International Business Machines Corporation Thermal management of display screens
RU2629320C1 (ru) * 2016-06-15 2017-08-28 Федеральное государственное бюджетное образовательное учреждение высшего образования Балтийский государственный технический университет "ВОЕНМЕХ" им. Д.Ф. Устинова (БГТУ "ВОЕНМЕХ") Электронная тепловая труба
CN106102306B (zh) * 2016-06-29 2019-08-06 华为技术有限公司 一种通信设备的电路板及散热方法、通信设备
CN106547315A (zh) * 2016-10-18 2017-03-29 湖北喵喵智能物联网科技有限公司 一种互联网用电脑机箱安全型防潮底座
US11278894B2 (en) 2017-11-22 2022-03-22 Hewlett-Packard Development Company, L.P. Temperature-controlling microfluidic devices
CN108509001B (zh) * 2018-04-02 2021-01-15 联想(北京)有限公司 电子设备及其水冷服务器
DE102019004450B4 (de) * 2019-06-26 2024-03-14 Drägerwerk AG & Co. KGaA Mikropumpensystem und Verfahren zur Führung eines kompressiblen Fluids
CN111952261B (zh) * 2020-07-09 2023-01-17 中国科学院微电子研究所 电子芯片以及电子器件
CN112899627B (zh) * 2021-01-16 2022-09-27 重庆电子工程职业学院 一种靶材安装结构、磁控溅射设备及磁控溅射方法
WO2023076747A2 (en) * 2021-11-01 2023-05-04 Novel Microdevices, Inc. Apparatus for controlling assay processes in a sample-to-answer device and method of use thereof
US11943904B2 (en) 2022-05-31 2024-03-26 GE Grid GmbH Hybrid thermosyphon with immersion cooled evaporator

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758926A (en) * 1986-03-31 1988-07-19 Microelectronics And Computer Technology Corporation Fluid-cooled integrated circuit package
US4775574A (en) * 1986-04-14 1988-10-04 Shin Etsu Polymer Co., Ltd. Covering member of keyboard and a base plate therefor
US5099910A (en) * 1991-01-15 1992-03-31 Massachusetts Institute Of Technology Microchannel heat sink with alternating flow directions
US5099311A (en) * 1991-01-17 1992-03-24 The United States Of America As Represented By The United States Department Of Energy Microchannel heat sink assembly
US5199487A (en) * 1991-05-31 1993-04-06 Hughes Aircraft Company Electroformed high efficiency heat exchanger and method for making
DE69211074T2 (de) * 1991-08-26 1996-10-02 Sun Microsystems Inc Verfahren und Apparat zum Kühlen von Mehrchip-Moduln durch die vollständige Wärmerohr-Technologie
JP2532352B2 (ja) * 1992-05-25 1996-09-11 マンネスマン・アクチエンゲゼルシャフト 流体により冷却される出力トランジスタ装置
US5727618A (en) * 1993-08-23 1998-03-17 Sdl Inc Modular microchannel heat exchanger
DE4330618A1 (de) * 1993-09-09 1995-03-16 Bayerische Motoren Werke Ag Kühlvorrichtung für ein Batterieladegerät und einen Bordnetzwandler in Elektrofahrzeugen
US6129973A (en) 1994-07-29 2000-10-10 Battelle Memorial Institute Microchannel laminated mass exchanger and method of making
DE19541266A1 (de) 1995-11-06 1997-05-07 Bayer Ag Verfahren und Vorrichtung zur Durchführung chemischer Reaktionen mittels eines Mikrostruktur-Lamellenmischers
US5863502A (en) 1996-01-24 1999-01-26 Sarnoff Corporation Parallel reaction cassette and associated devices
US5801442A (en) * 1996-07-22 1998-09-01 Northrop Grumman Corporation Microchannel cooling of high power semiconductor devices
WO1998003997A1 (en) 1996-07-22 1998-01-29 Northrop Grumman Corporation Closed loop liquid cooling within rf modules
US5763951A (en) * 1996-07-22 1998-06-09 Northrop Grumman Corporation Non-mechanical magnetic pump for liquid cooling
US5835345A (en) * 1996-10-02 1998-11-10 Sdl, Inc. Cooler for removing heat from a heated region
US5870823A (en) * 1996-11-27 1999-02-16 International Business Machines Corporation Method of forming a multilayer electronic packaging substrate with integral cooling channels
US5818692A (en) 1997-05-30 1998-10-06 Motorola, Inc. Apparatus and method for cooling an electrical component
US5901037A (en) * 1997-06-18 1999-05-04 Northrop Grumman Corporation Closed loop liquid cooling for semiconductor RF amplifier modules
US5842787A (en) * 1997-10-09 1998-12-01 Caliper Technologies Corporation Microfluidic systems incorporating varied channel dimensions
US6803019B1 (en) 1997-10-15 2004-10-12 Aclara Biosciences, Inc. Laminate microstructure device and method for making same
US6074725A (en) 1997-12-10 2000-06-13 Caliper Technologies Corp. Fabrication of microfluidic circuits by printing techniques
CA2320296A1 (en) 1998-05-18 1999-11-25 University Of Washington Liquid analysis cartridge
US6148635A (en) 1998-10-19 2000-11-21 The Board Of Trustees Of The University Of Illinois Active compressor vapor compression cycle integrated heat transfer device
US6337794B1 (en) * 2000-02-11 2002-01-08 International Business Machines Corporation Isothermal heat sink with tiered cooling channels

Also Published As

Publication number Publication date
EP1321015A2 (de) 2003-06-25
US6501654B2 (en) 2002-12-31
EP1321015B1 (de) 2004-05-19
WO2002028160A2 (en) 2002-04-04
WO2002028160A3 (en) 2002-06-27
US20020039280A1 (en) 2002-04-04
AU2002211325A1 (en) 2002-04-08
ATE267507T1 (de) 2004-06-15

Similar Documents

Publication Publication Date Title
DE60103415D1 (de) Mikrofluidische vorrichtung zur wärmeübertragung
WO2001063983A3 (en) Thermal management system
BR9909580B1 (pt) dispositivo de circuito integrado, processo para produzir um dispositivo eletrÈnico, e, dispositivo eletrÈnico.
EP1536313A3 (de) Termische Lösung für elektronische Geräte
BR9806147B1 (pt) disposição, sobretudo para o emprego em um equipamento de comando eletrÈnico, abrangendo uma placa de circuito impresso e um dissipador térmico e processo para a fabricação de uma disposição.
DE50204868D1 (de) Gehäuse zur aufnahme mindestens einer energiespeichereinrichtung
EP1286243A3 (de) Verbindungsloses Lizenzübertragungs- und Verteilungssystem
DE60134850D1 (de) Vorrichtung zum erleichterten gebrauch von standard elektronischen bauteilen in rauhen umgebungen
ATE517593T1 (de) Wärmeaustauschvorrichtung, insbesondere zur anwendung der wärmebehandlung
WO2006071517A3 (en) System and method for directing a fluid through a die
ATE457502T1 (de) Vorrichtung zur elektromagnetischen strahlung durch eine wand
KR960006732A (ko) 부재의 냉각구조
DE60224903D1 (de) Einrichtung zur Kühlung einer elektronischen Anlage
WO2004024009A8 (en) Bone plates
DE60134627D1 (de) POSITIONIERUNGSSTEUERSYSTEME UND VORRICHTUNG, UND DAMIT AUSGERüSTETES BESTüCKUNGSVERFAHREN FüR ELEKTRONISCHE BAUTEILE.
DE50201415D1 (de) Kühlluftführung
IT8720190A0 (it) Dispositivo per la protezione e il condizionamento termico di apparecchiature, in particolare apparecchiature elettroniche generanti calore.
ATE379848T1 (de) Schalt- oder steuergerät
FR2828089B1 (fr) Boitier de transport securise pour equipement medical et echantillons
DE50210002D1 (de) Vorrichtung zur wärmeübertragung
ITBO20010702A0 (it) Sistema per la singolarizzazione ed il trasferimento di oggetti , e dispositivo di trasferimento impiegato nel sistema .
DE50202798D1 (de) Kühlvorrichtung für eine elektrische und/oder elektronische Einheit
ITTO990930A0 (it) Procedimento e dispositivo per il condizionamento termico di component i elettronici.
DE69828768D1 (de) Vorrichtung zur Anfrage von Änderungen bezüglich der Nutzdaten und diese Vorrichtung enthaltende Übertragungsvorrichtung
WO2003017162A1 (fr) Appareil de gestion de requetes d'examen

Legal Events

Date Code Title Description
8332 No legal effect for de