DE60105754D1 - Polyimid und polyamidsäure - Google Patents

Polyimid und polyamidsäure

Info

Publication number
DE60105754D1
DE60105754D1 DE60105754T DE60105754T DE60105754D1 DE 60105754 D1 DE60105754 D1 DE 60105754D1 DE 60105754 T DE60105754 T DE 60105754T DE 60105754 T DE60105754 T DE 60105754T DE 60105754 D1 DE60105754 D1 DE 60105754D1
Authority
DE
Germany
Prior art keywords
polyimide
polyamid acid
polyamid
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60105754T
Other languages
English (en)
Other versions
DE60105754T2 (de
Inventor
Jun Kamada
Ken-Ichi Goto
Takashi Kuroki
Shoji Tamai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Application granted granted Critical
Publication of DE60105754D1 publication Critical patent/DE60105754D1/de
Publication of DE60105754T2 publication Critical patent/DE60105754T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/108—Polyolefin or halogen containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
DE60105754T 2000-04-28 2001-04-26 Polyimid und polyamidsäure Expired - Lifetime DE60105754T2 (de)

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
JP2000129786 2000-04-28
JP2000129786 2000-04-28
JP2000373778 2000-12-08
JP2000373778 2000-12-08
JP2000399897 2000-12-28
JP2000399897 2000-12-28
JP2001100886 2001-03-30
JP2001100886 2001-03-30
JP2001100888 2001-03-30
JP2001100888 2001-03-30
JP2001100887 2001-03-30
JP2001100887 2001-03-30
PCT/JP2001/003600 WO2001083591A1 (fr) 2000-04-28 2001-04-26 Polyimides et acides polyamiques

Publications (2)

Publication Number Publication Date
DE60105754D1 true DE60105754D1 (de) 2004-10-28
DE60105754T2 DE60105754T2 (de) 2005-06-23

Family

ID=27554774

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60105754T Expired - Lifetime DE60105754T2 (de) 2000-04-28 2001-04-26 Polyimid und polyamidsäure

Country Status (6)

Country Link
US (1) US6599675B2 (de)
EP (1) EP1225192B1 (de)
KR (1) KR100486823B1 (de)
CN (1) CN1148400C (de)
DE (1) DE60105754T2 (de)
WO (1) WO2001083591A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4120584B2 (ja) * 2001-07-26 2008-07-16 日産化学工業株式会社 ポリアミック酸樹脂組成物
US7851124B2 (en) * 2003-06-03 2010-12-14 Mitsui Chemicals, Inc. Composition for forming wiring protective film and uses thereof
JPWO2006082814A1 (ja) * 2005-02-01 2008-08-07 国立大学法人 名古屋工業大学 シロキサン変性多分岐ポリイミド
KR100662542B1 (ko) * 2005-06-17 2006-12-28 제일모직주식회사 반사방지 하드마스크 조성물 및 이를 이용하여 기판 상에패턴화된 재료 형상을 형성시키는 방법
US20110144297A1 (en) * 2009-12-15 2011-06-16 E. I. Du Pont De Nemours And Company Rapid thermal conversion of a polyamic acid fiber to a polyimide fiber
CN103183823A (zh) * 2011-12-27 2013-07-03 比亚迪股份有限公司 一种光固化聚酰亚胺及其制备方法
CN105408399B (zh) 2013-05-17 2019-01-01 富士胶片电子材料美国有限公司 新的聚合物和含有其的热固组合物
KR102233088B1 (ko) * 2014-01-31 2021-03-29 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 신규 폴리이미드 조성물
US10036952B2 (en) * 2015-04-21 2018-07-31 Fujifilm Electronic Materials U.S.A., Inc. Photosensitive polyimide compositions
CN108043232B (zh) * 2017-12-06 2021-02-09 上海交通大学 一种六元环聚酰亚胺共聚物分离膜及其制备方法和用途
CN109529641B (zh) * 2019-01-11 2021-04-20 天津工业大学 聚酰亚胺-光敏钴有机骨架杂化膜制备与气体分离应用
CN109912618B (zh) * 2019-03-20 2020-12-25 浙江福斯特新材料研究院有限公司 一种多官能度有机酸酐及低介电常数超支化聚酰亚胺薄膜

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4656116A (en) * 1983-10-12 1987-04-07 Ciba-Geigy Corporation Radiation-sensitive coating composition
US4826927A (en) * 1986-01-13 1989-05-02 Ciba-Geigy Corporation Mixtures containing polymides alkenyphenols and either epoxide group-free adducts or another polyimide
JPH07116112B2 (ja) * 1987-08-21 1995-12-13 三井東圧化学株式会社 ジアミノインダン誘導体およびその製造方法
US5206091A (en) * 1988-06-28 1993-04-27 Amoco Corporation Low dielectric constant, low moisture uptake polyimides and copolyimides for interlevel dielectrics and substrate coatings
US5137751A (en) * 1990-03-09 1992-08-11 Amoco Corporation Process for making thick multilayers of polyimide
US6071667A (en) * 1995-04-13 2000-06-06 Hitachi Chemical Co., Ltd. Photosensitive resin composition containing a photosensitive polyamide resin
CA2703161C (en) * 1998-10-23 2011-12-20 Mycogen Corporation Plant-optimized polynucleotides encoding approximately 15 kda and approximately 45 kda pesticidal proteins
JP3805918B2 (ja) * 1999-02-09 2006-08-09 日立化成デュポンマイクロシステムズ株式会社 ポジ型感光性樹脂組成物、レリーフパターンの製造法及び電子部品

Also Published As

Publication number Publication date
EP1225192A4 (de) 2003-01-02
US20020182536A1 (en) 2002-12-05
KR100486823B1 (ko) 2005-05-03
DE60105754T2 (de) 2005-06-23
EP1225192B1 (de) 2004-09-22
KR20020016868A (ko) 2002-03-06
WO2001083591A1 (fr) 2001-11-08
CN1366534A (zh) 2002-08-28
US6599675B2 (en) 2003-07-29
EP1225192A1 (de) 2002-07-24
CN1148400C (zh) 2004-05-05

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