DE60109339D1 - Verfahren zum Drahtbonden - Google Patents
Verfahren zum DrahtbondenInfo
- Publication number
- DE60109339D1 DE60109339D1 DE60109339T DE60109339T DE60109339D1 DE 60109339 D1 DE60109339 D1 DE 60109339D1 DE 60109339 T DE60109339 T DE 60109339T DE 60109339 T DE60109339 T DE 60109339T DE 60109339 D1 DE60109339 D1 DE 60109339D1
- Authority
- DE
- Germany
- Prior art keywords
- wire bonding
- bonding
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- H01L23/53238—Additional layers associated with copper layers, e.g. adhesion, barrier, cladding layers
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-
2001
- 2001-03-09 DE DE60109339T patent/DE60109339T2/de not_active Expired - Lifetime
- 2001-03-09 EP EP01000048A patent/EP1139413B1/de not_active Expired - Lifetime
- 2001-03-23 JP JP2001085103A patent/JP2001319946A/ja not_active Abandoned
- 2001-03-23 US US09/817,696 patent/US6800555B2/en not_active Expired - Lifetime
- 2001-03-23 KR KR1020010015120A patent/KR100741592B1/ko active IP Right Grant
- 2001-03-26 CN CNB011121351A patent/CN1245272C/zh not_active Expired - Fee Related
-
2004
- 2004-08-04 US US10/910,454 patent/US20050106851A1/en not_active Abandoned
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---|---|
US20010035452A1 (en) | 2001-11-01 |
KR20010090525A (ko) | 2001-10-18 |
EP1139413B1 (de) | 2005-03-16 |
US20050106851A1 (en) | 2005-05-19 |
EP1139413A3 (de) | 2002-06-12 |
CN1317389A (zh) | 2001-10-17 |
DE60109339T2 (de) | 2006-01-12 |
JP2001319946A (ja) | 2001-11-16 |
EP1139413A2 (de) | 2001-10-04 |
US6800555B2 (en) | 2004-10-05 |
KR100741592B1 (ko) | 2007-07-20 |
CN1245272C (zh) | 2006-03-15 |
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