DE60119119D1 - Mehrkammerreaktor mit zwei entlüftungs-/kühl-schleusekammern - Google Patents

Mehrkammerreaktor mit zwei entlüftungs-/kühl-schleusekammern

Info

Publication number
DE60119119D1
DE60119119D1 DE60119119T DE60119119T DE60119119D1 DE 60119119 D1 DE60119119 D1 DE 60119119D1 DE 60119119 T DE60119119 T DE 60119119T DE 60119119 T DE60119119 T DE 60119119T DE 60119119 D1 DE60119119 D1 DE 60119119D1
Authority
DE
Germany
Prior art keywords
wafer
chamber
cooling
loadlock
bell portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60119119T
Other languages
English (en)
Other versions
DE60119119T2 (de
Inventor
Andrew Clarke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CollabRx Inc
Original Assignee
CollabRx Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/609,733 external-priority patent/US6235656B1/en
Application filed by CollabRx Inc filed Critical CollabRx Inc
Application granted granted Critical
Publication of DE60119119D1 publication Critical patent/DE60119119D1/de
Publication of DE60119119T2 publication Critical patent/DE60119119T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
DE60119119T 2000-07-03 2001-07-02 Cluster-Tool mit zwei Entgasungs-/Kühlschleusenkammern Expired - Fee Related DE60119119T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US609733 2000-07-03
US09/609,733 US6235656B1 (en) 2000-07-03 2000-07-03 Dual degas/cool loadlock cluster tool
US798048 2001-03-05
US09/798,048 US6562141B2 (en) 2000-07-03 2001-03-05 Dual degas/cool loadlock cluster tool
PCT/US2001/021206 WO2002002445A1 (en) 2000-07-03 2001-07-02 Dual degas/cool loadlock cluster tool

Publications (2)

Publication Number Publication Date
DE60119119D1 true DE60119119D1 (de) 2006-06-01
DE60119119T2 DE60119119T2 (de) 2007-01-04

Family

ID=27086108

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60119119T Expired - Fee Related DE60119119T2 (de) 2000-07-03 2001-07-02 Cluster-Tool mit zwei Entgasungs-/Kühlschleusenkammern

Country Status (9)

Country Link
US (2) US6562141B2 (de)
EP (1) EP1303449B1 (de)
JP (1) JP5048198B2 (de)
KR (1) KR20020047143A (de)
CN (1) CN1193922C (de)
AT (1) ATE324341T1 (de)
DE (1) DE60119119T2 (de)
HK (1) HK1051992A1 (de)
WO (1) WO2002002445A1 (de)

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US8617347B2 (en) * 2009-08-06 2013-12-31 Applied Materials, Inc. Vacuum processing chambers incorporating a moveable flow equalizer
JP5257328B2 (ja) * 2009-11-04 2013-08-07 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
US9627324B2 (en) 2009-11-17 2017-04-18 Evatec Ag Apparatus and method for processing a substrate
JP5310512B2 (ja) * 2009-12-02 2013-10-09 東京エレクトロン株式会社 基板処理装置
JP5553588B2 (ja) * 2009-12-10 2014-07-16 東京エレクトロン株式会社 成膜装置
KR100996210B1 (ko) * 2010-04-12 2010-11-24 세메스 주식회사 가스 분사 유닛 및 이를 이용한 박막 증착 장치 및 방법
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KR101327458B1 (ko) * 2012-01-10 2013-11-08 주식회사 유진테크 냉각 방식의 샤워헤드 및 이를 구비하는 기판 처리 장치
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US10971381B2 (en) 2013-11-04 2021-04-06 Applied Materials, Inc. Transfer chambers with an increased number of sides, semiconductor device manufacturing processing tools, and processing methods
CN104746008B (zh) * 2013-12-30 2017-06-06 北京北方微电子基地设备工艺研究中心有限责任公司 去气腔室
US9453614B2 (en) * 2014-03-17 2016-09-27 Lam Research Corporation Systems and methods for cooling and removing reactants from a substrate processing chamber
JP6408904B2 (ja) * 2014-12-25 2018-10-17 東京エレクトロン株式会社 真空引き方法及び真空処理装置
TW201639063A (zh) 2015-01-22 2016-11-01 應用材料股份有限公司 批量加熱和冷卻腔室或負載鎖定裝置
JP6602894B2 (ja) * 2015-05-15 2019-11-06 アプライド マテリアルズ インコーポレイテッド ロードロックチャンバ、ロードロックチャンバを有する真空処理システム及びロードロックチャンバを排気する方法
CN106298585B (zh) * 2015-06-03 2020-10-16 北京北方华创微电子装备有限公司 腔室及半导体加工设备
DE102015110711A1 (de) 2015-07-02 2017-01-05 Endress+Hauser Flowtec Ag MEMS Sensor zu Messung mindestens einer Messgröße eines strömenden Fluids
CN107958851B (zh) * 2016-10-14 2022-08-16 北京北方华创微电子装备有限公司 传输腔室及半导体加工设备
US11802340B2 (en) * 2016-12-12 2023-10-31 Applied Materials, Inc. UHV in-situ cryo-cool chamber
WO2021044622A1 (ja) * 2019-09-06 2021-03-11 キヤノンアネルバ株式会社 ロードロック装置
JP7451436B2 (ja) 2020-02-14 2024-03-18 芝浦メカトロニクス株式会社 成膜装置及び成膜装置の水分除去方法
CN113265626B (zh) * 2020-02-14 2023-06-16 芝浦机械电子装置株式会社 成膜装置及成膜装置的水分去除方法
CN114875381B (zh) * 2022-05-13 2023-03-31 广东华升纳米科技股份有限公司 真空镀膜腔和真空镀膜设备

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Also Published As

Publication number Publication date
CN1386105A (zh) 2002-12-18
US6562141B2 (en) 2003-05-13
EP1303449A1 (de) 2003-04-23
JP5048198B2 (ja) 2012-10-17
HK1051992A1 (zh) 2003-08-29
DE60119119T2 (de) 2007-01-04
KR20020047143A (ko) 2002-06-21
CN1193922C (zh) 2005-03-23
US20020000194A1 (en) 2002-01-03
ATE324341T1 (de) 2006-05-15
JP2004503099A (ja) 2004-01-29
EP1303449B1 (de) 2006-04-26
US20030066606A1 (en) 2003-04-10
EP1303449A4 (de) 2004-09-22
WO2002002445A1 (en) 2002-01-10

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Legal Events

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee