DE60125133D1 - Bildaufnahmegerät - Google Patents

Bildaufnahmegerät

Info

Publication number
DE60125133D1
DE60125133D1 DE60125133T DE60125133T DE60125133D1 DE 60125133 D1 DE60125133 D1 DE 60125133D1 DE 60125133 T DE60125133 T DE 60125133T DE 60125133 T DE60125133 T DE 60125133T DE 60125133 D1 DE60125133 D1 DE 60125133D1
Authority
DE
Germany
Prior art keywords
imaging device
imaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60125133T
Other languages
English (en)
Inventor
Shunsuke Inoue
Tetsunobu Kochi
Hidekazu Takahashi
Masanori Ogura
Tomoya Yoneda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000313937A external-priority patent/JP2002125242A/ja
Priority claimed from JP2000319630A external-priority patent/JP3703385B2/ja
Priority claimed from JP2000349869A external-priority patent/JP2002158929A/ja
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE60125133D1 publication Critical patent/DE60125133D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14603Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/71Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • H04N25/74Circuitry for scanning or addressing the pixel array
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14625Optical elements or arrangements associated with the device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14643Photodiode arrays; MOS imagers
    • H01L27/14645Colour imagers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/10Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/80Camera processing pipelines; Components thereof
    • H04N23/84Camera processing pipelines; Components thereof for processing colour signals
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • H04N25/41Extracting pixel data from a plurality of image sensors simultaneously picking up an image, e.g. for increasing the field of view by combining the outputs of a plurality of sensors
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/62Detection or reduction of noise due to excess charges produced by the exposure, e.g. smear, blooming, ghost image, crosstalk or leakage between pixels
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/1462Coatings
    • H01L27/14621Colour filter arrangements
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N2209/00Details of colour television systems
    • H04N2209/04Picture signal generators
    • H04N2209/041Picture signal generators using solid-state devices
    • H04N2209/048Picture signal generators using solid-state devices having several pick-up sensors
DE60125133T 2000-10-13 2001-10-12 Bildaufnahmegerät Expired - Lifetime DE60125133D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000313937A JP2002125242A (ja) 2000-10-13 2000-10-13 固体撮像装置
JP2000319630A JP3703385B2 (ja) 2000-10-19 2000-10-19 撮像装置
JP2000349869A JP2002158929A (ja) 2000-11-16 2000-11-16 固体撮像素子、固体撮像装置及び撮像システム

Publications (1)

Publication Number Publication Date
DE60125133D1 true DE60125133D1 (de) 2007-01-25

Family

ID=27344939

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60125133T Expired - Lifetime DE60125133D1 (de) 2000-10-13 2001-10-12 Bildaufnahmegerät

Country Status (5)

Country Link
US (2) US6952228B2 (de)
EP (2) EP1206126B1 (de)
KR (1) KR100403100B1 (de)
CN (1) CN1207789C (de)
DE (1) DE60125133D1 (de)

Families Citing this family (76)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001251557A (ja) * 1999-12-27 2001-09-14 Canon Inc エリアセンサ、該エリアセンサを有する画像入力装置および該エリアセンサの駆動方法
US7262799B2 (en) * 2000-10-25 2007-08-28 Canon Kabushiki Kaisha Image sensing apparatus and its control method, control program, and storage medium
JP3873168B2 (ja) * 2001-07-03 2007-01-24 カシオ計算機株式会社 デジタルカメラ及び画像処理方法
US6777885B2 (en) * 2001-10-12 2004-08-17 Semiconductor Energy Laboratory Co., Ltd. Drive circuit, display device using the drive circuit and electronic apparatus using the display device
JP2003143459A (ja) * 2001-11-02 2003-05-16 Canon Inc 複眼撮像系およびこれを備えた装置
JP3530845B2 (ja) * 2002-02-07 2004-05-24 キヤノン株式会社 撮像装置、カメラ及び情報処理装置
JP4086514B2 (ja) * 2002-02-13 2008-05-14 キヤノン株式会社 光電変換装置及び撮像装置
JP3923341B2 (ja) 2002-03-06 2007-05-30 株式会社半導体エネルギー研究所 半導体集積回路およびその駆動方法
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KR101065659B1 (ko) * 2003-01-17 2011-09-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 전류원 회로, 신호선 구동회로 및 그 구동방법과, 발광장치
JP2004312107A (ja) * 2003-04-02 2004-11-04 Olympus Corp 固体撮像装置及びその読み出し方法
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CN1574370A (zh) * 2003-05-30 2005-02-02 松下电器产业株式会社 固体摄像器件
JP4161855B2 (ja) * 2003-09-10 2008-10-08 ソニー株式会社 固体撮像装置、駆動制御方法及び駆動制御装置
EP2466871A3 (de) * 2003-10-22 2017-05-03 Panasonic Intellectual Property Management Co., Ltd. Abbildungsvorrichtung und Verfahren zu deren Herstellung, tragbares Gerät und Abbildungssensor und Verfahren zur Herstellung davon
JP4371797B2 (ja) * 2003-12-12 2009-11-25 コニカミノルタホールディングス株式会社 固体撮像装置
JP2005229373A (ja) * 2004-02-13 2005-08-25 Sony Corp 固体撮像装置および固体撮像装置の駆動方法
CN1677217B (zh) * 2004-03-31 2010-08-25 松下电器产业株式会社 摄像装置及摄像用光检测装置
JP2005333265A (ja) * 2004-05-18 2005-12-02 Olympus Corp 固体撮像素子および装置
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US20070102622A1 (en) * 2005-07-01 2007-05-10 Olsen Richard I Apparatus for multiple camera devices and method of operating same
US7566855B2 (en) * 2005-08-25 2009-07-28 Richard Ian Olsen Digital camera with integrated infrared (IR) response
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Also Published As

Publication number Publication date
US20050270395A1 (en) 2005-12-08
CN1207789C (zh) 2005-06-22
KR100403100B1 (ko) 2003-10-23
CN1374701A (zh) 2002-10-16
US6952228B2 (en) 2005-10-04
US20020067416A1 (en) 2002-06-06
KR20020029646A (ko) 2002-04-19
EP1206126A2 (de) 2002-05-15
EP1206126A3 (de) 2004-07-14
EP1206126B1 (de) 2006-12-13
EP1667427A1 (de) 2006-06-07
US7639297B2 (en) 2009-12-29

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