DE60129267D1 - Fertigungsstrasse zur Montage elektronischer Bauteile - Google Patents

Fertigungsstrasse zur Montage elektronischer Bauteile

Info

Publication number
DE60129267D1
DE60129267D1 DE60129267T DE60129267T DE60129267D1 DE 60129267 D1 DE60129267 D1 DE 60129267D1 DE 60129267 T DE60129267 T DE 60129267T DE 60129267 T DE60129267 T DE 60129267T DE 60129267 D1 DE60129267 D1 DE 60129267D1
Authority
DE
Germany
Prior art keywords
assembly
electronic components
production line
production
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60129267T
Other languages
English (en)
Other versions
DE60129267T2 (de
Inventor
Toshihiro Kawahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Instruments Co Ltd
Original Assignee
Hitachi High Tech Instruments Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Tech Instruments Co Ltd filed Critical Hitachi High Tech Instruments Co Ltd
Publication of DE60129267D1 publication Critical patent/DE60129267D1/de
Application granted granted Critical
Publication of DE60129267T2 publication Critical patent/DE60129267T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y10T29/53048—Multiple station assembly or disassembly apparatus
    • Y10T29/53052—Multiple station assembly or disassembly apparatus including position sensor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53187—Multiple station assembly apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part
DE60129267T 2000-03-17 2001-03-19 Fertigungsstrasse zur Montage elektronischer Bauteile Expired - Lifetime DE60129267T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000076421A JP3459610B2 (ja) 2000-03-17 2000-03-17 装着ライン
JP2000076421 2000-03-17

Publications (2)

Publication Number Publication Date
DE60129267D1 true DE60129267D1 (de) 2007-08-23
DE60129267T2 DE60129267T2 (de) 2008-02-14

Family

ID=18594167

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60129267T Expired - Lifetime DE60129267T2 (de) 2000-03-17 2001-03-19 Fertigungsstrasse zur Montage elektronischer Bauteile

Country Status (4)

Country Link
US (1) US6497037B2 (de)
EP (1) EP1137335B1 (de)
JP (1) JP3459610B2 (de)
DE (1) DE60129267T2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6571462B1 (en) * 1999-04-27 2003-06-03 Matsushita Electric Industrial Co., Ltd Electronic component mounting apparatus using duplicate sources of components
JP2007013033A (ja) * 2005-07-04 2007-01-18 Yamaha Motor Co Ltd 実装ラインの管理方法
JP2006339388A (ja) * 2005-06-01 2006-12-14 Yamaha Motor Co Ltd 実装作業の管理方法、実装ラインおよび実装機
CN101209007A (zh) * 2005-06-27 2008-06-25 松下电器产业株式会社 贴装条件确定方法
JP4883071B2 (ja) * 2008-10-03 2012-02-22 パナソニック株式会社 電子部品実装システム
JP4883070B2 (ja) * 2008-10-03 2012-02-22 パナソニック株式会社 電子部品実装システムおよび電子部品実装方法
JP5323137B2 (ja) 2011-06-14 2013-10-23 ヤマハ発動機株式会社 段取り方法、部品実装方法および部品実装システム
WO2016051602A1 (ja) * 2014-10-03 2016-04-07 富士機械製造株式会社 部品装着システムおよび部品装着装置の異常停止診断方法
WO2018020594A1 (ja) * 2016-07-27 2018-02-01 富士機械製造株式会社 基板生産管理装置および基板生産管理方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2766107B2 (ja) 1991-12-19 1998-06-18 三洋電機株式会社 部品装着装置
JPH08172296A (ja) 1994-10-19 1996-07-02 Sanyo Electric Co Ltd 電子部品自動装着装置及び電子部品の装着方法
US5671527A (en) * 1995-11-01 1997-09-30 Fuji Machine Mfg. Co., Ltd. Electronic-component mounting system
JP3502228B2 (ja) * 1996-09-27 2004-03-02 サンデン株式会社 低温庫
JPH10190299A (ja) * 1996-12-20 1998-07-21 Matsushita Electric Ind Co Ltd 電子部品実装ライン及び電子部品実装方法
DE69825365T2 (de) * 1997-06-05 2005-07-21 Hitachi High-Tech Instruments Co., Ltd. Einrichtung zur Montage von elektronischen Bauteilen und Speisevorrichtung dafür
JP3596243B2 (ja) * 1997-08-07 2004-12-02 松下電器産業株式会社 電子部品実装方法

Also Published As

Publication number Publication date
US20010037187A1 (en) 2001-11-01
US6497037B2 (en) 2002-12-24
JP2001267799A (ja) 2001-09-28
EP1137335A2 (de) 2001-09-26
EP1137335B1 (de) 2007-07-11
DE60129267T2 (de) 2008-02-14
EP1137335A3 (de) 2004-01-02
JP3459610B2 (ja) 2003-10-20

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Legal Events

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