DE60136134D1 - Flachkabel und zugehöriges Vorrichtung und Herstellungsverfahren - Google Patents

Flachkabel und zugehöriges Vorrichtung und Herstellungsverfahren

Info

Publication number
DE60136134D1
DE60136134D1 DE60136134T DE60136134T DE60136134D1 DE 60136134 D1 DE60136134 D1 DE 60136134D1 DE 60136134 T DE60136134 T DE 60136134T DE 60136134 T DE60136134 T DE 60136134T DE 60136134 D1 DE60136134 D1 DE 60136134D1
Authority
DE
Germany
Prior art keywords
manufacturing
flat cable
associated apparatus
cable
flat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60136134T
Other languages
English (en)
Inventor
Tomonori Inagaki
Yoshiaki Yamano
Koji Fukumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000209759A external-priority patent/JP3752973B2/ja
Priority claimed from JP2000244711A external-priority patent/JP3893859B2/ja
Application filed by Sumitomo Wiring Systems Ltd filed Critical Sumitomo Wiring Systems Ltd
Application granted granted Critical
Publication of DE60136134D1 publication Critical patent/DE60136134D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/281Applying non-metallic protective coatings by means of a preformed insulating foil
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00Insulated conductors or cables characterised by their form
    • H01B7/08Flat or ribbon cables
    • H01B7/0838Parallel wires, sandwiched between two insulating layers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06Lamination
    • H05K2203/065Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
DE60136134T 2000-07-11 2001-07-10 Flachkabel und zugehöriges Vorrichtung und Herstellungsverfahren Expired - Fee Related DE60136134D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000209759A JP3752973B2 (ja) 2000-07-11 2000-07-11 フラットケーブルの製造方法及びフラットケーブル
JP2000244711A JP3893859B2 (ja) 2000-08-11 2000-08-11 フラットケーブルの製造装置

Publications (1)

Publication Number Publication Date
DE60136134D1 true DE60136134D1 (de) 2008-11-27

Family

ID=26595794

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60136134T Expired - Fee Related DE60136134D1 (de) 2000-07-11 2001-07-10 Flachkabel und zugehöriges Vorrichtung und Herstellungsverfahren

Country Status (3)

Country Link
US (2) US6585836B2 (de)
EP (1) EP1172826B1 (de)
DE (1) DE60136134D1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6841735B1 (en) * 1996-04-03 2005-01-11 Methode Electronics, Inc. Flat cable and modular rotary anvil to make same
JP4013691B2 (ja) * 2002-07-31 2007-11-28 住友電装株式会社 フレキシブルフラットケーブルの接続方法および超音波溶接機
US6905000B1 (en) * 2003-01-31 2005-06-14 Plantronics, Inc. Faceplate cover
US7247822B2 (en) * 2004-02-05 2007-07-24 Methode Electronics, Inc. Carbon fiber heating element assembly and methods for making
US7223919B2 (en) * 2004-05-11 2007-05-29 Gagne Norman P Flat flexible cable with integrated stiffener
US7332677B2 (en) * 2004-12-17 2008-02-19 General Electric Company Multiconductor cable assemblies and methods of making multiconductor cable assemblies
US7776441B2 (en) * 2004-12-17 2010-08-17 Sabic Innovative Plastics Ip B.V. Flexible poly(arylene ether) composition and articles thereof
US7091422B1 (en) * 2005-01-28 2006-08-15 Multek Flexible Circuits, Inc. Flexible flat cable with insulating layer having distinct adhesives on opposing faces
US7989701B2 (en) * 2007-11-27 2011-08-02 Sabic Innovative Plastics Ip B.V. Multiconductor cable assembly and fabrication method therefor
US8221567B2 (en) * 2009-06-08 2012-07-17 Wix Filtration Corp Llc Filter media and system and method of manufacturing the same
US20130161078A1 (en) 2010-09-03 2013-06-27 Hui Hong Jim Kery Li Rigid-flex circuit board and manufacturing method
JP5644716B2 (ja) * 2011-08-17 2014-12-24 日立金属株式会社 接着フィルム及びフラットケーブル
US20130125396A1 (en) * 2011-11-18 2013-05-23 Remy Technologies, L.L.C. Wrapped wire for electric machine
DE102012109576A1 (de) * 2012-10-09 2014-04-10 Sumida Flexible Connections Gmbh Flachleiter-Bandkabel
JP2014091382A (ja) * 2012-11-01 2014-05-19 Shimano Inc 自転車用ケーブルおよびその製造方法
JP6585034B2 (ja) 2013-05-01 2019-10-02 スリーエム イノベイティブ プロパティズ カンパニー 電気ケーブル用縁部絶縁構造
JP5737323B2 (ja) 2013-05-01 2015-06-17 住友電気工業株式会社 電気絶縁ケーブル
US10561539B2 (en) 2016-09-15 2020-02-18 Curt G. Joa, Inc. Dual bonder
US10537479B2 (en) 2016-09-15 2020-01-21 Curt G. Joa, Inc. Dual bonder
JP6798471B2 (ja) * 2017-06-19 2020-12-09 株式会社オートネットワーク技術研究所 ワイヤーハーネスおよびワイヤーハーネスの製造方法
WO2020086103A1 (en) * 2018-10-26 2020-04-30 Curt G. Joa, Inc. Dual bonder
JP7092209B2 (ja) * 2018-12-13 2022-06-28 株式会社オートネットワーク技術研究所 配線部材
US11192310B2 (en) 2019-07-11 2021-12-07 Curt G. Joa, Inc. Method and apparatus for improved ultrasonic bonding
US11677171B2 (en) * 2020-04-08 2023-06-13 Te Connectivity Solutions Gmbh System and method for sealing electrical terminals

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2524691A1 (fr) * 1982-04-06 1983-10-07 Filotex Sa Element de cable electrique plat, et procede et dispositif de fabrication de cet element
DE3537167C1 (de) * 1985-10-18 1990-05-10 Janisch Erich Kunststoffe Verfahren zur elektrisch isolierenden Umhuellung der Verbindungsstelle zwischen elektrisch leitenden Elementen,Vorrichtung zur Durchfuehrung dieses Verfahrens sowie Umhuellungsmaterial zur Verwendung bei diesem Verfahren
JPH0828139B2 (ja) * 1988-09-20 1996-03-21 株式会社フジクラ テープ電線の製造方法
JP3433438B2 (ja) * 1995-05-12 2003-08-04 矢崎総業株式会社 フラットケーブルの製造方法
JPH09185912A (ja) * 1995-11-02 1997-07-15 Mitsubishi Cable Ind Ltd フラットケーブルおよびその製造方法
JPH09245541A (ja) * 1996-03-14 1997-09-19 Matsushita Electric Ind Co Ltd フラットケーブルの製造方法およびその製造装置
US6026563A (en) * 1996-04-03 2000-02-22 Methode Electronics, Inc. Method of making flat cable
JP3901280B2 (ja) * 1997-05-01 2007-04-04 矢崎総業株式会社 フレキシブル導電体の固定方法及び固定構造
JP2000030552A (ja) * 1998-07-10 2000-01-28 Sony Chem Corp フラットケーブル製造装置
JP3959946B2 (ja) * 2000-10-04 2007-08-15 住友電装株式会社 フラットケーブルの製造方法およびフラットケーブル

Also Published As

Publication number Publication date
US6737586B2 (en) 2004-05-18
EP1172826A2 (de) 2002-01-16
US20030106706A1 (en) 2003-06-12
US20020017366A1 (en) 2002-02-14
US6585836B2 (en) 2003-07-01
EP1172826A3 (de) 2003-01-29
EP1172826B1 (de) 2008-10-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee