DE60137007D1 - Einrichtung zum Halten eines Substrats - Google Patents

Einrichtung zum Halten eines Substrats

Info

Publication number
DE60137007D1
DE60137007D1 DE60137007T DE60137007T DE60137007D1 DE 60137007 D1 DE60137007 D1 DE 60137007D1 DE 60137007 T DE60137007 T DE 60137007T DE 60137007 T DE60137007 T DE 60137007T DE 60137007 D1 DE60137007 D1 DE 60137007D1
Authority
DE
Germany
Prior art keywords
holding
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60137007T
Other languages
English (en)
Inventor
Tetsuji Togawa
Ikutaro Noji
Keisuke Namiki
Hozumi Yasuda
Shunichiro Kojima
Kunihiko Sakurai
Nobuyuki Takada
Osamu Nabeya
Makoto Fukushima
Hideki Takayanagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Application granted granted Critical
Publication of DE60137007D1 publication Critical patent/DE60137007D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
DE60137007T 2000-10-11 2001-10-11 Einrichtung zum Halten eines Substrats Expired - Lifetime DE60137007D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000311071 2000-10-11
JP2001013899A JP2002187060A (ja) 2000-10-11 2001-01-22 基板保持装置、ポリッシング装置、及び研磨方法

Publications (1)

Publication Number Publication Date
DE60137007D1 true DE60137007D1 (de) 2009-01-29

Family

ID=26601900

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60137007T Expired - Lifetime DE60137007D1 (de) 2000-10-11 2001-10-11 Einrichtung zum Halten eines Substrats

Country Status (7)

Country Link
US (4) US6852019B2 (de)
EP (4) EP1944123B1 (de)
JP (1) JP2002187060A (de)
KR (5) KR100874148B1 (de)
DE (1) DE60137007D1 (de)
SG (1) SG97201A1 (de)
TW (1) TW576773B (de)

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JP2002208563A (ja) * 2001-01-09 2002-07-26 Ebara Corp 被加工物の加工装置及び加工方法
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JP3970561B2 (ja) 2001-07-10 2007-09-05 株式会社荏原製作所 基板保持装置及び基板研磨装置
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CN101306512A (zh) * 2002-12-27 2008-11-19 株式会社荏原制作所 基片抛光设备
KR100481872B1 (ko) * 2003-01-14 2005-04-11 삼성전자주식회사 폴리싱 헤드 및 화학적 기계적 연마 장치
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JP2005011977A (ja) 2003-06-18 2005-01-13 Ebara Corp 基板研磨装置および基板研磨方法
DE10394257D2 (de) * 2003-07-09 2006-05-18 Peter Wolters Surface Technolo Halter für flache Werkstücke, insbesondere Halbleiterwafer zum chemisch-mechanischen Polieren
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JP2005268566A (ja) * 2004-03-19 2005-09-29 Ebara Corp 化学機械研磨装置の基板把持機構のヘッド構造
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JP5248127B2 (ja) * 2008-01-30 2013-07-31 株式会社荏原製作所 研磨方法及び研磨装置
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JP5390807B2 (ja) * 2008-08-21 2014-01-15 株式会社荏原製作所 研磨方法および装置
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JP5392483B2 (ja) * 2009-08-31 2014-01-22 不二越機械工業株式会社 研磨装置
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US9706605B2 (en) * 2012-03-30 2017-07-11 Applied Materials, Inc. Substrate support with feedthrough structure
US9016675B2 (en) * 2012-07-06 2015-04-28 Asm Technology Singapore Pte Ltd Apparatus and method for supporting a workpiece during processing
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TWI628043B (zh) * 2014-03-27 2018-07-01 日商荏原製作所股份有限公司 彈性膜、基板保持裝置、及研磨裝置
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JP6463303B2 (ja) * 2016-05-13 2019-01-30 株式会社荏原製作所 弾性膜、基板保持装置、基板研磨装置、基板保持装置における基板吸着判定方法および圧力制御方法
JP2017094441A (ja) * 2015-11-24 2017-06-01 株式会社荏原製作所 基板研磨装置の校正方法、校正装置および校正プログラム
KR102160328B1 (ko) * 2017-02-01 2020-09-25 강준모 화학기계적연마장치용 캐리어헤드
CN208584374U (zh) * 2018-02-26 2019-03-08 凯斯科技股份有限公司 基板处理装置
JP7003838B2 (ja) * 2018-05-17 2022-01-21 株式会社Sumco 研磨ヘッド及びこれを用いたウェーハ研磨装置及び研磨方法
US20200055160A1 (en) * 2018-08-14 2020-02-20 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing method and apparatus
JP7349791B2 (ja) * 2019-01-16 2023-09-25 株式会社東京精密 Ｃｍｐ装置
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JP7352168B2 (ja) 2019-11-06 2023-09-28 三益半導体工業株式会社 搬送ヘッドおよび搬送装置
KR20210061273A (ko) * 2019-11-19 2021-05-27 가부시키가이샤 에바라 세이사꾸쇼 기판을 보유 지지하기 위한 톱링 및 기판 처리 장치
CN115135449A (zh) * 2020-06-26 2022-09-30 应用材料公司 可变形的基板卡盘
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CN111823129B (zh) * 2020-07-17 2021-11-19 中国科学院微电子研究所 研磨头气动装置及研磨头
CN112355887B (zh) * 2020-11-10 2021-09-17 蚌埠高华电子股份有限公司 一种磁吸定位式揭片辅助器及其使用方法
JP7296173B2 (ja) * 2021-03-17 2023-06-22 ミクロ技研株式会社 研磨ヘッド及び研磨処理装置
CN113977451B (zh) * 2021-10-25 2023-08-25 长鑫存储技术有限公司 半导体设备的检测系统及检测方法

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Also Published As

Publication number Publication date
EP1935566A3 (de) 2008-07-23
US20020042246A1 (en) 2002-04-11
US7083507B2 (en) 2006-08-01
KR100874712B1 (ko) 2008-12-18
US7491117B2 (en) 2009-02-17
KR100874148B1 (ko) 2008-12-15
EP1944123A3 (de) 2008-07-23
US7850509B2 (en) 2010-12-14
EP1852220A1 (de) 2007-11-07
EP1935566A2 (de) 2008-06-25
EP1197292A2 (de) 2002-04-17
EP1197292A3 (de) 2002-07-31
KR20080058318A (ko) 2008-06-25
KR20020028845A (ko) 2002-04-17
KR100973766B1 (ko) 2010-08-04
US20060234609A1 (en) 2006-10-19
US6852019B2 (en) 2005-02-08
EP1935566B1 (de) 2012-05-16
TW576773B (en) 2004-02-21
KR20090099037A (ko) 2009-09-21
KR101000420B1 (ko) 2010-12-13
US20090061748A1 (en) 2009-03-05
KR20090082329A (ko) 2009-07-30
KR100939555B1 (ko) 2010-01-29
EP1197292B1 (de) 2008-12-17
KR20080011240A (ko) 2008-01-31
JP2002187060A (ja) 2002-07-02
EP1944123B1 (de) 2011-07-13
US20050118935A1 (en) 2005-06-02
EP1944123A2 (de) 2008-07-16
SG97201A1 (en) 2003-07-18

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