DE60137033D1 - Eingekapselte anzeigevorrichtung - Google Patents

Eingekapselte anzeigevorrichtung

Info

Publication number
DE60137033D1
DE60137033D1 DE60137033T DE60137033T DE60137033D1 DE 60137033 D1 DE60137033 D1 DE 60137033D1 DE 60137033 T DE60137033 T DE 60137033T DE 60137033 T DE60137033 T DE 60137033T DE 60137033 D1 DE60137033 D1 DE 60137033D1
Authority
DE
Germany
Prior art keywords
display device
environmentally sensitive
sensitive display
encapsulated
barrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60137033T
Other languages
English (en)
Inventor
Gordon Lee Graff
Peter Maclyn Martin
Mark Edward Gross
Shi Pleasanton Ming-Kun
Michael Gene Hall
Eric Sidney Mast
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Display Co Ltd
Original Assignee
Battelle Memorial Institute Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Battelle Memorial Institute Inc filed Critical Battelle Memorial Institute Inc
Application granted granted Critical
Publication of DE60137033D1 publication Critical patent/DE60137033D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/562Protection against mechanical damage
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133308Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133311Environmental protection, e.g. against dust or humidity
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133337Layers preventing ion diffusion, e.g. by ion absorption
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701Low temperature co-fired ceramic [LTCC]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12044OLED
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10Primary casings, jackets or wrappings of a single cell or a single battery
    • H01M50/183Sealing members
    • H01M50/19Sealing members characterised by the material
    • H01M50/193Organic material
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries
DE60137033T 2000-04-20 2001-03-08 Eingekapselte anzeigevorrichtung Expired - Lifetime DE60137033D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/553,187 US6573652B1 (en) 1999-10-25 2000-04-20 Encapsulated display devices
PCT/US2001/007383 WO2001082389A1 (en) 2000-04-20 2001-03-08 Encapsulated display device

Publications (1)

Publication Number Publication Date
DE60137033D1 true DE60137033D1 (de) 2009-01-29

Family

ID=24208455

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60137033T Expired - Lifetime DE60137033D1 (de) 2000-04-20 2001-03-08 Eingekapselte anzeigevorrichtung

Country Status (9)

Country Link
US (2) US6573652B1 (de)
EP (1) EP1279197B1 (de)
JP (3) JP4115130B2 (de)
CN (2) CN100520538C (de)
AT (1) ATE418087T1 (de)
AU (1) AU2001243498A1 (de)
DE (1) DE60137033D1 (de)
TW (1) TW493290B (de)
WO (1) WO2001082389A1 (de)

Families Citing this family (163)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000026973A1 (en) * 1998-11-02 2000-05-11 Presstek, Inc. Transparent conductive oxides for plastic flat panel displays
US6228434B1 (en) 1998-12-16 2001-05-08 Battelle Memorial Institute Method of making a conformal coating of a microtextured surface
US6866901B2 (en) 1999-10-25 2005-03-15 Vitex Systems, Inc. Method for edge sealing barrier films
US6573652B1 (en) * 1999-10-25 2003-06-03 Battelle Memorial Institute Encapsulated display devices
US7198832B2 (en) 1999-10-25 2007-04-03 Vitex Systems, Inc. Method for edge sealing barrier films
US6413645B1 (en) * 2000-04-20 2002-07-02 Battelle Memorial Institute Ultrabarrier substrates
US20100330748A1 (en) 1999-10-25 2010-12-30 Xi Chu Method of encapsulating an environmentally sensitive device
US7008366B1 (en) * 2000-10-27 2006-03-07 Zymequest, Inc. Circumferentially driven continuous flow centrifuge
JP2001307873A (ja) * 2000-04-21 2001-11-02 Toppan Printing Co Ltd 有機エレクトロルミネッセンス表示素子およびその製造方法
US20020003403A1 (en) * 2000-04-25 2002-01-10 Ghosh Amalkumar P. Thin film encapsulation of organic light emitting diode devices
JP4023076B2 (ja) * 2000-07-27 2007-12-19 富士通株式会社 表裏導通基板及びその製造方法
EP1317165B1 (de) * 2000-08-23 2013-12-04 Idemitsu Kosan Co., Ltd. Organische elektrolumineszierende anzeigevorrichtung
US20050274322A1 (en) * 2001-02-26 2005-12-15 Lee Chung J Reactor for producing reactive intermediates for low dielectric constant polymer thin films
US6881447B2 (en) 2002-04-04 2005-04-19 Dielectric Systems, Inc. Chemically and electrically stabilized polymer films
JP2002280167A (ja) * 2001-03-16 2002-09-27 Pioneer Electronic Corp 有機el表示パネル
US7077935B2 (en) * 2001-05-04 2006-07-18 General Atomics O2 and H2O barrier material
US7211828B2 (en) * 2001-06-20 2007-05-01 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and electronic apparatus
TW548860B (en) * 2001-06-20 2003-08-21 Semiconductor Energy Lab Light emitting device and method of manufacturing the same
JP4166455B2 (ja) * 2001-10-01 2008-10-15 株式会社半導体エネルギー研究所 偏光フィルム及び発光装置
TW519853B (en) * 2001-10-17 2003-02-01 Chi Mei Electronic Corp Organic electro-luminescent display and its packaging method
JP2003140561A (ja) * 2001-10-30 2003-05-16 Seiko Epson Corp 電気光学装置及びその製造方法並びに電子機器
TW520616B (en) * 2001-12-31 2003-02-11 Ritdisplay Corp Manufacturing method of organic surface light emitting device
US7109653B2 (en) * 2002-01-15 2006-09-19 Seiko Epson Corporation Sealing structure with barrier membrane for electronic element, display device, electronic apparatus, and fabrication method for electronic element
US6891330B2 (en) * 2002-03-29 2005-05-10 General Electric Company Mechanically flexible organic electroluminescent device with directional light emission
EP1351321B1 (de) 2002-04-01 2013-12-25 Konica Corporation Träger und organisches elektrolumineszentes Bauelement mit einem solchen Träger
US20050158454A1 (en) * 2002-04-04 2005-07-21 Dielectric Systems, Inc. Method and system for forming an organic light-emitting device display having a plurality of passive polymer layers
US20070216300A1 (en) * 2002-04-04 2007-09-20 International Display Systems, Inc. Organic opto-electronic device with environmentally protective barrier
US20050174045A1 (en) * 2002-04-04 2005-08-11 Dielectric Systems, Inc. Organic light-emitting device display having a plurality of passive polymer layers
US8808457B2 (en) 2002-04-15 2014-08-19 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US8900366B2 (en) 2002-04-15 2014-12-02 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US7164155B2 (en) 2002-05-15 2007-01-16 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
KR100477745B1 (ko) * 2002-05-23 2005-03-18 삼성에스디아이 주식회사 유기 전계발광 소자의 봉지방법 및 이를 이용하는 유기전계발광 패널
US7649674B2 (en) 2002-06-10 2010-01-19 E Ink Corporation Electro-optic display with edge seal
TWI283914B (en) * 2002-07-25 2007-07-11 Toppoly Optoelectronics Corp Passivation structure
US7129635B2 (en) * 2002-08-06 2006-10-31 Rohm Co., Ltd. Organic EL display device with plural electrode segments
TW569644B (en) * 2002-08-06 2004-01-01 Chi Mei Optoelectronics Corp Plastic substrate for organic electroluminescent display element, manufacturing method thereof and organic electroluminescent display element made by the substrate
US7279239B2 (en) * 2002-08-07 2007-10-09 Kabushiki Kaisha Toyota Chuo Kenkyusho Laminating product including adhesion layer and laminate product including protective film
US20070264564A1 (en) 2006-03-16 2007-11-15 Infinite Power Solutions, Inc. Thin film battery on an integrated circuit or circuit board and method thereof
US8431264B2 (en) 2002-08-09 2013-04-30 Infinite Power Solutions, Inc. Hybrid thin-film battery
US9793523B2 (en) 2002-08-09 2017-10-17 Sapurast Research Llc Electrochemical apparatus with barrier layer protected substrate
US8021778B2 (en) 2002-08-09 2011-09-20 Infinite Power Solutions, Inc. Electrochemical apparatus with barrier layer protected substrate
US8445130B2 (en) 2002-08-09 2013-05-21 Infinite Power Solutions, Inc. Hybrid thin-film battery
US8236443B2 (en) 2002-08-09 2012-08-07 Infinite Power Solutions, Inc. Metal film encapsulation
US8404376B2 (en) 2002-08-09 2013-03-26 Infinite Power Solutions, Inc. Metal film encapsulation
US8394522B2 (en) 2002-08-09 2013-03-12 Infinite Power Solutions, Inc. Robust metal film encapsulation
US6929864B2 (en) 2002-08-17 2005-08-16 3M Innovative Properties Company Extensible, visible light-transmissive and infrared-reflective film and methods of making and using the film
US7215473B2 (en) * 2002-08-17 2007-05-08 3M Innovative Properties Company Enhanced heat mirror films
US6933051B2 (en) * 2002-08-17 2005-08-23 3M Innovative Properties Company Flexible electrically conductive film
US8704211B2 (en) * 2004-06-30 2014-04-22 General Electric Company High integrity protective coatings
US8691371B2 (en) 2002-09-11 2014-04-08 General Electric Company Barrier coating and method
US7449246B2 (en) 2004-06-30 2008-11-11 General Electric Company Barrier coatings
WO2004025997A1 (ja) * 2002-09-13 2004-03-25 Dai Nippon Printing Co., Ltd. El素子、それを用いた表示体
US7972663B2 (en) * 2002-12-20 2011-07-05 Applied Materials, Inc. Method and apparatus for forming a high quality low temperature silicon nitride layer
AU2003299989A1 (en) * 2002-12-27 2004-07-29 Add-Vision, Inc. Method for encapsulation of light emitting polyme devices and apparatus made by same
DE60323158D1 (de) * 2003-02-26 2008-10-02 Horkos Corp Maschinenwerkzeug mit beweglicher säule und abgeschirmtem bearbeitungsplatz
US7229703B2 (en) * 2003-03-31 2007-06-12 Dai Nippon Printing Co. Ltd. Gas barrier substrate
US7018713B2 (en) * 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US7202602B2 (en) * 2003-04-08 2007-04-10 Organic Lighting Technologies Llc Metal seal packaging for organic light emitting diode device
US7648925B2 (en) * 2003-04-11 2010-01-19 Vitex Systems, Inc. Multilayer barrier stacks and methods of making multilayer barrier stacks
US6888172B2 (en) * 2003-04-11 2005-05-03 Eastman Kodak Company Apparatus and method for encapsulating an OLED formed on a flexible substrate
US8728285B2 (en) 2003-05-23 2014-05-20 Demaray, Llc Transparent conductive oxides
US20040238846A1 (en) * 2003-05-30 2004-12-02 Georg Wittmann Organic electronic device
WO2005006441A1 (en) * 2003-07-11 2005-01-20 Koninklijke Philips Electronics N.V. Encapsulation structure for display devices
US8722160B2 (en) * 2003-10-31 2014-05-13 Aeris Capital Sustainable Ip Ltd. Inorganic/organic hybrid nanolaminate barrier film
KR20060132630A (ko) * 2003-12-25 2006-12-21 후지 샤신 필름 가부시기가이샤 편광판 및 액정 디스플레이
KR100637147B1 (ko) * 2004-02-17 2006-10-23 삼성에스디아이 주식회사 박막의 밀봉부를 갖는 유기 전계 발광 표시장치, 그제조방법 및 막 형성장치
US8642455B2 (en) * 2004-02-19 2014-02-04 Matthew R. Robinson High-throughput printing of semiconductor precursor layer from nanoflake particles
WO2005081333A2 (en) * 2004-02-20 2005-09-01 Oc Oerlikon Balzers Ag Diffusion barrier layer and method for manufacturing a diffusion barrier layer
US8405193B2 (en) * 2004-04-02 2013-03-26 General Electric Company Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages
US8034419B2 (en) * 2004-06-30 2011-10-11 General Electric Company Method for making a graded barrier coating
US20090110892A1 (en) * 2004-06-30 2009-04-30 General Electric Company System and method for making a graded barrier coating
KR100601324B1 (ko) * 2004-07-27 2006-07-14 엘지전자 주식회사 유기 전계 발광 소자
US20090032108A1 (en) * 2007-03-30 2009-02-05 Craig Leidholm Formation of photovoltaic absorber layers on foil substrates
US20060063015A1 (en) * 2004-09-23 2006-03-23 3M Innovative Properties Company Protected polymeric film
KR100637198B1 (ko) 2004-11-25 2006-10-23 삼성에스디아이 주식회사 평판 표시장치 및 그 제조방법
KR100637197B1 (ko) 2004-11-25 2006-10-23 삼성에스디아이 주식회사 평판 표시장치 및 그 제조방법
US7959769B2 (en) 2004-12-08 2011-06-14 Infinite Power Solutions, Inc. Deposition of LiCoO2
TWI331634B (en) 2004-12-08 2010-10-11 Infinite Power Solutions Inc Deposition of licoo2
KR20060125307A (ko) * 2005-06-02 2006-12-06 삼성전자주식회사 표시장치용 기판, 이의 제조 방법 및 이를 갖는 표시장치
US7767498B2 (en) 2005-08-25 2010-08-03 Vitex Systems, Inc. Encapsulated devices and method of making
US7549905B2 (en) * 2005-09-30 2009-06-23 International Display Systems, Inc. Method of encapsulating an organic light emitting device
US7621794B2 (en) * 2005-11-09 2009-11-24 International Display Systems, Inc. Method of encapsulating an organic light-emitting device
US8003999B2 (en) * 2005-12-30 2011-08-23 Samsung Mobile Display Co., Ltd. Organic light emitting device
US20070164673A1 (en) * 2006-01-18 2007-07-19 Au Optronics Corporation Organic electro-luminescent display device and method for making same
DE102006015043A1 (de) * 2006-03-31 2007-10-11 Siemens Ag Verfahren zum Verkapseln eines organischen photoaktiven Bauteils und Verkapselung eines photoaktiven elektronischen Bauteils
US8158450B1 (en) * 2006-05-05 2012-04-17 Nanosolar, Inc. Barrier films and high throughput manufacturing processes for photovoltaic devices
GB0614341D0 (en) 2006-07-19 2006-08-30 Plastic Logic Ltd Encapsulation for flexible displays
US20080048178A1 (en) * 2006-08-24 2008-02-28 Bruce Gardiner Aitken Tin phosphate barrier film, method, and apparatus
EP2067163A4 (de) 2006-09-29 2009-12-02 Infinite Power Solutions Inc Maskierung von flexiblen substraten und materialbeschränkung zum aufbringen von batterieschichten auf diese
US8197781B2 (en) 2006-11-07 2012-06-12 Infinite Power Solutions, Inc. Sputtering target of Li3PO4 and method for producing same
KR100824881B1 (ko) * 2006-11-10 2008-04-23 삼성에스디아이 주식회사 유기 전계 발광 표시 장치 및 그 제조 방법
US20080138624A1 (en) * 2006-12-06 2008-06-12 General Electric Company Barrier layer, composite article comprising the same, electroactive device, and method
BRPI0721299B1 (pt) 2006-12-28 2018-07-24 3M Innovative Properties Company. Método para formação de um filme condutivo em um suporte de polímero flexível, filme condutivo e método para a fabricação de um artigo de vitrificação
JP5249240B2 (ja) * 2006-12-29 2013-07-31 スリーエム イノベイティブ プロパティズ カンパニー 金属アルコキシド含有フィルムの硬化方法
KR20170019491A (ko) * 2006-12-29 2017-02-21 쓰리엠 이노베이티브 프로퍼티즈 컴파니 무기 또는 무기/유기 하이브리드 필름의 제조 방법
US20100178490A1 (en) * 2007-03-28 2010-07-15 Glenn Cerny Roll-to-roll plasma enhanced chemical vapor deposition method of barrier layers comprising silicon and carbon
WO2008147191A1 (en) * 2007-06-01 2008-12-04 Polymer Vision Limited A multilayer structure comprising a chemically inert protective layer
KR100875099B1 (ko) * 2007-06-05 2008-12-19 삼성모바일디스플레이주식회사 유기 발광 장치 및 이의 제조 방법
US20090139567A1 (en) * 2007-11-29 2009-06-04 Philip Chihchau Liu Conformal protective coating for solar panel
KR100832847B1 (ko) * 2007-12-21 2008-05-28 (주)누리셀 평탄화 유기 박막 및 컨포멀 유기 박막을 포함하는 다층봉지막
US8268488B2 (en) 2007-12-21 2012-09-18 Infinite Power Solutions, Inc. Thin film electrolyte for thin film batteries
KR20150128817A (ko) 2007-12-21 2015-11-18 사푸라스트 리써치 엘엘씨 전해질 막을 위한 표적을 스퍼터링하는 방법
JP2011508062A (ja) * 2007-12-28 2011-03-10 スリーエム イノベイティブ プロパティズ カンパニー 可撓性封入フィルムシステム
JP5705549B2 (ja) 2008-01-11 2015-04-22 インフィニット パワー ソリューションズ, インコーポレイテッド 薄膜電池および他のデバイスのための薄膜カプセル化
CN101983469B (zh) 2008-04-02 2014-06-04 无穷动力解决方案股份有限公司 与能量采集关联的储能装置的无源过电压/欠电压控制和保护
GB2459888B (en) * 2008-05-09 2011-06-08 Design Led Products Ltd Capacitive sensing apparatus
US8350451B2 (en) * 2008-06-05 2013-01-08 3M Innovative Properties Company Ultrathin transparent EMI shielding film comprising a polymer basecoat and crosslinked polymer transparent dielectric layer
EP2304069A4 (de) * 2008-06-30 2012-01-04 3M Innovative Properties Co Verfahren zur herstellung von anorganischen barrierefilmen oder anorganisch/organischen hybridbarrierefilmen
JP2008251552A (ja) * 2008-07-16 2008-10-16 Seiko Epson Corp 発光装置及び電子機器
WO2010019577A1 (en) 2008-08-11 2010-02-18 Infinite Power Solutions, Inc. Energy device with integral collector surface for electromagnetic energy harvesting and method thereof
JP5650646B2 (ja) 2008-09-12 2015-01-07 インフィニット パワー ソリューションズ, インコーポレイテッド 電磁エネルギーを介したデータ通信のための一体型伝導性表面を有するエネルギーデバイスおよび電磁エネルギーを介したデータ通信のための方法
FR2936651B1 (fr) * 2008-09-30 2011-04-08 Commissariat Energie Atomique Dispositif optoelectronique organique et son procede d'encapsulation.
US8508193B2 (en) 2008-10-08 2013-08-13 Infinite Power Solutions, Inc. Environmentally-powered wireless sensor module
US9184410B2 (en) 2008-12-22 2015-11-10 Samsung Display Co., Ltd. Encapsulated white OLEDs having enhanced optical output
US9337446B2 (en) 2008-12-22 2016-05-10 Samsung Display Co., Ltd. Encapsulated RGB OLEDs having enhanced optical output
US20100253902A1 (en) 2009-04-07 2010-10-07 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device and manufacturing method thereof
US8911653B2 (en) 2009-05-21 2014-12-16 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing light-emitting device
TWI463680B (zh) * 2009-06-22 2014-12-01 Nexpower Technology Corp Transparent thin film solar cells
WO2011006018A2 (en) 2009-07-08 2011-01-13 Plasmasi, Inc. Apparatus and method for plasma processing
KR101792287B1 (ko) 2009-09-01 2017-10-31 사푸라스트 리써치 엘엘씨 집적된 박막 배터리를 갖는 인쇄 회로 보드
FR2949775B1 (fr) 2009-09-10 2013-08-09 Saint Gobain Performance Plast Substrat de protection pour dispositif collecteur ou emetteur de rayonnement
FR2949776B1 (fr) 2009-09-10 2013-05-17 Saint Gobain Performance Plast Element en couches pour l'encapsulation d'un element sensible
KR101084230B1 (ko) * 2009-11-16 2011-11-16 삼성모바일디스플레이주식회사 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법
US8590338B2 (en) 2009-12-31 2013-11-26 Samsung Mobile Display Co., Ltd. Evaporator with internal restriction
JP5381734B2 (ja) * 2010-01-14 2014-01-08 コニカミノルタ株式会社 バリア性フィルム及び有機電子デバイス
KR101127595B1 (ko) 2010-05-04 2012-03-23 삼성모바일디스플레이주식회사 유기 발광 표시 장치 및 그 제조방법
KR101930561B1 (ko) 2010-06-07 2018-12-18 사푸라스트 리써치 엘엘씨 재충전 가능한 고밀도 전기 화학 장치
US8766240B2 (en) * 2010-09-21 2014-07-01 Universal Display Corporation Permeation barrier for encapsulation of devices and substrates
KR101752876B1 (ko) * 2010-12-16 2017-07-03 삼성디스플레이 주식회사 유기 발광 표시 장치
US11038144B2 (en) 2010-12-16 2021-06-15 Samsung Display Co., Ltd. Organic light-emitting display apparatus
US8765232B2 (en) 2011-01-10 2014-07-01 Plasmasi, Inc. Apparatus and method for dielectric deposition
US8772066B2 (en) * 2011-02-08 2014-07-08 Applied Materials, Inc. Method for hybrid encapsulation of an organic light emitting diode
FR2973940A1 (fr) * 2011-04-08 2012-10-12 Saint Gobain Element en couches pour l’encapsulation d’un element sensible
FR2973939A1 (fr) * 2011-04-08 2012-10-12 Saint Gobain Element en couches pour l’encapsulation d’un element sensible
KR20120138307A (ko) * 2011-06-14 2012-12-26 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
JP5907722B2 (ja) 2011-12-23 2016-04-26 株式会社半導体エネルギー研究所 発光装置の作製方法
CN103474579B (zh) * 2012-06-06 2016-12-28 第一毛织株式会社 阻障堆栈和它的制造方法
US9299956B2 (en) 2012-06-13 2016-03-29 Aixtron, Inc. Method for deposition of high-performance coatings and encapsulated electronic devices
US10526708B2 (en) 2012-06-19 2020-01-07 Aixtron Se Methods for forming thin protective and optical layers on substrates
JP6276266B2 (ja) 2012-08-08 2018-02-07 スリーエム イノベイティブ プロパティズ カンパニー 封入バリアフィルムを備える光起電装置
CN104768957B (zh) 2012-08-08 2019-01-22 3M创新有限公司 脲(多)-氨基甲酸酯(甲基)丙烯酸酯-硅烷组合物及包含所述组合物的制品
WO2014034749A1 (en) 2012-09-03 2014-03-06 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device
KR101951223B1 (ko) * 2012-10-26 2019-02-25 삼성디스플레이 주식회사 표시장치 및 그 제조방법
CN103855105B (zh) 2012-12-06 2017-04-26 财团法人工业技术研究院 环境敏感电子元件封装体及其制作方法
WO2014163773A1 (en) * 2013-03-11 2014-10-09 Applied Materials, Inc. Plasma curing of pecvd hmdso film for oled applications
CN104051357B (zh) 2013-03-15 2017-04-12 财团法人工业技术研究院 环境敏感电子装置以及其封装方法
JP2016523442A (ja) * 2013-06-29 2016-08-08 アイクストロン、エスイー 高性能コーティングの堆積方法及びカプセル化電子デバイス
CN103337595B (zh) * 2013-07-04 2016-04-06 上海和辉光电有限公司 柔性封装衬底及其制造方法和使用该衬底的oled封装方法
KR101402355B1 (ko) * 2014-01-16 2014-06-02 (주)휴넷플러스 유기 전자 소자 및 이의 제조방법
TWI620360B (zh) 2014-02-18 2018-04-01 緯創資通股份有限公司 電子元件封裝體及其製作方法
US20160064299A1 (en) * 2014-08-29 2016-03-03 Nishant Lakhera Structure and method to minimize warpage of packaged semiconductor devices
WO2016044078A1 (en) * 2014-09-15 2016-03-24 3M Innovative Properties Company Multilayer oled cover sheet
KR102182521B1 (ko) * 2014-12-30 2020-11-24 코오롱글로텍주식회사 고유연성 배리어 섬유기판 및 그의 제조방법
KR102379573B1 (ko) * 2015-12-30 2022-03-25 코오롱글로텍주식회사 롤투롤 코팅을 이용한 섬유기반 배리어 기판의 제조 방법
US20170358445A1 (en) 2016-06-13 2017-12-14 Gvd Corporation Methods for plasma depositing polymers comprising cyclic siloxanes and related compositions and articles
US11679412B2 (en) 2016-06-13 2023-06-20 Gvd Corporation Methods for plasma depositing polymers comprising cyclic siloxanes and related compositions and articles
KR102550694B1 (ko) 2016-07-12 2023-07-04 삼성디스플레이 주식회사 플렉서블 표시 장치 및 이의 제조 방법
CN109037250B (zh) * 2017-06-12 2021-11-05 上海耕岩智能科技有限公司 一种影像侦测显示装置、器件及其制备方法
TWI634468B (zh) * 2017-08-18 2018-09-01 財團法人工業技術研究院 透明顯示裝置
CN109524361B (zh) * 2017-09-20 2020-12-04 Tcl科技集团股份有限公司 封装薄膜、电子装置及电子装置的制备方法
GB2567873A (en) * 2017-10-27 2019-05-01 Flexenable Ltd Air species barriers in liquid crystal display devices
CN107994131A (zh) * 2017-11-28 2018-05-04 武汉华星光电半导体显示技术有限公司 用于封装oled器件的封装结构、显示装置
US20220334448A1 (en) * 2021-04-16 2022-10-20 E Ink Corporation Electrophoretic display with low profile edge seal

Family Cites Families (97)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US125822A (en) * 1872-04-16 Improvement in straw-cutters
US3475307A (en) 1965-02-04 1969-10-28 Continental Can Co Condensation of monomer vapors to increase polymerization rates in a glow discharge
FR1393629A (fr) 1965-09-13 1965-03-26 Continental Oil Co Procédé et appareil pour enduire des feuilles en matières solides
US3607365A (en) 1969-05-12 1971-09-21 Minnesota Mining & Mfg Vapor phase method of coating substrates with polymeric coating
US4098965A (en) 1977-01-24 1978-07-04 Polaroid Corporation Flat batteries and method of making the same
US4266223A (en) * 1978-12-08 1981-05-05 W. H. Brady Co. Thin panel display
JPS55129345A (en) 1979-03-29 1980-10-07 Ulvac Corp Electron beam plate making method by vapor phase film formation and vapor phase development
US4581337A (en) 1983-07-07 1986-04-08 E. I. Du Pont De Nemours And Company Polyether polyamines as linking agents for particle reagents useful in immunoassays
US4842893A (en) 1983-12-19 1989-06-27 Spectrum Control, Inc. High speed process for coating substrates
US5032461A (en) 1983-12-19 1991-07-16 Spectrum Control, Inc. Method of making a multi-layered article
DE3571772D1 (en) 1984-03-21 1989-08-31 Ulvac Corp Improvements in or relating to the covering of substrates with synthetic resin films
US4695618A (en) 1986-05-23 1987-09-22 Ameron, Inc. Solventless polyurethane spray compositions and method for applying them
DE3786063T2 (de) 1986-06-23 1993-09-09 Spectrum Control Inc Bedampfen von fluessigen monomeren.
US4954371A (en) 1986-06-23 1990-09-04 Spectrum Control, Inc. Flash evaporation of monomer fluids
JPH07105034B2 (ja) 1986-11-28 1995-11-13 株式会社日立製作所 磁気記録体
US4768666A (en) * 1987-05-26 1988-09-06 Milton Kessler Tamper proof container closure
JP2627619B2 (ja) 1987-07-13 1997-07-09 日本電信電話株式会社 有機非晶質膜作製方法
US4847469A (en) 1987-07-15 1989-07-11 The Boc Group, Inc. Controlled flow vaporizer
JP2742057B2 (ja) 1988-07-14 1998-04-22 シャープ株式会社 薄膜elパネル
JPH02183230A (ja) 1989-01-09 1990-07-17 Sharp Corp 有機非線形光学材料及びその製造方法
US5189405A (en) 1989-01-26 1993-02-23 Sharp Kabushiki Kaisha Thin film electroluminescent panel
JPH02235019A (ja) * 1989-03-09 1990-09-18 Toshiba Corp 液晶表示装置
JP2678055B2 (ja) 1989-03-30 1997-11-17 シャープ株式会社 有機化合物薄膜の製法
US5792550A (en) 1989-10-24 1998-08-11 Flex Products, Inc. Barrier film having high colorless transparency and method
US5036249A (en) 1989-12-11 1991-07-30 Molex Incorporated Electroluminescent lamp panel and method of fabricating same
US5362328A (en) 1990-07-06 1994-11-08 Advanced Technology Materials, Inc. Apparatus and method for delivering reagents in vapor form to a CVD reactor, incorporating a cleaning subsystem
US5711816A (en) 1990-07-06 1998-01-27 Advanced Technolgy Materials, Inc. Source reagent liquid delivery apparatus, and chemical vapor deposition system comprising same
US5059861A (en) * 1990-07-26 1991-10-22 Eastman Kodak Company Organic electroluminescent device with stabilizing cathode capping layer
JP2755844B2 (ja) 1991-09-30 1998-05-25 シャープ株式会社 プラスチック基板液晶表示素子
US5372851A (en) 1991-12-16 1994-12-13 Matsushita Electric Industrial Co., Ltd. Method of manufacturing a chemically adsorbed film
US5759329A (en) 1992-01-06 1998-06-02 Pilot Industries, Inc. Fluoropolymer composite tube and method of preparation
JP2958186B2 (ja) 1992-04-20 1999-10-06 シャープ株式会社 プラスチック基板液晶表示素子
US5427638A (en) 1992-06-04 1995-06-27 Alliedsignal Inc. Low temperature reaction bonding
GB9215928D0 (en) 1992-07-27 1992-09-09 Cambridge Display Tech Ltd Manufacture of electroluminescent devices
US5260095A (en) 1992-08-21 1993-11-09 Battelle Memorial Institute Vacuum deposition and curing of liquid monomers
DE4232390A1 (de) 1992-09-26 1994-03-31 Roehm Gmbh Verfahren zum Erzeugen von siliciumoxidischen kratzfesten Schichten auf Kunststoffen durch Plasmabeschichtung
JPH06182935A (ja) 1992-12-18 1994-07-05 Bridgestone Corp ガスバリア性ゴム積層物及びその製造方法
JPH06234186A (ja) * 1993-02-10 1994-08-23 Mitsui Toatsu Chem Inc 高ガスバリヤー性透明電極フィルム
BR9407741A (pt) 1993-10-04 1997-02-12 Catalina Coatings Inc Revestimento de acrilato
US5440446A (en) 1993-10-04 1995-08-08 Catalina Coatings, Inc. Acrylate coating material
US5654084A (en) 1994-07-22 1997-08-05 Martin Marietta Energy Systems, Inc. Protective coatings for sensitive materials
JP3385292B2 (ja) * 1994-09-02 2003-03-10 株式会社クラレ 多層構造体およびその用途
US6083628A (en) 1994-11-04 2000-07-04 Sigma Laboratories Of Arizona, Inc. Hybrid polymer film
JP3565929B2 (ja) * 1994-12-27 2004-09-15 大日本印刷株式会社 液晶表示素子用プラスチック基板
US5607789A (en) 1995-01-23 1997-03-04 Duracell Inc. Light transparent multilayer moisture barrier for electrochemical cell tester and cell employing same
US5620524A (en) 1995-02-27 1997-04-15 Fan; Chiko Apparatus for fluid delivery in chemical vapor deposition systems
US5811183A (en) 1995-04-06 1998-09-22 Shaw; David G. Acrylate polymer release coated sheet materials and method of production thereof
US5771562A (en) 1995-05-02 1998-06-30 Motorola, Inc. Passivation of organic devices
US5554220A (en) 1995-05-19 1996-09-10 The Trustees Of Princeton University Method and apparatus using organic vapor phase deposition for the growth of organic thin films with large optical non-linearities
JPH08325713A (ja) 1995-05-30 1996-12-10 Matsushita Electric Works Ltd 有機質基材表面への金属膜形成方法
US5629389A (en) 1995-06-06 1997-05-13 Hewlett-Packard Company Polymer-based electroluminescent device with improved stability
CZ415997A3 (cs) 1995-06-30 1998-04-15 Commonwealth Scientific And Industrial Research Organisation Způsob zlepšení povrchu polymeru
US5681615A (en) 1995-07-27 1997-10-28 Battelle Memorial Institute Vacuum flash evaporated polymer composites
JPH0959763A (ja) 1995-08-25 1997-03-04 Matsushita Electric Works Ltd 有機質基材表面への金属膜形成方法
US5723219A (en) 1995-12-19 1998-03-03 Talison Research Plasma deposited film networks
DE19603746A1 (de) 1995-10-20 1997-04-24 Bosch Gmbh Robert Elektrolumineszierendes Schichtsystem
US5686360A (en) * 1995-11-30 1997-11-11 Motorola Passivation of organic devices
US5811177A (en) 1995-11-30 1998-09-22 Motorola, Inc. Passivation of electroluminescent organic devices
US5684084A (en) 1995-12-21 1997-11-04 E. I. Du Pont De Nemours And Company Coating containing acrylosilane polymer to improve mar and acid etch resistance
US6195142B1 (en) * 1995-12-28 2001-02-27 Matsushita Electrical Industrial Company, Ltd. Organic electroluminescence element, its manufacturing method, and display device using organic electroluminescence element
US5955161A (en) 1996-01-30 1999-09-21 Becton Dickinson And Company Blood collection tube assembly
JP3093627B2 (ja) * 1996-02-09 2000-10-03 キヤノン株式会社 液晶表示装置の製造方法
US5731661A (en) 1996-07-15 1998-03-24 Motorola, Inc. Passivation of electroluminescent organic devices
US5902688A (en) 1996-07-16 1999-05-11 Hewlett-Packard Company Electroluminescent display device
US5693956A (en) 1996-07-29 1997-12-02 Motorola Inverted oleds on hard plastic substrate
US5844363A (en) 1997-01-23 1998-12-01 The Trustees Of Princeton Univ. Vacuum deposited, non-polymeric flexible organic light emitting devices
US5948552A (en) 1996-08-27 1999-09-07 Hewlett-Packard Company Heat-resistant organic electroluminescent device
WO1998010116A1 (en) 1996-09-05 1998-03-12 Talison Research Ultrasonic nozzle feed for plasma deposited film networks
KR19980033213A (ko) 1996-10-31 1998-07-25 조셉제이.스위니 스퍼터링 챔버내의 미립자 물질 발생 감소 방법
US5821692A (en) 1996-11-26 1998-10-13 Motorola, Inc. Organic electroluminescent device hermetic encapsulation package
US5912069A (en) 1996-12-19 1999-06-15 Sigma Laboratories Of Arizona Metal nanolaminate composite
US5952778A (en) 1997-03-18 1999-09-14 International Business Machines Corporation Encapsulated organic light emitting device
US5872355A (en) 1997-04-09 1999-02-16 Hewlett-Packard Company Electroluminescent device and fabrication method for a light detection system
JP3290375B2 (ja) 1997-05-12 2002-06-10 松下電器産業株式会社 有機電界発光素子
JPH112812A (ja) * 1997-06-12 1999-01-06 Toshiba Corp 反射型導電性基板、反射型液晶表示装置、及び反射型導電性基板の製造方法
JP3743876B2 (ja) * 1997-07-16 2006-02-08 カシオ計算機株式会社 電界発光素子及びその製造方法
US5965907A (en) 1997-09-29 1999-10-12 Motorola, Inc. Full color organic light emitting backlight device for liquid crystal display applications
US6224948B1 (en) 1997-09-29 2001-05-01 Battelle Memorial Institute Plasma enhanced chemical deposition with low vapor pressure compounds
US5902641A (en) 1997-09-29 1999-05-11 Battelle Memorial Institute Flash evaporation of liquid monomer particle mixture
DE69813144T2 (de) * 1997-11-07 2003-12-04 Rohm & Haas Kunstoffsubstrate zur Verwendung in elektronischen Anzeigesystemen
EP0916394B1 (de) 1997-11-14 2004-03-10 Sharp Kabushiki Kaisha Verfahren und Einrichtung zur Hertellung von modifizierten Partikeln
KR100249784B1 (ko) * 1997-11-20 2000-04-01 정선종 고분자복합막을이용한유기물혹은고분자전기발광소자의패키징방법
US6045864A (en) 1997-12-01 2000-04-04 3M Innovative Properties Company Vapor coating method
DE19802740A1 (de) 1998-01-26 1999-07-29 Leybold Systems Gmbh Verfahren zur Behandlung von Oberflächen von Substraten aus Kunststoff
US5996498A (en) 1998-03-12 1999-12-07 Presstek, Inc. Method of lithographic imaging with reduced debris-generated performance degradation and related constructions
US6004660A (en) * 1998-03-12 1999-12-21 E.I. Du Pont De Nemours And Company Oxygen barrier composite film structure
US5904958A (en) 1998-03-20 1999-05-18 Rexam Industries Corp. Adjustable nozzle for evaporation or organic monomers
US6146225A (en) 1998-07-30 2000-11-14 Agilent Technologies, Inc. Transparent, flexible permeability barrier for organic electroluminescent devices
US6084702A (en) * 1998-10-15 2000-07-04 Pleotint, L.L.C. Thermochromic devices
TW439308B (en) 1998-12-16 2001-06-07 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
US6268695B1 (en) * 1998-12-16 2001-07-31 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
US6083313A (en) * 1999-07-27 2000-07-04 Advanced Refractory Technologies, Inc. Hardcoats for flat panel display substrates
US6413645B1 (en) 2000-04-20 2002-07-02 Battelle Memorial Institute Ultrabarrier substrates
US6573652B1 (en) 1999-10-25 2003-06-03 Battelle Memorial Institute Encapsulated display devices
US6548912B1 (en) 1999-10-25 2003-04-15 Battelle Memorial Institute Semicoductor passivation using barrier coatings
JP4468546B2 (ja) * 2000-04-13 2010-05-26 三井化学株式会社 透明電極
US6492026B1 (en) 2000-04-20 2002-12-10 Battelle Memorial Institute Smoothing and barrier layers on high Tg substrates

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US20030104753A1 (en) 2003-06-05
ATE418087T1 (de) 2009-01-15
JP2008181088A (ja) 2008-08-07
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US6573652B1 (en) 2003-06-03
CN100520538C (zh) 2009-07-29
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