DE602004005598D1 - Verfahren zur herstellung einer midplane - Google Patents

Verfahren zur herstellung einer midplane

Info

Publication number
DE602004005598D1
DE602004005598D1 DE602004005598T DE602004005598T DE602004005598D1 DE 602004005598 D1 DE602004005598 D1 DE 602004005598D1 DE 602004005598 T DE602004005598 T DE 602004005598T DE 602004005598 T DE602004005598 T DE 602004005598T DE 602004005598 D1 DE602004005598 D1 DE 602004005598D1
Authority
DE
Germany
Prior art keywords
layer
dielectric layer
layer board
connector area
connection assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE602004005598T
Other languages
English (en)
Other versions
DE602004005598T2 (de
Inventor
Gerald A Hermkens
Roger Theelen
Marcel Smeets
Frank Speetjens
Peter J Thoolen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Viasystems Group Inc
Original Assignee
Viasystems Group Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Viasystems Group Inc filed Critical Viasystems Group Inc
Publication of DE602004005598D1 publication Critical patent/DE602004005598D1/de
Application granted granted Critical
Publication of DE602004005598T2 publication Critical patent/DE602004005598T2/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/044—Details of backplane or midplane for mounting orthogonal PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09127—PCB or component having an integral separable or breakable part
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10878—Means for retention of a lead in a hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
DE602004005598T 2003-07-08 2004-07-08 Verfahren zur herstellung einer midplane Expired - Fee Related DE602004005598T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US48576503P 2003-07-08 2003-07-08
US485765P 2003-07-08
PCT/IB2004/002560 WO2005004570A1 (en) 2003-07-08 2004-07-08 Method for manufacturing a midplane

Publications (2)

Publication Number Publication Date
DE602004005598D1 true DE602004005598D1 (de) 2007-05-10
DE602004005598T2 DE602004005598T2 (de) 2008-01-24

Family

ID=33564053

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004005598T Expired - Fee Related DE602004005598T2 (de) 2003-07-08 2004-07-08 Verfahren zur herstellung einer midplane

Country Status (10)

Country Link
US (2) US7172805B2 (de)
EP (1) EP1647170B1 (de)
JP (1) JP2007516593A (de)
CN (1) CN100475012C (de)
AT (1) ATE358411T1 (de)
AU (1) AU2004300569A1 (de)
DE (1) DE602004005598T2 (de)
ES (1) ES2284031T3 (de)
PL (1) PL1647170T3 (de)
WO (1) WO2005004570A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100665298B1 (ko) * 2004-06-10 2007-01-04 서울반도체 주식회사 발광장치
FR3034219B1 (fr) * 2015-03-23 2018-04-06 Safran Electronics & Defense Carte electronique de fond de panier et calculateur electronique associe
DE102015113322B3 (de) * 2015-08-12 2016-11-17 Schweizer Electronic Ag Hochfrequenzantenne, Hochfrequenzsubstrat mit Hochfrequenzantenne und Verfahren zur Herstellung
DE102015113324A1 (de) * 2015-08-12 2017-02-16 Schweizer Electronic Ag Leiterstrukturelement mit einlaminiertem Innenlagensubstrat und Verfahren zu dessen Herstellung
US20170318673A1 (en) * 2016-04-29 2017-11-02 Arista Networks, Inc. Connector for printed circuit board
FR3091136B1 (fr) * 2018-12-21 2022-01-21 Safran Electronics & Defense procédé de fabrication d'une carte électronique de fond de panier

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US3756891A (en) * 1967-12-26 1973-09-04 Multilayer circuit board techniques
US3610811A (en) * 1969-06-02 1971-10-05 Honeywell Inf Systems Printed circuit board with solder resist gas escape ports
US4030190A (en) * 1976-03-30 1977-06-21 International Business Machines Corporation Method for forming a multilayer printed circuit board
GB2101411B (en) * 1981-06-04 1985-06-05 Standard Telephones Cables Ltd Flexi-rigid printed circuit boards
US4478469A (en) * 1982-05-17 1984-10-23 Zero Corporation Card keying device
US4686607A (en) * 1986-01-08 1987-08-11 Teradyne, Inc. Daughter board/backplane assembly
US4943334A (en) * 1986-09-15 1990-07-24 Compositech Ltd. Method for making reinforced plastic laminates for use in the production of circuit boards
US5023754A (en) * 1990-01-19 1991-06-11 International Business Machines Corporation Double-sided backplane assembly
TW210422B (de) * 1991-06-04 1993-08-01 Akzo Nv
US5677515A (en) * 1991-10-18 1997-10-14 Trw Inc. Shielded multilayer printed wiring board, high frequency, high isolation
US5199879A (en) * 1992-02-24 1993-04-06 International Business Machines Corporation Electrical assembly with flexible circuit
US5573172A (en) * 1993-11-08 1996-11-12 Sawtek, Inc. Surface mount stress relief hidden lead package device and method
US5400220A (en) * 1994-05-18 1995-03-21 Dell Usa, L.P. Mechanical printed circuit board and ball grid array interconnect apparatus
US6016598A (en) * 1995-02-13 2000-01-25 Akzo Nobel N.V. Method of manufacturing a multilayer printed wire board
US5826329A (en) * 1995-12-19 1998-10-27 Ncr Corporation Method of making printed circuit board using thermal transfer techniques
US5784260A (en) * 1996-05-29 1998-07-21 International Business Machines Corporation Structure for constraining the flow of encapsulant applied to an I/C chip on a substrate
SE509938C2 (sv) * 1996-07-09 1999-03-29 Ericsson Telefon Ab L M Förfarande och anordning vid mönsterkort
US6135781A (en) * 1996-07-17 2000-10-24 Minnesota Mining And Manufacturing Company Electrical interconnection system and device
DE19957789A1 (de) * 1999-12-01 2001-06-21 Leoni Bordnetz Sys Gmbh & Co Kontaktierungssystem für zwei Leiterplatten
KR100333627B1 (ko) * 2000-04-11 2002-04-22 구자홍 다층 인쇄회로기판 및 그 제조방법
US6499214B2 (en) * 2000-05-26 2002-12-31 Visteon Global Tech, Inc. Method of making a circuit board
US6201305B1 (en) * 2000-06-09 2001-03-13 Amkor Technology, Inc. Making solder ball mounting pads on substrates
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US6535397B2 (en) * 2001-05-31 2003-03-18 Harris Corporation Interconnect structure for interconnecting electronic modules
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US6456498B1 (en) * 2001-08-07 2002-09-24 Hewlett-Packard Co. CompactPCI-based computer system with mid-plane connector for equivalent front and back loading
US20040108137A1 (en) * 2002-12-10 2004-06-10 Litton Systems, Inc. Cross connect via for multilayer printed circuit boards

Also Published As

Publication number Publication date
JP2007516593A (ja) 2007-06-21
ES2284031T3 (es) 2007-11-01
US20050109532A1 (en) 2005-05-26
DE602004005598T2 (de) 2008-01-24
US7172805B2 (en) 2007-02-06
CN1820557A (zh) 2006-08-16
AU2004300569A1 (en) 2005-01-13
WO2005004570A1 (en) 2005-01-13
CN100475012C (zh) 2009-04-01
PL1647170T3 (pl) 2007-08-31
EP1647170B1 (de) 2007-03-28
ATE358411T1 (de) 2007-04-15
US20060278430A1 (en) 2006-12-14
EP1647170A1 (de) 2006-04-19

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Legal Events

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8339 Ceased/non-payment of the annual fee