DE602004011000D1 - Prüfkopf zur Messung der elektrischen Eigenschaften und Verfahren zur dessen Herstellung - Google Patents

Prüfkopf zur Messung der elektrischen Eigenschaften und Verfahren zur dessen Herstellung

Info

Publication number
DE602004011000D1
DE602004011000D1 DE602004011000T DE602004011000T DE602004011000D1 DE 602004011000 D1 DE602004011000 D1 DE 602004011000D1 DE 602004011000 T DE602004011000 T DE 602004011000T DE 602004011000 T DE602004011000 T DE 602004011000T DE 602004011000 D1 DE602004011000 D1 DE 602004011000D1
Authority
DE
Germany
Prior art keywords
measuring
production
electrical properties
test head
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004011000T
Other languages
English (en)
Other versions
DE602004011000T2 (de
Inventor
Naoyuki Koizumi
Akinori Shiraishi
Kei Murayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Publication of DE602004011000D1 publication Critical patent/DE602004011000D1/de
Application granted granted Critical
Publication of DE602004011000T2 publication Critical patent/DE602004011000T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
DE602004011000T 2003-11-26 2004-11-12 Prüfkopf zur Messung der elektrischen Eigenschaften und Verfahren zur dessen Herstellung Active DE602004011000T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003395830A JP2005156365A (ja) 2003-11-26 2003-11-26 電気特性測定用プローブ及びその製造方法
JP2003395830 2003-11-26

Publications (2)

Publication Number Publication Date
DE602004011000D1 true DE602004011000D1 (de) 2008-02-14
DE602004011000T2 DE602004011000T2 (de) 2008-12-18

Family

ID=34463802

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004011000T Active DE602004011000T2 (de) 2003-11-26 2004-11-12 Prüfkopf zur Messung der elektrischen Eigenschaften und Verfahren zur dessen Herstellung

Country Status (4)

Country Link
US (1) US7330037B2 (de)
EP (1) EP1536241B1 (de)
JP (1) JP2005156365A (de)
DE (1) DE602004011000T2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7126361B1 (en) 2005-08-03 2006-10-24 Qualitau, Inc. Vertical probe card and air cooled probe head system
US20070089551A1 (en) * 2005-09-30 2007-04-26 Sv Probe Ptd. Ltd. Cantilever probe structure for a probe card assembly
EP1780550A1 (de) * 2005-10-31 2007-05-02 Capres A/S Sonde zum Testen elektrischer Eigenschaften von Testproben
KR100850274B1 (ko) * 2007-01-04 2008-08-04 삼성전자주식회사 반도체 칩 테스트를 위한 프로브 카드 및 이를 이용한반도체 칩 테스트 방법
JP5276895B2 (ja) * 2008-05-19 2013-08-28 新光電気工業株式会社 プローブカード及びその製造方法
JP2010117268A (ja) * 2008-11-13 2010-05-27 Nidec-Read Corp 検査用プローブ
US8232205B2 (en) * 2009-08-25 2012-07-31 Corning Incorporated Methods of manufacturing a honeycomb extrusion die
US8263895B2 (en) * 2009-08-28 2012-09-11 Corning Incorporated Electro-discharge electrode and method of use
JP2012047674A (ja) * 2010-08-30 2012-03-08 Advantest Corp 試験用個片基板、プローブ、及び半導体ウェハ試験装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4382228A (en) * 1974-07-15 1983-05-03 Wentworth Laboratories Inc. Probes for fixed point probe cards
JPH07114227B2 (ja) * 1989-01-07 1995-12-06 三菱電機株式会社 ウエハ試験用探触板
KR0138752B1 (ko) * 1990-09-03 1998-06-15 이노우에 아키라 프로우브 장치
US5414371A (en) * 1993-03-25 1995-05-09 Probes Associates, Inc. Semiconductor device test probe ring apparatus and method of manufacture
JPH077052A (ja) 1993-06-16 1995-01-10 Seiko Epson Corp 電気特性測定用プローブ
JP3054003B2 (ja) * 1993-09-01 2000-06-19 株式会社東芝 Ｉｃコンタクタ
JP2710544B2 (ja) * 1993-09-30 1998-02-10 インターナショナル・ビジネス・マシーンズ・コーポレイション プローブ構造、プローブ構造の形成方法
JP3838381B2 (ja) * 1995-11-22 2006-10-25 株式会社アドバンテスト プローブカード
JP3022312B2 (ja) * 1996-04-15 2000-03-21 日本電気株式会社 プローブカードの製造方法
US5989994A (en) * 1998-12-29 1999-11-23 Advantest Corp. Method for producing contact structures
US20020048973A1 (en) * 1998-11-30 2002-04-25 Yu Zhou Contact structure and production method thereof and probe contact assembly using same
US6255126B1 (en) * 1998-12-02 2001-07-03 Formfactor, Inc. Lithographic contact elements
JP2001091543A (ja) * 1999-09-27 2001-04-06 Hitachi Ltd 半導体検査装置
JP2001255340A (ja) 2000-03-13 2001-09-21 Yokowo Co Ltd コンタクトプローブ及び該コンタクトプローブを設けたｉｃパッケージ検査用ソケット
JP2002090390A (ja) * 2000-09-20 2002-03-27 Hitachi Ltd 半導体装置の検査装置及びそれを用いた半導体の製造方法
JP2002098736A (ja) * 2000-09-26 2002-04-05 Nec Corp 半導体デバイス試験装置
JP2002168904A (ja) 2000-12-01 2002-06-14 Hitachi Ltd 半導体装置の製造方法
US20040169521A1 (en) * 2001-08-02 2004-09-02 Rincon Reynaldo M. High density probe card apparatus and method of manufacture
US6998857B2 (en) * 2001-09-20 2006-02-14 Yamaha Corporation Probe unit and its manufacture
JP2003287553A (ja) * 2002-03-28 2003-10-10 Fujitsu Ltd プローブカード及びそれを製造するための基板

Also Published As

Publication number Publication date
JP2005156365A (ja) 2005-06-16
EP1536241A3 (de) 2006-07-05
US20050110507A1 (en) 2005-05-26
EP1536241B1 (de) 2008-01-02
US7330037B2 (en) 2008-02-12
DE602004011000T2 (de) 2008-12-18
EP1536241A2 (de) 2005-06-01

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Legal Events

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