DE602004027412D1 - Haltering mit geformter fläche - Google Patents

Haltering mit geformter fläche

Info

Publication number
DE602004027412D1
DE602004027412D1 DE602004027412T DE602004027412T DE602004027412D1 DE 602004027412 D1 DE602004027412 D1 DE 602004027412D1 DE 602004027412 T DE602004027412 T DE 602004027412T DE 602004027412 T DE602004027412 T DE 602004027412T DE 602004027412 D1 DE602004027412 D1 DE 602004027412D1
Authority
DE
Germany
Prior art keywords
ring
lapping
holding
shaped surface
retaining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004027412T
Other languages
English (en)
Inventor
Hung Chih Chen
Steven M Zuniga
Charles C Garretson
Douglas R Mcallister
Stacy Meyer
Jian Lin
Sidney P Huey
Jeonghoon Oh
Trung T Doan
Jeffrey Schmidt
Martin S Wohlert
Kerry F Hughes
James C Wang
Danny Cam Lu
Romain Beau Delamenie
Venkata R Balagani
Aden Martin Allen
Michael Jon Fong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of DE602004027412D1 publication Critical patent/DE602004027412D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
DE602004027412T 2003-11-13 2004-11-12 Haltering mit geformter fläche Active DE602004027412D1 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US52055503P 2003-11-13 2003-11-13
US55656904P 2004-03-26 2004-03-26
US58075804P 2004-06-17 2004-06-17
US58075904P 2004-06-17 2004-06-17
US60306804P 2004-08-19 2004-08-19
PCT/US2004/038083 WO2005049274A2 (en) 2003-11-13 2004-11-12 Retaining ring with shaped surface

Publications (1)

Publication Number Publication Date
DE602004027412D1 true DE602004027412D1 (de) 2010-07-08

Family

ID=34624074

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004027412T Active DE602004027412D1 (de) 2003-11-13 2004-11-12 Haltering mit geformter fläche

Country Status (9)

Country Link
US (9) US7344434B2 (de)
EP (3) EP2191936B1 (de)
JP (2) JP5296985B2 (de)
KR (1) KR101252751B1 (de)
CN (1) CN1910012B (de)
AT (1) ATE468941T1 (de)
DE (1) DE602004027412D1 (de)
TW (2) TWI496660B (de)
WO (1) WO2005049274A2 (de)

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US11260500B2 (en) * 2003-11-13 2022-03-01 Applied Materials, Inc. Retaining ring with shaped surface
JP5296985B2 (ja) 2003-11-13 2013-09-25 アプライド マテリアルズ インコーポレイテッド 整形面をもつリテーニングリング
CN101137464A (zh) * 2005-04-12 2008-03-05 日本精密电子株式会社 Cmp装置用挡圈及其制造方法、以及cmp装置
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US7727055B2 (en) 2006-11-22 2010-06-01 Applied Materials, Inc. Flexible membrane for carrier head
US8033895B2 (en) * 2007-07-19 2011-10-11 Applied Materials, Inc. Retaining ring with shaped profile
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US8998676B2 (en) * 2012-10-26 2015-04-07 Applied Materials, Inc. Retaining ring with selected stiffness and thickness
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US9233452B2 (en) 2012-10-29 2016-01-12 Wayne O. Duescher Vacuum-grooved membrane abrasive polishing wafer workholder
US9199354B2 (en) 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
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US20150021498A1 (en) * 2013-07-17 2015-01-22 Applied Materials, Inc. Chemical mechanical polishing retaining ring methods and apparatus
JP6403981B2 (ja) * 2013-11-13 2018-10-10 株式会社荏原製作所 基板保持装置、研磨装置、研磨方法、およびリテーナリング
CN104681472A (zh) * 2013-12-02 2015-06-03 有研新材料股份有限公司 一种载片圈
JP6336893B2 (ja) * 2014-11-11 2018-06-06 株式会社荏原製作所 研磨装置
US10105812B2 (en) * 2014-07-17 2018-10-23 Applied Materials, Inc. Polishing pad configuration and polishing pad support
CN104308537B (zh) * 2014-08-27 2017-01-25 北京蓝爱迪电力技术有限公司 一种l型汽封片成型装置及生产方法
US10252397B2 (en) 2014-10-30 2019-04-09 Applied Materials, Inc. Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes
CN105729298A (zh) * 2014-12-11 2016-07-06 宁波江丰电子材料股份有限公司 化学机械研磨用保持环的剥离方法
JP2016155188A (ja) * 2015-02-24 2016-09-01 株式会社荏原製作所 リテーナリング、基板保持装置、研磨装置およびリテーナリングのメンテナンス方法
SG10201601379WA (en) * 2015-03-19 2016-10-28 Applied Materials Inc Retaining ring for lower wafer defects
JP1546801S (de) * 2015-06-12 2016-03-28
TWD179095S (zh) * 2015-08-25 2016-10-21 荏原製作所股份有限公司 基板保持環
JP1556433S (de) * 2015-10-06 2016-08-15
JP6392193B2 (ja) * 2015-10-14 2018-09-19 株式会社荏原製作所 基板保持装置および基板研磨装置ならびに基板保持装置の製造方法
US9744640B2 (en) * 2015-10-16 2017-08-29 Applied Materials, Inc. Corrosion resistant retaining rings
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US10926378B2 (en) 2017-07-08 2021-02-23 Wayne O. Duescher Abrasive coated disk islands using magnetic font sheet
CN109420969B (zh) * 2017-08-29 2020-12-01 中芯国际集成电路制造(上海)有限公司 一种研磨头和化学机械研磨装置
US11400560B2 (en) * 2017-10-04 2022-08-02 Applied Materials, Inc. Retaining ring design
CN109693174A (zh) * 2017-10-23 2019-04-30 中芯国际集成电路制造(上海)有限公司 一种研磨头和化学机械研磨装置
JP7219009B2 (ja) * 2018-03-27 2023-02-07 株式会社荏原製作所 基板保持装置およびドライブリングの製造方法
KR101952829B1 (ko) * 2018-08-13 2019-02-27 최유섭 금속부품의 연마가공장치 및 이를 이용한 연마가공방법
EP3708300A1 (de) * 2019-03-15 2020-09-16 SABIC Global Technologies B.V. Haltering für ein chemisch-mechanisches polierverfahren, verfahren zur herstellung davon und chemisch-mechanisches poliersystem mit dem haltering
JP1651623S (de) * 2019-07-18 2020-01-27
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier
KR102304948B1 (ko) * 2020-01-13 2021-09-24 (주)제이쓰리 반도체 웨이퍼 형상을 제어하는 웨이퍼 가공용 헤드 장치
CN111347345B (zh) * 2020-04-16 2020-10-16 华海清科股份有限公司 一种用于化学机械抛光的保持环和承载头
WO2022010687A1 (en) 2020-07-08 2022-01-13 Applied Materials, Inc. Multi-toothed, magnetically controlled retaining ring
US11565367B2 (en) * 2020-07-09 2023-01-31 Applied Materials, Inc. Retaining ring
CN113478390B (zh) * 2021-07-27 2022-11-11 京东方杰恩特喜科技有限公司 抛光治具及抛光装置
CN113524027A (zh) * 2021-08-09 2021-10-22 北京烁科精微电子装备有限公司 晶圆保持件及研磨机
CN115106932B (zh) * 2021-11-10 2024-03-05 华海清科股份有限公司 一种化学机械抛光头和抛光设备
CN114952610B (zh) * 2021-11-10 2024-02-09 华海清科股份有限公司 一种用于化学机械抛光的承载头和抛光设备

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Also Published As

Publication number Publication date
WO2005049274B1 (en) 2005-12-29
CN1910012A (zh) 2007-02-07
US11850703B2 (en) 2023-12-26
EP2191936A3 (de) 2012-05-09
JP2007511377A (ja) 2007-05-10
EP2883656A1 (de) 2015-06-17
JP2013056416A (ja) 2013-03-28
US20160045997A1 (en) 2016-02-18
US7344434B2 (en) 2008-03-18
US20110195639A1 (en) 2011-08-11
ATE468941T1 (de) 2010-06-15
US20050191947A1 (en) 2005-09-01
KR101252751B1 (ko) 2013-04-09
CN1910012B (zh) 2012-03-21
US10766117B2 (en) 2020-09-08
EP2191936B1 (de) 2015-01-21
US8066551B2 (en) 2011-11-29
JP5296985B2 (ja) 2013-09-25
US8585468B2 (en) 2013-11-19
US20140053981A1 (en) 2014-02-27
US9186773B2 (en) 2015-11-17
EP1694464A2 (de) 2006-08-30
EP2191936A2 (de) 2010-06-02
TW200526353A (en) 2005-08-16
US7927190B2 (en) 2011-04-19
TWI496660B (zh) 2015-08-21
US20080196833A1 (en) 2008-08-21
EP1694464B1 (de) 2010-05-26
TW201136708A (en) 2011-11-01
EP2883656B1 (de) 2016-12-21
US20220152778A1 (en) 2022-05-19
KR20070011250A (ko) 2007-01-24
US20180185979A1 (en) 2018-07-05
JP5506894B2 (ja) 2014-05-28
US9937601B2 (en) 2018-04-10
WO2005049274A2 (en) 2005-06-02
WO2005049274A3 (en) 2005-11-03
TWI355984B (en) 2012-01-11
US11577361B2 (en) 2023-02-14
US20120071067A1 (en) 2012-03-22
US20230182261A1 (en) 2023-06-15

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