DE602005009957D1 - Rfid-einrichtung und herstellungsverfahren - Google Patents
Rfid-einrichtung und herstellungsverfahrenInfo
- Publication number
- DE602005009957D1 DE602005009957D1 DE602005009957T DE602005009957T DE602005009957D1 DE 602005009957 D1 DE602005009957 D1 DE 602005009957D1 DE 602005009957 T DE602005009957 T DE 602005009957T DE 602005009957 T DE602005009957 T DE 602005009957T DE 602005009957 D1 DE602005009957 D1 DE 602005009957D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- rfid device
- rfid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07756—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being non-galvanic, e.g. capacitive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/871,169 US7224280B2 (en) | 2002-12-31 | 2004-06-18 | RFID device and method of forming |
PCT/US2005/021631 WO2006009934A1 (en) | 2004-06-18 | 2005-06-20 | Rfid device and method of forming |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602005009957D1 true DE602005009957D1 (de) | 2008-11-06 |
Family
ID=35058758
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602005009957T Expired - Fee Related DE602005009957D1 (de) | 2004-06-18 | 2005-06-20 | Rfid-einrichtung und herstellungsverfahren |
Country Status (8)
Country | Link |
---|---|
US (2) | US7224280B2 (de) |
EP (1) | EP1769430B1 (de) |
KR (1) | KR20070034502A (de) |
CN (1) | CN1993703A (de) |
CA (1) | CA2571231A1 (de) |
DE (1) | DE602005009957D1 (de) |
ES (1) | ES2317271T3 (de) |
WO (1) | WO2006009934A1 (de) |
Families Citing this family (171)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7564409B2 (en) * | 2001-03-26 | 2009-07-21 | Ertek Inc. | Antennas and electrical connections of electrical devices |
EP1603757B1 (de) * | 2003-03-12 | 2014-12-10 | Bundesdruckerei GmbH | Verfahren zur herstellung einer buchdeckeneinlage und eines buchartigen wertdokumentes sowie eine buchdeckeneinlage und ein buchartiges wertdokument |
US7209039B2 (en) * | 2003-05-08 | 2007-04-24 | Illinois Tool Works Inc. | Decorative surface covering with embedded RF antenna and RF shield and method for making the same |
FI20030833A0 (fi) | 2003-06-04 | 2003-06-04 | Rafsec Oy | Älytarra ja menetelmä älytarran valmistamiseksi |
US20080272885A1 (en) * | 2004-01-22 | 2008-11-06 | Mikoh Corporation | Modular Radio Frequency Identification Tagging Method |
JP2005216077A (ja) * | 2004-01-30 | 2005-08-11 | Bridgestone Corp | Rfid組込バーコードラベル、及び、タイヤとその管理方法 |
US8722235B2 (en) | 2004-04-21 | 2014-05-13 | Blue Spark Technologies, Inc. | Thin printable flexible electrochemical cell and method of making the same |
US9210806B2 (en) | 2004-06-02 | 2015-12-08 | Joel S. Douglas | Bondable conductive ink |
US8127440B2 (en) | 2006-10-16 | 2012-03-06 | Douglas Joel S | Method of making bondable flexible printed circuit |
JP4328682B2 (ja) * | 2004-07-13 | 2009-09-09 | 富士通株式会社 | 光記録媒体用の無線タグアンテナ構造および無線タグアンテナ付き光記録媒体の収納ケース |
WO2006047007A2 (en) * | 2004-09-02 | 2006-05-04 | E.I. Dupont De Nemours And Company | Radio frequency coupling structure for coupling to an electronic device |
US7760141B2 (en) * | 2004-09-02 | 2010-07-20 | E.I. Du Pont De Nemours And Company | Method for coupling a radio frequency electronic device to a passive element |
US7530166B2 (en) * | 2004-09-02 | 2009-05-12 | E.I. Du Pont De Nemours And Company | Method for making a radio frequency coupling structure |
US9953259B2 (en) | 2004-10-08 | 2018-04-24 | Thin Film Electronics, Asa | RF and/or RF identification tag/device having an integrated interposer, and methods for making and using the same |
US7326857B2 (en) * | 2004-11-18 | 2008-02-05 | International Business Machines Corporation | Method and structure for creating printed circuit boards with stepped thickness |
WO2006059732A1 (ja) * | 2004-12-03 | 2006-06-08 | Hallys Corporation | インターポーザ接合装置 |
EP1833290A4 (de) * | 2004-12-03 | 2009-11-11 | Hallys Corp | Verfahren und geräte zur herstellung elektronischer komponenten |
CN101950748B (zh) * | 2005-01-28 | 2013-06-12 | 株式会社半导体能源研究所 | 半导体器件和制造它的方法 |
JP2006209497A (ja) * | 2005-01-28 | 2006-08-10 | Seiko Epson Corp | Rfidタグ、印刷用紙、プリンタ装置、rfidシステム |
US7545272B2 (en) | 2005-02-08 | 2009-06-09 | Therasense, Inc. | RF tag on test strips, test strip vials and boxes |
US8029927B2 (en) | 2005-03-22 | 2011-10-04 | Blue Spark Technologies, Inc. | Thin printable electrochemical cell utilizing a “picture frame” and methods of making the same |
EP1876877B1 (de) | 2005-04-06 | 2010-08-25 | Hallys Corporation | Vorrichtung zur herstellung elektronischer komponenten |
US20090166431A1 (en) * | 2005-04-18 | 2009-07-02 | Hallys Corporation | Electronic component and manufacturing method thereof |
JP2006311372A (ja) * | 2005-04-28 | 2006-11-09 | Hitachi Ltd | 無線icタグ |
US8722233B2 (en) | 2005-05-06 | 2014-05-13 | Blue Spark Technologies, Inc. | RFID antenna-battery assembly and the method to make the same |
JP4500214B2 (ja) * | 2005-05-30 | 2010-07-14 | 株式会社日立製作所 | 無線icタグ、及び無線icタグの製造方法 |
US7571862B2 (en) * | 2005-06-02 | 2009-08-11 | Avery Dennison Corporation | RFID tag that provides a flat print area and a pinch roller that enables the same |
JP2006347609A (ja) * | 2005-06-17 | 2006-12-28 | Renesas Technology Corp | 電子部品搬送用キャリアの製造方法 |
US20060290512A1 (en) * | 2005-06-22 | 2006-12-28 | Smurfit-Stone Container Enterprises, Inc. | Methods and apparatus for RFID transponder fabrication |
WO2007000578A2 (en) | 2005-06-25 | 2007-01-04 | Omni-Id Limited | Electromagnetic radiation decoupler |
FR2887665B1 (fr) * | 2005-06-27 | 2007-10-12 | Oberthur Card Syst Sa | Entite electronique a antenne magnetique |
US7273768B2 (en) * | 2005-08-30 | 2007-09-25 | Mutual-Pak Technology Co. Ltd. | Wafer-level package and IC module assembly method for the wafer-level package |
WO2007043602A1 (en) | 2005-10-14 | 2007-04-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and communication system using the semiconductor device |
US7456748B2 (en) * | 2005-10-20 | 2008-11-25 | National Starch And Chemical Investment Holding Corporation | RFID antenna with pre-applied adhesives |
US7555826B2 (en) * | 2005-12-22 | 2009-07-07 | Avery Dennison Corporation | Method of manufacturing RFID devices |
US8786510B2 (en) * | 2006-01-24 | 2014-07-22 | Avery Dennison Corporation | Radio frequency (RF) antenna containing element and methods of making the same |
US8462062B2 (en) * | 2006-05-12 | 2013-06-11 | Solstice Medical, Llc | RF passive repeater for a metal container |
CN101467162B (zh) * | 2006-06-07 | 2011-11-23 | Nxp股份有限公司 | 半导体芯片、应答机以及制造应答机的方法 |
US20070285239A1 (en) * | 2006-06-12 | 2007-12-13 | Easton Martyn N | Centralized optical-fiber-based RFID systems and methods |
US7741999B2 (en) * | 2006-06-15 | 2010-06-22 | Kathrein-Werke Kg | Multilayer antenna of planar construction |
WO2008007326A2 (en) * | 2006-07-10 | 2008-01-17 | Nxp B.V. | Transponder and method of producing a transponder |
CA2612557A1 (en) * | 2006-08-31 | 2008-03-15 | Kruger Inc. | Method of protecting a radio frequency identification inlay |
US20080062046A1 (en) * | 2006-09-08 | 2008-03-13 | Intelleflex Corporation | Mounting structure for matching an rf integrated circuit with an antenna and rfid device implementing same |
US20080103944A1 (en) * | 2006-10-30 | 2008-05-01 | Mobile Logistics Management L.L.C. | Intelligent Pallet |
US9652707B2 (en) | 2006-10-31 | 2017-05-16 | Fiber Mountain, Inc. | Radio frequency identification (RFID) connected tag communications protocol and related systems and methods |
US7782202B2 (en) | 2006-10-31 | 2010-08-24 | Corning Cable Systems, Llc | Radio frequency identification of component connections |
US9652709B2 (en) | 2006-10-31 | 2017-05-16 | Fiber Mountain, Inc. | Communications between multiple radio frequency identification (RFID) connected tags and one or more devices, and related systems and methods |
US8421626B2 (en) | 2006-10-31 | 2013-04-16 | Corning Cable Systems, Llc | Radio frequency identification transponder for communicating condition of a component |
US10032102B2 (en) | 2006-10-31 | 2018-07-24 | Fiber Mountain, Inc. | Excess radio-frequency (RF) power storage in RF identification (RFID) tags, and related systems and methods |
US9652708B2 (en) | 2006-10-31 | 2017-05-16 | Fiber Mountain, Inc. | Protocol for communications between a radio frequency identification (RFID) tag and a connected device, and related systems and methods |
US7772975B2 (en) * | 2006-10-31 | 2010-08-10 | Corning Cable Systems, Llc | System for mapping connections using RFID function |
US8264366B2 (en) * | 2009-03-31 | 2012-09-11 | Corning Incorporated | Components, systems, and methods for associating sensor data with component location |
DE102006052517A1 (de) * | 2006-11-06 | 2008-05-08 | Bielomatik Leuze Gmbh + Co.Kg | Chipmodul für ein RFID-System |
JP5027481B2 (ja) | 2006-11-06 | 2012-09-19 | 株式会社日立製作所 | Icタグ |
US7760094B1 (en) | 2006-12-14 | 2010-07-20 | Corning Cable Systems Llc | RFID systems and methods for optical fiber network deployment and maintenance |
US7667574B2 (en) * | 2006-12-14 | 2010-02-23 | Corning Cable Systems, Llc | Signal-processing systems and methods for RFID-tag signals |
US8264355B2 (en) | 2006-12-14 | 2012-09-11 | Corning Cable Systems Llc | RFID systems and methods for optical fiber network deployment and maintenance |
WO2008088984A2 (en) * | 2007-01-11 | 2008-07-24 | University Of Pittsburgh - Of The Commonwealth System Of Higher Education | Transponder networks and transponder systems employing a touch probe reader device |
US7547150B2 (en) * | 2007-03-09 | 2009-06-16 | Corning Cable Systems, Llc | Optically addressed RFID elements |
US7965186B2 (en) | 2007-03-09 | 2011-06-21 | Corning Cable Systems, Llc | Passive RFID elements having visual indicators |
WO2008111914A1 (en) * | 2007-03-09 | 2008-09-18 | Nanyang Technological University | An integrated circuit structure and a method of forming the same |
US8009101B2 (en) * | 2007-04-06 | 2011-08-30 | Murata Manufacturing Co., Ltd. | Wireless IC device |
FR2917534B1 (fr) * | 2007-06-15 | 2009-10-02 | Ask Sa | Procede de connexion d'une puce electronique sur un dispositif d'identification radiofrequence |
US7768407B2 (en) * | 2007-06-22 | 2010-08-03 | Avery Dennison Corporation | Foldable RFID device interposer and method |
JP5099134B2 (ja) * | 2007-07-04 | 2012-12-12 | 株式会社村田製作所 | 無線icデバイス及び無線icデバイス用部品 |
US8330579B2 (en) * | 2007-07-05 | 2012-12-11 | Baxter International Inc. | Radio-frequency auto-identification system for dialysis systems |
US7830311B2 (en) * | 2007-07-18 | 2010-11-09 | Murata Manufacturing Co., Ltd. | Wireless IC device and electronic device |
WO2009012463A2 (en) | 2007-07-18 | 2009-01-22 | Blue Spark Technologies, Inc. | Integrated electronic device and methods of making the same |
JP5155616B2 (ja) * | 2007-07-25 | 2013-03-06 | 沖プリンテッドサーキット株式会社 | Rfidタグ、rfidシステムおよびrfidタグの製造方法 |
US20090033495A1 (en) * | 2007-08-03 | 2009-02-05 | Akash Abraham | Moldable radio frequency identification device |
US9589220B2 (en) | 2007-08-04 | 2017-03-07 | David Nissen | Gaming chips and table game security system |
US8062445B2 (en) * | 2007-08-06 | 2011-11-22 | Avery Dennison Corporation | Method of making RFID devices |
US7855697B2 (en) * | 2007-08-13 | 2010-12-21 | Corning Cable Systems, Llc | Antenna systems for passive RFID tags |
US8221244B2 (en) | 2007-08-14 | 2012-07-17 | John B. French | Table with sensors and smart card holder for automated gaming system and gaming cards |
US8235825B2 (en) * | 2007-08-14 | 2012-08-07 | John B. French | Smart card holder for automated gaming system and gaming cards |
US7880614B2 (en) | 2007-09-26 | 2011-02-01 | Avery Dennison Corporation | RFID interposer with impedance matching |
DE102007046679B4 (de) | 2007-09-27 | 2012-10-31 | Polyic Gmbh & Co. Kg | RFID-Transponder |
FR2922342B1 (fr) * | 2007-10-11 | 2010-07-30 | Ask Sa | Support de dispositif d'identification radiofrequence renforce et son procede de fabrication |
US8633821B2 (en) * | 2007-12-03 | 2014-01-21 | Avery Dennison Corporation | Dual use RFID/EAS device |
US8847764B2 (en) | 2007-12-05 | 2014-09-30 | Avery Dennison Corporation | RFID system with distributed read structure |
US7786868B2 (en) * | 2007-12-11 | 2010-08-31 | Avery Dennison Corporation | RFID device with multiple passive operation modes |
EP2071906A1 (de) * | 2007-12-13 | 2009-06-17 | Gemplus | Verfahren zur Herstellung einer Vorrichtung, die mindestens zwei verschiedene Komponenten umfasst, die durch Verbindungsdrähte miteinander verbunden sind, und so erhaltene Vorrichtung |
EP2235773B1 (de) | 2007-12-19 | 2013-05-08 | Blue Spark Technologies, Inc. | Dünne hochstrom-batteriezelle und verfahren zu ihrer herstellung |
US7931205B2 (en) * | 2008-02-04 | 2011-04-26 | Avery Dennison Corporation | Printer with integrated RFID data collector |
US20100288436A1 (en) * | 2008-02-04 | 2010-11-18 | Solido 3D, Ltd. | Depicting interior details in a three-dimensional object |
US8068031B2 (en) | 2008-02-08 | 2011-11-29 | Avery Dennison Corporation | RFID devices and methods for overlapped objects |
FR2927441B1 (fr) * | 2008-02-13 | 2011-06-17 | Yannick Grasset | Objet sans contact a circuit integre connecte aux bornes d'un circuit par couplage capacitif |
US7999677B2 (en) * | 2008-06-19 | 2011-08-16 | Omron Corporation | RFID inlay structure and method of manufacturing RFID inlay structure |
US8248208B2 (en) | 2008-07-15 | 2012-08-21 | Corning Cable Systems, Llc. | RFID-based active labeling system for telecommunication systems |
US8731405B2 (en) | 2008-08-28 | 2014-05-20 | Corning Cable Systems Llc | RFID-based systems and methods for collecting telecommunications network information |
FR2936096B1 (fr) * | 2008-09-12 | 2011-01-28 | Yannick Grasset | Procede de fabrication d'objets portatifs sans contact |
US8350704B2 (en) | 2008-10-03 | 2013-01-08 | Neology, Inc. | Non-transferable radio frequency identification label or tag |
US8414471B2 (en) * | 2008-10-28 | 2013-04-09 | Mobile Aspects, Inc. | Endoscope storage cabinet, tracking system, and signal emitting member |
FR2938954B1 (fr) * | 2008-11-24 | 2011-06-24 | Rfideal | Procede de fabrication d'objets portatifs sans contact avec pont dielectrique. |
WO2010068469A1 (en) * | 2008-11-25 | 2010-06-17 | Kovio, Inc. | Printed antennas, methods of printing an antenna, and devices including the printed antenna |
US8391018B2 (en) * | 2009-09-28 | 2013-03-05 | Qualcomm Incorporated | Semiconductor die-based packaging interconnect |
EP2507746B1 (de) | 2009-11-30 | 2015-10-14 | Corning Incorporated | Rfid-zustandsverriegelung |
US8267494B2 (en) * | 2009-12-09 | 2012-09-18 | Hand Held Products, Inc. | Automatic RFID circuit tuning |
JP2011170592A (ja) * | 2010-02-18 | 2011-09-01 | Kyocera Corp | 積層体構造物 |
US9112263B2 (en) * | 2010-02-25 | 2015-08-18 | Stmicroelectronics S.R.L. | Electronic communications device with antenna and electromagnetic shield |
US8561909B2 (en) * | 2010-03-09 | 2013-10-22 | Skyworks Solutions, Inc. | RFID device having low-loss barium-based ceramic oxide |
US8172468B2 (en) | 2010-05-06 | 2012-05-08 | Corning Incorporated | Radio frequency identification (RFID) in communication connections, including fiber optic components |
CN102947083B (zh) | 2010-06-14 | 2016-08-17 | 艾利丹尼森公司 | 箔层压片半成品和制造方法 |
US9412061B2 (en) | 2010-08-13 | 2016-08-09 | Avery Dennison Corporation | Sensing radio frequency identification device with reactive strap attachment |
EP2458530B1 (de) * | 2010-11-30 | 2014-04-02 | Nxp B.V. | Mit einem Transponder markiertes Objekt, und Herstellungsverfahren |
KR20120059938A (ko) * | 2010-12-01 | 2012-06-11 | 한국전자통신연구원 | 무선 주파수 식별 태그 |
WO2012138009A1 (ko) | 2011-04-07 | 2012-10-11 | (주)네톰 | 무선인식 태그 및 이를 구비한 전자제품 피씨비 및 전자제품 관리 시스템 |
TW201249275A (en) * | 2011-05-16 | 2012-12-01 | Jieng Tai Internat Electric Corp | Method for forming component-mounting device with antenna |
FI125720B (fi) | 2011-05-19 | 2016-01-29 | Tecnomar Oy | Rullalta rullalle -massavalmistukseen soveltuva sähköisten siltojen valmistusmenetelmä |
US8899488B2 (en) | 2011-05-31 | 2014-12-02 | United Technologies Corporation | RFID tag system |
US9147145B2 (en) | 2011-05-31 | 2015-09-29 | United Technologies Corporation | RFID tag system |
CN102820531B (zh) * | 2011-06-08 | 2016-09-28 | 刘智佳 | 具有补偿结构的rfid标签天线、rfid标签及系统 |
WO2013028920A2 (en) * | 2011-08-23 | 2013-02-28 | Eagile, Inc. | System for associating rfid tag with upc code, and validating associative encoding of same |
US20130056537A1 (en) * | 2011-09-06 | 2013-03-07 | E. I. Du Pont De Nemours And Company | Barrier layer dielectric for rfid circuits |
US9027242B2 (en) | 2011-09-22 | 2015-05-12 | Blue Spark Technologies, Inc. | Cell attachment method |
TWI453677B (zh) * | 2011-12-01 | 2014-09-21 | Mutual Pak Technology Co Ltd | 射頻識別標籤與具有其之衣物 |
US9165232B2 (en) | 2012-05-14 | 2015-10-20 | Corning Incorporated | Radio-frequency identification (RFID) tag-to-tag autoconnect discovery, and related methods, circuits, and systems |
WO2013177202A1 (en) | 2012-05-21 | 2013-11-28 | Blue Spark Technologies, Inc. | Multi-cell battery |
WO2014008508A1 (en) * | 2012-07-06 | 2014-01-09 | The Ohio State University | Compact dual band gnss antenna design |
EP2895994B1 (de) * | 2012-09-14 | 2022-07-06 | JAMM Technologies, Inc. | Hochtemperatur-transponder |
US9563832B2 (en) | 2012-10-08 | 2017-02-07 | Corning Incorporated | Excess radio-frequency (RF) power storage and power sharing RF identification (RFID) tags, and related connection systems and methods |
CN103778460A (zh) * | 2012-10-12 | 2014-05-07 | 上海中京电子标签集成技术有限公司 | 带有大接触板的无线射频识别集成电路 |
KR101759806B1 (ko) | 2012-11-01 | 2017-07-19 | 블루 스파크 테크놀러지스, 인크. | 체온 기록 패치 |
US9484621B2 (en) * | 2012-11-02 | 2016-11-01 | Nokia Technologies Oy | Portable electronic device body having laser perforation apertures and associated fabrication method |
JP6178428B2 (ja) | 2012-11-27 | 2017-08-09 | ブルー スパーク テクノロジーズ,インク. | バッテリセル構成 |
USD749062S1 (en) * | 2013-01-02 | 2016-02-09 | Callas Enterprises Llc | Combined floor mat and EAS antenna |
FR3001070B1 (fr) * | 2013-01-17 | 2016-05-06 | Inside Secure | Systeme d'antenne pour microcircuit sans contact |
US9087765B2 (en) * | 2013-03-15 | 2015-07-21 | Qualcomm Incorporated | System-in-package with interposer pitch adapter |
EP3005240B1 (de) | 2013-06-05 | 2018-08-29 | Haemonetics Corporation | Zerbrechliches rfid-etikett und verfahren zur herstellung davon |
HUE045283T2 (hu) | 2013-06-18 | 2019-12-30 | Haemonetics Corp | RFID címke és eljárás annak tárgyhoz erõsítésére |
US9892618B2 (en) | 2013-08-09 | 2018-02-13 | Mobile Aspects, Inc. | Signal emitting member attachment system and arrangement |
US9348013B2 (en) | 2013-09-18 | 2016-05-24 | Mobile Aspects, Inc. | Item hanger arrangement, system, and method |
DE102013111027A1 (de) * | 2013-10-04 | 2015-04-09 | Infineon Technologies Ag | Mehrfrequenzfähige Antenne für miniaturisierte Anwendungen |
US9224124B2 (en) | 2013-10-29 | 2015-12-29 | Mobile Aspects, Inc. | Item storage and tracking cabinet and arrangement |
US10034400B2 (en) | 2013-12-04 | 2018-07-24 | Mobile Aspects, Inc. | Item storage arrangement system and method |
JP6347607B2 (ja) * | 2013-12-27 | 2018-06-27 | キヤノン株式会社 | 電子機器 |
DE102014203385A1 (de) * | 2014-02-25 | 2015-08-27 | Robert Bosch Gmbh | Elektronisches System sowie Herstellungsverfahren und Vorrichtung zum Herstellen eines elektronischen Systems |
JP2015174272A (ja) * | 2014-03-14 | 2015-10-05 | セイコーエプソン株式会社 | 三次元造形物の製造方法、三次元造形物製造装置および三次元造形物 |
CN107077772A (zh) * | 2014-06-04 | 2017-08-18 | 艾利丹尼森零售信息服务公司 | 并入无线通信装置的货物标签 |
US9390367B2 (en) * | 2014-07-08 | 2016-07-12 | Wernher von Braun Centro de Pesquisas Avancadas | RFID tag and RFID tag antenna |
US9697455B2 (en) * | 2014-12-26 | 2017-07-04 | Avery Dennison Retail Information Services, Llc | Using reactive coupling of a printed RFID chip on a strap to allow the printed material to be over-laminated with a barrier film against oxygen and moisture ingress |
US9693689B2 (en) | 2014-12-31 | 2017-07-04 | Blue Spark Technologies, Inc. | Body temperature logging patch |
FR3033080B1 (fr) * | 2015-02-20 | 2018-02-02 | Jean Pierre FOUCAULT | Procede de fabrication de ponts dielectriques(straps en anglais) d'identification sans contact |
WO2016160359A1 (en) * | 2015-04-01 | 2016-10-06 | 3M Innovative Properties Company | Radio frequency identification tag |
EP3322264A4 (de) * | 2015-07-08 | 2019-03-06 | Alps Electric Co., Ltd. | Hochfrequenzmodul |
US9454724B1 (en) * | 2015-11-09 | 2016-09-27 | Bong J. Im | Membrane for removable electronic identifiers |
WO2017120889A1 (zh) * | 2016-01-15 | 2017-07-20 | 焦林 | 天线芯片嵌合体、制做天线芯片嵌合体的装置及其工艺 |
TWI621993B (zh) * | 2016-12-19 | 2018-04-21 | 韋僑科技股份有限公司 | 無線射頻識別感測與記錄裝置及其製造方法 |
EP4109340A1 (de) | 2016-12-29 | 2022-12-28 | Avery Dennison Retail Information Services LLC | Rfid-etiketten mit schirmstruktur zur integration in mikrowellentaugliche lebensmittelverpackungen |
EP3563297B1 (de) | 2016-12-29 | 2023-07-05 | Avery Dennison Retail Information Services LLC | Doppelfunktionsband für resonanzelemente und ultrahochfrequenzantennen |
US10849501B2 (en) | 2017-08-09 | 2020-12-01 | Blue Spark Technologies, Inc. | Body temperature logging patch |
WO2019068077A1 (en) | 2017-09-29 | 2019-04-04 | Avery Dennison Retail Information Services, Llc | SYSTEMS AND METHODS FOR TRANSFERRING A FLEXIBLE CONDUCTOR TO A MOBILE STRIP |
CN111295672B (zh) * | 2017-09-29 | 2023-08-29 | 艾利丹尼森零售信息服务公司 | 有线格式天线的条安装技术 |
SE541540C2 (en) * | 2017-12-21 | 2019-10-29 | Stora Enso Oyj | Method for manufacturing a collar piece comprising an RFID tag |
PL240267B1 (pl) * | 2018-02-01 | 2022-03-07 | Smart Textiles Spolka Z Ograniczona Odpowiedzialnoscia | Rura z tworzywa termoplastycznego |
US10790571B2 (en) * | 2018-03-01 | 2020-09-29 | Matrics2, Inc. | Integrated circuit controlled ejection system (ICCES) for massively parallel integrated circuit assembly (MPICA) |
JP7377816B2 (ja) * | 2018-04-20 | 2023-11-10 | エイブリィ・デニソン・リテイル・インフォメーション・サービシズ・リミテッド・ライアビリティ・カンパニー | Rfidタグ設計を備えた遮蔽rfidストラップの使用方法 |
BR112020021426A2 (pt) | 2018-04-20 | 2021-01-19 | Avery Dennison Retail Information Services, Llc | Correias de rfid com um condutor superior e inferior |
EP3782078A1 (de) | 2018-04-20 | 2021-02-24 | Avery Dennison Retail Information Services, LLC | Abgeschirmte rfid-etiketten zum einsatz in mikrowellentauglichen lebensmittelverpackungen |
CN112639825B (zh) | 2018-06-27 | 2024-03-19 | 艾利丹尼森零售信息服务公司 | 耐受微波炉的操作于高频带中的rfid标签 |
EP3899796A1 (de) * | 2018-12-17 | 2021-10-27 | Avery Dennison Retail Information Services, LLC | Verfahren, system und vorrichtung für rfid-integriertes gewebtes etikett |
US11443160B2 (en) | 2019-09-18 | 2022-09-13 | Sensormatic Electronics, LLC | Systems and methods for laser tuning and attaching RFID tags to products |
US10970613B1 (en) | 2019-09-18 | 2021-04-06 | Sensormatic Electronics, LLC | Systems and methods for providing tags adapted to be incorporated with or in items |
US11055588B2 (en) | 2019-11-27 | 2021-07-06 | Sensormatic Electronics, LLC | Flexible water-resistant sensor tag |
EP3840542A1 (de) * | 2019-12-18 | 2021-06-23 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Kompakter laminierter komponententräger mit frontend-chip und impedanzanpassungsschaltung für die antennenkommunikation |
FR3111022B1 (fr) * | 2020-05-28 | 2023-01-20 | Centre Technique Du Papier | Dispositif de radio-identification comprenant un élément de jonction |
CN112348147A (zh) * | 2020-11-30 | 2021-02-09 | 广州市大时代印刷厂 | 一种新型rfid电子标签及其制作方法 |
US11755874B2 (en) | 2021-03-03 | 2023-09-12 | Sensormatic Electronics, LLC | Methods and systems for heat applied sensor tag |
US11869324B2 (en) | 2021-12-23 | 2024-01-09 | Sensormatic Electronics, LLC | Securing a security tag into an article |
ES2901750A1 (es) * | 2021-12-30 | 2022-03-23 | Soluciones De Movilidad Espec S L | Sistema y metodo para controlar el correcto uso de una plaza de aparcamiento |
CN114421139B (zh) * | 2022-04-01 | 2022-07-26 | 深圳源明杰科技股份有限公司 | 射频天线制作方法及射频天线 |
Family Cites Families (86)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4369557A (en) | 1980-08-06 | 1983-01-25 | Jan Vandebult | Process for fabricating resonant tag circuit constructions |
US4783646A (en) * | 1986-03-07 | 1988-11-08 | Kabushiki Kaisha Toshiba | Stolen article detection tag sheet, and method for manufacturing the same |
US4898323A (en) | 1987-06-17 | 1990-02-06 | Avery International Corporation | Mailer for laser printer |
JPH0821790B2 (ja) | 1990-02-15 | 1996-03-04 | 松下電器産業株式会社 | ロータリーヘッド式電子部品実装装置 |
US5564888A (en) | 1993-09-27 | 1996-10-15 | Doan; Carl V. | Pick and place machine |
US5904545A (en) | 1993-12-17 | 1999-05-18 | The Regents Of The University Of California | Apparatus for fabricating self-assembling microstructures |
US5545291A (en) | 1993-12-17 | 1996-08-13 | The Regents Of The University Of California | Method for fabricating self-assembling microstructures |
US5824186A (en) | 1993-12-17 | 1998-10-20 | The Regents Of The University Of California | Method and apparatus for fabricating self-assembling microstructures |
US5528222A (en) | 1994-09-09 | 1996-06-18 | International Business Machines Corporation | Radio frequency circuit and memory in thin flexible package |
US6145901A (en) | 1996-03-11 | 2000-11-14 | Rich; Donald S. | Pick and place head construction |
US6215401B1 (en) | 1996-03-25 | 2001-04-10 | Intermec Ip Corp. | Non-laminated coating for radio frequency transponder (RF tag) |
US5786626A (en) * | 1996-03-25 | 1998-07-28 | Ibm Corporation | Thin radio frequency transponder with leadframe antenna structure |
US5781110A (en) | 1996-05-01 | 1998-07-14 | James River Paper Company, Inc. | Electronic article surveillance tag product and method of manufacturing same |
DE59706058D1 (de) | 1996-08-22 | 2002-02-21 | Pav Card Gmbh | Verfahren zur herstellung einer elektrischen und mechanischen verbindung eines moduls in einer ausnehmung eines kartenkörpers |
BR9808620A (pt) | 1997-03-10 | 2000-05-16 | Precision Dynamics Corp | Elementos reativamente acoplados em circuitos sobre substratos flexìveis |
DE19732644C1 (de) | 1997-07-29 | 1998-11-12 | Siemens Ag | Verfahren zur Herstellung einer Chipkarte für kontaktlose Daten- und/oder Energieübertragung sowie Chipkarte |
US6177859B1 (en) | 1997-10-21 | 2001-01-23 | Micron Technology, Inc. | Radio frequency communication apparatus and methods of forming a radio frequency communication apparatus |
US6091332A (en) | 1998-06-09 | 2000-07-18 | Motorola, Inc. | Radio frequency identification tag having printed circuit interconnections |
US6246327B1 (en) | 1998-06-09 | 2001-06-12 | Motorola, Inc. | Radio frequency identification tag circuit chip having printed interconnection pads |
US6107920A (en) | 1998-06-09 | 2000-08-22 | Motorola, Inc. | Radio frequency identification tag having an article integrated antenna |
US6262292B1 (en) | 1998-06-30 | 2001-07-17 | Showa Denko K.K. | Method for producing cyanophenyl derivatives |
US6147605A (en) | 1998-09-11 | 2000-11-14 | Motorola, Inc. | Method and apparatus for an optimized circuit for an electrostatic radio frequency identification tag |
ATE398814T1 (de) | 1998-09-11 | 2008-07-15 | Motorola Inc | Rfid-etikettenvorrichtung und verfahren |
US6100804A (en) | 1998-10-29 | 2000-08-08 | Intecmec Ip Corp. | Radio frequency identification system |
US5969482A (en) | 1998-11-30 | 1999-10-19 | Philips Electronics North America Corporation | Circuit arrangement for operating a discharge lamp including real power sensing using a single quadrant multiplier |
FI990055A (fi) | 1999-01-14 | 2000-08-28 | Rafsec Oy | Menetelmä tuoteanturin muodostamiseksi |
EP1035503B2 (de) | 1999-01-23 | 2010-03-03 | X-ident technology GmbH | RFID-Transponder mit bedruckbarer Oberfläche |
US6274508B1 (en) | 1999-02-05 | 2001-08-14 | Alien Technology Corporation | Apparatuses and methods used in forming assemblies |
WO2000046854A1 (en) | 1999-02-05 | 2000-08-10 | Alien Technology Corporation | Apparatuses and methods for forming assemblies |
US6281038B1 (en) | 1999-02-05 | 2001-08-28 | Alien Technology Corporation | Methods for forming assemblies |
US6380729B1 (en) | 1999-02-16 | 2002-04-30 | Alien Technology Corporation | Testing integrated circuit dice |
WO2000049648A1 (de) | 1999-02-17 | 2000-08-24 | Forschungszentrum Jülich GmbH | Keramischer mehrlagen-dünnschichtkondensator |
CN1374993A (zh) | 1999-03-02 | 2002-10-16 | 摩托罗拉公司 | 电子标签组件及其方法 |
US6316278B1 (en) | 1999-03-16 | 2001-11-13 | Alien Technology Corporation | Methods for fabricating a multiple modular assembly |
US6468638B2 (en) | 1999-03-16 | 2002-10-22 | Alien Technology Corporation | Web process interconnect in electronic assemblies |
ES2453486T3 (es) | 1999-03-24 | 2014-04-07 | Motorola Solutions, Inc. | Conector de chip de circuito y método de conexión de un chip de circuito |
US6376769B1 (en) | 1999-05-18 | 2002-04-23 | Amerasia International Technology, Inc. | High-density electronic package, and method for making same |
US6121880A (en) | 1999-05-27 | 2000-09-19 | Intermec Ip Corp. | Sticker transponder for use on glass surface |
US6717819B1 (en) * | 1999-06-01 | 2004-04-06 | Amerasia International Technology, Inc. | Solderable flexible adhesive interposer as for an electronic package, and method for making same |
US6518885B1 (en) | 1999-10-14 | 2003-02-11 | Intermec Ip Corp. | Ultra-thin outline package for integrated circuit |
US6479395B1 (en) | 1999-11-02 | 2002-11-12 | Alien Technology Corporation | Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings |
US6259408B1 (en) * | 1999-11-19 | 2001-07-10 | Intermec Ip Corp. | RFID transponders with paste antennas and flip-chip attachment |
US6522308B1 (en) | 2000-01-03 | 2003-02-18 | Ask S.A. | Variable capacitance coupling antenna |
DE10002000A1 (de) | 2000-01-19 | 2001-08-09 | Bosch Gmbh Robert | Zerstäubungsanordnung |
US6451154B1 (en) | 2000-02-18 | 2002-09-17 | Moore North America, Inc. | RFID manufacturing concepts |
DE50103433D1 (de) | 2000-03-02 | 2004-10-07 | Lucatron Ag Baar | Elektronisch detektierbare Resonanzetikette, insbesondere RFID-Labels |
DE10012967A1 (de) | 2000-03-16 | 2001-09-20 | Andreas Plettner | Transponder |
US6400271B1 (en) | 2000-03-20 | 2002-06-04 | Checkpoint Systems, Inc. | Activate/deactiveable security tag with enhanced electronic protection for use with an electronic security system |
JP2003529163A (ja) | 2000-03-28 | 2003-09-30 | ルカトロン アーゲー | 共振周波数を調整する部材を有するrfidラベル |
FI112287B (fi) | 2000-03-31 | 2003-11-14 | Rafsec Oy | Menetelmä tuoteanturin muodostamiseksi ja tuoteanturi |
CA2406078A1 (en) | 2000-04-13 | 2001-10-25 | International Paper | Integrated package and rfid antenna |
US20020027294A1 (en) * | 2000-07-21 | 2002-03-07 | Neuhaus Herbert J. | Electrical component assembly and method of fabrication |
CN1498417A (zh) | 2000-09-19 | 2004-05-19 | 纳诺皮尔斯技术公司 | 用于在无线频率识别装置中装配元件和天线的方法 |
US6630203B2 (en) * | 2001-06-15 | 2003-10-07 | Nanopierce Technologies, Inc. | Electroless process for the preparation of particle enhanced electric contact surfaces |
US20040087128A1 (en) | 2000-10-24 | 2004-05-06 | Neuhaus Herbert J | Method and materials for printing particle-enhanced electrical contacts |
US20020149107A1 (en) | 2001-02-02 | 2002-10-17 | Avery Dennison Corporation | Method of making a flexible substrate containing self-assembling microstructures |
US6951596B2 (en) | 2002-01-18 | 2005-10-04 | Avery Dennison Corporation | RFID label technique |
DE10108080C1 (de) | 2001-02-20 | 2002-04-04 | Infineon Technologies Ag | Kontaktlos arbeitender Datenträger mit einer kapazitiv an das Modul gekoppelten Antennenspule |
JP2002308437A (ja) | 2001-04-16 | 2002-10-23 | Dainippon Printing Co Ltd | Rfidタグを用いた検査システム |
DE10120269C1 (de) | 2001-04-25 | 2002-07-25 | Muehlbauer Ag | Verfahren zum Verbinden von Mikrochips mit auf einem Trägerband angeordneten Antennen zum Herstellen eines Transponders |
US6606247B2 (en) * | 2001-05-31 | 2003-08-12 | Alien Technology Corporation | Multi-feature-size electronic structures |
FI112550B (fi) | 2001-05-31 | 2003-12-15 | Rafsec Oy | Älytarra ja älytarraraina |
DE20110585U1 (de) | 2001-06-11 | 2001-11-15 | Cubit Electronics Gmbh | Kontaktloser Transponder |
FR2826154B1 (fr) | 2001-06-14 | 2004-07-23 | A S K | Carte a puce sans contact avec un support d'antenne et un support de puce en materiau fibreux |
DE10133588A1 (de) | 2001-07-11 | 2002-09-05 | Infineon Technologies Ag | Anordnung eines Chips und einer Leiterstruktur |
US6456256B1 (en) * | 2001-08-03 | 2002-09-24 | Cardiac Pacemakers, Inc. | Circumferential antenna for an implantable medical device |
FI119401B (fi) | 2001-12-21 | 2008-10-31 | Upm Raflatac Oy | Älytarraraina ja menetelmä sen valmistamiseksi |
US7214569B2 (en) | 2002-01-23 | 2007-05-08 | Alien Technology Corporation | Apparatus incorporating small-feature-size and large-feature-size components and method for making same |
JP3908549B2 (ja) | 2002-01-31 | 2007-04-25 | 大日本印刷株式会社 | Rfidタグの製造方法 |
US20030151028A1 (en) | 2002-02-14 | 2003-08-14 | Lawrence Daniel P. | Conductive flexographic and gravure ink |
JP3998992B2 (ja) | 2002-02-14 | 2007-10-31 | 大日本印刷株式会社 | ウェブに実装されたicチップへのアンテナパターン形成方法とicタグ付き包装体 |
US6665193B1 (en) | 2002-07-09 | 2003-12-16 | Amerasia International Technology, Inc. | Electronic circuit construction, as for a wireless RF tag |
EP1525630A2 (de) | 2002-07-29 | 2005-04-27 | Siemens Aktiengesellschaft | Elektronisches bauteil mit vorwiegend organischen funktionsmaterialien und herstellungsverfahren dazu |
JP4109039B2 (ja) | 2002-08-28 | 2008-06-25 | 株式会社ルネサステクノロジ | 電子タグ用インレットおよびその製造方法 |
US20040052202A1 (en) | 2002-09-13 | 2004-03-18 | Brollier Brian W. | RFID enabled information disks |
US20040052203A1 (en) | 2002-09-13 | 2004-03-18 | Brollier Brian W. | Light enabled RFID in information disks |
US6667092B1 (en) * | 2002-09-26 | 2003-12-23 | International Paper Company | RFID enabled corrugated structures |
US6683254B1 (en) | 2002-09-30 | 2004-01-27 | Andrew Corp. | Low loss cable coupler |
AU2003274560A1 (en) | 2002-11-12 | 2004-06-03 | Koninklijke Philips Electronics N.V. | Data carrier with a module with a reinforcement strip |
DE60220927T2 (de) | 2002-11-13 | 2008-04-03 | Mitsubishi Materials Corp. | Armbanduhr mit einem RFID-Etikett |
SG106662A1 (en) | 2002-11-15 | 2004-10-29 | Smartag S Pte Ltd | Rfid tag for an object having metallic portions, tag coupler and method thereof |
FI20022094A0 (fi) | 2002-11-25 | 2002-11-25 | Rafsec Oy | Transponderi ja menetelmä sen valmistamiseksi |
DE10257111B4 (de) | 2002-12-05 | 2005-12-22 | Mühlbauer Ag | Chipkarte und Verfahren zur Herstellung einer Chipkarte |
AU2003293395A1 (en) | 2002-12-10 | 2004-06-30 | Shalom Wertsberger | Deactivation of radio frequency identification tags |
US6940408B2 (en) | 2002-12-31 | 2005-09-06 | Avery Dennison Corporation | RFID device and method of forming |
US7253735B2 (en) | 2003-03-24 | 2007-08-07 | Alien Technology Corporation | RFID tags and processes for producing RFID tags |
-
2004
- 2004-06-18 US US10/871,169 patent/US7224280B2/en not_active Expired - Lifetime
-
2005
- 2005-06-20 DE DE602005009957T patent/DE602005009957D1/de not_active Expired - Fee Related
- 2005-06-20 ES ES05763194T patent/ES2317271T3/es active Active
- 2005-06-20 CN CNA2005800268353A patent/CN1993703A/zh active Pending
- 2005-06-20 EP EP05763194A patent/EP1769430B1/de not_active Expired - Fee Related
- 2005-06-20 KR KR1020067026685A patent/KR20070034502A/ko not_active Application Discontinuation
- 2005-06-20 CA CA002571231A patent/CA2571231A1/en not_active Abandoned
- 2005-06-20 WO PCT/US2005/021631 patent/WO2006009934A1/en active Application Filing
-
2007
- 2007-05-23 US US11/752,482 patent/US8072333B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US7224280B2 (en) | 2007-05-29 |
WO2006009934A1 (en) | 2006-01-26 |
US20050001785A1 (en) | 2005-01-06 |
CN1993703A (zh) | 2007-07-04 |
EP1769430A1 (de) | 2007-04-04 |
CA2571231A1 (en) | 2006-01-26 |
EP1769430B1 (de) | 2008-09-24 |
US8072333B2 (en) | 2011-12-06 |
US20070216534A1 (en) | 2007-09-20 |
KR20070034502A (ko) | 2007-03-28 |
ES2317271T3 (es) | 2009-04-16 |
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