DE602005011017D1 - Lichtempfindliche dielektrische harzzusammensetzungen und ihre verwendungen - Google Patents

Lichtempfindliche dielektrische harzzusammensetzungen und ihre verwendungen

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Publication number
DE602005011017D1
DE602005011017D1 DE602005011017T DE602005011017T DE602005011017D1 DE 602005011017 D1 DE602005011017 D1 DE 602005011017D1 DE 602005011017 T DE602005011017 T DE 602005011017T DE 602005011017 T DE602005011017 T DE 602005011017T DE 602005011017 D1 DE602005011017 D1 DE 602005011017D1
Authority
DE
Germany
Prior art keywords
resin compositions
dielectric resin
lens
sensitive dielectric
films
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005011017T
Other languages
English (en)
Inventor
Dino Amoroso
Brian Bedwell
Andrew Bell
Edmund Elce
Daoji Gan
Seok Ho Kang
Hiroaki Makabe
Rajesh Raja Puthenkovilakom
Ramakrishna Ravikiran
Robert Shick
Yasunori Takahashi
Takeuchi Etsu
Xiaoming Wu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Promerus LLC
Original Assignee
Promerus LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Promerus LLC filed Critical Promerus LLC
Publication of DE602005011017D1 publication Critical patent/DE602005011017D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F232/00—Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
    • C08F232/08—Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having condensed rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C08G61/04—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
    • C08G61/06—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
DE602005011017T 2004-07-07 2005-07-01 Lichtempfindliche dielektrische harzzusammensetzungen und ihre verwendungen Active DE602005011017D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US58607004P 2004-07-07 2004-07-07
PCT/US2005/023369 WO2006017035A1 (en) 2004-07-07 2005-07-01 Photosensitive dielectric resin compositions and their uses

Publications (1)

Publication Number Publication Date
DE602005011017D1 true DE602005011017D1 (de) 2008-12-24

Family

ID=35427771

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005011017T Active DE602005011017D1 (de) 2004-07-07 2005-07-01 Lichtempfindliche dielektrische harzzusammensetzungen und ihre verwendungen

Country Status (10)

Country Link
US (2) US7524594B2 (de)
EP (1) EP1778759B1 (de)
JP (3) JP5430066B2 (de)
KR (1) KR100971299B1 (de)
AT (1) ATE414118T1 (de)
DE (1) DE602005011017D1 (de)
HK (1) HK1101405A1 (de)
SG (2) SG139738A1 (de)
TW (1) TWI411876B (de)
WO (1) WO2006017035A1 (de)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5430066B2 (ja) * 2004-07-07 2014-02-26 プロメラス， エルエルシー 絶縁樹脂組成物及びその使用
TW200628981A (en) * 2004-09-29 2006-08-16 Sumitomo Bakelite Co Semiconductor device
JP4556598B2 (ja) * 2004-09-30 2010-10-06 住友ベークライト株式会社 半導体装置
JP2006098984A (ja) * 2004-09-30 2006-04-13 Sumitomo Bakelite Co Ltd 平坦化樹脂層、並びにそれを有する半導体装置及び表示体装置
US7799883B2 (en) 2005-02-22 2010-09-21 Promerus Llc Norbornene-type polymers, compositions thereof and lithographic process using such compositions
US7838997B2 (en) 2005-06-14 2010-11-23 John Trezza Remote chip attachment
US7687400B2 (en) 2005-06-14 2010-03-30 John Trezza Side stacking apparatus and method
US7215032B2 (en) 2005-06-14 2007-05-08 Cubic Wafer, Inc. Triaxial through-chip connection
US7942182B2 (en) 2005-06-14 2011-05-17 Cufer Asset Ltd. L.L.C. Rigid-backed, membrane-based chip tooling
US7786592B2 (en) 2005-06-14 2010-08-31 John Trezza Chip capacitive coupling
US7851348B2 (en) 2005-06-14 2010-12-14 Abhay Misra Routingless chip architecture
US8456015B2 (en) 2005-06-14 2013-06-04 Cufer Asset Ltd. L.L.C. Triaxial through-chip connection
KR101350479B1 (ko) * 2007-02-12 2014-01-16 삼성전자주식회사 Ｄｒｍ 디바이스를 이용하여 ｄｒｍ 기능과 부가 기능을수행하기 위한 방법 및 그 시스템
US7727705B2 (en) * 2007-02-23 2010-06-01 Fujifilm Electronic Materials, U.S.A., Inc. High etch resistant underlayer compositions for multilayer lithographic processes
US8215496B2 (en) * 2008-01-28 2012-07-10 Promerus Llc Polynorbornene pervaporation membrane films, preparation and use thereof
FR2929947B1 (fr) * 2008-04-11 2011-03-04 Essilor Int Procede de preparation d'une composition photoreticulable.
JP5017227B2 (ja) * 2008-09-26 2012-09-05 富士フイルム株式会社 ノルボルネン系付加重合体、それを用いた光学材料
US8753790B2 (en) * 2009-07-01 2014-06-17 Promerus, Llc Self-imageable film forming polymer, compositions thereof and devices and structures made therefrom
WO2011033993A1 (en) * 2009-09-16 2011-03-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8580477B2 (en) * 2009-09-21 2013-11-12 Promerus Llc Aqueous base-developable negative-tone films based on functionalized norbornene polymers
CN102576192B (zh) * 2009-10-26 2014-01-01 株式会社东进世美肯 感光性树脂组合物
JP2011138116A (ja) * 2009-12-04 2011-07-14 Jsr Corp 感放射線性樹脂組成物、層間絶縁膜並びにそれらの形成方法
US8541523B2 (en) 2010-04-05 2013-09-24 Promerus, Llc Norbornene-type polymers, compositions thereof and lithographic process using such compositions
WO2012026465A1 (ja) * 2010-08-27 2012-03-01 住友ベークライト株式会社 フォトレジスト用樹脂組成物
KR20130141492A (ko) * 2010-09-28 2013-12-26 프로메러스, 엘엘씨 노르보르난-베이스 pac 밸러스트 및 상기 pac를 포함하는 포지티브형 감광성 수지 조성물
JP5728762B2 (ja) * 2010-11-24 2015-06-03 住友ベークライト株式会社 自己画像形成性フィルム形成ポリマー、その組成物、並びにそれから製造されるデバイス及び構造物
US8829087B2 (en) * 2010-12-14 2014-09-09 Promerus, Llc Transparent layer forming polymer
KR101400187B1 (ko) * 2010-12-30 2014-05-27 제일모직 주식회사 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자
US8715900B2 (en) 2011-07-14 2014-05-06 Promerus, Llc Self-imageable layer forming polymer and compositions thereof
TWI460154B (zh) * 2011-09-28 2014-11-11 Promerus Llc 降烷系ｐａｃ安定物之製備
JP6138828B2 (ja) * 2012-01-16 2017-05-31 プロメラス， エルエルシー マイクロ電子及び光電子デバイス並びにそのアセンブリ用の熱酸化安定性の側鎖ポリエーテル官能化ポリノルボルネン
KR101273669B1 (ko) * 2012-11-29 2013-06-11 주식회사 폴리사이언텍 유연성이 우수한 고내열투명성 환상올레핀 공중합체 및 이로부터 제조된 플렉시블 기판
KR102115817B1 (ko) * 2013-01-16 2020-05-27 제이에스알 가부시끼가이샤 경화막 형성용 열경화성 수지 조성물, 네가티브형 감방사선성 수지 조성물, 포지티브형 감방사선성 수지 조성물, 경화막, 그의 형성 방법, 반도체 소자 및 표시 소자
JP6070203B2 (ja) * 2013-01-16 2017-02-01 Jsr株式会社 半導体素子及び表示素子
JP5673784B2 (ja) * 2013-02-21 2015-02-18 Jsr株式会社 感光性組成物、硬化膜およびその製造方法ならびに電子部品
US9696623B2 (en) 2013-04-26 2017-07-04 Promerus, Llc Photosensitive compositions and applications thereof
WO2014176490A1 (en) * 2013-04-26 2014-10-30 Promerus, Llc Photosensitive compositions and applications thereof
KR102341367B1 (ko) * 2013-08-27 2021-12-17 제온 코포레이션 감방사선 수지 조성물, 수지막 및 전자 부품
TWI627217B (zh) 2013-09-16 2018-06-21 日商住友電木股份有限公司 經胺處理之順丁烯二酸酐聚合物、組成物及其應用
US9291901B2 (en) 2013-09-16 2016-03-22 Sumitomo Bakelite Co., Ltd. Amine treated maleic anhydride polymers with pendent silyl group, compositions and applications thereof
JP6248561B2 (ja) * 2013-11-14 2017-12-20 日本ゼオン株式会社 感放射線性樹脂組成物、及び積層体
JP6477492B2 (ja) * 2013-12-03 2019-03-06 住友ベークライト株式会社 ネガ型フォトレジスト用樹脂組成物、硬化膜及び電子装置
WO2015141525A1 (ja) * 2014-03-20 2015-09-24 住友ベークライト株式会社 感光性樹脂組成物、および電子装置
JP6318957B2 (ja) * 2014-07-31 2018-05-09 Jsr株式会社 感放射線性樹脂組成物、硬化膜及びその形成方法、並びに表示素子
JP6605720B2 (ja) * 2015-10-01 2019-11-13 プロメラス， エルエルシー 光パターニング可能なフッ素フリーフェノール官能基含有ポリマー組成物
KR20170083284A (ko) 2016-01-08 2017-07-18 동우 화인켐 주식회사 필름 터치 센서 및 이의 제조 방법
KR102028870B1 (ko) * 2016-09-08 2019-10-04 스미또모 베이크라이트 가부시키가이샤 반도체 장치의 제조 방법
KR102296795B1 (ko) * 2017-12-27 2021-08-31 삼성에스디아이 주식회사 유기막 조성물 및 패턴 형성 방법
KR102074200B1 (ko) * 2018-05-02 2020-03-02 송기용 저온경화 가능한 유기절연체 조성물 및 이를 이용한 유기절연막 제조방법
CN114555674A (zh) 2019-10-17 2022-05-27 普罗米鲁斯有限责任公司 感光性组合物及其应用

Family Cites Families (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5011730A (en) * 1987-08-14 1991-04-30 The B. F. Goodrich Company Bulk polymerized cycloolefin circuit boards
US4923734A (en) * 1988-12-23 1990-05-08 The B. F. Goodrich Company Laminates of polynorbornene and polyolefins derived from C2 -C4 monomers
US4923678A (en) * 1989-02-14 1990-05-08 The B. F. Goodrich Company Low dielectric constant prepreg based on blends of polynorbornene and polyolefins derived form C2 -C4 monomers
US4902556A (en) * 1989-01-27 1990-02-20 The B. F. Goodrich Company Multi-layer polynorbornene and epoxy laminates and process for making the same
US5439992A (en) * 1989-03-31 1995-08-08 The B. F. Goodrich Company Continuous process for making melt-processable optical grade ring-opened polycyclic (co)polymers in a single-stage multi-zoned reactor
JPH0463807A (ja) * 1990-03-06 1992-02-28 Idemitsu Kosan Co Ltd ノルボルネン系重合体およびその製造方法ならびに該重合体からなるフィルムおよびその製造方法
JPH03262108A (ja) 1990-03-13 1991-11-21 Matsushita Electron Corp チップ型電子部品
CA2070654C (en) * 1990-10-05 2003-06-03 Takuji Okamoto Process for producing cyclic olefin based polymers, cyclic olefin copolymers, compositions and molded articles comprising the copolymers
JPH04195397A (ja) * 1990-11-27 1992-07-15 Matsushita Electric Ind Co Ltd 道路障害監視装置
JP2961722B2 (ja) 1991-12-11 1999-10-12 ジェイエスアール株式会社 感放射線性樹脂組成物
US5514728A (en) * 1993-07-23 1996-05-07 Minnesota Mining And Manufacturing Company Catalysts and initiators for polymerization
US5468819A (en) * 1993-11-16 1995-11-21 The B.F. Goodrich Company Process for making polymers containing a norbornene repeating unit by addition polymerization using an organo (nickel or palladium) complex
KR100365545B1 (ko) * 1994-03-14 2003-04-11 후지쯔 가부시끼가이샤 에폭시기를갖는시클로올레핀수지조성물
US6465743B1 (en) * 1994-12-05 2002-10-15 Motorola, Inc. Multi-strand substrate for ball-grid array assemblies and method
US5912313A (en) * 1995-11-22 1999-06-15 The B. F. Goodrich Company Addition polymers of polycycloolefins containing silyl functional groups
RU2194295C2 (ru) * 1996-03-07 2002-12-10 З Би. Эф. Гудрич Кампэни Фоторезистная композиция и полимер
JP4267073B2 (ja) * 1996-10-09 2009-05-27 日本ゼオン株式会社 ノルボルネン系重合体組成物を溶媒に溶解させた溶液
US5929181A (en) * 1997-06-09 1999-07-27 The B.F.Goodrich Co. Method for preparation of copolymers of ethylene/norbornene-type monomers with nickel catalysts
US7087691B2 (en) * 1997-06-18 2006-08-08 Promerus Llc Photo-imageable compositions of norbornene and acrylate copolymers and use thereof
KR100403325B1 (ko) * 1998-07-27 2004-03-24 주식회사 하이닉스반도체 포토레지스트중합체및이를이용한포토레지스트조성물
KR100271420B1 (ko) 1998-09-23 2001-03-02 박찬구 화학증폭형 양성 포토레지스트 조성물
ID26727A (id) * 1998-10-05 2001-02-01 B F Goodrich Company Cs Katalis dan metoda untuk polimerisasi sikloolefin
US6903171B2 (en) * 1998-10-05 2005-06-07 Promerus, Llc Polymerized cycloolefins using transition metal catalyst and end products thereof
US6350832B1 (en) * 1998-12-09 2002-02-26 The B. F. Goodrich Company Mold addition polymerization of norbornene-type monomers using group 10 metal complexes
US6235849B1 (en) * 1999-02-05 2001-05-22 The B. F. Goodrich Company Method of preparing norbornene sulfonamide polymers
TWI274230B (en) * 1999-07-30 2007-02-21 Hyundai Electronics Ind Novel photoresist monomer, polymer thereof and photoresist composition containing it
US6653424B1 (en) * 1999-08-25 2003-11-25 Zeon Corporation Norbornene open-ring polymers, products of hydrogenation thereof and processes for the production of both
KR100389912B1 (ko) * 1999-12-08 2003-07-04 삼성전자주식회사 지환식 감광성 폴리머 및 이를 포함하는 레지스트 조성물
DE60101105T2 (de) * 2000-02-26 2004-08-19 Shipley Co., L.L.C., Marlborough Monomere,Polymere,Verfahren zu ihrer Synthese und Photoresistcompositionen
TW574622B (en) * 2000-05-05 2004-02-01 Ibm Copolymer photoresist with improved etch resistance
JP4838437B2 (ja) * 2000-06-16 2011-12-14 Ｊｓｒ株式会社 感放射線性樹脂組成物
WO2002010231A2 (en) * 2000-07-28 2002-02-07 Goodrich Corporation Polymeric compositions for forming optical waveguides; optical waveguides formed therefrom; and methods for making same
US6911507B2 (en) * 2001-01-24 2005-06-28 Jsr Corporation Processes for producing cycloolefin addition polymer
US6509134B2 (en) * 2001-01-26 2003-01-21 International Business Machines Corporation Norbornene fluoroacrylate copolymers and process for the use thereof
EP1376230A1 (de) * 2001-03-09 2004-01-02 Semiconductor Leading Edge Technologies, Inc. Feinstrukturausbildungsverfahren
TW591329B (en) * 2001-04-21 2004-06-11 Samsung Electronics Co Ltd Acetal group containing norbornene copolymer for photoresist, method for producing the same and photoresist composition containing the same
JP4238501B2 (ja) * 2001-04-27 2009-03-18 Ｊｓｒ株式会社 熱可塑性ノルボルネン系樹脂系光学用フィルム
KR20030036948A (ko) * 2001-11-01 2003-05-12 삼성전자주식회사 포토레지스트용 노르보넨계 공중합체, 이의 제조방법 및이를 포함하는 포토레지스트 조성물
JP3952756B2 (ja) 2001-11-29 2007-08-01 日本ゼオン株式会社 感放射線性樹脂組成物及びその利用
CN100413898C (zh) * 2001-12-12 2008-08-27 住友电木株式会社 聚合物组合物及其用途
US6939662B2 (en) * 2002-05-31 2005-09-06 Fuji Photo Film Co., Ltd. Positive-working resist composition
US20060020068A1 (en) * 2004-07-07 2006-01-26 Edmund Elce Photosensitive compositions based on polycyclic polymers for low stress, high temperature films
US20040084774A1 (en) * 2002-11-02 2004-05-06 Bo Li Gas layer formation materials
KR20040039731A (ko) * 2002-11-04 2004-05-12 주식회사 동진쎄미켐 디사이클로헥실이 결합된 펜던트 기를 가지는 화학적으로증폭된 고분자와 그 제조방법, 및 이를 포함하는 레지스트조성물
JP2004161827A (ja) * 2002-11-11 2004-06-10 Nec Corp フッ素含有有橋脂環式ラクトン構造をもつ不飽和単量体、その重合体、化学増幅レジスト及びパターン形成方法
TWI344578B (en) 2003-02-20 2011-07-01 Promerus Llc Dissolution rate modifiers for photoresist compositions
US7674847B2 (en) * 2003-02-21 2010-03-09 Promerus Llc Vinyl addition polycyclic olefin polymers prepared with non-olefinic chain transfer agents and uses thereof
JP5430066B2 (ja) * 2004-07-07 2014-02-26 プロメラス， エルエルシー 絶縁樹脂組成物及びその使用
ATE517370T1 (de) * 2005-02-22 2011-08-15 Promerus Llc Norbornenpolymere und deren herstellungsverfahren

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ATE414118T1 (de) 2008-11-15
JP5430066B2 (ja) 2014-02-26
EP1778759B1 (de) 2008-11-12
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JP6003973B2 (ja) 2016-10-05
US20090215976A1 (en) 2009-08-27
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US20060008734A1 (en) 2006-01-12
SG139738A1 (en) 2008-02-29
KR100971299B1 (ko) 2010-07-20
HK1101405A1 (en) 2007-10-18
WO2006017035A1 (en) 2006-02-16
TWI411876B (zh) 2013-10-11
EP1778759A1 (de) 2007-05-02
US7858721B2 (en) 2010-12-28
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TW200613897A (en) 2006-05-01

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