DE602005022400D1 - Transportgurt für elektronische Bauteile - Google Patents

Transportgurt für elektronische Bauteile

Info

Publication number
DE602005022400D1
DE602005022400D1 DE602005022400T DE602005022400T DE602005022400D1 DE 602005022400 D1 DE602005022400 D1 DE 602005022400D1 DE 602005022400 T DE602005022400 T DE 602005022400T DE 602005022400 T DE602005022400 T DE 602005022400T DE 602005022400 D1 DE602005022400 D1 DE 602005022400D1
Authority
DE
Germany
Prior art keywords
electronic components
transport belt
belt
transport
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005022400T
Other languages
English (en)
Inventor
Akitoshi Yoshii
Yasushi Izumibe
Taisuke Ahiko
Tooru Suda
Tsuyoshi Takashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Publication of DE602005022400D1 publication Critical patent/DE602005022400D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S206/00—Special receptacle or package
    • Y10S206/813—Adhesive
DE602005022400T 2004-12-27 2005-12-23 Transportgurt für elektronische Bauteile Active DE602005022400D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004377786A JP4517856B2 (ja) 2004-12-27 2004-12-27 電子部品連

Publications (1)

Publication Number Publication Date
DE602005022400D1 true DE602005022400D1 (de) 2010-09-02

Family

ID=36283912

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005022400T Active DE602005022400D1 (de) 2004-12-27 2005-12-23 Transportgurt für elektronische Bauteile

Country Status (4)

Country Link
US (1) US7584853B2 (de)
EP (1) EP1675452B1 (de)
JP (1) JP4517856B2 (de)
DE (1) DE602005022400D1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8622206B2 (en) * 2006-09-08 2014-01-07 The Procter & Gamble Company Peel-to-open packages
US8205766B2 (en) * 2009-05-20 2012-06-26 The Bergquist Company Method for packaging thermal interface materials
JP5791532B2 (ja) * 2012-01-31 2015-10-07 株式会社ソシオネクスト 収容体及びリール
JP5790633B2 (ja) * 2012-12-14 2015-10-07 株式会社村田製作所 キャリアテープ、包装用テープおよび電子部品連
JP2014205511A (ja) * 2013-04-15 2014-10-30 株式会社ティ−アンドケイ東華 圧着ヘッドおよび圧着装置
JP2015110441A (ja) * 2013-10-31 2015-06-18 株式会社村田製作所 電子部品の包装体、電子部品連およびキャリアテープ
WO2017146484A1 (en) * 2016-02-26 2017-08-31 Cg Bio Co., Ltd. Packing envelope
US10384860B2 (en) * 2016-07-27 2019-08-20 Taiyo Yuden Co., Ltd. Carrier tape for electronic component storage tape, electronic component storage tape, and method for manufacturing electronic component storage tape
US10679877B2 (en) 2018-06-28 2020-06-09 Taiwan Semiconductor Manufacturing Co., Ltd. Carrier tape system and methods of using carrier tape system
US11240947B2 (en) * 2018-06-28 2022-02-01 Taiwan Semiconductor Manufacturing Co., Ltd. Carrier tape system and components and methods of use
JP7156231B2 (ja) * 2019-10-07 2022-10-19 株式会社村田製作所 電子部品連および電子部品連の製造方法
JP7156236B2 (ja) * 2019-10-11 2022-10-19 株式会社村田製作所 電子部品包装体、電子部品連および電子部品連形成装置
JP7264007B2 (ja) * 2019-10-23 2023-04-25 株式会社村田製作所 電子部品連およびベーステープ

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6151896A (ja) * 1984-08-21 1986-03-14 株式会社村田製作所 電子部品連
JPS6439268U (de) * 1987-08-31 1989-03-08
JPH01254571A (ja) * 1988-03-24 1989-10-11 Nippon Dempa Kogyo Co Ltd エンボステープ
US4966281A (en) * 1988-09-09 1990-10-30 Nitto Denko Corporation Electronic component carrier
DE3925130A1 (de) * 1989-07-28 1991-01-31 Pelikan Ag Mehrschichtiges, flexibles markierband
US5361901A (en) * 1991-02-12 1994-11-08 Minnesota Mining And Manufacturing Company Carrier tape
US5203143A (en) * 1992-03-28 1993-04-20 Tempo G Multiple and split pressure sensitive adhesive stratums for carrier tape packaging system
US5472085A (en) * 1994-05-16 1995-12-05 Gpax International, Inc. Gated-pocket tape-form packaging system
US5524765A (en) * 1994-11-15 1996-06-11 Tempo G Carrier tape packaging system utilizing a layer of gel for retaining small components
US5765692A (en) * 1995-11-13 1998-06-16 Minnesota Mining And Manufacturing Company Carrier tape with adhesive and protective walls
US5857572A (en) * 1995-12-21 1999-01-12 Bird; Gerald C. Component carrier tape
US6102210A (en) * 1997-10-27 2000-08-15 Sumitomo Bakelite Company Limited Carrier tape for electronic components
US6003676A (en) * 1997-12-05 1999-12-21 Tek Pak, Inc. Product carrier and method of making same
US6224975B1 (en) * 1997-12-30 2001-05-01 Arkwright, Incorporated Pressure sensitive adhesive tape article with an anti-static coating
US6357594B1 (en) * 1998-06-30 2002-03-19 Tempo G Means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes
US5960961A (en) * 1998-08-03 1999-10-05 Tempo G Tab means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes
CN1178232C (zh) * 1999-04-26 2004-12-01 松下电器产业株式会社 电子零件及无线终端装置
JP2001163305A (ja) 1999-12-03 2001-06-19 Hitachi Ltd 梱包方法および梱包形態ならびに半導体装置の製造方法
JP2001323228A (ja) * 2000-05-15 2001-11-22 Nitto Denko Corp 加熱剥離型粘着シート
JP2002145381A (ja) 2000-11-10 2002-05-22 Matsushita Electric Ind Co Ltd 電子部品連
US20030180531A1 (en) * 2002-03-22 2003-09-25 Tesa Ag PSA tape and its production
KR20040099471A (ko) * 2002-05-01 2004-11-26 엔테그리스, 아이엔씨. 전자 부품을 위한 캐리어 테이프
US20040124119A1 (en) * 2002-12-30 2004-07-01 Ahn Seung Bae Carrier tape for use in the automated parts-implanting machine for carrying parts therewith
WO2005056734A2 (en) * 2003-12-03 2005-06-23 Coilcraft, Incorporated Electronic component

Also Published As

Publication number Publication date
US7584853B2 (en) 2009-09-08
EP1675452A2 (de) 2006-06-28
JP4517856B2 (ja) 2010-08-04
JP2006182399A (ja) 2006-07-13
US20060138019A1 (en) 2006-06-29
EP1675452A3 (de) 2007-07-18
EP1675452B1 (de) 2010-07-21

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