DE602007013478D1 - RFID-Vorrichtung - Google Patents

RFID-Vorrichtung

Info

Publication number
DE602007013478D1
DE602007013478D1 DE602007013478T DE602007013478T DE602007013478D1 DE 602007013478 D1 DE602007013478 D1 DE 602007013478D1 DE 602007013478 T DE602007013478 T DE 602007013478T DE 602007013478 T DE602007013478 T DE 602007013478T DE 602007013478 D1 DE602007013478 D1 DE 602007013478D1
Authority
DE
Germany
Prior art keywords
rfid device
rfid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007013478T
Other languages
English (en)
Inventor
Shunpei Yamazaki
Koji Dairiki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Publication of DE602007013478D1 publication Critical patent/DE602007013478D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0278—Arrangement or mounting of spray heads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/30—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages
    • B05B1/3033—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages the control being effected by relative coaxial longitudinal movement of the controlling element and the spray head
    • B05B1/304—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages the control being effected by relative coaxial longitudinal movement of the controlling element and the spray head the controlling element being a lift valve
    • B05B1/3046—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages the control being effected by relative coaxial longitudinal movement of the controlling element and the spray head the controlling element being a lift valve the valve element, e.g. a needle, co-operating with a valve seat located downstream of the valve element and its actuating means, generally in the proximity of the outlet orifice
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/002—Manually-actuated controlling means, e.g. push buttons, levers or triggers
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    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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DE602007013478T 2006-02-08 2007-01-31 RFID-Vorrichtung Active DE602007013478D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006031720 2006-02-08

Publications (1)

Publication Number Publication Date
DE602007013478D1 true DE602007013478D1 (de) 2011-05-12

Family

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Family Applications (1)

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DE602007013478T Active DE602007013478D1 (de) 2006-02-08 2007-01-31 RFID-Vorrichtung

Country Status (4)

Country Link
US (1) US8138614B2 (de)
EP (2) EP1818860B1 (de)
KR (1) KR101402104B1 (de)
DE (1) DE602007013478D1 (de)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
US7923800B2 (en) * 2006-12-27 2011-04-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
JP2008270757A (ja) * 2007-03-26 2008-11-06 Semiconductor Energy Lab Co Ltd 半導体装置
JP5408930B2 (ja) 2007-08-31 2014-02-05 株式会社半導体エネルギー研究所 半導体装置の作製方法
TWM336510U (en) * 2007-09-04 2008-07-11 Genesys Logic Inc Non-volatile memory storage device
KR101582503B1 (ko) 2008-05-12 2016-01-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작 방법
US8081118B2 (en) * 2008-05-15 2011-12-20 The Boeing Company Phased array antenna radiator assembly and method of forming same
EP2297778A1 (de) * 2008-05-23 2011-03-23 Semiconductor Energy Laboratory Co, Ltd. Halbleiterbauelement
WO2009142310A1 (en) 2008-05-23 2009-11-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
CN103500700B (zh) * 2008-06-06 2016-06-08 株式会社半导体能源研究所 半导体装置的制造方法
US8053253B2 (en) 2008-06-06 2011-11-08 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP5248412B2 (ja) 2008-06-06 2013-07-31 株式会社半導体エネルギー研究所 半導体装置の作製方法
KR101588576B1 (ko) 2008-07-10 2016-01-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 전자 기기
TWI475282B (zh) * 2008-07-10 2015-03-01 Semiconductor Energy Lab 液晶顯示裝置和其製造方法
JP5216716B2 (ja) 2008-08-20 2013-06-19 株式会社半導体エネルギー研究所 発光装置及びその作製方法
WO2010032602A1 (en) 2008-09-18 2010-03-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2010032611A1 (en) 2008-09-19 2010-03-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
WO2010035627A1 (en) 2008-09-25 2010-04-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2010035625A1 (en) 2008-09-25 2010-04-01 Semiconductor Energy Laboratory Co., Ltd. Semi conductor device
WO2010038599A1 (en) * 2008-10-01 2010-04-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
EP2380238A1 (de) * 2008-12-17 2011-10-26 Fci Verfahren zur herstellung von kontaktlosen ic-kommunikationseinrichtungen
WO2010070779A1 (ja) * 2008-12-19 2010-06-24 パナソニック株式会社 異方性導電樹脂、基板接続構造及び電子機器
JP2010157112A (ja) * 2008-12-26 2010-07-15 Sony Corp Ｉｃカード、データ制御方法およびプログラム
WO2010111601A2 (en) 2009-03-26 2010-09-30 Semprius, Inc. Methods of forming printable integrated circuit devices and devices formed thereby
TWI517268B (zh) * 2009-08-07 2016-01-11 半導體能源研究所股份有限公司 端子構造的製造方法和電子裝置的製造方法
JP5719560B2 (ja) * 2009-10-21 2015-05-20 株式会社半導体エネルギー研究所 端子構造の作製方法
US8686297B2 (en) 2011-08-29 2014-04-01 Apple Inc. Laminated flex circuit layers for electronic device components
KR101952844B1 (ko) * 2011-09-14 2019-02-28 삼성전기주식회사 전력 모듈 패키지 및 그 제조방법
US9269914B2 (en) 2013-08-01 2016-02-23 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, electronic device, and lighting device
WO2015112958A1 (en) 2014-01-27 2015-07-30 Corning Incorporated Articles and methods for controlled bonding of thin sheets with carriers
EP3129221A1 (de) 2014-04-09 2017-02-15 Corning Incorporated Vorrichtungsmodifizierter substratartikel und herstellungsverfahren
JP2015216072A (ja) * 2014-05-13 2015-12-03 株式会社ジャパンディスプレイ 有機ｅｌ装置及びその製造方法
KR102472238B1 (ko) 2014-10-17 2022-11-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치, 모듈, 전자 기기, 및 발광 장치의 제작 방법
JP2018524201A (ja) 2015-05-19 2018-08-30 コーニング インコーポレイテッド シートをキャリアと結合するための物品および方法
EP3313799B1 (de) 2015-06-26 2022-09-07 Corning Incorporated Verfahren und artikel mit einem bogen und einem träger
CN108738377B (zh) 2015-07-30 2020-11-10 株式会社半导体能源研究所 发光装置的制造方法、发光装置、模块及电子设备
EP3156947B1 (de) * 2015-10-12 2020-01-01 Nxp B.V. Elektronische vorrichtung
TW201825623A (zh) 2016-08-30 2018-07-16 美商康寧公司 用於片材接合的矽氧烷電漿聚合物
TWI821867B (zh) 2016-08-31 2023-11-11 美商康寧公司 具以可控制式黏結的薄片之製品及製作其之方法
WO2019118660A1 (en) 2017-12-15 2019-06-20 Corning Incorporated Method for treating a substrate and method for making articles comprising bonded sheets
FR3095735B1 (fr) * 2019-05-03 2021-05-21 Idemia Identity & Security France Etui d’enrôlement pour carte à puce

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4278510A (en) * 1980-03-31 1981-07-14 Gulf Oil Corporation Platable propylene polymer compositions
US4642263A (en) * 1984-12-18 1987-02-10 American Hoechst Corporation Antistat coated films
US4851487A (en) * 1988-02-22 1989-07-25 Lockheed Corporation Conductive polymer materials and method of producing same
DE4107729A1 (de) 1991-03-11 1992-09-17 Philips Patentverwaltung Anordnung zur erzeugung von digitalsignalen
JPH05334912A (ja) * 1992-06-01 1993-12-17 Casio Comput Co Ltd 異方性導電接着剤および導電接続構造
JPH10198778A (ja) * 1997-01-14 1998-07-31 Rohm Co Ltd Ｉｃカード
DE69828573T2 (de) 1997-12-03 2005-06-16 Nissan Chemical Industries, Ltd. Transparente leitfähige Polymere
US6018299A (en) 1998-06-09 2000-01-25 Motorola, Inc. Radio frequency identification tag having a printed antenna and method
US6107920A (en) * 1998-06-09 2000-08-22 Motorola, Inc. Radio frequency identification tag having an article integrated antenna
US6359444B1 (en) * 1999-05-28 2002-03-19 University Of Kentucky Research Foundation Remote resonant-circuit analyte sensing apparatus with sensing structure and associated method of sensing
TW561266B (en) * 1999-09-17 2003-11-11 Jsr Corp Anisotropic conductive sheet, its manufacturing method, and connector
KR100426344B1 (ko) * 2001-03-21 2004-04-06 이석현 용해성 자발배열 물질 및 그 물질을 포함하는 전도성고분자 조성물
WO2003085681A1 (en) 2002-04-01 2003-10-16 World Properties, Inc. Electrically conductive polymeric foams and elastomers and methods of manufacture thereof
US6937153B2 (en) * 2002-06-28 2005-08-30 Appleton Papers Inc. Thermal imaging paper laminate
CN100565902C (zh) 2002-10-09 2009-12-02 株式会社半导体能源研究所 发光装置的制造方法
KR20050097956A (ko) 2003-01-28 2005-10-10 컨덕티브 잉크젯 테크놀로지 리미티드 기판상에 도전성 금속을 형성하는 방법
JP4624109B2 (ja) 2003-03-25 2011-02-02 株式会社半導体エネルギー研究所 半導体装置の検査回路
JP3803097B2 (ja) 2003-10-07 2006-08-02 株式会社日立製作所 無線通信媒体の製造方法
US7243421B2 (en) 2003-10-29 2007-07-17 Conductive Inkjet Technology Limited Electrical connection of components
WO2005044451A1 (en) * 2003-10-29 2005-05-19 Conductive Inkjet Technology Limited Electrical connection of components
JP2007510063A (ja) 2003-10-29 2007-04-19 コンダクティブ・インクジェット・テクノロジー・リミテッド 基板上の層の形成
US20050130397A1 (en) 2003-10-29 2005-06-16 Bentley Philip G. Formation of layers on substrates
US8435603B2 (en) 2003-12-05 2013-05-07 Conductive Inkjet Technology Limited Formation of solid layers on substrates
EP1689909B1 (de) 2003-12-05 2017-10-11 CIT Technology Limited Ausbildung von festen schichten auf trägern
JP2005174220A (ja) * 2003-12-15 2005-06-30 Konica Minolta Photo Imaging Inc Ｉｃカード及びｉｃカードの製造方法
JP4494003B2 (ja) * 2003-12-19 2010-06-30 株式会社半導体エネルギー研究所 半導体装置
US7271076B2 (en) 2003-12-19 2007-09-18 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device
US7405665B2 (en) 2003-12-19 2008-07-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, RFID tag and label-like object
US7342490B2 (en) * 2004-11-23 2008-03-11 Alien Technology Corporation Radio frequency identification static discharge protection
US7482925B2 (en) * 2005-06-24 2009-01-27 Visa U.S.A. Apparatus and method to electromagnetically shield portable consumer devices

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EP1818860A3 (de) 2007-08-29
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