DE602008003166D1 - Abschirmungs- und wärmeableitungsvorrichtung - Google Patents

Abschirmungs- und wärmeableitungsvorrichtung

Info

Publication number
DE602008003166D1
DE602008003166D1 DE602008003166T DE602008003166T DE602008003166D1 DE 602008003166 D1 DE602008003166 D1 DE 602008003166D1 DE 602008003166 T DE602008003166 T DE 602008003166T DE 602008003166 T DE602008003166 T DE 602008003166T DE 602008003166 D1 DE602008003166 D1 DE 602008003166D1
Authority
DE
Germany
Prior art keywords
shielding
heat
heat sink
conductive
conductive surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602008003166T
Other languages
English (en)
Inventor
Linfang Jin
Liechun Zhou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Publication of DE602008003166D1 publication Critical patent/DE602008003166D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
DE602008003166T 2007-04-04 2008-03-05 Abschirmungs- und wärmeableitungsvorrichtung Active DE602008003166D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200720143737.4U CN201104378Y (zh) 2007-04-04 2007-04-04 屏蔽和散热装置
PCT/CN2008/070419 WO2008122220A1 (en) 2007-04-04 2008-03-05 Shielding and heat-dissipating device

Publications (1)

Publication Number Publication Date
DE602008003166D1 true DE602008003166D1 (de) 2010-12-09

Family

ID=39830485

Family Applications (2)

Application Number Title Priority Date Filing Date
DE602008003166T Active DE602008003166D1 (de) 2007-04-04 2008-03-05 Abschirmungs- und wärmeableitungsvorrichtung
DE202008017728U Expired - Lifetime DE202008017728U1 (de) 2007-04-04 2008-03-05 Vorrichtung zur Abschirmung und Hitzeableitung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE202008017728U Expired - Lifetime DE202008017728U1 (de) 2007-04-04 2008-03-05 Vorrichtung zur Abschirmung und Hitzeableitung

Country Status (6)

Country Link
US (1) US7692927B2 (de)
EP (1) EP2031952B1 (de)
CN (1) CN201104378Y (de)
AT (1) ATE486492T1 (de)
DE (2) DE602008003166D1 (de)
WO (1) WO2008122220A1 (de)

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CN201104378Y (zh) 2007-04-04 2008-08-20 华为技术有限公司 屏蔽和散热装置
JP4842346B2 (ja) * 2009-04-21 2011-12-21 シャープ株式会社 電子部品モジュールおよびその製造方法
CN101873784B (zh) * 2009-04-27 2012-08-08 台达电子工业股份有限公司 电子元件的散热模块及其组装方法
DE102010008553B4 (de) * 2010-02-19 2011-09-22 Continental Automotive Gmbh Vorrichtung zur Abschirmung eines Elektronikmoduls
US8982564B2 (en) 2011-06-29 2015-03-17 Mitsubishi Electric Corporation Electronic device
US8760868B2 (en) * 2011-08-30 2014-06-24 Apple Inc. Electronic device enclosures and heatsink structures with thermal management features
JP5920356B2 (ja) * 2011-10-25 2016-05-18 富士通株式会社 水冷装置、水冷装置を有する電子機器、及び水冷方法
DE102012107668A1 (de) 2012-08-21 2014-03-20 Epcos Ag Bauelementanordnung
US9439333B2 (en) 2013-01-15 2016-09-06 Genesis Technology Usa, Inc. Heat-dissipating EMI/RFI shield
US9398700B2 (en) * 2013-06-21 2016-07-19 Invensas Corporation Method of forming a reliable microelectronic assembly
KR102172314B1 (ko) 2013-11-12 2020-10-30 삼성전자주식회사 반도체 장치
CN104813760B (zh) 2014-03-18 2018-02-02 华为终端（东莞）有限公司 一种散热组件及电子设备
CN105338783B (zh) * 2014-07-01 2018-08-31 联想(北京)有限公司 一种电子设备以及用于电子设备的散热装置
US10292253B2 (en) 2014-10-17 2019-05-14 Huawei Technologies Co., Ltd. Heat-dissipation and shielding structure and communications product
CN105764302B (zh) * 2014-12-18 2019-12-13 中兴通讯股份有限公司 一种导热垫、散热器和散热组件
JP6330690B2 (ja) * 2015-02-19 2018-05-30 株式会社オートネットワーク技術研究所 基板ユニット
CN204721769U (zh) * 2015-05-14 2015-10-21 中兴通讯股份有限公司 移动通信终端
US10104806B2 (en) * 2015-09-04 2018-10-16 Toshiba Memory Corporation Semiconductor storage device
KR102473586B1 (ko) * 2015-10-27 2022-12-05 삼성전자주식회사 방열장치를 포함하는 디스플레이 기기 및 전자 기기
CN106686962B (zh) * 2015-11-09 2023-08-29 天津莱尔德电子材料有限公司 可用作bls盖的导电多孔材料
CN106876347B (zh) * 2015-12-11 2019-05-21 青岛海尔多媒体有限公司 一种外设模块及外设模块连接装置
US9913361B2 (en) * 2016-01-06 2018-03-06 International Business Machines Corporation Integrated circuit device assembly
WO2017131688A1 (en) * 2016-01-28 2017-08-03 Hewlett Packard Enterprise Development Lp Heat transfer adapter plate
CN107105596A (zh) * 2016-02-23 2017-08-29 中兴通讯股份有限公司 散热组件
CN205389320U (zh) * 2016-03-23 2016-07-20 乐视控股（北京）有限公司 一种散热屏蔽装置
US10763218B2 (en) * 2016-03-24 2020-09-01 Intel Corporation Electrical devices and methods for forming electrical devices
CN106304819A (zh) * 2016-08-23 2017-01-04 昆山市中迪新材料技术有限公司 一种具有散热功能的屏蔽器件及其制备方法
CN106413369A (zh) * 2016-10-31 2017-02-15 努比亚技术有限公司 一种屏蔽罩及电路板
JP6096977B1 (ja) * 2016-11-11 2017-03-15 シナノケンシ株式会社 電動ポンプ
CN106850883B (zh) * 2016-12-20 2020-03-24 Oppo广东移动通信有限公司 支架组件、功能模组及移动终端
US20180199453A1 (en) * 2017-01-10 2018-07-12 Whisker Labs, Inc. Electronics enclosure
CN107172872B (zh) * 2017-06-26 2024-02-13 上海传英信息技术有限公司 电子终端的散热装置与电子终端
WO2019000162A1 (en) * 2017-06-26 2019-01-03 Thomson Licensing ELECTROMAGNETIC SHIELDING OF ELECTRONIC DEVICE
US10649503B2 (en) * 2017-06-29 2020-05-12 Qualcomm Incorporated Device comprising compressed thermal interface material (TIM) and electromagnetic (EMI) shield comprising flexible portion
CN109561641B (zh) * 2017-09-27 2021-03-02 北京小米移动软件有限公司 屏蔽罩、印制电路板及电子设备
US10999957B2 (en) * 2018-02-12 2021-05-04 Samsung Electro-Mechanics Co., Ltd. Communication module and mounting structure thereof
US10674646B1 (en) * 2019-10-25 2020-06-02 Aliner Industries Inc. EMI shield with increased heat dissipating effect
CN113498296A (zh) * 2020-03-20 2021-10-12 上海禾赛科技有限公司 具有导热装置的电路结构及其散热方法与制作方法
JP2024509570A (ja) * 2021-03-08 2024-03-04 テスラ，インコーポレイテッド 静電放電及び／又は電磁干渉の影響を低減するための手段を伴う冷却システム・オン・ウエハ
CN115023099B (zh) * 2021-11-10 2023-11-21 荣耀终端有限公司 电子设备

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US7327577B2 (en) * 2005-11-03 2008-02-05 International Business Machines Corporation Method and apparatus for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers
CN201104378Y (zh) 2007-04-04 2008-08-20 华为技术有限公司 屏蔽和散热装置

Also Published As

Publication number Publication date
US7692927B2 (en) 2010-04-06
EP2031952B1 (de) 2010-10-27
CN201104378Y (zh) 2008-08-20
WO2008122220A1 (en) 2008-10-16
ATE486492T1 (de) 2010-11-15
EP2031952A4 (de) 2009-06-17
US20090040731A1 (en) 2009-02-12
EP2031952A1 (de) 2009-03-04
DE202008017728U1 (de) 2010-05-12

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