DE60204032D1 - Leistungsversorgungsverbinder mit kondensator - Google Patents

Leistungsversorgungsverbinder mit kondensator

Info

Publication number
DE60204032D1
DE60204032D1 DE60204032T DE60204032T DE60204032D1 DE 60204032 D1 DE60204032 D1 DE 60204032D1 DE 60204032 T DE60204032 T DE 60204032T DE 60204032 T DE60204032 T DE 60204032T DE 60204032 D1 DE60204032 D1 DE 60204032D1
Authority
DE
Germany
Prior art keywords
condenser
power supply
supply connector
connector
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60204032T
Other languages
English (en)
Other versions
DE60204032T2 (de
Inventor
D Lopata
P Panella
Arindum Dutta
L Mcgrath
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Molex LLC
Original Assignee
Molex LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex LLC filed Critical Molex LLC
Application granted granted Critical
Publication of DE60204032D1 publication Critical patent/DE60204032D1/de
Publication of DE60204032T2 publication Critical patent/DE60204032T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/6608—Structural association with built-in electrical component with built-in single component
    • H01R13/6625—Structural association with built-in electrical component with built-in single component with capacitive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1092—Plug-in assemblages of components, e.g. IC sockets with built-in components, e.g. intelligent sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01021—Scandium [Sc]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H01L2924/1533—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
    • H01L2924/15331—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
DE60204032T 2001-09-26 2002-09-26 Leistungsversorgungsverbinder mit kondensator Expired - Fee Related DE60204032T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US32510701P 2001-09-26 2001-09-26
US325107P 2001-09-26
PCT/US2002/030589 WO2003034799A1 (en) 2001-09-26 2002-09-26 Power delivery connector for integrated circuits with capacitor

Publications (2)

Publication Number Publication Date
DE60204032D1 true DE60204032D1 (de) 2005-06-09
DE60204032T2 DE60204032T2 (de) 2006-01-26

Family

ID=23266471

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60204032T Expired - Fee Related DE60204032T2 (de) 2001-09-26 2002-09-26 Leistungsversorgungsverbinder mit kondensator

Country Status (7)

Country Link
US (4) US6936917B2 (de)
EP (2) EP1433370B1 (de)
JP (4) JP4050700B2 (de)
CN (4) CN1288948C (de)
AU (1) AU2002343431A1 (de)
DE (1) DE60204032T2 (de)
WO (4) WO2003028095A2 (de)

Families Citing this family (172)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI117717B (fi) * 1999-07-09 2007-01-31 Ciba Sc Holding Ag Pintaliimakoostumus
US6936917B2 (en) * 2001-09-26 2005-08-30 Molex Incorporated Power delivery connector for integrated circuits utilizing integrated capacitors
US6780057B2 (en) * 2001-12-21 2004-08-24 Intel Corporation Coaxial dual pin sockets for high speed I/O applications
WO2003073250A2 (en) * 2002-02-25 2003-09-04 Molex Incorporated Electrical connector equipped with filter
US6731493B2 (en) * 2002-03-28 2004-05-04 Intel Corporation Low impedance inter-digital capacitor and method of using
US6862184B2 (en) * 2002-06-27 2005-03-01 Intel Corporation High performance microprocessor power delivery solution using flex connections
WO2004029858A1 (en) * 2002-09-25 2004-04-08 Koninklijke Philips Electronics N.V. Connector for chip-card
US6998328B2 (en) * 2002-11-06 2006-02-14 Irvine Sensors Corp. Method for creating neo-wafers from singulated integrated circuit die and a device made according to the method
KR100488518B1 (ko) * 2002-11-14 2005-05-11 삼성전자주식회사 반도체 장치의 방열 시스템
TWI278273B (en) * 2002-12-13 2007-04-01 Arima Computer Corp Heat dissipation device for electronic component
JP4057921B2 (ja) * 2003-01-07 2008-03-05 株式会社東芝 半導体装置およびそのアセンブリ方法
US6809417B1 (en) * 2003-04-07 2004-10-26 Fairchild Semiconductor Corporation Power circuitry with a thermionic cooling system
US8584353B2 (en) 2003-04-11 2013-11-19 Neoconix, Inc. Method for fabricating a contact grid array
US6916181B2 (en) 2003-06-11 2005-07-12 Neoconix, Inc. Remountable connector for land grid array packages
US7244125B2 (en) 2003-12-08 2007-07-17 Neoconix, Inc. Connector for making electrical contact at semiconductor scales
US7114961B2 (en) 2003-04-11 2006-10-03 Neoconix, Inc. Electrical connector on a flexible carrier
US7758351B2 (en) 2003-04-11 2010-07-20 Neoconix, Inc. Method and system for batch manufacturing of spring elements
US7495322B2 (en) * 2003-05-26 2009-02-24 Panasonic Electric Works Co., Ltd. Light-emitting device
US6869290B2 (en) 2003-06-11 2005-03-22 Neoconix, Inc. Circuitized connector for land grid array
US7070419B2 (en) 2003-06-11 2006-07-04 Neoconix Inc. Land grid array connector including heterogeneous contact elements
JP2005012004A (ja) * 2003-06-19 2005-01-13 Mitsumi Electric Co Ltd 半導体集積回路装置
US6956387B2 (en) * 2003-08-15 2005-10-18 Intel Corporation Socket connection test modules and methods of using the same
US20050104678A1 (en) * 2003-09-11 2005-05-19 Shahrooz Shahparnia System and method for noise mitigation in high speed printed circuit boards using electromagnetic bandgap structures
US7581124B1 (en) 2003-09-19 2009-08-25 Xilinx, Inc. Method and mechanism for controlling power consumption of an integrated circuit
US7504854B1 (en) 2003-09-19 2009-03-17 Xilinx, Inc. Regulating unused/inactive resources in programmable logic devices for static power reduction
US7098689B1 (en) 2003-09-19 2006-08-29 Xilinx, Inc. Disabling unused/inactive resources in programmable logic devices for static power reduction
US7498836B1 (en) 2003-09-19 2009-03-03 Xilinx, Inc. Programmable low power modes for embedded memory blocks
US7549139B1 (en) 2003-09-19 2009-06-16 Xilinx, Inc. Tuning programmable logic devices for low-power design implementation
DE10348620A1 (de) * 2003-10-15 2005-06-02 Infineon Technologies Ag Halbleitermodul mit Gehäusedurchkontakten
US6979784B1 (en) * 2003-10-17 2005-12-27 Advanced Micro Devices, Inc. Component power interface board
JP4120562B2 (ja) * 2003-10-31 2008-07-16 沖電気工業株式会社 受動素子チップ、高集積モジュール、受動素子チップの製造方法、及び高集積モジュールの製造方法。
US20080142369A1 (en) * 2003-12-31 2008-06-19 Microfabrica Inc. Integrated Circuit Packaging Using Electrochemically Fabricated Structures
US20060134831A1 (en) * 2003-12-31 2006-06-22 Microfabrica Inc. Integrated circuit packaging using electrochemically fabricated structures
US7115988B1 (en) * 2004-01-21 2006-10-03 Altera Corporation Bypass capacitor embedded flip chip package lid and stiffener
ES2350007T3 (es) * 2004-02-12 2011-01-14 Askoll Holding S.R.L. Componente electrónico discreto y método de ensamblaje relacionado.
JP2005286305A (ja) * 2004-03-02 2005-10-13 Mitsubishi Electric Corp 光半導体装置
US20050205292A1 (en) * 2004-03-18 2005-09-22 Etenna Corporation. Circuit and method for broadband switching noise suppression in multilayer printed circuit boards using localized lattice structures
US7383632B2 (en) 2004-03-19 2008-06-10 Neoconix, Inc. Method for fabricating a connector
JP4552524B2 (ja) * 2004-06-10 2010-09-29 パナソニック株式会社 複合型電子部品
US20060016994A1 (en) * 2004-07-22 2006-01-26 Suresh Basoor System and method to prevent cross-talk between a transmitter and a receiver
US7262951B2 (en) * 2004-09-27 2007-08-28 Taiwan Semiconductor Manufacturing Co., Ltd. De-coupling capacitors produced by utilizing dummy conductive structures integrated circuits
US20160170456A9 (en) * 2004-09-30 2016-06-16 Intel Corporation Power management integrated circuit
US7315463B2 (en) * 2004-09-30 2008-01-01 Intel Corporation Apparatus and method for multi-phase transformers
US7425760B1 (en) * 2004-10-13 2008-09-16 Sun Microsystems, Inc. Multi-chip module structure with power delivery using flexible cables
US7498839B1 (en) 2004-10-22 2009-03-03 Xilinx, Inc. Low power zones for programmable logic devices
US7629674B1 (en) 2004-11-17 2009-12-08 Amkor Technology, Inc. Shielded package having shield fence
US7235875B2 (en) * 2004-12-09 2007-06-26 International Business Machines Corporation Modular heat sink decoupling capacitor array forming heat sink fins and power distribution interposer module
US20060171527A1 (en) * 2004-12-30 2006-08-03 Mills Michael J Switched supply coupling for driver
US7607586B2 (en) * 2005-03-28 2009-10-27 R828 Llc Semiconductor structure with RF element
US8416556B2 (en) * 2005-05-02 2013-04-09 Conti Temic Microelectronic Gmbh Power capacitor
ATE512446T1 (de) * 2005-05-02 2011-06-15 Epcos Ag Modul der leistungselektronik umfassend einen kondensator
US7408780B2 (en) * 2005-06-14 2008-08-05 International Business Machines Corporation Compliant thermal interface structure utilizing spring elements with fins
US7327006B2 (en) * 2005-06-23 2008-02-05 Nokia Corporation Semiconductor package
US20060289887A1 (en) * 2005-06-24 2006-12-28 Jabil Circuit, Inc. Surface mount light emitting diode (LED) assembly with improved power dissipation
US7504808B2 (en) 2005-06-30 2009-03-17 Intel Corporation Multiphase transformer for a multiphase DC-DC converter
JP5181415B2 (ja) * 2005-09-30 2013-04-10 富士通株式会社 電気部品の電源ピンへの給電装置
JP2007096223A (ja) * 2005-09-30 2007-04-12 Fujitsu Ltd 電気部品の電源ピンへのコンデンサ内蔵型給電装置
JP4366352B2 (ja) * 2005-10-19 2009-11-18 富士通テン株式会社 電子装置
TWI324378B (en) * 2005-10-21 2010-05-01 Freescale Semiconductor Inc Method of making semiconductor package with reduced moisture sensitivity
US7498835B1 (en) 2005-11-04 2009-03-03 Xilinx, Inc. Implementation of low power standby modes for integrated circuits
KR100663549B1 (ko) * 2005-12-21 2007-01-02 삼성전자주식회사 반도체 패키지 및 그 제조방법
US7345944B1 (en) 2006-01-11 2008-03-18 Xilinx, Inc. Programmable detection of power failure in an integrated circuit
US20070206363A1 (en) * 2006-03-01 2007-09-06 Wetherill Associates, Inc., Corporation Of The State Of Delaware Voltage regulator with welded lead frame connectors and method of making
TWM302140U (en) * 2006-04-10 2006-12-01 Hon Hai Prec Ind Co Ltd Electrical connector assembly
TW200743268A (en) * 2006-05-02 2007-11-16 Hon Hai Prec Ind Co Ltd Electrical connector
US9299634B2 (en) * 2006-05-16 2016-03-29 Broadcom Corporation Method and apparatus for cooling semiconductor device hot blocks and large scale integrated circuit (IC) using integrated interposer for IC packages
US7837455B2 (en) * 2006-07-28 2010-11-23 Ethicon, Inc. Apparatus and method for making suture packages
US7514684B2 (en) * 2006-08-28 2009-04-07 L-3 Communications Corporation Surface mounted infrared image detector systems and associated methods
US20080145977A1 (en) * 2006-12-18 2008-06-19 Xiang Yin Zeng Increasing the resistance of a high frequency input/output power delivery decoupling path
US7344383B1 (en) * 2006-12-27 2008-03-18 Intel Corporation Split socket optical interconnect
CN200994225Y (zh) * 2006-12-29 2007-12-19 帛汉股份有限公司 电路基板结构
US7675160B2 (en) * 2006-12-29 2010-03-09 Intel Corporation Individual sub-assembly containing a ceramic interposer, silicon voltage regulator, and array capacitor
US20080157343A1 (en) * 2006-12-29 2008-07-03 Sriram Dattaguru Ceramic interposer with silicon voltage regulator and array capacitor combination for integrated circuit packages
US20080186650A1 (en) * 2007-02-03 2008-08-07 Benjamin Beker Decoupling Capacitor with Controlled Equivalent Series Resistance
JP5028579B2 (ja) * 2007-02-16 2012-09-19 国立大学法人東北大学 不整脈信号検出装置および除細動装置
WO2008111391A1 (ja) * 2007-03-14 2008-09-18 Mitsubishi Electric Corporation 高周波パッケージ
US7728771B2 (en) * 2007-07-03 2010-06-01 Northrop Grumman Systems Corporation Dual band quadpack transmit/receive module
US7893545B2 (en) * 2007-07-18 2011-02-22 Infineon Technologies Ag Semiconductor device
DE102007049523A1 (de) * 2007-10-15 2009-04-16 Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG System für die Prozessautomatisierung mit einer Vielzahl von intelligenten Sensoren und ein Verfahren zur Kalibrierung der Sensoren
US7947908B2 (en) * 2007-10-19 2011-05-24 Advantest Corporation Electronic device
TWI380419B (en) * 2008-01-16 2012-12-21 Raydium Semiconductor Corp Integrated circuit package and the method for fabricating thereof
US20100187910A1 (en) * 2008-01-29 2010-07-29 Alexander Brengauz Method and system for wireless delivery of power and control to a miniature wireless apparatuses
US20090194434A1 (en) * 2008-02-04 2009-08-06 Kevin Ellis Unit dose packaging system with reusable electronics component
US20090194452A1 (en) * 2008-02-04 2009-08-06 Christopher Hession Unit dose packaging system with reusable electronics component
WO2009107303A1 (ja) * 2008-02-28 2009-09-03 日本電気株式会社 電磁シールド構造およびそれを用いた無線装置、電磁シールドの製造方法
JP5479703B2 (ja) * 2008-10-07 2014-04-23 株式会社東芝 半導体装置及びその製造方法
US20100237462A1 (en) * 2009-03-18 2010-09-23 Benjamin Beker Package Level Tuning Techniques for Propagation Channels of High-Speed Signals
US8787022B2 (en) * 2009-07-24 2014-07-22 Kabushiki Kaisha Toshiba Semiconductor storage device and method of manufacturing the same
KR20110028999A (ko) * 2009-09-14 2011-03-22 삼성전자주식회사 이종의 커넥터를 선택적으로 적용할 수 있는 메모리 장치
KR101051576B1 (ko) * 2009-09-15 2011-07-22 삼성전기주식회사 최적화된 전장용 파워패키지
US8110915B2 (en) * 2009-10-16 2012-02-07 Infineon Technologies Ag Open cavity leadless surface mountable package for high power RF applications
US8079849B2 (en) * 2010-05-11 2011-12-20 Tyco Electronics Corporation Socket connector assembly with compressive contacts
US8823405B1 (en) 2010-09-10 2014-09-02 Xilinx, Inc. Integrated circuit with power gating
US8572840B2 (en) * 2010-09-30 2013-11-05 International Business Machines Corporation Method of attaching an electronic module power supply
US8536935B1 (en) 2010-10-22 2013-09-17 Xilinx, Inc. Uniform power regulation for integrated circuits
KR101797106B1 (ko) 2010-10-26 2017-11-13 삼성전자주식회사 저항성 메모리 장치와 상기 저항성 메모리 장치를 포함하는 전자 장치들
TWI433617B (zh) * 2010-11-08 2014-04-01 Delta Electronics Inc 電路板
US8590387B2 (en) * 2011-03-31 2013-11-26 DePuy Synthes Products, LLC Absolute capacitive micro pressure sensor
US9614590B2 (en) 2011-05-12 2017-04-04 Keyssa, Inc. Scalable high-bandwidth connectivity
JP2013026160A (ja) * 2011-07-25 2013-02-04 Alps Electric Co Ltd 電子部品用ソケット
KR101879907B1 (ko) * 2011-09-15 2018-08-16 키사, 아이엔씨. 유전체 매체와의 무선 통신
US8641428B2 (en) 2011-12-02 2014-02-04 Neoconix, Inc. Electrical connector and method of making it
US11314854B2 (en) 2011-12-30 2022-04-26 Bedrock Automation Platforms Inc. Image capture devices for a secure industrial control system
US9600434B1 (en) 2011-12-30 2017-03-21 Bedrock Automation Platforms, Inc. Switch fabric having a serial communications interface and a parallel communications interface
US9727511B2 (en) 2011-12-30 2017-08-08 Bedrock Automation Platforms Inc. Input/output module with multi-channel switching capability
US9437967B2 (en) 2011-12-30 2016-09-06 Bedrock Automation Platforms, Inc. Electromagnetic connector for an industrial control system
US11144630B2 (en) 2011-12-30 2021-10-12 Bedrock Automation Platforms Inc. Image capture devices for a secure industrial control system
US8862802B2 (en) 2011-12-30 2014-10-14 Bedrock Automation Platforms Inc. Switch fabric having a serial communications interface and a parallel communications interface
US10834094B2 (en) 2013-08-06 2020-11-10 Bedrock Automation Platforms Inc. Operator action authentication in an industrial control system
US9449756B2 (en) 2013-05-02 2016-09-20 Bedrock Automation Platforms Inc. Electromagnetic connectors
US8868813B2 (en) 2011-12-30 2014-10-21 Bedrock Automation Platforms Inc. Communications control system with a serial communications interface and a parallel communications interface
US11967839B2 (en) 2011-12-30 2024-04-23 Analog Devices, Inc. Electromagnetic connector for an industrial control system
US9467297B2 (en) 2013-08-06 2016-10-11 Bedrock Automation Platforms Inc. Industrial control system redundant communications/control modules authentication
US9191203B2 (en) 2013-08-06 2015-11-17 Bedrock Automation Platforms Inc. Secure industrial control system
US8971072B2 (en) 2011-12-30 2015-03-03 Bedrock Automation Platforms Inc. Electromagnetic connector for an industrial control system
US10834820B2 (en) 2013-08-06 2020-11-10 Bedrock Automation Platforms Inc. Industrial control system cable
TWI483489B (zh) * 2012-03-07 2015-05-01 Hon Hai Prec Ind Co Ltd 電連接器及其組合
US9941242B2 (en) 2012-04-24 2018-04-10 Innogration (Suzhou) Co., Ltd. Unpacked structure for power device of radio frequency power amplification module and assembly method therefor
CN102623416B (zh) * 2012-04-24 2015-09-02 苏州远创达科技有限公司 一种射频功放模块的功率器件无封装结构及其组装方法
JP5890252B2 (ja) * 2012-05-30 2016-03-22 日本航空電子工業株式会社 電気コネクタ
KR20140023112A (ko) * 2012-08-17 2014-02-26 삼성전자주식회사 반도체 패키지를 포함하는 전자 장치 및 그 제조 방법
KR101966250B1 (ko) * 2012-09-12 2019-04-05 삼성전자주식회사 무선 전력 전송의 영향을 받는 디바이스의 공진주파수 제어 장치 및 이의 방법
DE102012112389A1 (de) * 2012-12-17 2014-06-18 Aptronic Ag Elektrische Baugruppe zur Montage auf einer Hutschiene
TWI506273B (zh) * 2013-01-09 2015-11-01 Giga Byte Tech Co Ltd 電子元件測試治具及測試方法
US9680273B2 (en) 2013-03-15 2017-06-13 Neoconix, Inc Electrical connector with electrical contacts protected by a layer of compressible material and method of making it
US9338918B2 (en) * 2013-07-10 2016-05-10 Samsung Electronics Co., Ltd. Socket interposer and computer system using the socket interposer
US10613567B2 (en) 2013-08-06 2020-04-07 Bedrock Automation Platforms Inc. Secure power supply for an industrial control system
USD721706S1 (en) * 2013-08-06 2015-01-27 Bedrock Automation Platforms Inc. Input output module for an industrial control system
USD758978S1 (en) 2013-08-06 2016-06-14 Bedrock Automation Platforms, Inc. Backplane for an industrial control system (ICS)
USD721707S1 (en) * 2013-08-06 2015-01-27 Bedrock Automation Platforms Inc. Communications control module for an industrial control system
CN104933837A (zh) * 2014-03-21 2015-09-23 鸿富锦精密工业(武汉)有限公司 散热器报警装置
US8929169B1 (en) * 2014-05-13 2015-01-06 Sandisk Technologies Inc. Power management for nonvolatile memory array
US9536805B2 (en) * 2014-07-03 2017-01-03 Qualcomm Incorporated Power management integrated circuit (PMIC) integration into a processor package
WO2016069018A1 (en) * 2014-10-31 2016-05-06 Hewlett Packard Enterprise Development Lp Server device with capacitive circuit
US9419624B2 (en) 2014-11-12 2016-08-16 Xilinx, Inc. Power management system for integrated circuits
US9439278B2 (en) 2014-12-12 2016-09-06 Deere & Company Film capacitor having a package for heat transfer
TWI557857B (zh) * 2015-01-22 2016-11-11 台達電子工業股份有限公司 功率模組之封裝結構
US9627224B2 (en) * 2015-03-30 2017-04-18 Stmicroelectronics, Inc. Semiconductor device with sloped sidewall and related methods
CN104881984B (zh) * 2015-05-28 2020-05-22 乐鑫信息科技（上海）股份有限公司 一种触摸式可交互Wi-Fi物联网控制设备
US9438225B1 (en) 2015-06-11 2016-09-06 Applied Micro Circuits Corporation High efficiency half-cross-coupled decoupling capacitor
CN107534029B (zh) * 2015-07-31 2021-11-26 慧与发展有限责任合伙企业 多芯片模块
CN108713354B (zh) * 2016-03-03 2020-12-11 株式会社村田制作所 探针卡用层叠布线基板以及具备它的探针卡
JP2017208481A (ja) * 2016-05-19 2017-11-24 株式会社オートネットワーク技術研究所 電源装置およびその製造方法
DE102016112289B4 (de) * 2016-07-05 2020-07-30 Danfoss Silicon Power Gmbh Leiterrahmen und Verfahren zur Herstellung desselben
US11407634B2 (en) 2016-09-12 2022-08-09 MEMS Drive (Nanjing) Co., Ltd. MEMS actuation systems and methods
US11261081B2 (en) 2016-09-12 2022-03-01 MEMS Drive (Nanjing) Co., Ltd. MEMS actuation systems and methods
WO2018049175A1 (en) * 2016-09-12 2018-03-15 Mems Drive, Inc. Mems actuation systems and methods
US10861803B1 (en) * 2017-03-17 2020-12-08 Scientific Components Corporation Low cost millimeter wave integrated LTCC package and method of manufacturing
US10686269B2 (en) * 2017-09-25 2020-06-16 Johnstech International Corporation High isolation contactor with test pin and housing for integrated circuit testing
CN114421199A (zh) 2017-11-14 2022-04-29 申泰公司 数据通信系统
CN108337009B (zh) * 2018-03-14 2019-05-03 深圳市晟江科技有限公司 一种电台信号接口选择设备
WO2020000413A1 (en) * 2018-06-29 2020-01-02 Intel Corporation Hybrid socket for higher thermal design point processor support
DE102018118765A1 (de) * 2018-08-02 2020-02-06 Endress+Hauser SE+Co. KG Hochfrequenzbaustein
US10225932B1 (en) * 2018-08-27 2019-03-05 Tactotek Oy Interfacing arrangement, method for manufacturing an interfacing arrangement, and multilayer structure hosting an interfacing arrangement
US10901161B2 (en) 2018-09-14 2021-01-26 Toyota Motor Engineering & Manufacturing North America, Inc. Optical power transfer devices with an embedded active cooling chip
CN109346449B (zh) * 2018-11-13 2024-04-16 北方电子研究院安徽有限公司 一种大功率高电压ltcc模块散热封装
US10651583B1 (en) * 2018-12-18 2020-05-12 Te Connectivity Corporation Power supply for socket assembly
US10993352B2 (en) * 2019-01-08 2021-04-27 Te Connectivity Corporation Thermal transfer device for a pluggable module assembly
US10840216B2 (en) * 2019-03-05 2020-11-17 Cerebras Systems Inc. Systems and methods for powering an integrated circuit having multiple interconnected die
US11457524B2 (en) * 2019-04-29 2022-09-27 Nxp B.V. Integrated filter for de-sense reduction
TW202137559A (zh) * 2020-03-30 2021-10-01 智原科技股份有限公司 電容器
US11329035B2 (en) 2020-04-16 2022-05-10 International Business Machines Corporation Tetherless chip module
US11289836B2 (en) 2020-07-23 2022-03-29 International Business Machines Corporation Land grid array electrical contact coating
KR20220029128A (ko) * 2020-09-01 2022-03-08 삼성전자주식회사 반도체 패키지
US11482802B2 (en) 2020-12-04 2022-10-25 Cisco Technology, Inc. High speed traceless interconnect
DE102021201482A1 (de) 2021-02-17 2022-08-18 Robert Bosch Gesellschaft mit beschränkter Haftung Optische Schaltungsträgeranordnung sowie Verfahren zum Ausrichten einer solchen
TWI798647B (zh) * 2021-02-23 2023-04-11 華泰電子股份有限公司 電子封裝件及其製法
TWI792358B (zh) * 2021-06-18 2023-02-11 新加坡商鴻運科股份有限公司 具有卸除功能的散熱器
US11758690B2 (en) 2021-06-18 2023-09-12 Nanning Fulian Fugui Precision Industrial Co., Ltd. Heat-dissipation device allowing easy detachment from heat-generating component
US20230050002A1 (en) * 2021-08-13 2023-02-16 Cisco Technology, Inc. Integrated circuit interconnect techniques
US11778725B2 (en) * 2021-11-11 2023-10-03 Cisco Technology, Inc. Thermal interface material (TIM) filling structure for high warpage chips
CN115332199B (zh) * 2022-08-29 2023-07-11 杭州芯正微电子有限公司 一种集成电路封装体

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4754366A (en) * 1985-01-22 1988-06-28 Rogers Corporation Decoupling capacitor for leadless surface mounted chip carrier
US4734819A (en) * 1985-12-20 1988-03-29 Rogers Corporation Decoupling capacitor for surface mounted leadless chip carrier, surface mounted leaded chip carrier and pin grid array package
US5438481A (en) * 1987-11-17 1995-08-01 Advanced Interconnections Corporation Molded-in lead frames
WO1989005570A1 (en) 1987-12-08 1989-06-15 Rogers Corporation Mounting substrate for leadless ceramic chip carrier
US4853826A (en) * 1988-08-01 1989-08-01 Rogers Corporation Low inductance decoupling capacitor
US5161729A (en) * 1988-11-21 1992-11-10 Honeywell Inc. Package to semiconductor chip active interconnect site method
US5103283A (en) * 1989-01-17 1992-04-07 Hite Larry R Packaged integrated circuit with in-cavity decoupling capacitors
US5022869A (en) * 1989-11-06 1991-06-11 Amp Incorporated Adapter for use with a bumperless chip carrier
US5272590A (en) * 1990-02-12 1993-12-21 Hernandez Jorge M Integrated circuit package having an internal cavity for incorporating decoupling capacitor
US5403784A (en) * 1991-09-03 1995-04-04 Microelectronics And Computer Technology Corporation Process for manufacturing a stacked multiple leadframe semiconductor package using an alignment template
JPH05102262A (ja) * 1991-10-03 1993-04-23 Hitachi Ltd 半導体装置及びそれを実装した実装装置
US5212402A (en) * 1992-02-14 1993-05-18 Motorola, Inc. Semiconductor device with integral decoupling capacitor
DE4418426B4 (de) * 1993-09-08 2007-08-02 Mitsubishi Denki K.K. Halbleiterleistungsmodul und Verfahren zur Herstellung des Halbleiterleistungsmoduls
US5481436A (en) * 1992-12-30 1996-01-02 Interconnect Systems, Inc. Multi-level assemblies and methods for interconnecting integrated circuits
US5369056A (en) * 1993-03-29 1994-11-29 Staktek Corporation Warp-resistent ultra-thin integrated circuit package fabrication method
US5420752A (en) * 1993-08-18 1995-05-30 Lsi Logic Corporation GPT system for encapsulating an integrated circuit package
TW381328B (en) * 1994-03-07 2000-02-01 Ibm Dual substrate package assembly for being electrically coupled to a conducting member
US5734555A (en) * 1994-03-30 1998-03-31 Intel Corporation Shared socket multi-chip module and/or piggyback pin grid array package
US5403195A (en) * 1994-05-24 1995-04-04 The Whitaker Corporation Socket having an auxiliary electrical component mounted thereon
US5741729A (en) * 1994-07-11 1998-04-21 Sun Microsystems, Inc. Ball grid array package for an integrated circuit
US5483099A (en) * 1994-08-31 1996-01-09 Intel Corporation Standardized power and ground design for pin grid array packages
KR100197187B1 (ko) * 1995-04-05 1999-06-15 모리 가즈히로 고주파전력 증폭회로장치
US5892275A (en) * 1995-08-29 1999-04-06 Intel Corporation High performance power and ground edge connect IC package
US5694297A (en) * 1995-09-05 1997-12-02 Astec International Limited Integrated circuit mounting structure including a switching power supply
AU6900096A (en) * 1995-09-29 1997-04-17 Analog Devices, Inc. Integrated circuit and supply decoupling capacitor therefor
US5721673A (en) * 1995-10-05 1998-02-24 Micron Electronics, Inc. Socket for retaining multiple electronic packages
US5844419A (en) * 1996-05-14 1998-12-01 Micron Technology, Inc. Method for testing semiconductor packages using decoupling capacitors to reduce noise
US5831810A (en) * 1996-08-21 1998-11-03 International Business Machines Corporation Electronic component package with decoupling capacitors completely within die receiving cavity of substrate
US5956576A (en) * 1996-09-13 1999-09-21 International Business Machines Corporation Enhanced protection of semiconductors with dual surface seal
US6081426A (en) * 1996-09-18 2000-06-27 Shinko Electric Industries Co., Ltd. Semiconductor package having a heat slug
US5982018A (en) * 1997-05-23 1999-11-09 Micron Technology, Inc. Thin film capacitor coupons for memory modules and multi-chip modules
US5798567A (en) * 1997-08-21 1998-08-25 Hewlett-Packard Company Ball grid array integrated circuit package which employs a flip chip integrated circuit and decoupling capacitors
US6222260B1 (en) * 1998-05-07 2001-04-24 Vlsi Technology, Inc. Integrated circuit device with integral decoupling capacitor
FR2780577B1 (fr) * 1998-06-26 2000-09-15 Valeo Equip Electr Moteur Sous-ensemble a composants electroniques pour un alternateur de vehicule automobile
US6228682B1 (en) * 1999-12-21 2001-05-08 International Business Machines Corporation Multi-cavity substrate structure for discrete devices
AU2001266551A1 (en) 2000-02-18 2001-09-12 Incep Technologies, Inc. Method and apparatus for providing power to a microprocessor with integrated thermal and emi management
US6558181B2 (en) * 2000-12-29 2003-05-06 Intel Corporation System and method for package socket with embedded power and ground planes
US6936917B2 (en) * 2001-09-26 2005-08-30 Molex Incorporated Power delivery connector for integrated circuits utilizing integrated capacitors
US6606251B1 (en) * 2002-02-07 2003-08-12 Cooligy Inc. Power conditioning module
WO2003073250A2 (en) * 2002-02-25 2003-09-04 Molex Incorporated Electrical connector equipped with filter

Also Published As

Publication number Publication date
CN1294792C (zh) 2007-01-10
EP1433369A1 (de) 2004-06-30
JP4150670B2 (ja) 2008-09-17
DE60204032T2 (de) 2006-01-26
WO2003028095A3 (en) 2004-02-12
EP1433370B1 (de) 2005-05-04
US6936917B2 (en) 2005-08-30
US20030197198A1 (en) 2003-10-23
JP2005507143A (ja) 2005-03-10
EP1433370A1 (de) 2004-06-30
JP2005508066A (ja) 2005-03-24
AU2002343431A1 (en) 2003-04-07
CN1288948C (zh) 2006-12-06
WO2003037054A1 (en) 2003-05-01
US6885563B2 (en) 2005-04-26
JP2005505127A (ja) 2005-02-17
US6853559B2 (en) 2005-02-08
CN1315360C (zh) 2007-05-09
US20030202330A1 (en) 2003-10-30
WO2003028420A1 (en) 2003-04-03
CN1559084A (zh) 2004-12-29
JP2005505126A (ja) 2005-02-17
US6888235B2 (en) 2005-05-03
JP4050700B2 (ja) 2008-02-20
US20030194832A1 (en) 2003-10-16
CN1559164A (zh) 2004-12-29
CN1545828A (zh) 2004-11-10
WO2003028095A2 (en) 2003-04-03
US20030193791A1 (en) 2003-10-16
CN1559163A (zh) 2004-12-29
WO2003034799A1 (en) 2003-04-24
JP4133819B2 (ja) 2008-08-13
WO2003034799B1 (en) 2003-10-16
CN1290181C (zh) 2006-12-13

Similar Documents

Publication Publication Date Title
DE60204032D1 (de) Leistungsversorgungsverbinder mit kondensator
DE60237579D1 (de) Endgerät mit stromsparmodus
DE60134477D1 (de) Ladungspumpeschaltung mit niedriger Leistung
DE60215442D1 (de) Schaltnetzteil
DE60005275D1 (de) Leistungsversorgungsverbinder
DE60322789D1 (de) Stromversorgungseinrichtung
DE50206597D1 (de) Kraftverbindungsstrebe
NO20041128D0 (no) Universielt energiforsyningssystem
DE60123995D1 (de) Elektronisches vorschaltgerät mit kontinuierlichem netzstrom
DE60136231D1 (de) Kompressor mit zweifacher förderleistung
DE50301311D1 (de) Schaltnetzteilanordnung
DE10290312T5 (de) Schaltstromversorgung
DE60214810D1 (de) Stromversorgungseinheit
DE60229722D1 (de) Spannungsumsetzungsmodul
DE60224638D1 (de) Schaltnetzteil
DE60201294D1 (de) Schaltnetzteilgerät
DE60326616D1 (de) Kapazitiv gekoppelte stromversorgung
DE10196155T1 (de) DC-DC-Leistungsversorgungsvorrichtung
DE60316365D1 (de) Stromversorgungsanlaufschaltung
DE60306911D1 (de) Spaltoven mit gleichmässiger heizung
NO20041129L (no) Universielt effektforsyningssystem
FI20000747A (fi) Teholähdejärjestely
DE60236831D1 (de) Stromversorgung mit pyroelektrischen Kondensator
DE60114255D1 (de) Stromversorgung mit synchronisiertem Einschaltübergangsmodus
DE60200710D1 (de) Schaltnetzteil

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee