DE60207572D1 - Methode zur herstellung einer nadelkarte - Google Patents

Methode zur herstellung einer nadelkarte

Info

Publication number
DE60207572D1
DE60207572D1 DE60207572T DE60207572T DE60207572D1 DE 60207572 D1 DE60207572 D1 DE 60207572D1 DE 60207572 T DE60207572 T DE 60207572T DE 60207572 T DE60207572 T DE 60207572T DE 60207572 D1 DE60207572 D1 DE 60207572D1
Authority
DE
Germany
Prior art keywords
producing
needle card
needle
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60207572T
Other languages
English (en)
Other versions
DE60207572T2 (de
Inventor
W Grube
K Khandros
N Eldridge
L Mathieu
Poya Lotfizadeh
Chih-Chiang Tseng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/903,798 external-priority patent/US6729019B2/en
Application filed by FormFactor Inc filed Critical FormFactor Inc
Publication of DE60207572D1 publication Critical patent/DE60207572D1/de
Application granted granted Critical
Publication of DE60207572T2 publication Critical patent/DE60207572T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
DE60207572T 2001-07-11 2002-07-10 Verfahren zum herstellen einer nadelkarte Expired - Lifetime DE60207572T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US903798 1986-09-05
US09/903,798 US6729019B2 (en) 2001-07-11 2001-07-11 Method of manufacturing a probe card
US87081 2002-03-01
US10/087,081 US6864105B2 (en) 2001-07-11 2002-03-01 Method of manufacturing a probe card
PCT/US2002/022303 WO2003007003A1 (en) 2001-07-11 2002-07-10 Method of manufacturing a probe card

Publications (2)

Publication Number Publication Date
DE60207572D1 true DE60207572D1 (de) 2005-12-29
DE60207572T2 DE60207572T2 (de) 2006-08-10

Family

ID=26776578

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60207572T Expired - Lifetime DE60207572T2 (de) 2001-07-11 2002-07-10 Verfahren zum herstellen einer nadelkarte

Country Status (7)

Country Link
US (2) US7196531B2 (de)
EP (1) EP1407280B1 (de)
JP (2) JP2004534957A (de)
CN (1) CN1288450C (de)
DE (1) DE60207572T2 (de)
TW (1) TW546858B (de)
WO (1) WO2003007003A1 (de)

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JP2004534957A (ja) * 2001-07-11 2004-11-18 フォームファクター，インコーポレイテッド プローブ・カードの製造方法
US6729019B2 (en) * 2001-07-11 2004-05-04 Formfactor, Inc. Method of manufacturing a probe card
US6784674B2 (en) * 2002-05-08 2004-08-31 Formfactor, Inc. Test signal distribution system for IC tester
US6798225B2 (en) * 2002-05-08 2004-09-28 Formfactor, Inc. Tester channel to multiple IC terminals
JP2004317162A (ja) * 2003-04-11 2004-11-11 Masaki Esashi プローブカード、プローブピン及びその製造方法
JP3940694B2 (ja) * 2003-04-18 2007-07-04 株式会社東芝 半導体装置及びその製造方法
JP4727948B2 (ja) * 2004-05-24 2011-07-20 東京エレクトロン株式会社 プローブカードに用いられる積層基板
TWI287634B (en) * 2004-12-31 2007-10-01 Wen-Chang Dung Micro-electromechanical probe circuit film, method for making the same and applications thereof
US7724004B2 (en) * 2005-12-21 2010-05-25 Formfactor, Inc. Probing apparatus with guarded signal traces
CN1916915A (zh) * 2005-08-19 2007-02-21 鸿富锦精密工业（深圳）有限公司 改良过孔阻抗的方法
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KR100683444B1 (ko) 2005-12-29 2007-02-22 주식회사 파이컴 프로브 카드의 기판 및 그 기판의 재생 방법
US8130005B2 (en) * 2006-12-14 2012-03-06 Formfactor, Inc. Electrical guard structures for protecting a signal trace from electrical interference
JP5572084B2 (ja) * 2007-04-03 2014-08-13 スキャニメトリクス，インコーポレイテッド アクティブプローブ集積回路を用いた電子回路試験
JPWO2010038433A1 (ja) * 2008-09-30 2012-03-01 ローム株式会社 プローブカードの製造方法、プローブカード、半導体装置の製造方法およびプローブの形成方法
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TWI413777B (zh) * 2010-09-01 2013-11-01 Multi - power circuit board and its application probe card
TWI443341B (zh) 2011-07-28 2014-07-01 Star Techn Inc 半導體元件測試裝置
TWI439698B (zh) * 2011-09-30 2014-06-01 Hermes Testing Solutions Inc 電路測試探針卡及其探針基板結構
JP5868239B2 (ja) * 2012-03-27 2016-02-24 株式会社日本マイクロニクス プローブ及びプローブカード
CN103808992B (zh) * 2012-11-12 2017-09-12 旺矽科技股份有限公司 低电源损耗的探针卡结构
KR101442354B1 (ko) 2012-12-21 2014-09-17 삼성전기주식회사 예비 공간 변환기 및 이를 이용하여 제조된 공간 변환기, 그리고 상기 공간 변환기를 구비하는 반도체 소자 검사 장치
KR101431915B1 (ko) * 2012-12-21 2014-08-26 삼성전기주식회사 예비 공간 변환기 및 이를 이용하여 제조된 공간 변환기, 그리고 상기 공간 변환기를 구비하는 반도체 소자 검사 장치
KR20140124631A (ko) * 2013-04-17 2014-10-27 삼성전자주식회사 플립 칩 반도체 패키지
US9372205B2 (en) * 2014-01-15 2016-06-21 Taiwan Semiconductor Manufacturing Co., Ltd. Universal probe card PCB design
US9759745B2 (en) * 2014-04-29 2017-09-12 Taiwan Semiconductor Manufacturing Company Ltd. Probe card
TWI529396B (zh) * 2014-07-18 2016-04-11 Mpi Corp Probe card and its transfer circuit board and signal feed structure
JP2019160937A (ja) * 2018-03-09 2019-09-19 東京エレクトロン株式会社 位置補正方法、検査装置及びプローブカード
JP7250182B2 (ja) * 2019-07-01 2023-03-31 メガセン・カンパニー・リミテッド ディスプレイパネル検査のためのプローブブロック組立体、この制御方法およびディスプレイパネル検査装置

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Also Published As

Publication number Publication date
US20050146339A1 (en) 2005-07-07
WO2003007003A1 (en) 2003-01-23
CN1547669A (zh) 2004-11-17
JP2008102145A (ja) 2008-05-01
US7196531B2 (en) 2007-03-27
JP2004534957A (ja) 2004-11-18
EP1407280A1 (de) 2004-04-14
TW546858B (en) 2003-08-11
CN1288450C (zh) 2006-12-06
US7400157B2 (en) 2008-07-15
DE60207572T2 (de) 2006-08-10
EP1407280B1 (de) 2005-11-23
US20070247176A1 (en) 2007-10-25

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