DE60227760D1 - Gegen Flüssigkeiten beständige Silikoneinkapselungsmasse - Google Patents

Gegen Flüssigkeiten beständige Silikoneinkapselungsmasse

Info

Publication number
DE60227760D1
DE60227760D1 DE60227760T DE60227760T DE60227760D1 DE 60227760 D1 DE60227760 D1 DE 60227760D1 DE 60227760 T DE60227760 T DE 60227760T DE 60227760 T DE60227760 T DE 60227760T DE 60227760 D1 DE60227760 D1 DE 60227760D1
Authority
DE
Germany
Prior art keywords
liquid
resistant silicone
silicone encapsulant
encapsulant
resistant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60227760T
Other languages
English (en)
Inventor
Elizabeth M Walker
Jiazhong Luo
Rose Ann Schultz
Katharine Louise Pearce
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Original Assignee
National Starch and Chemical Investment Holding Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Starch and Chemical Investment Holding Corp filed Critical National Starch and Chemical Investment Holding Corp
Application granted granted Critical
Publication of DE60227760D1 publication Critical patent/DE60227760D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
DE60227760T 2001-11-06 2002-11-05 Gegen Flüssigkeiten beständige Silikoneinkapselungsmasse Expired - Fee Related DE60227760D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/993,589 US6841647B2 (en) 2001-11-06 2001-11-06 Fluid resistant silicone encapsulant

Publications (1)

Publication Number Publication Date
DE60227760D1 true DE60227760D1 (de) 2008-09-04

Family

ID=25539731

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60227760T Expired - Fee Related DE60227760D1 (de) 2001-11-06 2002-11-05 Gegen Flüssigkeiten beständige Silikoneinkapselungsmasse

Country Status (4)

Country Link
US (4) US6841647B2 (de)
EP (2) EP1308479B1 (de)
JP (1) JP2003192900A (de)
DE (1) DE60227760D1 (de)

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US7943719B2 (en) * 2008-02-28 2011-05-17 The Regents of the University of California; Encapsulation resins
US7732553B2 (en) * 2008-02-28 2010-06-08 The Regents Of The University Of California Method of producing encapsulation resins
TWI435914B (zh) * 2010-12-31 2014-05-01 Eternal Chemical Co Ltd 可固化之有機聚矽氧烷組合物及其製法
US9736957B2 (en) * 2012-08-10 2017-08-15 Commscope Technologies Llc Hybrid thermoplastic gels and their methods of making
JP5858027B2 (ja) * 2013-03-07 2016-02-10 Jsr株式会社 硬化性組成物、硬化物および光半導体装置
KR101733960B1 (ko) * 2013-03-07 2017-05-10 제이에스알 가부시끼가이샤 경화성 조성물, 경화물 및 광반도체 장치
JP6634201B2 (ja) * 2014-03-17 2020-01-22 矢崎総業株式会社 液面レベルセンサ
TWI663236B (zh) * 2014-10-16 2019-06-21 Dow Silicones Corporation 聚矽氧組合物及具有由該組合物製得之壓敏性黏著層的壓敏性黏著膜
KR20170135882A (ko) * 2015-04-10 2017-12-08 다우 코닝 도레이 캄파니 리미티드 플루오로알킬기 함유 경화성 오가노폴리실록산 조성물, 그의 경화물 및 당해 경화물을 구비한 전자 부품 또는 표시 장치
CN110183853A (zh) * 2019-05-31 2019-08-30 宋远周 一种阻燃高导热有机硅灌封复合材料及其制备方法
CN111859786B (zh) * 2020-07-03 2022-02-15 安徽理工大学 一种全尺度梯度开采沉陷D-InSAR三维预测方法
JP2023546395A (ja) * 2020-10-14 2023-11-02 ディディピー スペシャルティ エレクトロニック マテリアルズ ユーエス，エルエルシー 複合金属パネル
CN113736260A (zh) * 2021-08-16 2021-12-03 歌尔股份有限公司 用于发声装置的振膜及发声装置

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Also Published As

Publication number Publication date
EP1308479B1 (de) 2008-07-23
US7273916B2 (en) 2007-09-25
EP1308479A3 (de) 2003-09-24
JP2003192900A (ja) 2003-07-09
US7241852B2 (en) 2007-07-10
US20040192874A1 (en) 2004-09-30
EP1655345A1 (de) 2006-05-10
US6841647B2 (en) 2005-01-11
US20050003217A1 (en) 2005-01-06
US20040266945A1 (en) 2004-12-30
US20030187153A1 (en) 2003-10-02
EP1308479A2 (de) 2003-05-07
US7199206B2 (en) 2007-04-03

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Legal Events

Date Code Title Description
8328 Change in the person/name/address of the agent

Representative=s name: MEISSNER, BOLTE & PARTNER GBR, 80538 MUENCHEN

8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: HENKEL AG & CO. KGAA, 40589 DUESSELDORF, DE

8339 Ceased/non-payment of the annual fee