DE60229514D1 - Halbleiterbauelement auf basis einer nitridverbindung der gruppe iii mit multiquantentopf - Google Patents

Halbleiterbauelement auf basis einer nitridverbindung der gruppe iii mit multiquantentopf

Info

Publication number
DE60229514D1
DE60229514D1 DE60229514T DE60229514T DE60229514D1 DE 60229514 D1 DE60229514 D1 DE 60229514D1 DE 60229514 T DE60229514 T DE 60229514T DE 60229514 T DE60229514 T DE 60229514T DE 60229514 D1 DE60229514 D1 DE 60229514D1
Authority
DE
Germany
Prior art keywords
group iii
iii nitride
multiquantone
head
semiconductor component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60229514T
Other languages
English (en)
Inventor
David Todd Emerson
James Ibbetson
Michael John O'loughlin
Howard Dean Nordby
Amber Christine Abare
Michael John Bergmann
Kathleen Marie Doverspike
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wolfspeed Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27495441&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE60229514(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Cree Inc filed Critical Cree Inc
Application granted granted Critical
Publication of DE60229514D1 publication Critical patent/DE60229514D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/04Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
    • H01L33/06Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02373Group 14 semiconducting materials
    • H01L21/02378Silicon carbide
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02439Materials
    • H01L21/02455Group 13/15 materials
    • H01L21/02458Nitrides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02494Structure
    • H01L21/02496Layer structure
    • H01L21/02505Layer structure consisting of more than two layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02494Structure
    • H01L21/02496Layer structure
    • H01L21/02505Layer structure consisting of more than two layers
    • H01L21/02507Alternating layers, e.g. superlattice
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02538Group 13/15 materials
    • H01L21/0254Nitrides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • H01L33/30Materials of the light emitting region containing only elements of group III and group V of the periodic system
    • H01L33/32Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00Nanooptics, e.g. quantum optics or photonic crystals
DE60229514T 2001-05-30 2002-05-23 Halbleiterbauelement auf basis einer nitridverbindung der gruppe iii mit multiquantentopf Expired - Lifetime DE60229514D1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US29430801P 2001-05-30 2001-05-30
US29444501P 2001-05-30 2001-05-30
US29437801P 2001-05-30 2001-05-30
US10/140,796 US6958497B2 (en) 2001-05-30 2002-05-07 Group III nitride based light emitting diode structures with a quantum well and superlattice, group III nitride based quantum well structures and group III nitride based superlattice structures
PCT/US2002/016407 WO2002097904A2 (en) 2001-05-30 2002-05-23 Group iii nitride based light emitting diode structures with a quantum well and superlattice

Publications (1)

Publication Number Publication Date
DE60229514D1 true DE60229514D1 (de) 2008-12-04

Family

ID=27495441

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60229514T Expired - Lifetime DE60229514D1 (de) 2001-05-30 2002-05-23 Halbleiterbauelement auf basis einer nitridverbindung der gruppe iii mit multiquantentopf
DE60231877T Expired - Lifetime DE60231877D1 (de) 2001-05-30 2002-05-23 Leuchtdiodenstruktur auf Basis einer Nitridverbindung der Gruppe III mit Übergitter

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE60231877T Expired - Lifetime DE60231877D1 (de) 2001-05-30 2002-05-23 Leuchtdiodenstruktur auf Basis einer Nitridverbindung der Gruppe III mit Übergitter

Country Status (12)

Country Link
US (7) US6958497B2 (de)
EP (4) EP2237334B1 (de)
JP (5) JP2005507155A (de)
KR (4) KR101032847B1 (de)
CN (1) CN100350637C (de)
AT (2) ATE412253T1 (de)
AU (1) AU2002257318A1 (de)
CA (1) CA2441310A1 (de)
DE (2) DE60229514D1 (de)
MY (1) MY137396A (de)
TW (1) TW544952B (de)
WO (1) WO2002097904A2 (de)

Families Citing this family (388)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6800876B2 (en) 2001-01-16 2004-10-05 Cree, Inc. Group III nitride LED with undoped cladding layer (5000.137)
US6794684B2 (en) 2001-02-01 2004-09-21 Cree, Inc. Reflective ohmic contacts for silicon carbide including a layer consisting essentially of nickel, methods of fabricating same, and light emitting devices including the same
US6791119B2 (en) * 2001-02-01 2004-09-14 Cree, Inc. Light emitting diodes including modifications for light extraction
US7692182B2 (en) * 2001-05-30 2010-04-06 Cree, Inc. Group III nitride based quantum well light emitting device structures with an indium containing capping structure
US6958497B2 (en) * 2001-05-30 2005-10-25 Cree, Inc. Group III nitride based light emitting diode structures with a quantum well and superlattice, group III nitride based quantum well structures and group III nitride based superlattice structures
TW546855B (en) * 2001-06-07 2003-08-11 Sumitomo Chemical Co Group 3-5 compound semiconductor and light emitting diode
JP2004531894A (ja) 2001-06-15 2004-10-14 クリー インコーポレイテッド 紫外線発光ダイオード
US7211833B2 (en) 2001-07-23 2007-05-01 Cree, Inc. Light emitting diodes including barrier layers/sublayers
US6740906B2 (en) * 2001-07-23 2004-05-25 Cree, Inc. Light emitting diodes including modifications for submount bonding
US7858403B2 (en) 2001-10-31 2010-12-28 Cree, Inc. Methods and systems for fabricating broad spectrum light emitting devices
US20030090103A1 (en) * 2001-11-09 2003-05-15 Thomas Becker Direct mailing device
US6893442B2 (en) * 2002-06-14 2005-05-17 Ablatrics, Inc. Vacuum coagulation probe for atrial fibrillation treatment
US7572257B2 (en) * 2002-06-14 2009-08-11 Ncontact Surgical, Inc. Vacuum coagulation and dissection probes
US8235990B2 (en) 2002-06-14 2012-08-07 Ncontact Surgical, Inc. Vacuum coagulation probes
US7063698B2 (en) * 2002-06-14 2006-06-20 Ncontact Surgical, Inc. Vacuum coagulation probes
US9439714B2 (en) * 2003-04-29 2016-09-13 Atricure, Inc. Vacuum coagulation probes
SG115549A1 (en) * 2002-07-08 2005-10-28 Sumitomo Chemical Co Epitaxial substrate for compound semiconductor light emitting device, method for producing the same and light emitting device
GB2416920B (en) * 2002-07-08 2006-09-27 Sumitomo Chemical Co Epitaxial substrate for compound semiconductor light - emitting device, method for producing the same and light - emitting device
KR100497890B1 (ko) * 2002-08-19 2005-06-29 엘지이노텍 주식회사 질화물 반도체 발광소자 및 그 제조방법
WO2004027884A1 (en) * 2002-09-19 2004-04-01 Cree, Inc. Phosphor-coated light emitting diodes including tapered sidewalls, and fabrication methods therefor
US7009199B2 (en) * 2002-10-22 2006-03-07 Cree, Inc. Electronic devices having a header and antiparallel connected light emitting diodes for producing light from AC current
KR100906921B1 (ko) * 2002-12-09 2009-07-10 엘지이노텍 주식회사 발광 다이오드 제조 방법
KR101045160B1 (ko) * 2002-12-20 2011-06-30 크리 인코포레이티드 자기정렬 반도체 메사와 콘택층을 구비한 반도체 소자형성방법 및 그에 관련된 소자
US6885033B2 (en) * 2003-03-10 2005-04-26 Cree, Inc. Light emitting devices for light conversion and methods and semiconductor chips for fabricating the same
US7531380B2 (en) * 2003-04-30 2009-05-12 Cree, Inc. Methods of forming light-emitting devices having an active region with electrical contacts coupled to opposing surfaces thereof
US7087936B2 (en) * 2003-04-30 2006-08-08 Cree, Inc. Methods of forming light-emitting devices having an antireflective layer that has a graded index of refraction
US7714345B2 (en) 2003-04-30 2010-05-11 Cree, Inc. Light-emitting devices having coplanar electrical contacts adjacent to a substrate surface opposite an active region and methods of forming the same
US6995389B2 (en) * 2003-06-18 2006-02-07 Lumileds Lighting, U.S., Llc Heterostructures for III-nitride light emitting devices
KR100525545B1 (ko) * 2003-06-25 2005-10-31 엘지이노텍 주식회사 질화물 반도체 발광소자 및 그 제조방법
KR101034055B1 (ko) 2003-07-18 2011-05-12 엘지이노텍 주식회사 발광 다이오드 및 그 제조방법
US20050104072A1 (en) 2003-08-14 2005-05-19 Slater David B.Jr. Localized annealing of metal-silicon carbide ohmic contacts and devices so formed
JP4110222B2 (ja) * 2003-08-20 2008-07-02 住友電気工業株式会社 発光ダイオード
US6995403B2 (en) * 2003-09-03 2006-02-07 United Epitaxy Company, Ltd. Light emitting device
US7183587B2 (en) 2003-09-09 2007-02-27 Cree, Inc. Solid metal block mounting substrates for semiconductor light emitting devices
US7029935B2 (en) * 2003-09-09 2006-04-18 Cree, Inc. Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same
US7915085B2 (en) 2003-09-18 2011-03-29 Cree, Inc. Molded chip fabrication method
KR100641989B1 (ko) * 2003-10-15 2006-11-02 엘지이노텍 주식회사 질화물 반도체 발광소자
CA2545628A1 (en) * 2003-11-12 2005-05-26 Cree, Inc. Methods of processing semiconductor wafer backsides having light emitting devices (leds) thereon and leds so formed
TWI250669B (en) * 2003-11-26 2006-03-01 Sanken Electric Co Ltd Semiconductor light emitting element and its manufacturing method
US7518158B2 (en) * 2003-12-09 2009-04-14 Cree, Inc. Semiconductor light emitting devices and submounts
US7615689B2 (en) * 2004-02-12 2009-11-10 Seminis Vegatable Seeds, Inc. Methods for coupling resistance alleles in tomato
US7202181B2 (en) * 2004-03-26 2007-04-10 Cres, Inc. Etching of substrates of light emitting devices
US7355284B2 (en) 2004-03-29 2008-04-08 Cree, Inc. Semiconductor light emitting devices including flexible film having therein an optical element
US7326583B2 (en) 2004-03-31 2008-02-05 Cree, Inc. Methods for packaging of a semiconductor light emitting device
US7279346B2 (en) * 2004-03-31 2007-10-09 Cree, Inc. Method for packaging a light emitting device by one dispense then cure step followed by another
US7517728B2 (en) * 2004-03-31 2009-04-14 Cree, Inc. Semiconductor light emitting devices including a luminescent conversion element
US7419912B2 (en) * 2004-04-01 2008-09-02 Cree, Inc. Laser patterning of light emitting devices
US7868343B2 (en) * 2004-04-06 2011-01-11 Cree, Inc. Light-emitting devices having multiple encapsulation layers with at least one of the encapsulation layers including nanoparticles and methods of forming the same
KR100678854B1 (ko) * 2004-04-13 2007-02-05 엘지이노텍 주식회사 발광 다이오드 및 그 제조방법
WO2005106985A2 (en) * 2004-04-22 2005-11-10 Cree, Inc. Improved substrate buffer structure for group iii nitride devices
US7504274B2 (en) 2004-05-10 2009-03-17 The Regents Of The University Of California Fabrication of nonpolar indium gallium nitride thin films, heterostructures and devices by metalorganic chemical vapor deposition
EP1787330A4 (de) * 2004-05-10 2011-04-13 Univ California Herstellung von nichtpolaren indium-gallium-nitrid-dünnfilmen, heterostrukturen und einrichtungen durch metallorganische chemische aufdampfung
CN100369198C (zh) * 2004-06-15 2008-02-13 中国科学院半导体研究所 自适应柔性层制备无裂纹硅基ⅲ族氮化物薄膜的方法
US7583715B2 (en) * 2004-06-15 2009-09-01 Stc.Unm Semiconductor conductive layers
US20060002442A1 (en) * 2004-06-30 2006-01-05 Kevin Haberern Light emitting devices having current blocking structures and methods of fabricating light emitting devices having current blocking structures
US7795623B2 (en) 2004-06-30 2010-09-14 Cree, Inc. Light emitting devices having current reducing structures and methods of forming light emitting devices having current reducing structures
WO2006005062A2 (en) * 2004-06-30 2006-01-12 Cree, Inc. Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices
KR20060007123A (ko) * 2004-07-19 2006-01-24 에피밸리 주식회사 n형 질화물층의 전도도를 제어하는 방법
US7118262B2 (en) * 2004-07-23 2006-10-10 Cree, Inc. Reflective optical elements for semiconductor light emitting devices
US7557380B2 (en) * 2004-07-27 2009-07-07 Cree, Inc. Light emitting devices having a reflective bond pad and methods of fabricating light emitting devices having reflective bond pads
TWI374552B (en) 2004-07-27 2012-10-11 Cree Inc Ultra-thin ohmic contacts for p-type nitride light emitting devices and methods of forming
US20060039498A1 (en) * 2004-08-19 2006-02-23 De Figueiredo Rui J P Pre-distorter for orthogonal frequency division multiplexing systems and method of operating the same
KR100670531B1 (ko) * 2004-08-26 2007-01-16 엘지이노텍 주식회사 질화물 반도체 발광소자 및 그 제조방법
US7217583B2 (en) * 2004-09-21 2007-05-15 Cree, Inc. Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension
US7372198B2 (en) 2004-09-23 2008-05-13 Cree, Inc. Semiconductor light emitting devices including patternable films comprising transparent silicone and phosphor
US20090200538A1 (en) * 2004-09-28 2009-08-13 Sumitomo Chemical Company, Limited Group lll-V compound semiconductor and a method for producing the same
JP2006108585A (ja) * 2004-10-08 2006-04-20 Toyoda Gosei Co Ltd Iii族窒化物系化合物半導体発光素子
US20060097385A1 (en) * 2004-10-25 2006-05-11 Negley Gerald H Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same
US7322732B2 (en) * 2004-12-23 2008-01-29 Cree, Inc. Light emitting diode arrays for direct backlighting of liquid crystal displays
TWI245440B (en) * 2004-12-30 2005-12-11 Ind Tech Res Inst Light emitting diode
US8125137B2 (en) 2005-01-10 2012-02-28 Cree, Inc. Multi-chip light emitting device lamps for providing high-CRI warm white light and light fixtures including the same
US7304694B2 (en) * 2005-01-12 2007-12-04 Cree, Inc. Solid colloidal dispersions for backlighting of liquid crystal displays
US7335920B2 (en) * 2005-01-24 2008-02-26 Cree, Inc. LED with current confinement structure and surface roughening
US7939842B2 (en) * 2005-01-27 2011-05-10 Cree, Inc. Light emitting device packages, light emitting diode (LED) packages and related methods
US7446345B2 (en) * 2005-04-29 2008-11-04 Cree, Inc. Light emitting devices with active layers that extend into opened pits
JP2006332365A (ja) * 2005-05-26 2006-12-07 Toyoda Gosei Co Ltd Iii族窒化物系化合物半導体発光素子およびそれを用いた発光装置
US20060267043A1 (en) * 2005-05-27 2006-11-30 Emerson David T Deep ultraviolet light emitting devices and methods of fabricating deep ultraviolet light emitting devices
US9331192B2 (en) * 2005-06-29 2016-05-03 Cree, Inc. Low dislocation density group III nitride layers on silicon carbide substrates and methods of making the same
TWI422044B (zh) * 2005-06-30 2014-01-01 Cree Inc 封裝發光裝置之晶片尺度方法及經晶片尺度封裝之發光裝置
CN100550443C (zh) * 2005-07-06 2009-10-14 Lg伊诺特有限公司 氮化物半导体led及其制造方法
KR100565894B1 (ko) 2005-07-06 2006-03-31 (주)룩셀런트 3족 질화물 반도체 발광소자의 활성층을 제어하는 방법
US7365371B2 (en) * 2005-08-04 2008-04-29 Cree, Inc. Packages for semiconductor light emitting devices utilizing dispensed encapsulants
US8835952B2 (en) 2005-08-04 2014-09-16 Cree, Inc. Submounts for semiconductor light emitting devices and methods of forming packaged light emitting devices including dispensed encapsulants
JP4913375B2 (ja) 2005-08-08 2012-04-11 昭和電工株式会社 半導体素子の製造方法
KR100691283B1 (ko) * 2005-09-23 2007-03-12 삼성전기주식회사 질화물 반도체 소자
KR100649749B1 (ko) * 2005-10-25 2006-11-27 삼성전기주식회사 질화물 반도체 발광 소자
US7547925B2 (en) 2005-11-14 2009-06-16 Palo Alto Research Center Incorporated Superlattice strain relief layer for semiconductor devices
JP5255759B2 (ja) * 2005-11-14 2013-08-07 パロ・アルト・リサーチ・センター・インコーポレーテッド 半導体デバイス用超格子歪緩衝層
US7547939B2 (en) * 2005-11-23 2009-06-16 Sensor Electronic Technology, Inc. Semiconductor device and circuit having multiple voltage controlled capacitors
GB2432715A (en) * 2005-11-25 2007-05-30 Sharp Kk Nitride semiconductor light emitting devices
CN101460779A (zh) * 2005-12-21 2009-06-17 科锐Led照明技术公司 照明装置
US7614759B2 (en) 2005-12-22 2009-11-10 Cree Led Lighting Solutions, Inc. Lighting device
JP2009530798A (ja) 2006-01-05 2009-08-27 イルミテックス, インコーポレイテッド Ledから光を導くための独立した光学デバイス
US7442564B2 (en) * 2006-01-19 2008-10-28 Cree, Inc. Dispensed electrical interconnections
US7521728B2 (en) * 2006-01-20 2009-04-21 Cree, Inc. Packages for semiconductor light emitting devices utilizing dispensed reflectors and methods of forming the same
US8441179B2 (en) 2006-01-20 2013-05-14 Cree, Inc. Lighting devices having remote lumiphors that are excited by lumiphor-converted semiconductor excitation sources
US8264138B2 (en) * 2006-01-20 2012-09-11 Cree, Inc. Shifting spectral content in solid state light emitters by spatially separating lumiphor films
KR100735488B1 (ko) * 2006-02-03 2007-07-04 삼성전기주식회사 질화갈륨계 발광다이오드 소자의 제조방법
US8969908B2 (en) 2006-04-04 2015-03-03 Cree, Inc. Uniform emission LED package
US8373195B2 (en) 2006-04-12 2013-02-12 SemiLEDs Optoelectronics Co., Ltd. Light-emitting diode lamp with low thermal resistance
US7863639B2 (en) * 2006-04-12 2011-01-04 Semileds Optoelectronics Co. Ltd. Light-emitting diode lamp with low thermal resistance
US8033692B2 (en) * 2006-05-23 2011-10-11 Cree, Inc. Lighting device
JP2009538531A (ja) * 2006-05-23 2009-11-05 クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド 照明装置、および、製造方法
WO2007139894A2 (en) 2006-05-26 2007-12-06 Cree Led Lighting Solutions, Inc. Solid state light emitting device and method of making same
US8698184B2 (en) 2011-01-21 2014-04-15 Cree, Inc. Light emitting diodes with low junction temperature and solid state backlight components including light emitting diodes with low junction temperature
KR101234783B1 (ko) * 2006-07-13 2013-02-20 삼성전자주식회사 질화물계 반도체 발광소자 및 그 제조방법
KR100850950B1 (ko) * 2006-07-26 2008-08-08 엘지전자 주식회사 질화물계 발광 소자
EP1883141B1 (de) * 2006-07-27 2017-05-24 OSRAM Opto Semiconductors GmbH LD oder LED mit Übergitter-Mantelschicht
PL1883119T3 (pl) * 2006-07-27 2016-04-29 Osram Opto Semiconductors Gmbh Półprzewodnikowa struktura warstwowa z supersiecią
EP1883140B1 (de) * 2006-07-27 2013-02-27 OSRAM Opto Semiconductors GmbH LD oder LED mit Übergitter-Mantelschicht und Dotierungsgradienten
US7943952B2 (en) 2006-07-31 2011-05-17 Cree, Inc. Method of uniform phosphor chip coating and LED package fabricated using method
US7646024B2 (en) * 2006-08-18 2010-01-12 Cree, Inc. Structure and method for reducing forward voltage across a silicon carbide-group III nitride interface
US7763478B2 (en) * 2006-08-21 2010-07-27 Cree, Inc. Methods of forming semiconductor light emitting device packages by liquid injection molding
EP3624560A1 (de) 2006-08-23 2020-03-18 IDEAL Industries Lighting LLC Beleuchtungsvorrichtung und beleuchtungsverfahren
KR100785374B1 (ko) * 2006-09-25 2007-12-18 서울옵토디바이스주식회사 발광 다이오드 및 이의 제조 방법
WO2008042351A2 (en) 2006-10-02 2008-04-10 Illumitex, Inc. Led system and method
US7518139B2 (en) * 2006-10-31 2009-04-14 Lehigh University Gallium nitride-based device and method
US7808013B2 (en) * 2006-10-31 2010-10-05 Cree, Inc. Integrated heat spreaders for light emitting devices (LEDs) and related assemblies
US10295147B2 (en) 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
JP4948134B2 (ja) * 2006-11-22 2012-06-06 シャープ株式会社 窒化物半導体発光素子
KR100835717B1 (ko) * 2006-12-07 2008-06-05 삼성전기주식회사 질화물 반도체 발광소자
US8030641B2 (en) * 2006-12-19 2011-10-04 Lehigh University Graded in content gallium nitride-based device and method
CN101207167B (zh) * 2006-12-22 2010-05-19 上海蓝光科技有限公司 氮化物半导体发光元件
WO2009082404A1 (en) 2006-12-24 2009-07-02 Lehigh University Staggered composition quantum well method and device
WO2008133756A1 (en) * 2006-12-24 2008-11-06 Lehigh University Efficient light extraction method and device
KR100920915B1 (ko) 2006-12-28 2009-10-12 서울옵토디바이스주식회사 초격자 구조의 장벽층을 갖는 발광 다이오드
US9024349B2 (en) 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US8232564B2 (en) 2007-01-22 2012-07-31 Cree, Inc. Wafer level phosphor coating technique for warm light emitting diodes
US9159888B2 (en) 2007-01-22 2015-10-13 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
TWI440210B (zh) 2007-01-22 2014-06-01 Cree Inc 使用發光裝置外部互連陣列之照明裝置及其製造方法
US7709853B2 (en) * 2007-02-12 2010-05-04 Cree, Inc. Packaged semiconductor light emitting devices having multiple optical elements
US9061450B2 (en) 2007-02-12 2015-06-23 Cree, Inc. Methods of forming packaged semiconductor light emitting devices having front contacts by compression molding
US20080198572A1 (en) 2007-02-21 2008-08-21 Medendorp Nicholas W LED lighting systems including luminescent layers on remote reflectors
JP2008244121A (ja) * 2007-03-27 2008-10-09 Rohm Co Ltd 窒化物半導体素子の製造方法
EP1976031A3 (de) 2007-03-29 2010-09-08 Seoul Opto Device Co., Ltd. Lichtemittierende Diode mit Bohr- und/oder Sperrschichten mit Übergitterstruktur
US7910944B2 (en) * 2007-05-04 2011-03-22 Cree, Inc. Side mountable semiconductor light emitting device packages and panels
US20090002979A1 (en) * 2007-06-27 2009-01-01 Cree, Inc. Light emitting device (led) lighting systems for emitting light in multiple directions and related methods
US8042971B2 (en) 2007-06-27 2011-10-25 Cree, Inc. Light emitting device (LED) lighting systems for emitting light in multiple directions and related methods
KR100864609B1 (ko) * 2007-07-04 2008-10-22 우리엘에스티 주식회사 화합물 반도체를 이용한 발광소자
DE102007031926A1 (de) * 2007-07-09 2009-01-15 Osram Opto Semiconductors Gmbh Strahlungsemittierender Halbleiterkörper
US10505083B2 (en) 2007-07-11 2019-12-10 Cree, Inc. Coating method utilizing phosphor containment structure and devices fabricated using same
CN101743488B (zh) * 2007-07-17 2014-02-26 科锐公司 具有内部光学特性结构的光学元件及其制造方法
US20090039375A1 (en) * 2007-08-07 2009-02-12 Cree, Inc. Semiconductor light emitting devices with separated wavelength conversion materials and methods of forming the same
US7863635B2 (en) * 2007-08-07 2011-01-04 Cree, Inc. Semiconductor light emitting devices with applied wavelength conversion materials
KR101438806B1 (ko) 2007-08-28 2014-09-12 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
KR100877774B1 (ko) 2007-09-10 2009-01-16 서울옵토디바이스주식회사 개선된 구조의 발광다이오드
DE102007046027A1 (de) * 2007-09-26 2009-04-02 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip mit einer Mehrfachquantentopfstruktur
WO2009055079A1 (en) * 2007-10-26 2009-04-30 Cree Led Lighting Solutions, Inc. Illumination device having one or more lumiphors, and methods of fabricating same
US9754926B2 (en) 2011-01-31 2017-09-05 Cree, Inc. Light emitting diode (LED) arrays including direct die attach and related assemblies
US9660153B2 (en) 2007-11-14 2017-05-23 Cree, Inc. Gap engineering for flip-chip mounted horizontal LEDs
US8119028B2 (en) 2007-11-14 2012-02-21 Cree, Inc. Cerium and europium doped single crystal phosphors
KR100961107B1 (ko) 2007-11-19 2010-06-07 삼성엘이디 주식회사 이종접합(dh)구조 활성층을 갖는 질화물 반도체 소자
KR100972978B1 (ko) * 2007-12-13 2010-07-29 삼성엘이디 주식회사 질화물 반도체 소자
US8167674B2 (en) 2007-12-14 2012-05-01 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
US9041285B2 (en) 2007-12-14 2015-05-26 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
US8058088B2 (en) 2008-01-15 2011-11-15 Cree, Inc. Phosphor coating systems and methods for light emitting structures and packaged light emitting diodes including phosphor coating
US8940561B2 (en) * 2008-01-15 2015-01-27 Cree, Inc. Systems and methods for application of optical materials to optical elements
US10008637B2 (en) 2011-12-06 2018-06-26 Cree, Inc. Light emitter devices and methods with reduced dimensions and improved light output
US8178888B2 (en) * 2008-02-01 2012-05-15 Cree, Inc. Semiconductor light emitting devices with high color rendering
WO2009100358A1 (en) 2008-02-08 2009-08-13 Illumitex, Inc. System and method for emitter layer shaping
KR100961109B1 (ko) * 2008-02-11 2010-06-07 삼성엘이디 주식회사 GaN계 반도체 발광소자
US8637883B2 (en) 2008-03-19 2014-01-28 Cree, Inc. Low index spacer layer in LED devices
US8664747B2 (en) * 2008-04-28 2014-03-04 Toshiba Techno Center Inc. Trenched substrate for crystal growth and wafer bonding
US9147812B2 (en) * 2008-06-24 2015-09-29 Cree, Inc. Methods of assembly for a semiconductor light emitting device package
US8240875B2 (en) 2008-06-25 2012-08-14 Cree, Inc. Solid state linear array modules for general illumination
EP2332185A2 (de) * 2008-09-08 2011-06-15 3M Innovative Properties Company Elektrisch gepixeltes lumineszenzbauelement
US7955875B2 (en) * 2008-09-26 2011-06-07 Cree, Inc. Forming light emitting devices including custom wavelength conversion structures
WO2010056596A2 (en) * 2008-11-13 2010-05-20 3M Innovative Properties Company Electrically pixelated luminescent device incorporating optical elements
WO2010059132A1 (en) * 2008-11-21 2010-05-27 Agency For Science, Technology And Research A light emitting diode structure and a method of forming a light emitting diode structure
TW201034256A (en) 2008-12-11 2010-09-16 Illumitex Inc Systems and methods for packaging light-emitting diode devices
US8096671B1 (en) 2009-04-06 2012-01-17 Nmera, Llc Light emitting diode illumination system
US8921876B2 (en) * 2009-06-02 2014-12-30 Cree, Inc. Lighting devices with discrete lumiphor-bearing regions within or on a surface of remote elements
US8207547B2 (en) 2009-06-10 2012-06-26 Brudgelux, Inc. Thin-film LED with P and N contacts electrically isolated from the substrate
US20110012141A1 (en) 2009-07-15 2011-01-20 Le Toquin Ronan P Single-color wavelength-converted light emitting devices
KR20120085743A (ko) 2009-08-12 2012-08-01 조지아 스테이트 유니버시티 리서치 파운데이션, 인코포레이티드 고압 화학기상증착 장치, 방법 및 그로부터 제조된 조성물
US8585253B2 (en) 2009-08-20 2013-11-19 Illumitex, Inc. System and method for color mixing lens array
US8449128B2 (en) 2009-08-20 2013-05-28 Illumitex, Inc. System and method for a lens and phosphor layer
TWI405409B (zh) * 2009-08-27 2013-08-11 Novatek Microelectronics Corp 低電壓差動訊號輸出級
US9502612B2 (en) 2009-09-20 2016-11-22 Viagan Ltd. Light emitting diode package with enhanced heat conduction
US8525221B2 (en) * 2009-11-25 2013-09-03 Toshiba Techno Center, Inc. LED with improved injection efficiency
US8466611B2 (en) 2009-12-14 2013-06-18 Cree, Inc. Lighting device with shaped remote phosphor
US8604461B2 (en) * 2009-12-16 2013-12-10 Cree, Inc. Semiconductor device structures with modulated doping and related methods
US8536615B1 (en) 2009-12-16 2013-09-17 Cree, Inc. Semiconductor device structures with modulated and delta doping and related methods
JP5060656B2 (ja) * 2009-12-21 2012-10-31 株式会社東芝 窒化物半導体発光素子およびその製造方法
WO2011083940A2 (ko) * 2010-01-05 2011-07-14 서울옵토디바이스주식회사 발광 다이오드 및 그것을 제조하는 방법
KR100999780B1 (ko) 2010-01-07 2010-12-08 엘지이노텍 주식회사 광학 어셈블리, 이를 구비한 백라이트 유닛 및 디스플레이 장치
KR101710892B1 (ko) * 2010-11-16 2017-02-28 엘지이노텍 주식회사 발광소자
US8575592B2 (en) * 2010-02-03 2013-11-05 Cree, Inc. Group III nitride based light emitting diode structures with multiple quantum well structures having varying well thicknesses
JP5306254B2 (ja) * 2010-02-12 2013-10-02 株式会社東芝 半導体発光素子
US9275979B2 (en) 2010-03-03 2016-03-01 Cree, Inc. Enhanced color rendering index emitter through phosphor separation
US8508127B2 (en) * 2010-03-09 2013-08-13 Cree, Inc. High CRI lighting device with added long-wavelength blue color
JP2011187862A (ja) * 2010-03-11 2011-09-22 Toyoda Gosei Co Ltd Iii族窒化物半導体発光素子の製造方法
CN101807523A (zh) * 2010-03-17 2010-08-18 中国科学院半导体研究所 在大失配衬底上生长表面无裂纹的GaN薄膜的方法
US20110233521A1 (en) * 2010-03-24 2011-09-29 Cree, Inc. Semiconductor with contoured structure
KR101754900B1 (ko) * 2010-04-09 2017-07-06 엘지이노텍 주식회사 발광 소자
KR101051326B1 (ko) * 2010-04-23 2011-07-22 주식회사 세미콘라이트 화합물 반도체 발광소자
TWI649895B (zh) * 2010-04-30 2019-02-01 美國波士頓大學信託會 具能帶結構位變動之高效率紫外光發光二極體
CN102315341B (zh) * 2010-06-30 2014-03-12 比亚迪股份有限公司 具有超晶格结构有源层的发光器件
US9293678B2 (en) * 2010-07-15 2016-03-22 Micron Technology, Inc. Solid-state light emitters having substrates with thermal and electrical conductivity enhancements and method of manufacture
US10546846B2 (en) 2010-07-23 2020-01-28 Cree, Inc. Light transmission control for masking appearance of solid state light sources
JP2010251810A (ja) * 2010-08-11 2010-11-04 Sumitomo Electric Ind Ltd 半導体発光素子
US9515229B2 (en) 2010-09-21 2016-12-06 Cree, Inc. Semiconductor light emitting devices with optical coatings and methods of making same
US8410679B2 (en) 2010-09-21 2013-04-02 Cree, Inc. Semiconductor light emitting devices with densely packed phosphor layer at light emitting surface
US8192051B2 (en) 2010-11-01 2012-06-05 Quarkstar Llc Bidirectional LED light sheet
US8772817B2 (en) 2010-12-22 2014-07-08 Cree, Inc. Electronic device submounts including substrates with thermally conductive vias
US8653542B2 (en) * 2011-01-13 2014-02-18 Tsmc Solid State Lighting Ltd. Micro-interconnects for light-emitting diodes
CN102097555A (zh) * 2011-01-14 2011-06-15 武汉迪源光电科技有限公司 一种二极管外延结构
US8589120B2 (en) 2011-01-28 2013-11-19 Cree, Inc. Methods, systems, and apparatus for determining optical properties of elements of lighting components having similar color points
US9831220B2 (en) 2011-01-31 2017-11-28 Cree, Inc. Light emitting diode (LED) arrays including direct die attach and related assemblies
US9508904B2 (en) 2011-01-31 2016-11-29 Cree, Inc. Structures and substrates for mounting optical elements and methods and devices for providing the same background
US9673363B2 (en) 2011-01-31 2017-06-06 Cree, Inc. Reflective mounting substrates for flip-chip mounted horizontal LEDs
US9166126B2 (en) 2011-01-31 2015-10-20 Cree, Inc. Conformally coated light emitting devices and methods for providing the same
US9053958B2 (en) 2011-01-31 2015-06-09 Cree, Inc. Light emitting diode (LED) arrays including direct die attach and related assemblies
US9401103B2 (en) 2011-02-04 2016-07-26 Cree, Inc. LED-array light source with aspect ratio greater than 1
US11251164B2 (en) 2011-02-16 2022-02-15 Creeled, Inc. Multi-layer conversion material for down conversion in solid state lighting
US10098197B2 (en) 2011-06-03 2018-10-09 Cree, Inc. Lighting devices with individually compensating multi-color clusters
US8314566B2 (en) 2011-02-22 2012-11-20 Quarkstar Llc Solid state lamp using light emitting strips
US8410726B2 (en) 2011-02-22 2013-04-02 Quarkstar Llc Solid state lamp using modular light emitting elements
CN102683538B (zh) 2011-03-06 2016-06-08 维亚甘有限公司 发光二极管封装和制造方法
KR101781435B1 (ko) 2011-04-13 2017-09-25 삼성전자주식회사 질화물 반도체 발광소자
US9263636B2 (en) 2011-05-04 2016-02-16 Cree, Inc. Light-emitting diode (LED) for achieving an asymmetric light output
CN102185056B (zh) * 2011-05-05 2012-10-03 中国科学院半导体研究所 提高电子注入效率的氮化镓基发光二极管
US8921875B2 (en) 2011-05-10 2014-12-30 Cree, Inc. Recipient luminophoric mediums having narrow spectrum luminescent materials and related semiconductor light emitting devices and methods
US8906263B2 (en) 2011-06-03 2014-12-09 Cree, Inc. Red nitride phosphors
US8729790B2 (en) 2011-06-03 2014-05-20 Cree, Inc. Coated phosphors and light emitting devices including the same
US8814621B2 (en) 2011-06-03 2014-08-26 Cree, Inc. Methods of determining and making red nitride compositions
US8747697B2 (en) 2011-06-07 2014-06-10 Cree, Inc. Gallium-substituted yttrium aluminum garnet phosphor and light emitting devices including the same
US8684569B2 (en) 2011-07-06 2014-04-01 Cree, Inc. Lens and trim attachment structure for solid state downlights
US8395165B2 (en) 2011-07-08 2013-03-12 Bridelux, Inc. Laterally contacted blue LED with superlattice current spreading layer
US10686107B2 (en) 2011-07-21 2020-06-16 Cree, Inc. Light emitter devices and components with improved chemical resistance and related methods
US10211380B2 (en) 2011-07-21 2019-02-19 Cree, Inc. Light emitting devices and components having improved chemical resistance and related methods
JP2014525146A (ja) 2011-07-21 2014-09-25 クリー インコーポレイテッド 発光デバイス、パッケージ、部品、ならびに改良された化学抵抗性のための方法および関連する方法
US20130026480A1 (en) 2011-07-25 2013-01-31 Bridgelux, Inc. Nucleation of Aluminum Nitride on a Silicon Substrate Using an Ammonia Preflow
US8916906B2 (en) 2011-07-29 2014-12-23 Kabushiki Kaisha Toshiba Boron-containing buffer layer for growing gallium nitride on silicon
US8865565B2 (en) 2011-08-02 2014-10-21 Kabushiki Kaisha Toshiba LED having a low defect N-type layer that has grown on a silicon substrate
US9343641B2 (en) 2011-08-02 2016-05-17 Manutius Ip, Inc. Non-reactive barrier metal for eutectic bonding process
US9142743B2 (en) 2011-08-02 2015-09-22 Kabushiki Kaisha Toshiba High temperature gold-free wafer bonding for light emitting diodes
US9012939B2 (en) 2011-08-02 2015-04-21 Kabushiki Kaisha Toshiba N-type gallium-nitride layer having multiple conductive intervening layers
US20130032810A1 (en) 2011-08-03 2013-02-07 Bridgelux, Inc. Led on silicon substrate using zinc-sulfide as buffer layer
US8564010B2 (en) 2011-08-04 2013-10-22 Toshiba Techno Center Inc. Distributed current blocking structures for light emitting diodes
US8624482B2 (en) 2011-09-01 2014-01-07 Toshiba Techno Center Inc. Distributed bragg reflector for reflecting light of multiple wavelengths from an LED
US8669585B1 (en) 2011-09-03 2014-03-11 Toshiba Techno Center Inc. LED that has bounding silicon-doped regions on either side of a strain release layer
US8558247B2 (en) 2011-09-06 2013-10-15 Toshiba Techno Center Inc. GaN LEDs with improved area and method for making the same
US8686430B2 (en) 2011-09-07 2014-04-01 Toshiba Techno Center Inc. Buffer layer for GaN-on-Si LED
CN103022288B (zh) * 2011-09-27 2017-02-01 比亚迪股份有限公司 一种发光二极管及其制造方法
US8853668B2 (en) 2011-09-29 2014-10-07 Kabushiki Kaisha Toshiba Light emitting regions for use with light emitting devices
US20130082274A1 (en) 2011-09-29 2013-04-04 Bridgelux, Inc. Light emitting devices having dislocation density maintaining buffer layers
US8698163B2 (en) 2011-09-29 2014-04-15 Toshiba Techno Center Inc. P-type doping layers for use with light emitting devices
US8664679B2 (en) 2011-09-29 2014-03-04 Toshiba Techno Center Inc. Light emitting devices having light coupling layers with recessed electrodes
US9012921B2 (en) 2011-09-29 2015-04-21 Kabushiki Kaisha Toshiba Light emitting devices having light coupling layers
US9178114B2 (en) 2011-09-29 2015-11-03 Manutius Ip, Inc. P-type doping layers for use with light emitting devices
US8957440B2 (en) 2011-10-04 2015-02-17 Cree, Inc. Light emitting devices with low packaging factor
US8581267B2 (en) 2011-11-09 2013-11-12 Toshiba Techno Center Inc. Series connected segmented LED
US8552465B2 (en) 2011-11-09 2013-10-08 Toshiba Techno Center Inc. Method for reducing stress in epitaxial growth
WO2013082592A1 (en) 2011-12-03 2013-06-06 Sensor Electronic Technology, Inc. Epitaxy technique for growing semiconductor compounds
US10490697B2 (en) 2011-12-03 2019-11-26 Sensor Electronic Technology, Inc. Epitaxy technique for growing semiconductor compounds
US10158044B2 (en) 2011-12-03 2018-12-18 Sensor Electronic Technology, Inc. Epitaxy technique for growing semiconductor compounds
US9496466B2 (en) 2011-12-06 2016-11-15 Cree, Inc. Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction
KR20130078345A (ko) * 2011-12-30 2013-07-10 일진엘이디(주) 스트레인 완충층을 이용하여 발광효율이 우수한 질화물계 발광소자
US9318669B2 (en) 2012-01-30 2016-04-19 Cree, Inc. Methods of determining and making red nitride compositions
WO2013116622A1 (en) * 2012-02-01 2013-08-08 Sensor Electronic Technology, Inc. Epitaxy technique for reducing threading dislocations in stressed semiconductor compounds
US9343441B2 (en) 2012-02-13 2016-05-17 Cree, Inc. Light emitter devices having improved light output and related methods
US9240530B2 (en) 2012-02-13 2016-01-19 Cree, Inc. Light emitter devices having improved chemical and physical resistance and related methods
US9735198B2 (en) 2012-03-30 2017-08-15 Cree, Inc. Substrate based light emitter devices, components, and related methods
JP6211057B2 (ja) 2012-04-16 2017-10-11 センサー エレクトロニック テクノロジー インコーポレイテッド 不均一多重量子井戸構造
KR101461602B1 (ko) * 2012-06-25 2014-11-20 청주대학교 산학협력단 양자우물 구조 태양전지 및 그 제조 방법
JP5383876B1 (ja) 2012-08-01 2014-01-08 株式会社東芝 半導体発光素子及びその製造方法
KR20140019635A (ko) * 2012-08-06 2014-02-17 엘지이노텍 주식회사 발광 소자 및 발광 소자 패키지
JP5881560B2 (ja) * 2012-08-30 2016-03-09 株式会社東芝 半導体発光装置及びその製造方法
US9171826B2 (en) * 2012-09-04 2015-10-27 Micron Technology, Inc. High voltage solid-state transducers and solid-state transducer arrays having electrical cross-connections and associated systems and methods
US8814376B2 (en) 2012-09-26 2014-08-26 Apogee Translite, Inc. Lighting devices
TWI535055B (zh) 2012-11-19 2016-05-21 新世紀光電股份有限公司 氮化物半導體結構及半導體發光元件
TWI524551B (zh) 2012-11-19 2016-03-01 新世紀光電股份有限公司 氮化物半導體結構及半導體發光元件
US10153394B2 (en) * 2012-11-19 2018-12-11 Genesis Photonics Inc. Semiconductor structure
US9182091B2 (en) 2012-12-14 2015-11-10 Remphos Technologies Llc LED panel light fixture
US8882298B2 (en) 2012-12-14 2014-11-11 Remphos Technologies Llc LED module for light distribution
WO2014110195A1 (en) 2013-01-09 2014-07-17 Sensor Electronic Technology, Inc. Light emitting heterostructure with partially relaxed semiconductor layer
US9960315B2 (en) 2013-01-09 2018-05-01 Sensor Electronic Technology, Inc. Light emitting heterostructure with partially relaxed semiconductor layer
US9316382B2 (en) 2013-01-31 2016-04-19 Cree, Inc. Connector devices, systems, and related methods for connecting light emitting diode (LED) modules
US9030103B2 (en) 2013-02-08 2015-05-12 Cree, Inc. Solid state light emitting devices including adjustable scotopic / photopic ratio
US9039746B2 (en) 2013-02-08 2015-05-26 Cree, Inc. Solid state light emitting devices including adjustable melatonin suppression effects
US9565782B2 (en) 2013-02-15 2017-02-07 Ecosense Lighting Inc. Field replaceable power supply cartridge
US9055643B2 (en) 2013-03-13 2015-06-09 Cree, Inc. Solid state lighting apparatus and methods of forming
WO2014151264A1 (en) * 2013-03-15 2014-09-25 Crystal Is, Inc. Planar contacts to pseudomorphic electronic and optoelectronic devices
KR102108196B1 (ko) * 2013-04-05 2020-05-08 서울바이오시스 주식회사 성장 기판이 분리된 자외선 발광소자 및 그 제조 방법
CN103236477B (zh) * 2013-04-19 2015-08-12 安徽三安光电有限公司 一种led外延结构及其制备方法
US11435064B1 (en) 2013-07-05 2022-09-06 DMF, Inc. Integrated lighting module
US10753558B2 (en) 2013-07-05 2020-08-25 DMF, Inc. Lighting apparatus and methods
US11060705B1 (en) 2013-07-05 2021-07-13 DMF, Inc. Compact lighting apparatus with AC to DC converter and integrated electrical connector
US9964266B2 (en) 2013-07-05 2018-05-08 DMF, Inc. Unified driver and light source assembly for recessed lighting
US11255497B2 (en) 2013-07-05 2022-02-22 DMF, Inc. Adjustable electrical apparatus with hangar bars for installation in a building
US10139059B2 (en) 2014-02-18 2018-11-27 DMF, Inc. Adjustable compact recessed lighting assembly with hangar bars
US10551044B2 (en) 2015-11-16 2020-02-04 DMF, Inc. Recessed lighting assembly
US10591120B2 (en) 2015-05-29 2020-03-17 DMF, Inc. Lighting module for recessed lighting systems
US10563850B2 (en) 2015-04-22 2020-02-18 DMF, Inc. Outer casing for a recessed lighting fixture
US9412911B2 (en) 2013-07-09 2016-08-09 The Silanna Group Pty Ltd Optical tuning of light emitting semiconductor junctions
US9240528B2 (en) 2013-10-03 2016-01-19 Cree, Inc. Solid state lighting apparatus with high scotopic/photopic (S/P) ratio
CN103872198B (zh) * 2014-03-24 2016-09-28 天津三安光电有限公司 一种多量子阱结构及采用该结构的发光二极管
TWI550902B (zh) * 2014-04-02 2016-09-21 國立交通大學 發光二極體元件
WO2015181657A1 (en) 2014-05-27 2015-12-03 The Silanna Group Pty Limited Advanced electronic device structures using semiconductor structures and superlattices
US11322643B2 (en) 2014-05-27 2022-05-03 Silanna UV Technologies Pte Ltd Optoelectronic device
JP6986349B2 (ja) 2014-05-27 2021-12-22 シランナ・ユー・ブイ・テクノロジーズ・プライベート・リミテッドSilanna Uv Technologies Pte Ltd n型超格子及びp型超格子を備える電子デバイス
KR102439708B1 (ko) 2014-05-27 2022-09-02 실라나 유브이 테크놀로지스 피티이 리미티드 광전자 디바이스
US10797204B2 (en) 2014-05-30 2020-10-06 Cree, Inc. Submount based light emitter components and methods
JPWO2016002419A1 (ja) * 2014-07-04 2017-04-27 シャープ株式会社 窒化物半導体発光素子
KR102227772B1 (ko) 2014-08-19 2021-03-16 삼성전자주식회사 반도체 발광소자
US10477636B1 (en) 2014-10-28 2019-11-12 Ecosense Lighting Inc. Lighting systems having multiple light sources
WO2016073678A1 (en) 2014-11-06 2016-05-12 Koninklijke Philips N.V. Light emitting device with trench beneath a top contact
US9985168B1 (en) 2014-11-18 2018-05-29 Cree, Inc. Group III nitride based LED structures including multiple quantum wells with barrier-well unit interface layers
US10431568B2 (en) 2014-12-18 2019-10-01 Cree, Inc. Light emitting diodes, components and related methods
US11306897B2 (en) 2015-02-09 2022-04-19 Ecosense Lighting Inc. Lighting systems generating partially-collimated light emissions
US9869450B2 (en) 2015-02-09 2018-01-16 Ecosense Lighting Inc. Lighting systems having a truncated parabolic- or hyperbolic-conical light reflector, or a total internal reflection lens; and having another light reflector
US9651216B2 (en) 2015-03-03 2017-05-16 Ecosense Lighting Inc. Lighting systems including asymmetric lens modules for selectable light distribution
US9746159B1 (en) 2015-03-03 2017-08-29 Ecosense Lighting Inc. Lighting system having a sealing system
US9568665B2 (en) 2015-03-03 2017-02-14 Ecosense Lighting Inc. Lighting systems including lens modules for selectable light distribution
US9651227B2 (en) 2015-03-03 2017-05-16 Ecosense Lighting Inc. Low-profile lighting system having pivotable lighting enclosure
CN104701432A (zh) * 2015-03-20 2015-06-10 映瑞光电科技(上海)有限公司 GaN 基LED 外延结构及其制备方法
CN113130725A (zh) 2015-03-31 2021-07-16 科锐Led公司 具有包封的发光二极管和方法
WO2016176625A1 (en) 2015-04-30 2016-11-03 Cree, Inc. Solid state lighting components
KR102322692B1 (ko) * 2015-05-29 2021-11-05 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 자외선 발광소자
USD785218S1 (en) 2015-07-06 2017-04-25 Ecosense Lighting Inc. LED luminaire having a mounting system
US10074635B2 (en) 2015-07-17 2018-09-11 Cree, Inc. Solid state light emitter devices and methods
USD782093S1 (en) 2015-07-20 2017-03-21 Ecosense Lighting Inc. LED luminaire having a mounting system
USD782094S1 (en) 2015-07-20 2017-03-21 Ecosense Lighting Inc. LED luminaire having a mounting system
US9651232B1 (en) 2015-08-03 2017-05-16 Ecosense Lighting Inc. Lighting system having a mounting device
JP6896708B2 (ja) 2015-09-17 2021-06-30 クリスタル アイエス,インコーポレーテッドCrystal Is,Inc. 2次元正孔ガスを組み込んだ紫外線発光デバイス
USD851046S1 (en) 2015-10-05 2019-06-11 DMF, Inc. Electrical Junction Box
US20170207365A1 (en) * 2016-01-20 2017-07-20 Google Inc. Layered active region light emitting diode
TWI738640B (zh) 2016-03-08 2021-09-11 新世紀光電股份有限公司 半導體結構
KR20170124439A (ko) * 2016-05-02 2017-11-10 서울바이오시스 주식회사 고효율 장파장 발광 소자
TWI577842B (zh) * 2016-05-30 2017-04-11 光鋐科技股份有限公司 氮化鋁鎵的成長方法
JP7118427B2 (ja) 2016-06-20 2022-08-16 スージョウ レキン セミコンダクター カンパニー リミテッド 半導体素子
JP6870228B2 (ja) 2016-07-18 2021-05-12 豊田合成株式会社 Iii族窒化物半導体発光素子とその製造方法
CN109791968A (zh) 2016-07-26 2019-05-21 克利公司 发光二极管、组件和相关方法
US10340415B2 (en) 2016-09-01 2019-07-02 Lg Innotek Co., Ltd. Semiconductor device and semiconductor device package including the same
JP7178712B2 (ja) 2016-09-10 2022-11-28 スージョウ レキン セミコンダクター カンパニー リミテッド 半導体素子
CN115498078A (zh) 2016-09-13 2022-12-20 苏州立琻半导体有限公司 半导体器件和包括该半导体器件的半导体器件封装
WO2018052902A1 (en) 2016-09-13 2018-03-22 Cree, Inc. Light emitting diodes, components and related methods
TWI717386B (zh) 2016-09-19 2021-02-01 新世紀光電股份有限公司 含氮半導體元件
US10804251B2 (en) 2016-11-22 2020-10-13 Cree, Inc. Light emitting diode (LED) devices, components and methods
US10903395B2 (en) * 2016-11-24 2021-01-26 Lg Innotek Co., Ltd. Semiconductor device having varying concentrations of aluminum
US10121932B1 (en) * 2016-11-30 2018-11-06 The United States Of America As Represented By The Secretary Of The Navy Tunable graphene light-emitting device
KR102604739B1 (ko) * 2017-01-05 2023-11-22 삼성전자주식회사 반도체 발광 장치
US10439114B2 (en) 2017-03-08 2019-10-08 Cree, Inc. Substrates for light emitting diodes and related methods
US10410997B2 (en) 2017-05-11 2019-09-10 Cree, Inc. Tunable integrated optics LED components and methods
CN109148661B (zh) * 2017-06-19 2022-11-15 新世纪光电股份有限公司 半导体结构
WO2018237294A2 (en) 2017-06-22 2018-12-27 DMF, Inc. THIN-PROFILE SURFACE MOUNTING LIGHTING DEVICE
US10488000B2 (en) 2017-06-22 2019-11-26 DMF, Inc. Thin profile surface mount lighting apparatus
USD905327S1 (en) 2018-05-17 2020-12-15 DMF, Inc. Light fixture
US10672957B2 (en) 2017-07-19 2020-06-02 Cree, Inc. LED apparatuses and methods for high lumen output density
KR102390828B1 (ko) 2017-08-14 2022-04-26 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자
US11101248B2 (en) 2017-08-18 2021-08-24 Creeled, Inc. Light emitting diodes, components and related methods
US11107857B2 (en) 2017-08-18 2021-08-31 Creeled, Inc. Light emitting diodes, components and related methods
US11067231B2 (en) 2017-08-28 2021-07-20 DMF, Inc. Alternate junction box and arrangement for lighting apparatus
US10361349B2 (en) 2017-09-01 2019-07-23 Cree, Inc. Light emitting diodes, components and related methods
US10541353B2 (en) 2017-11-10 2020-01-21 Cree, Inc. Light emitting devices including narrowband converters for outdoor lighting applications
CN114719211A (zh) 2017-11-28 2022-07-08 Dmf股份有限公司 可调整的吊架杆组合件
US10734560B2 (en) 2017-11-29 2020-08-04 Cree, Inc. Configurable circuit layout for LEDs
CA3087187A1 (en) 2017-12-27 2019-07-04 DMF, Inc. Methods and apparatus for adjusting a luminaire
US10516076B2 (en) 2018-02-01 2019-12-24 Silanna UV Technologies Pte Ltd Dislocation filter for semiconductor devices
WO2019188318A1 (ja) * 2018-03-26 2019-10-03 パナソニック株式会社 半導体発光素子
US10573543B2 (en) 2018-04-30 2020-02-25 Cree, Inc. Apparatus and methods for mass transfer of electronic die
USD877957S1 (en) 2018-05-24 2020-03-10 DMF Inc. Light fixture
US11024785B2 (en) * 2018-05-25 2021-06-01 Creeled, Inc. Light-emitting diode packages
US10453827B1 (en) 2018-05-30 2019-10-22 Cree, Inc. LED apparatuses and methods
US11101410B2 (en) 2018-05-30 2021-08-24 Creeled, Inc. LED systems, apparatuses, and methods
EP3776674A1 (de) 2018-06-04 2021-02-17 Cree, Inc. Led-vorrichtungen und verfahren
CA3103255A1 (en) 2018-06-11 2019-12-19 DMF, Inc. A polymer housing for a recessed lighting system and methods for using same
USD903605S1 (en) 2018-06-12 2020-12-01 DMF, Inc. Plastic deep electrical junction box
US10964866B2 (en) 2018-08-21 2021-03-30 Cree, Inc. LED device, system, and method with adaptive patterns
US11233183B2 (en) 2018-08-31 2022-01-25 Creeled, Inc. Light-emitting diodes, light-emitting diode arrays and related devices
US11335833B2 (en) 2018-08-31 2022-05-17 Creeled, Inc. Light-emitting diodes, light-emitting diode arrays and related devices
US11393948B2 (en) 2018-08-31 2022-07-19 Creeled, Inc. Group III nitride LED structures with improved electrical performance
CA3115146A1 (en) 2018-10-02 2020-04-09 Ver Lighting Llc A bar hanger assembly with mating telescoping bars
USD1012864S1 (en) 2019-01-29 2024-01-30 DMF, Inc. Portion of a plastic deep electrical junction box
USD864877S1 (en) 2019-01-29 2019-10-29 DMF, Inc. Plastic deep electrical junction box with a lighting module mounting yoke
USD901398S1 (en) 2019-01-29 2020-11-10 DMF, Inc. Plastic deep electrical junction box
USD966877S1 (en) 2019-03-14 2022-10-18 Ver Lighting Llc Hanger bar for a hanger bar assembly
KR102160881B1 (ko) * 2019-04-29 2020-09-28 숭실대학교산학협력단 마이크로 발광 다이오드
US11101411B2 (en) 2019-06-26 2021-08-24 Creeled, Inc. Solid-state light emitting devices including light emitting diodes in package structures
WO2021051101A1 (en) 2019-09-12 2021-03-18 DMF, Inc. Miniature lighting module and lighting fixtures using same
CN114730818A (zh) * 2019-11-26 2022-07-08 日亚化学工业株式会社 氮化物半导体元件
CN115668519A (zh) * 2020-05-19 2023-01-31 谷歌有限责任公司 光发射元件应变管理层的组合
US11621370B2 (en) 2020-06-19 2023-04-04 Seoul Viosys Co., Ltd. Single chip multi band led and application thereof
USD990030S1 (en) 2020-07-17 2023-06-20 DMF, Inc. Housing for a lighting system
CA3124976A1 (en) 2020-07-17 2022-01-17 DMF, Inc. Polymer housing for a lighting system and methods for using same
CA3125954A1 (en) 2020-07-23 2022-01-23 DMF, Inc. Lighting module having field-replaceable optics, improved cooling, and tool-less mounting features
CN115050866B (zh) * 2022-08-16 2022-11-08 江苏第三代半导体研究院有限公司 极化可控的量子点Micro-LED同质外延结构及其制备方法

Family Cites Families (139)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US691268A (en) * 1901-09-09 1902-01-14 William Jankowsky Enameling metal ware.
JPH0614564B2 (ja) 1987-07-13 1994-02-23 日本電信電話株式会社 半導体発光素子
US5319657A (en) 1991-10-08 1994-06-07 Matsushita Electric Industrial Co., Ltd. Semiconductor laser of modulation doping quantum well structure with stopper against dopant dispersion and manufacturing method thereof
US5351255A (en) * 1992-05-12 1994-09-27 North Carolina State University Of Raleigh Inverted integrated heterostructure of group II-VI semiconductor materials including epitaxial ohmic contact and method of fabricating same
US5818072A (en) * 1992-05-12 1998-10-06 North Carolina State University Integrated heterostructure of group II-VI semiconductor materials including epitaxial ohmic contact and method of fabricating same
US5323022A (en) * 1992-09-10 1994-06-21 North Carolina State University Platinum ohmic contact to p-type silicon carbide
EP0606093B1 (de) 1993-01-07 1997-12-17 Nec Corporation Integrierte optische Halbleiteranordnung und Herstellungsverfahren
JP2932467B2 (ja) 1993-03-12 1999-08-09 日亜化学工業株式会社 窒化ガリウム系化合物半導体発光素子
JP2932468B2 (ja) 1993-12-10 1999-08-09 日亜化学工業株式会社 窒化ガリウム系化合物半導体発光素子
US5393993A (en) * 1993-12-13 1995-02-28 Cree Research, Inc. Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices
JP2800666B2 (ja) 1993-12-17 1998-09-21 日亜化学工業株式会社 窒化ガリウム系化合物半導体レーザ素子
US5679152A (en) * 1994-01-27 1997-10-21 Advanced Technology Materials, Inc. Method of making a single crystals Ga*N article
US6130147A (en) 1994-04-07 2000-10-10 Sdl, Inc. Methods for forming group III-V arsenide-nitride semiconductor materials
JP2956489B2 (ja) 1994-06-24 1999-10-04 日亜化学工業株式会社 窒化ガリウム系化合物半導体の結晶成長方法
JP2890390B2 (ja) 1994-07-06 1999-05-10 日亜化学工業株式会社 窒化ガリウム系化合物半導体発光素子
US5838029A (en) * 1994-08-22 1998-11-17 Rohm Co., Ltd. GaN-type light emitting device formed on a silicon substrate
US5523589A (en) * 1994-09-20 1996-06-04 Cree Research, Inc. Vertical geometry light emitting diode with group III nitride active layer and extended lifetime
JP2790242B2 (ja) 1994-10-07 1998-08-27 日亜化学工業株式会社 窒化物半導体発光ダイオード
US5777350A (en) * 1994-12-02 1998-07-07 Nichia Chemical Industries, Ltd. Nitride semiconductor light-emitting device
US5766981A (en) * 1995-01-04 1998-06-16 Xerox Corporation Thermally processed, phosphorus- or arsenic-containing semiconductor laser with selective IILD
JP2921746B2 (ja) 1995-01-31 1999-07-19 日亜化学工業株式会社 窒化物半導体レーザ素子
US5661074A (en) * 1995-02-03 1997-08-26 Advanced Technology Materials, Inc. High brightness electroluminescent device emitting in the green to ultraviolet spectrum and method of making the same
US5585648A (en) * 1995-02-03 1996-12-17 Tischler; Michael A. High brightness electroluminescent device, emitting in the green to ultraviolet spectrum, and method of making the same
JP2890396B2 (ja) 1995-03-27 1999-05-10 日亜化学工業株式会社 窒化物半導体発光素子
US5670798A (en) * 1995-03-29 1997-09-23 North Carolina State University Integrated heterostructures of Group III-V nitride semiconductor materials including epitaxial ohmic contact non-nitride buffer layer and methods of fabricating same
US5679965A (en) * 1995-03-29 1997-10-21 North Carolina State University Integrated heterostructures of Group III-V nitride semiconductor materials including epitaxial ohmic contact, non-nitride buffer layer and methods of fabricating same
JP3728332B2 (ja) 1995-04-24 2005-12-21 シャープ株式会社 化合物半導体発光素子
JP3373975B2 (ja) 1995-05-24 2003-02-04 三洋電機株式会社 半導体発光素子
JP3135041B2 (ja) 1995-09-29 2001-02-13 日亜化学工業株式会社 窒化物半導体発光素子
JP2891348B2 (ja) 1995-11-24 1999-05-17 日亜化学工業株式会社 窒化物半導体レーザ素子
JP2900990B2 (ja) 1995-11-24 1999-06-02 日亜化学工業株式会社 窒化物半導体発光素子
JP3371830B2 (ja) 1995-11-24 2003-01-27 日亜化学工業株式会社 窒化物半導体発光素子
JP3298390B2 (ja) 1995-12-11 2002-07-02 日亜化学工業株式会社 窒化物半導体多色発光素子の製造方法
JP3635757B2 (ja) * 1995-12-28 2005-04-06 昭和電工株式会社 AlGaInP発光ダイオード
EP0817283A1 (de) * 1996-01-19 1998-01-07 Matsushita Electric Industrial Co., Ltd. Lichtemittierende vorrichtung aus einer gallium-nitrid-halbleiterverbindung und verfahren zum herstellen einer gallium-nitrid-halbleiterverbindung
US5874747A (en) * 1996-02-05 1999-02-23 Advanced Technology Materials, Inc. High brightness electroluminescent device emitting in the green to ultraviolet spectrum and method of making the same
JPH09232629A (ja) 1996-02-26 1997-09-05 Toshiba Corp 半導体素子
JP3336855B2 (ja) 1996-03-27 2002-10-21 豊田合成株式会社 3族窒化物化合物半導体発光素子
JP3314620B2 (ja) 1996-04-11 2002-08-12 日亜化学工業株式会社 窒化物半導体発光素子
JP3576743B2 (ja) 1996-04-22 2004-10-13 東芝電子エンジニアリング株式会社 発光素子
JP3448450B2 (ja) 1996-04-26 2003-09-22 三洋電機株式会社 発光素子およびその製造方法
JP3366188B2 (ja) 1996-05-21 2003-01-14 日亜化学工業株式会社 窒化物半導体素子
US5771256A (en) * 1996-06-03 1998-06-23 Bell Communications Research, Inc. InP-based lasers with reduced blue shifts
JPH1012969A (ja) 1996-06-19 1998-01-16 Nichia Chem Ind Ltd 窒化物半導体レーザ素子
US5684309A (en) * 1996-07-11 1997-11-04 North Carolina State University Stacked quantum well aluminum indium gallium nitride light emitting diodes
JPH1065271A (ja) * 1996-08-13 1998-03-06 Toshiba Corp 窒化ガリウム系半導体光発光素子
JP3304787B2 (ja) * 1996-09-08 2002-07-22 豊田合成株式会社 半導体発光素子及びその製造方法
JP3304782B2 (ja) 1996-09-08 2002-07-22 豊田合成株式会社 半導体発光素子
JP3660446B2 (ja) 1996-11-07 2005-06-15 日亜化学工業株式会社 窒化物半導体素子及びその製造方法
JP3424465B2 (ja) 1996-11-15 2003-07-07 日亜化学工業株式会社 窒化物半導体素子及び窒化物半導体の成長方法
CN100530719C (zh) 1997-01-09 2009-08-19 日亚化学工业株式会社 氮化物半导体元器件
JP3478090B2 (ja) * 1997-05-26 2003-12-10 日亜化学工業株式会社 窒化物半導体素子
JP3374737B2 (ja) 1997-01-09 2003-02-10 日亜化学工業株式会社 窒化物半導体素子
JPH10209569A (ja) * 1997-01-16 1998-08-07 Hewlett Packard Co <Hp> p型窒化物半導体装置とその製造方法
JP3679914B2 (ja) * 1997-02-12 2005-08-03 株式会社東芝 半導体発光装置及びその製造方法
CN1195895A (zh) * 1997-04-10 1998-10-14 李炳辉 半导体量子振荡器件
WO1998047170A1 (en) * 1997-04-11 1998-10-22 Nichia Chemical Industries, Ltd. Method of growing nitride semiconductors, nitride semiconductor substrate and nitride semiconductor device
JP3642157B2 (ja) * 1997-05-26 2005-04-27 ソニー株式会社 p型III族ナイトライド化合物半導体、発光ダイオードおよび半導体レーザ
JP3646502B2 (ja) 1997-06-13 2005-05-11 豊田合成株式会社 3族窒化物半導体素子の製造方法
JPH1174562A (ja) 1997-06-30 1999-03-16 Nichia Chem Ind Ltd 窒化物半導体素子
JP3606015B2 (ja) 1997-07-23 2005-01-05 豊田合成株式会社 3族窒化物半導体素子の製造方法
JP3744211B2 (ja) 1997-09-01 2006-02-08 日亜化学工業株式会社 窒化物半導体素子
EP1014455B1 (de) 1997-07-25 2006-07-12 Nichia Corporation Halbleitervorrichtung aus einer nitridverbindung
JP3651260B2 (ja) 1997-10-01 2005-05-25 日亜化学工業株式会社 窒化物半導体素子
US6201262B1 (en) * 1997-10-07 2001-03-13 Cree, Inc. Group III nitride photonic devices on silicon carbide substrates with conductive buffer interlay structure
JP4122552B2 (ja) 1997-11-12 2008-07-23 日亜化学工業株式会社 発光装置
JPH11238945A (ja) 1997-12-18 1999-08-31 Nichia Chem Ind Ltd 窒化物半導体発光素子
JP3647236B2 (ja) 1997-12-22 2005-05-11 日亜化学工業株式会社 窒化物半導体レーザ素子
JP3468082B2 (ja) 1998-02-26 2003-11-17 日亜化学工業株式会社 窒化物半導体素子
CA2322490C (en) 1998-03-12 2010-10-26 Nichia Chemical Industries, Ltd. Nitride semiconductor device
JPH11298090A (ja) 1998-04-09 1999-10-29 Nichia Chem Ind Ltd 窒化物半導体素子
JPH11308964A (ja) 1998-04-27 1999-11-09 Shigeru Matoba 蒸葉の撹拌露取り装置
JPH11330552A (ja) 1998-05-18 1999-11-30 Nichia Chem Ind Ltd 窒化物半導体発光素子及び発光装置
JPH11340573A (ja) * 1998-05-28 1999-12-10 Sharp Corp 窒化ガリウム系半導体レーザ素子
US6657300B2 (en) 1998-06-05 2003-12-02 Lumileds Lighting U.S., Llc Formation of ohmic contacts in III-nitride light emitting devices
JP3279266B2 (ja) 1998-09-11 2002-04-30 日本電気株式会社 窒化ガリウム系半導体発光素子
US6459100B1 (en) 1998-09-16 2002-10-01 Cree, Inc. Vertical geometry ingan LED
US6608330B1 (en) 1998-09-21 2003-08-19 Nichia Corporation Light emitting device
WO2000021143A1 (de) 1998-10-05 2000-04-13 Osram Opto Semiconductors Gmbh & Co. Ohg Strahlungsemittierender halbleiterchip
JP3063756B1 (ja) 1998-10-06 2000-07-12 日亜化学工業株式会社 窒化物半導体素子
JP4629178B2 (ja) 1998-10-06 2011-02-09 日亜化学工業株式会社 窒化物半導体素子
JP2000133883A (ja) 1998-10-22 2000-05-12 Nichia Chem Ind Ltd 窒化物半導体素子
JP2000150957A (ja) 1998-11-12 2000-05-30 Showa Denko Kk Iii族窒化物半導体発光素子
US6153894A (en) * 1998-11-12 2000-11-28 Showa Denko Kabushiki Kaisha Group-III nitride semiconductor light-emitting device
JP3063757B1 (ja) 1998-11-17 2000-07-12 日亜化学工業株式会社 窒化物半導体素子
JP3470622B2 (ja) 1998-11-18 2003-11-25 日亜化学工業株式会社 窒化物半導体発光素子
JP3519990B2 (ja) 1998-12-09 2004-04-19 三洋電機株式会社 発光素子及びその製造方法
JP3705047B2 (ja) 1998-12-15 2005-10-12 日亜化学工業株式会社 窒化物半導体発光素子
JP3868136B2 (ja) * 1999-01-20 2007-01-17 日亜化学工業株式会社 窒化ガリウム系化合物半導体発光素子
US6838705B1 (en) 1999-03-29 2005-01-04 Nichia Corporation Nitride semiconductor device
JP3567790B2 (ja) * 1999-03-31 2004-09-22 豊田合成株式会社 Iii族窒化物系化合物半導体発光素子
JP2000286448A (ja) * 1999-03-31 2000-10-13 Toyoda Gosei Co Ltd Iii族窒化物系化合物半導体発光素子
JP3656456B2 (ja) * 1999-04-21 2005-06-08 日亜化学工業株式会社 窒化物半導体素子
US6407407B1 (en) * 1999-05-05 2002-06-18 The United States Of America As Represented By The Director Of The National Security Agency Ridge laser with oxidized strain-compensated superlattice of group III-V semiconductor
GB9912583D0 (en) * 1999-05-28 1999-07-28 Arima Optoelectronics Corp A light emitting diode having a two well system with asymmetric tunneling
JP3719047B2 (ja) 1999-06-07 2005-11-24 日亜化学工業株式会社 窒化物半導体素子
US6133589A (en) * 1999-06-08 2000-10-17 Lumileds Lighting, U.S., Llc AlGaInN-based LED having thick epitaxial layer for improved light extraction
GB9913950D0 (en) * 1999-06-15 1999-08-18 Arima Optoelectronics Corp Unipolar light emitting devices based on iii-nitride semiconductor superlattices
JP2001050956A (ja) 1999-08-05 2001-02-23 Matsushita Electric Ind Co Ltd 尿検査装置
JP4854829B2 (ja) 1999-11-22 2012-01-18 日亜化学工業株式会社 窒化物半導体レーザ素子
JP4032636B2 (ja) 1999-12-13 2008-01-16 日亜化学工業株式会社 発光素子
KR100628200B1 (ko) 2000-02-03 2006-09-27 엘지전자 주식회사 질화물 발광 소자
TW497277B (en) * 2000-03-10 2002-08-01 Toshiba Corp Semiconductor light emitting device and method for manufacturing the same
US6447604B1 (en) * 2000-03-13 2002-09-10 Advanced Technology Materials, Inc. Method for achieving improved epitaxy quality (surface texture and defect density) on free-standing (aluminum, indium, gallium) nitride ((al,in,ga)n) substrates for opto-electronic and electronic devices
CA2341979A1 (en) 2000-03-24 2001-09-24 Contentguard Holdings, Inc. System and method for protection of digital works
JP3624794B2 (ja) * 2000-05-24 2005-03-02 豊田合成株式会社 Iii族窒化物系化合物半導体発光素子の製造方法
US6586762B2 (en) 2000-07-07 2003-07-01 Nichia Corporation Nitride semiconductor device with improved lifetime and high output power
JP2002190621A (ja) * 2000-10-12 2002-07-05 Sharp Corp 半導体発光素子およびその製造方法
US6534797B1 (en) * 2000-11-03 2003-03-18 Cree, Inc. Group III nitride light emitting devices with gallium-free layers
JP3864735B2 (ja) 2000-12-28 2007-01-10 ソニー株式会社 半導体発光素子およびその製造方法
US6906352B2 (en) * 2001-01-16 2005-06-14 Cree, Inc. Group III nitride LED with undoped cladding layer and multiple quantum well
US6794684B2 (en) * 2001-02-01 2004-09-21 Cree, Inc. Reflective ohmic contacts for silicon carbide including a layer consisting essentially of nickel, methods of fabricating same, and light emitting devices including the same
US6791119B2 (en) * 2001-02-01 2004-09-14 Cree, Inc. Light emitting diodes including modifications for light extraction
US6608328B2 (en) 2001-02-05 2003-08-19 Uni Light Technology Inc. Semiconductor light emitting diode on a misoriented substrate
US7095051B2 (en) * 2001-03-28 2006-08-22 Nichia Corporation Nitride semiconductor element
KR100902109B1 (ko) 2001-04-12 2009-06-09 니치아 카가쿠 고교 가부시키가이샤 질화 갈륨계 화합물 반도체 소자
US7692182B2 (en) * 2001-05-30 2010-04-06 Cree, Inc. Group III nitride based quantum well light emitting device structures with an indium containing capping structure
US6958497B2 (en) * 2001-05-30 2005-10-25 Cree, Inc. Group III nitride based light emitting diode structures with a quantum well and superlattice, group III nitride based quantum well structures and group III nitride based superlattice structures
JP3876649B2 (ja) 2001-06-05 2007-02-07 ソニー株式会社 窒化物半導体レーザ及びその製造方法
JP2004531894A (ja) * 2001-06-15 2004-10-14 クリー インコーポレイテッド 紫外線発光ダイオード
US6833564B2 (en) * 2001-11-02 2004-12-21 Lumileds Lighting U.S., Llc Indium gallium nitride separate confinement heterostructure light emitting devices
DE60225322T2 (de) 2001-11-05 2009-02-26 Nichia Corp., Anan Halbleiterelement
US6618413B2 (en) 2001-12-21 2003-09-09 Xerox Corporation Graded semiconductor layers for reducing threshold voltage for a nitride-based laser diode structure
JP2003298192A (ja) 2002-02-04 2003-10-17 Sanyo Electric Co Ltd 窒化物系半導体レーザ素子
WO2004017433A1 (en) 2002-08-02 2004-02-26 Massachusetts Institute Of Technology Yellow-green light emitting diodes and laser based on strained-ingap quantum well grown on a transparent indirect bandgap substrate
US7245559B2 (en) * 2003-01-17 2007-07-17 Science Applications Incorporated Corporation Acoustic fence
US6943381B2 (en) * 2004-01-30 2005-09-13 Lumileds Lighting U.S., Llc III-nitride light-emitting devices with improved high-current efficiency
JP3933637B2 (ja) 2004-03-17 2007-06-20 シャープ株式会社 窒化ガリウム系半導体レーザ素子
US7791061B2 (en) * 2004-05-18 2010-09-07 Cree, Inc. External extraction light emitting diode based upon crystallographic faceted surfaces
US20060002442A1 (en) * 2004-06-30 2006-01-05 Kevin Haberern Light emitting devices having current blocking structures and methods of fabricating light emitting devices having current blocking structures
US7557380B2 (en) * 2004-07-27 2009-07-07 Cree, Inc. Light emitting devices having a reflective bond pad and methods of fabricating light emitting devices having reflective bond pads
TWI374552B (en) * 2004-07-27 2012-10-11 Cree Inc Ultra-thin ohmic contacts for p-type nitride light emitting devices and methods of forming
US7244630B2 (en) 2005-04-05 2007-07-17 Philips Lumileds Lighting Company, Llc A1InGaP LED having reduced temperature dependence
US20070018198A1 (en) * 2005-07-20 2007-01-25 Brandes George R High electron mobility electronic device structures comprising native substrates and methods for making the same
US20080258130A1 (en) * 2007-04-23 2008-10-23 Bergmann Michael J Beveled LED Chip with Transparent Substrate
CN101821861B (zh) 2007-10-12 2012-02-01 新加坡科技研究局 不含磷的基于氮化物的红和白发光二极管的制造
US20090283746A1 (en) * 2008-05-15 2009-11-19 Palo Alto Research Center Incorporated Light-emitting devices with modulation doped active layers
JP2011009524A (ja) * 2009-06-26 2011-01-13 Hitachi Cable Ltd 発光素子及び発光素子の製造方法
US8575592B2 (en) * 2010-02-03 2013-11-05 Cree, Inc. Group III nitride based light emitting diode structures with multiple quantum well structures having varying well thicknesses

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