DE60230462D1 - Akustischer Volumenwellenresonator mit einem leitenden akustischen Spiegel - Google Patents

Akustischer Volumenwellenresonator mit einem leitenden akustischen Spiegel

Info

Publication number
DE60230462D1
DE60230462D1 DE60230462T DE60230462T DE60230462D1 DE 60230462 D1 DE60230462 D1 DE 60230462D1 DE 60230462 T DE60230462 T DE 60230462T DE 60230462 T DE60230462 T DE 60230462T DE 60230462 D1 DE60230462 D1 DE 60230462D1
Authority
DE
Germany
Prior art keywords
resonator
isolation structure
substrate
acoustic
resonator section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60230462T
Other languages
English (en)
Inventor
Juha Ella
Jyrki Kaitila
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avago Technologies International Sales Pte Ltd
Original Assignee
Avago Technologies Wireless IP Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avago Technologies Wireless IP Singapore Pte Ltd filed Critical Avago Technologies Wireless IP Singapore Pte Ltd
Application granted granted Critical
Publication of DE60230462D1 publication Critical patent/DE60230462D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/105—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the BAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
    • H03H9/175—Acoustic mirrors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
DE60230462T 2001-01-16 2002-01-15 Akustischer Volumenwellenresonator mit einem leitenden akustischen Spiegel Expired - Lifetime DE60230462D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/761,171 US6509813B2 (en) 2001-01-16 2001-01-16 Bulk acoustic wave resonator with a conductive mirror

Publications (1)

Publication Number Publication Date
DE60230462D1 true DE60230462D1 (de) 2009-02-05

Family

ID=25061382

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60230462T Expired - Lifetime DE60230462D1 (de) 2001-01-16 2002-01-15 Akustischer Volumenwellenresonator mit einem leitenden akustischen Spiegel

Country Status (5)

Country Link
US (1) US6509813B2 (de)
EP (1) EP1227581B1 (de)
JP (1) JP4248180B2 (de)
AT (1) ATE418813T1 (de)
DE (1) DE60230462D1 (de)

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US20100107389A1 (en) * 2002-01-11 2010-05-06 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Method of fabricating an electrode for a bulk acoustic resonator
US7989851B2 (en) * 2002-06-06 2011-08-02 Rutgers, The State University Of New Jersey Multifunctional biosensor based on ZnO nanostructures
DE10225202B4 (de) * 2002-06-06 2017-06-01 Epcos Ag Mit akustischen Wellen arbeitendes Bauelement mit einem Anpassnetzwerk
US8377683B2 (en) 2002-06-06 2013-02-19 Rutgers, The State University Of New Jersey Zinc oxide-based nanostructure modified QCM for dynamic monitoring of cell adhesion and proliferation
JP2004120016A (ja) * 2002-09-20 2004-04-15 Fujitsu Media Device Kk フィルタ装置
JP4128836B2 (ja) * 2002-09-27 2008-07-30 Ｔｄｋ株式会社 薄膜圧電共振子、それを用いたフィルタ及びデュプレクサ
FR2848036B1 (fr) * 2002-11-28 2005-08-26 St Microelectronics Sa Support pour resonateur acoustique, resonateur acoustique et circuit integre correspondant
KR100517841B1 (ko) * 2003-02-22 2005-09-30 주식회사 엠에스솔루션 체적탄성파 공진기 밴드 패스 필터, 이를 포함하는듀플렉서 및 그 제조 방법
EP1469599B1 (de) * 2003-04-18 2010-11-03 Samsung Electronics Co., Ltd. Dünnschicht-Resonator von Luftspaltbauart, Duplexer mit dem Resonator und deren Herstellungsverfahren
DE10331322A1 (de) * 2003-07-10 2005-02-03 Epcos Ag Elektronisches Bauelement und Verfahren zur Herstellung
KR100616511B1 (ko) * 2003-09-24 2006-08-29 삼성전기주식회사 Ｆｂａｒ 소자 및 그 제조 방법
KR100519816B1 (ko) * 2003-09-29 2005-10-10 삼성전기주식회사 Ｆｂａｒ 듀플렉서 소자 및 그 제조 방법
KR100555762B1 (ko) * 2003-10-07 2006-03-03 삼성전자주식회사 에어갭형 박막 벌크 음향 공진기 및 그 제조방법, 이를이용한 필터 및 듀플렉서
JP2005129610A (ja) * 2003-10-22 2005-05-19 Tdk Corp 電子部品
JP2005136683A (ja) * 2003-10-30 2005-05-26 Tdk Corp 電子部品
JP2005167969A (ja) * 2003-11-14 2005-06-23 Fujitsu Media Device Kk 弾性波素子および弾性波素子の製造方法
JP2005151287A (ja) * 2003-11-18 2005-06-09 Tdk Corp 電子部品
FR2863789B1 (fr) * 2003-12-12 2006-09-29 St Microelectronics Sa Dispositif de resonateur acoustique
US6992400B2 (en) * 2004-01-30 2006-01-31 Nokia Corporation Encapsulated electronics device with improved heat dissipation
US7227433B2 (en) * 2004-03-31 2007-06-05 Intel Corporation Electro mechanical device having a sealed cavity
JP4375399B2 (ja) * 2004-07-20 2009-12-02 株式会社村田製作所 圧電フィルタ
JP4693397B2 (ja) * 2004-11-26 2011-06-01 京セラ株式会社 薄膜バルク音響波共振子およびフィルタならびに通信装置
JP4016983B2 (ja) 2004-12-07 2007-12-05 株式会社村田製作所 圧電薄膜共振子およびその製造方法
JP2006191304A (ja) * 2005-01-05 2006-07-20 Matsushita Electric Ind Co Ltd 圧電共振器及びその製造方法
DE102005004435B4 (de) * 2005-01-31 2006-10-19 Infineon Technologies Ag Baw-resonator
DE102005006833B4 (de) * 2005-02-15 2017-02-23 Epcos Ag Verfahren zur Herstellung eines BAW-Bauelements und BAW-Bauelement
FR2890490A1 (fr) * 2005-09-05 2007-03-09 St Microelectronics Sa Support de resonateur acoustique et circuit integre correspondant
DE102005044330A1 (de) * 2005-09-16 2007-03-29 Epcos Ag Abstimmbarer Kondensator und Schaltung mit einem solchen Kondensator
JP5096695B2 (ja) * 2006-05-30 2012-12-12 パナソニック株式会社 薄膜音響共振器
US8212331B1 (en) * 2006-10-02 2012-07-03 Newport Fab, Llc Method for fabricating a backside through-wafer via in a processed wafer and related structure
US7851333B2 (en) * 2007-03-15 2010-12-14 Infineon Technologies Ag Apparatus comprising a device and method for producing it
WO2009051631A1 (en) * 2007-10-18 2009-04-23 Skyworks Solutions, Inc. Baw structure with reduced topographic steps and related method
US8476809B2 (en) 2008-04-29 2013-07-02 Sand 9, Inc. Microelectromechanical systems (MEMS) resonators and related apparatus and methods
US8410868B2 (en) * 2009-06-04 2013-04-02 Sand 9, Inc. Methods and apparatus for temperature control of devices and mechanical resonating structures
US9048811B2 (en) 2009-03-31 2015-06-02 Sand 9, Inc. Integration of piezoelectric materials with substrates
DE102009018879B4 (de) * 2009-04-24 2016-03-17 Epcos Ag Bodenelektrode für Bulk Acoustic Wave (BAW) Resonator
US20110121916A1 (en) * 2009-11-24 2011-05-26 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Hybrid bulk acoustic wave resonator
US8922302B2 (en) 2011-08-24 2014-12-30 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator formed on a pedestal
US9246467B2 (en) 2012-05-31 2016-01-26 Texas Instruments Incorporated Integrated resonator with a mass bias
KR101959204B1 (ko) * 2013-01-09 2019-07-04 삼성전자주식회사 무선 주파수 필터 및 무선 주파수 필터의 제조방법
US10658998B2 (en) 2013-07-31 2020-05-19 Oepic Semiconductors, Inc. Piezoelectric film transfer for acoustic resonators and filters
KR101923573B1 (ko) * 2015-03-16 2018-11-29 가부시키가이샤 무라타 세이사쿠쇼 탄성파 장치 및 그 제조 방법
US20160329481A1 (en) * 2015-05-04 2016-11-10 Samsung Electro-Mechanics Co., Ltd. Bulk acoustic wave resonator and filter including the same
US10135415B2 (en) * 2015-12-18 2018-11-20 Texas Instruments Incorporated Method to reduce frequency distribution of bulk acoustic wave resonators during manufacturing
DE102016124236B4 (de) * 2016-12-13 2018-07-26 Snaptrack, Inc. BAW-Resonator
CN110231407B (zh) * 2018-03-06 2022-02-15 中国石油化工股份有限公司 一种判断碳酸盐岩盖层有效性的方法
US10985729B2 (en) * 2018-12-28 2021-04-20 Texas Instruments Incorporated BAW resonator based pressure sensor
WO2021021745A1 (en) 2019-07-31 2021-02-04 QXONIX Inc. Acoustic device structures, filters and systems

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AT353506B (de) * 1976-10-19 1979-11-26 List Hans Piezoelektrischer resonator
US5373268A (en) * 1993-02-01 1994-12-13 Motorola, Inc. Thin film resonator having stacked acoustic reflecting impedance matching layers and method
US5864261A (en) * 1994-05-23 1999-01-26 Iowa State University Research Foundation Multiple layer acoustical structures for thin-film resonator based circuits and systems
US5714917A (en) 1996-10-02 1998-02-03 Nokia Mobile Phones Limited Device incorporating a tunable thin film bulk acoustic resonator for performing amplitude and phase modulation
US5873154A (en) 1996-10-17 1999-02-23 Nokia Mobile Phones Limited Method for fabricating a resonator having an acoustic mirror
US6087198A (en) * 1998-02-12 2000-07-11 Texas Instruments Incorporated Low cost packaging for thin-film resonators and thin-film resonator-based filters
US5872493A (en) * 1997-03-13 1999-02-16 Nokia Mobile Phones, Ltd. Bulk acoustic wave (BAW) filter having a top portion that includes a protective acoustic mirror
US5910756A (en) 1997-05-21 1999-06-08 Nokia Mobile Phones Limited Filters and duplexers utilizing thin film stacked crystal filter structures and thin film bulk acoustic wave resonators
FI108583B (fi) * 1998-06-02 2002-02-15 Nokia Corp Resonaattorirakenteita
US6060818A (en) 1998-06-02 2000-05-09 Hewlett-Packard Company SBAR structures and method of fabrication of SBAR.FBAR film processing techniques for the manufacturing of SBAR/BAR filters

Also Published As

Publication number Publication date
JP4248180B2 (ja) 2009-04-02
US20020093398A1 (en) 2002-07-18
EP1227581A3 (de) 2004-12-15
ATE418813T1 (de) 2009-01-15
EP1227581A2 (de) 2002-07-31
JP2002278558A (ja) 2002-09-27
US6509813B2 (en) 2003-01-21
EP1227581B1 (de) 2008-12-24

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Legal Events

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