DE60236923D1 - Verfahren und gerät zur kühlung von elektronischen bausteinen - Google Patents

Verfahren und gerät zur kühlung von elektronischen bausteinen

Info

Publication number
DE60236923D1
DE60236923D1 DE60236923T DE60236923T DE60236923D1 DE 60236923 D1 DE60236923 D1 DE 60236923D1 DE 60236923 T DE60236923 T DE 60236923T DE 60236923 T DE60236923 T DE 60236923T DE 60236923 D1 DE60236923 D1 DE 60236923D1
Authority
DE
Germany
Prior art keywords
electronic components
cap assembly
coupled
building blocks
electronic building
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60236923T
Other languages
English (en)
Inventor
Gregory W Pautsch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cray Inc
Original Assignee
Cray Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cray Inc filed Critical Cray Inc
Priority claimed from PCT/US2002/015458 external-priority patent/WO2002093994A2/en
Application granted granted Critical
Publication of DE60236923D1 publication Critical patent/DE60236923D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20345—Sprayers; Atomizers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
DE60236923T 2001-05-16 2002-05-16 Verfahren und gerät zur kühlung von elektronischen bausteinen Expired - Lifetime DE60236923D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/860,038 US6646879B2 (en) 2001-05-16 2001-05-16 Spray evaporative cooling system and method
US10/118,279 US6580609B2 (en) 2001-05-16 2002-04-08 Method and apparatus for cooling electronic components
PCT/US2002/015458 WO2002093994A2 (en) 2001-05-16 2002-05-16 Method and apparatus for cooling electronic components

Publications (1)

Publication Number Publication Date
DE60236923D1 true DE60236923D1 (de) 2010-08-19

Family

ID=25332363

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60236923T Expired - Lifetime DE60236923D1 (de) 2001-05-16 2002-05-16 Verfahren und gerät zur kühlung von elektronischen bausteinen

Country Status (4)

Country Link
US (2) US6646879B2 (de)
EP (2) EP2267771A3 (de)
AT (1) ATE473621T1 (de)
DE (1) DE60236923D1 (de)

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Also Published As

Publication number Publication date
EP2267771A3 (de) 2011-11-02
US20020172007A1 (en) 2002-11-21
EP2267771A2 (de) 2010-12-29
US6580609B2 (en) 2003-06-17
US20020135981A1 (en) 2002-09-26
ATE473621T1 (de) 2010-07-15
EP2242345B1 (de) 2014-09-10
EP2242345A3 (de) 2011-11-02
EP2242345A2 (de) 2010-10-20
US6646879B2 (en) 2003-11-11

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