DE60309422D1 - Multichip-modul und Herstellungsverfahren - Google Patents
Multichip-modul und HerstellungsverfahrenInfo
- Publication number
- DE60309422D1 DE60309422D1 DE60309422T DE60309422T DE60309422D1 DE 60309422 D1 DE60309422 D1 DE 60309422D1 DE 60309422 T DE60309422 T DE 60309422T DE 60309422 T DE60309422 T DE 60309422T DE 60309422 D1 DE60309422 D1 DE 60309422D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing process
- chip module
- chip
- module
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5385—Assembly of a plurality of insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00015—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US321900 | 2002-12-17 | ||
US10/321,900 US6833628B2 (en) | 2002-12-17 | 2002-12-17 | Mutli-chip module |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60309422D1 true DE60309422D1 (de) | 2006-12-14 |
DE60309422T2 DE60309422T2 (de) | 2007-10-11 |
Family
ID=32393007
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60309422T Expired - Fee Related DE60309422T2 (de) | 2002-12-17 | 2003-11-28 | Multichip-modul und Herstellungsverfahren |
Country Status (3)
Country | Link |
---|---|
US (2) | US6833628B2 (de) |
EP (1) | EP1432033B1 (de) |
DE (1) | DE60309422T2 (de) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW569416B (en) * | 2002-12-19 | 2004-01-01 | Via Tech Inc | High density multi-chip module structure and manufacturing method thereof |
US6916684B2 (en) * | 2003-03-18 | 2005-07-12 | Delphi Technologies, Inc. | Wafer-applied underfill process |
DE10323007B4 (de) | 2003-05-21 | 2005-10-20 | Infineon Technologies Ag | Halbleiteranordnung |
US20050017337A1 (en) * | 2003-07-21 | 2005-01-27 | Cherng-Chiao Wu | Stacking apparatus for integrated circuit assembly |
KR101075169B1 (ko) * | 2003-08-27 | 2011-10-19 | 페어차일드코리아반도체 주식회사 | 파워 모듈 플립 칩 패키지 |
JP2005158814A (ja) * | 2003-11-20 | 2005-06-16 | Alps Electric Co Ltd | 電子回路ユニット |
WO2005067029A1 (en) * | 2004-01-06 | 2005-07-21 | Infineon Technologies Ag | Method for packaging integrated circuit dies |
KR100640335B1 (ko) * | 2004-10-28 | 2006-10-30 | 삼성전자주식회사 | 랜드 그리드 어레이 모듈 |
US7473585B2 (en) * | 2005-06-13 | 2009-01-06 | Delphi Technologies, Inc. | Technique for manufacturing an overmolded electronic assembly |
US20070158811A1 (en) * | 2006-01-11 | 2007-07-12 | James Douglas Wehrly | Low profile managed memory component |
KR100782774B1 (ko) * | 2006-05-25 | 2007-12-05 | 삼성전기주식회사 | Sip 모듈 |
TW200807647A (en) * | 2006-07-17 | 2008-02-01 | Delta Electronics Inc | Integrated circuit module |
WO2008120756A1 (ja) * | 2007-03-29 | 2008-10-09 | Kyocera Corporation | 携帯無線機 |
US8134227B2 (en) * | 2007-03-30 | 2012-03-13 | Stats Chippac Ltd. | Stacked integrated circuit package system with conductive spacer |
US7915089B2 (en) * | 2007-04-10 | 2011-03-29 | Infineon Technologies Ag | Encapsulation method |
US7973433B2 (en) * | 2007-07-30 | 2011-07-05 | Nelson David F | Power electronics devices with integrated gate drive circuitry |
US8139371B2 (en) * | 2007-07-30 | 2012-03-20 | GM Global Technology Operations LLC | Power electronics devices with integrated control circuitry |
US8273603B2 (en) * | 2008-04-04 | 2012-09-25 | The Charles Stark Draper Laboratory, Inc. | Interposers, electronic modules, and methods for forming the same |
US8017451B2 (en) | 2008-04-04 | 2011-09-13 | The Charles Stark Draper Laboratory, Inc. | Electronic modules and methods for forming the same |
US9293350B2 (en) * | 2008-10-28 | 2016-03-22 | Stats Chippac Ltd. | Semiconductor package system with cavity substrate and manufacturing method therefor |
US8618654B2 (en) | 2010-07-20 | 2013-12-31 | Marvell World Trade Ltd. | Structures embedded within core material and methods of manufacturing thereof |
KR101088824B1 (ko) * | 2010-06-16 | 2011-12-06 | 주식회사 하이닉스반도체 | 모듈 기판, 이를 갖는 메모리 모듈 및 메모리 모듈 형성방법 |
CN106935577A (zh) * | 2011-03-22 | 2017-07-07 | 晶元光电股份有限公司 | 发光二极管装置 |
US8514576B1 (en) * | 2011-06-14 | 2013-08-20 | Juniper Networks, Inc. | Dual sided system in a package |
EP2565913B1 (de) * | 2011-06-22 | 2019-03-20 | Huawei Device Co., Ltd. | Verfahren zur einkapselung eines halbleiters |
US20130020702A1 (en) * | 2011-07-21 | 2013-01-24 | Jun Zhai | Double-sided flip chip package |
US20130082383A1 (en) * | 2011-10-03 | 2013-04-04 | Texas Instruments Incorporated | Electronic assembly having mixed interface including tsv die |
US8698323B2 (en) * | 2012-06-18 | 2014-04-15 | Invensas Corporation | Microelectronic assembly tolerant to misplacement of microelectronic elements therein |
KR20150025129A (ko) * | 2013-08-28 | 2015-03-10 | 삼성전기주식회사 | 전자 소자 모듈 및 그 제조 방법 |
US9076802B1 (en) * | 2013-09-25 | 2015-07-07 | Stats Chippac Ltd. | Dual-sided film-assist molding process |
CN104576411A (zh) * | 2013-10-25 | 2015-04-29 | 飞思卡尔半导体公司 | 双角部顶部闸道模制 |
US9392695B2 (en) * | 2014-01-03 | 2016-07-12 | Samsung Electro-Mechanics Co., Ltd. | Electric component module |
US9666559B2 (en) * | 2014-09-05 | 2017-05-30 | Invensas Corporation | Multichip modules and methods of fabrication |
TWI590392B (zh) * | 2015-08-03 | 2017-07-01 | 矽品精密工業股份有限公司 | 電子封裝件及其製法 |
TWI676259B (zh) * | 2016-09-02 | 2019-11-01 | 矽品精密工業股份有限公司 | 電子封裝件及其製法 |
KR20180090527A (ko) * | 2017-02-03 | 2018-08-13 | 삼성전기주식회사 | 반도체 패키지와 그 제조 방법 |
US20220367413A1 (en) * | 2021-05-13 | 2022-11-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Packages With Multiple Types of Underfill and Method Forming The Same |
US11747555B2 (en) | 2021-10-04 | 2023-09-05 | Eagle Technology, Llc | Optical assembly having commonly-shaped optical modules and associated methods |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5914A (en) * | 1848-11-14 | Odometer | ||
US13640A (en) * | 1855-10-09 | Corlil-sheitleb | ||
US5331511A (en) | 1993-03-25 | 1994-07-19 | Vlsi Technology, Inc. | Electrically and thermally enhanced integrated-circuit package |
JP2541487B2 (ja) | 1993-11-29 | 1996-10-09 | 日本電気株式会社 | 半導体装置パッケ―ジ |
JPH0846136A (ja) * | 1994-07-26 | 1996-02-16 | Fujitsu Ltd | 半導体装置 |
US5608262A (en) * | 1995-02-24 | 1997-03-04 | Lucent Technologies Inc. | Packaging multi-chip modules without wire-bond interconnection |
US5770477A (en) | 1997-02-10 | 1998-06-23 | Delco Electronics Corporation | Flip chip-on-flip chip multi-chip module |
US5981312A (en) | 1997-06-27 | 1999-11-09 | International Business Machines Corporation | Method for injection molded flip chip encapsulation |
JP3359846B2 (ja) * | 1997-07-18 | 2002-12-24 | シャープ株式会社 | 半導体装置 |
JP2991172B2 (ja) | 1997-10-24 | 1999-12-20 | 日本電気株式会社 | 半導体装置 |
JP3109477B2 (ja) * | 1998-05-26 | 2000-11-13 | 日本電気株式会社 | マルチチップモジュール |
JP3485507B2 (ja) | 1999-10-25 | 2004-01-13 | 沖電気工業株式会社 | 半導体装置 |
US6383846B1 (en) * | 2000-03-20 | 2002-05-07 | Chi-Chih Shen | Method and apparatus for molding a flip chip semiconductor device |
-
2002
- 2002-12-17 US US10/321,900 patent/US6833628B2/en not_active Expired - Fee Related
-
2003
- 2003-11-28 DE DE60309422T patent/DE60309422T2/de not_active Expired - Fee Related
- 2003-11-28 EP EP03078782A patent/EP1432033B1/de not_active Expired - Fee Related
-
2004
- 2004-12-15 US US11/012,401 patent/US20050093144A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US6833628B2 (en) | 2004-12-21 |
EP1432033A1 (de) | 2004-06-23 |
DE60309422T2 (de) | 2007-10-11 |
US20040113281A1 (en) | 2004-06-17 |
EP1432033B1 (de) | 2006-11-02 |
US20050093144A1 (en) | 2005-05-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |