DE60312583D1 - Drucksensor und Verfahren zu seiner Herstellung - Google Patents

Drucksensor und Verfahren zu seiner Herstellung

Info

Publication number
DE60312583D1
DE60312583D1 DE60312583T DE60312583T DE60312583D1 DE 60312583 D1 DE60312583 D1 DE 60312583D1 DE 60312583 T DE60312583 T DE 60312583T DE 60312583 T DE60312583 T DE 60312583T DE 60312583 D1 DE60312583 D1 DE 60312583D1
Authority
DE
Germany
Prior art keywords
manufacture
pressure sensor
sensor
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60312583T
Other languages
English (en)
Other versions
DE60312583T2 (de
Inventor
Chien-Hua Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Application granted granted Critical
Publication of DE60312583D1 publication Critical patent/DE60312583D1/de
Publication of DE60312583T2 publication Critical patent/DE60312583T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
DE60312583T 2002-04-10 2003-04-02 Drucksensor und Verfahren zu seiner Herstellung Expired - Fee Related DE60312583T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US120944 2002-04-10
US10/120,944 US6662663B2 (en) 2002-04-10 2002-04-10 Pressure sensor with two membranes forming a capacitor

Publications (2)

Publication Number Publication Date
DE60312583D1 true DE60312583D1 (de) 2007-05-03
DE60312583T2 DE60312583T2 (de) 2008-05-29

Family

ID=28454012

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60312583T Expired - Fee Related DE60312583T2 (de) 2002-04-10 2003-04-02 Drucksensor und Verfahren zu seiner Herstellung

Country Status (5)

Country Link
US (2) US6662663B2 (de)
EP (1) EP1353161B1 (de)
JP (1) JP3682046B2 (de)
DE (1) DE60312583T2 (de)
TW (1) TW200305008A (de)

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7420659B1 (en) * 2000-06-02 2008-09-02 Honeywell Interantional Inc. Flow control system of a cartridge
US7114397B2 (en) 2004-03-12 2006-10-03 General Electric Company Microelectromechanical system pressure sensor and method for making and using
US7222639B2 (en) * 2004-12-29 2007-05-29 Honeywell International Inc. Electrostatically actuated gas valve
US7328882B2 (en) * 2005-01-06 2008-02-12 Honeywell International Inc. Microfluidic modulating valve
US7445017B2 (en) * 2005-01-28 2008-11-04 Honeywell International Inc. Mesovalve modulator
US7517201B2 (en) * 2005-07-14 2009-04-14 Honeywell International Inc. Asymmetric dual diaphragm pump
US20070051415A1 (en) * 2005-09-07 2007-03-08 Honeywell International Inc. Microvalve switching array
US20070170528A1 (en) * 2006-01-20 2007-07-26 Aaron Partridge Wafer encapsulated microelectromechanical structure and method of manufacturing same
DK1818664T3 (da) * 2006-02-13 2013-08-05 Hoffmann La Roche Apparat til erkendelse af en trykændring i et mikrodoseringsapparats væskebane
US7543604B2 (en) * 2006-09-11 2009-06-09 Honeywell International Inc. Control valve
US7644731B2 (en) 2006-11-30 2010-01-12 Honeywell International Inc. Gas valve with resilient seat
US7360429B1 (en) 2007-01-31 2008-04-22 Brooks Automation, Inc. High sensitivity pressure actuated switch based on MEMS-fabricated silicon diaphragm and having electrically adjustable switch point
US7677107B2 (en) * 2007-07-03 2010-03-16 Endotronix, Inc. Wireless pressure sensor and method for fabricating wireless pressure sensor for integration with an implantable device
US8033177B2 (en) * 2008-02-15 2011-10-11 Pacesetter, Inc. MEMS pressure sensor and housing therefor
US8723276B2 (en) * 2008-09-11 2014-05-13 Infineon Technologies Ag Semiconductor structure with lamella defined by singulation trench
CN102442636B (zh) * 2010-10-05 2015-05-27 英飞凌科技股份有限公司 具有由划片槽限定的薄片的半导体结构
US8518732B2 (en) 2010-12-22 2013-08-27 Infineon Technologies Ag Method of providing a semiconductor structure with forming a sacrificial structure
CN102442634B (zh) * 2010-10-05 2016-04-20 英飞凌科技股份有限公司 通过形成牺牲结构而提供半导体结构的方法
US8631919B2 (en) * 2010-12-17 2014-01-21 GM Global Technology Operations LLC Automatic transmission shift quality via selective use of closed-loop pressure feedback control
US20120211805A1 (en) 2011-02-22 2012-08-23 Bernhard Winkler Cavity structures for mems devices
US9074770B2 (en) 2011-12-15 2015-07-07 Honeywell International Inc. Gas valve with electronic valve proving system
US8839815B2 (en) 2011-12-15 2014-09-23 Honeywell International Inc. Gas valve with electronic cycle counter
US9846440B2 (en) 2011-12-15 2017-12-19 Honeywell International Inc. Valve controller configured to estimate fuel comsumption
US9557059B2 (en) 2011-12-15 2017-01-31 Honeywell International Inc Gas valve with communication link
US9835265B2 (en) 2011-12-15 2017-12-05 Honeywell International Inc. Valve with actuator diagnostics
US9851103B2 (en) 2011-12-15 2017-12-26 Honeywell International Inc. Gas valve with overpressure diagnostics
US8947242B2 (en) 2011-12-15 2015-02-03 Honeywell International Inc. Gas valve with valve leakage test
US8905063B2 (en) 2011-12-15 2014-12-09 Honeywell International Inc. Gas valve with fuel rate monitor
US8899264B2 (en) 2011-12-15 2014-12-02 Honeywell International Inc. Gas valve with electronic proof of closure system
US9995486B2 (en) 2011-12-15 2018-06-12 Honeywell International Inc. Gas valve with high/low gas pressure detection
DE102012206531B4 (de) 2012-04-17 2015-09-10 Infineon Technologies Ag Verfahren zur Erzeugung einer Kavität innerhalb eines Halbleitersubstrats
US9234661B2 (en) 2012-09-15 2016-01-12 Honeywell International Inc. Burner control system
US10422531B2 (en) 2012-09-15 2019-09-24 Honeywell International Inc. System and approach for controlling a combustion chamber
US9136136B2 (en) 2013-09-19 2015-09-15 Infineon Technologies Dresden Gmbh Method and structure for creating cavities with extreme aspect ratios
EP2868970B1 (de) 2013-10-29 2020-04-22 Honeywell Technologies Sarl Regelungsvorrichtung
US10024439B2 (en) 2013-12-16 2018-07-17 Honeywell International Inc. Valve over-travel mechanism
US9733139B2 (en) 2014-05-02 2017-08-15 Silicon Microstructures, Inc. Vertical membranes for pressure sensing applications
US9841122B2 (en) 2014-09-09 2017-12-12 Honeywell International Inc. Gas valve with electronic valve proving system
US9645584B2 (en) 2014-09-17 2017-05-09 Honeywell International Inc. Gas valve with electronic health monitoring
JP6296031B2 (ja) * 2015-09-28 2018-03-20 株式会社村田製作所 圧力センサ製造装置および圧力センサ製造方法
US10503181B2 (en) 2016-01-13 2019-12-10 Honeywell International Inc. Pressure regulator
US10564062B2 (en) 2016-10-19 2020-02-18 Honeywell International Inc. Human-machine interface for gas valve
US11615257B2 (en) 2017-02-24 2023-03-28 Endotronix, Inc. Method for communicating with implant devices
WO2018156930A1 (en) 2017-02-24 2018-08-30 Endotronix, Inc. Wireless sensor reader assembly
US11073281B2 (en) 2017-12-29 2021-07-27 Honeywell International Inc. Closed-loop programming and control of a combustion appliance
US10697815B2 (en) 2018-06-09 2020-06-30 Honeywell International Inc. System and methods for mitigating condensation in a sensor module
WO2019240791A1 (en) * 2018-06-13 2019-12-19 Hewlett-Packard Development Company, L.P. Vacuum-based microphone sensor controller and indicator
US11206494B2 (en) 2018-10-05 2021-12-21 Knowles Electronics, Llc Microphone device with ingress protection
CN112840676B (zh) 2018-10-05 2022-05-03 美商楼氏电子有限公司 响应于声学信号来生成电信号的声学换能器和麦克风组件
WO2020072938A1 (en) 2018-10-05 2020-04-09 Knowles Electronics, Llc Methods of forming mems diaphragms including corrugations
CN111885469B (zh) * 2020-07-09 2022-09-13 诺思(天津)微系统有限责任公司 Mems扬声器及其制造方法
US11528546B2 (en) 2021-04-05 2022-12-13 Knowles Electronics, Llc Sealed vacuum MEMS die
US11540048B2 (en) 2021-04-16 2022-12-27 Knowles Electronics, Llc Reduced noise MEMS device with force feedback
US11649161B2 (en) 2021-07-26 2023-05-16 Knowles Electronics, Llc Diaphragm assembly with non-uniform pillar distribution
US11772961B2 (en) 2021-08-26 2023-10-03 Knowles Electronics, Llc MEMS device with perimeter barometric relief pierce
US11780726B2 (en) 2021-11-03 2023-10-10 Knowles Electronics, Llc Dual-diaphragm assembly having center constraint

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4445383A (en) 1982-06-18 1984-05-01 General Signal Corporation Multiple range capacitive pressure transducer
DE3310643C2 (de) 1983-03-24 1986-04-10 Karlheinz Dr. 7801 Schallstadt Ziegler Drucksensor
FI71015C (fi) 1984-02-21 1986-10-27 Vaisala Oy Temperaturoberoende kapacitiv tryckgivare
FI69211C (fi) 1984-02-21 1985-12-10 Vaisala Oy Kapacitiv styckgivare
FI74350C (fi) 1984-02-21 1988-01-11 Vaisala Oy Kapacitiv absoluttryckgivare.
US4689999A (en) * 1985-07-26 1987-09-01 The Garrett Corporation Temperature compensated pressure transducer
US4943032A (en) 1986-09-24 1990-07-24 Stanford University Integrated, microminiature electric to fluidic valve and pressure/flow regulator
JPS6413158U (de) * 1987-07-10 1989-01-24
JPH0368175A (ja) * 1989-08-05 1991-03-25 Mitsubishi Electric Corp 半導体圧力センサ
CN1018844B (zh) 1990-06-02 1992-10-28 中国科学院兰州化学物理研究所 防锈干膜润滑剂
US5197330A (en) 1990-07-19 1993-03-30 Koganei, Ltd. Regulator
DE4106288C2 (de) * 1991-02-28 2001-05-31 Bosch Gmbh Robert Sensor zur Messung von Drücken oder Beschleunigungen
US5295247A (en) * 1992-04-17 1994-03-15 Micronics Computers, Inc. Local IDE (integrated drive electronics) bus architecture
US5264075A (en) * 1992-11-06 1993-11-23 Ford Motor Company Fabrication methods for silicon/glass capacitive absolute pressure sensors
FI93059C (fi) * 1993-07-07 1995-02-10 Vaisala Oy Kapasitiivinen paineanturirakenne ja menetelmä sen valmistamiseksi
US5381299A (en) * 1994-01-28 1995-01-10 United Technologies Corporation Capacitive pressure sensor having a substrate with a curved mesa
US5578843A (en) 1994-10-06 1996-11-26 Kavlico Corporation Semiconductor sensor with a fusion bonded flexible structure
US5833603A (en) 1996-03-13 1998-11-10 Lipomatrix, Inc. Implantable biosensing transponder
US6324914B1 (en) * 1997-03-20 2001-12-04 Alliedsignal, Inc. Pressure sensor support base with cavity
FR2762389B1 (fr) 1997-04-17 1999-05-21 Commissariat Energie Atomique Microsysteme a membrane souple pour capteur de pression et procede de realisation
JP3359871B2 (ja) * 1998-06-24 2002-12-24 株式会社日立製作所 容量型圧力センサ及びその製造方法
JP2000002610A (ja) * 1998-06-18 2000-01-07 Denso Corp 半導体圧力センサ及びその製造方法
JP2000121473A (ja) * 1998-10-14 2000-04-28 Fuji Electric Co Ltd 静電容量式絶対圧検出器
US6388299B1 (en) * 1998-12-10 2002-05-14 Honeywell Inc. Sensor assembly and method
JP2001029772A (ja) * 1999-07-27 2001-02-06 Matsushita Electric Ind Co Ltd 基板処理装置
JP4540775B2 (ja) * 1999-10-27 2010-09-08 キヤノンアネルバ株式会社 サーボ式静電容量型真空センサ

Also Published As

Publication number Publication date
US7004034B2 (en) 2006-02-28
EP1353161B1 (de) 2007-03-21
DE60312583T2 (de) 2008-05-29
JP3682046B2 (ja) 2005-08-10
US20040060360A1 (en) 2004-04-01
US20030192383A1 (en) 2003-10-16
JP2003322576A (ja) 2003-11-14
US6662663B2 (en) 2003-12-16
EP1353161A1 (de) 2003-10-15
TW200305008A (en) 2003-10-16

Similar Documents

Publication Publication Date Title
DE60312583D1 (de) Drucksensor und Verfahren zu seiner Herstellung
DE50214717D1 (de) Und verfahren zu seiner herstellung
DE602005002859D1 (de) Druckaufnehmer und Verfahren zu seiner Herstellung
DE602004030984D1 (de) Festkörperbildsensor und Verfahren zu dessen Herstellung
DE602004023910D1 (de) Verbundmaterial und Verfahren zu seiner Herstellung
DE602004021927D1 (de) Halbleiterbauelement und verfahren zu seiner herstellung
DE60325690D1 (de) Halbleiterbauelement und verfahren zu seiner herstellung
DE60115902D1 (de) Osteoimplantat und verfahren zu seiner herstellung
DE60144094D1 (de) Drucksensor des kapazitätstyps und verfahren zu seiner herstellung
DE602004021527D1 (de) Honigwabenstruktur und Verfahren zu seiner Herstellung
DE60208263D1 (de) Gasdurchlässiger Stopfen und Verfahren zu seiner Herstellung
ATA10852001A (de) Bauelement und verfahren zu seiner herstellung
DE602004015020D1 (de) Harzverkapselter elektronischer Bauteil und Verfahren zu seiner Herstellung
DE60337036D1 (de) Halbleiterbauelement und verfahren zu seiner herstellung
DE60311103D1 (de) Auf norbornenester basierendes polymerisat und verfahren zu seiner herstellung
DE50310782D1 (de) Piezoaktor und verfahren zu dessen herstellung
DE60335812D1 (de) Biosensor und verfahren zu seiner herstellung
DE60116486D1 (de) Gallengangstent und verfahren zu seiner herstellung
DE602004008991D1 (de) Umlenkbeschlag und verfahren zu dessen herstellung
DE60332463D1 (de) Hochbrillianter mechanolumineszenzstoff und verfahren zu seiner herstellung
DE60309411D1 (de) Pollensensor und Verfahren
DE602004023778D1 (de) Flüssigkeitspegelsensor und Verfahren zu dessen Herstellung
DE102005032999A8 (de) Sensor und Verfahren zur Herstellung desselben
DE60239493D1 (de) Halbleiterbauelement und verfahren zu seiner herstellung
DE602004028894D1 (de) Sensor und Verfahren zur Herstellung desselben

Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: HEWLETT-PACKARD DEVELOPMENT CO., L.P., HOUSTON, US

8328 Change in the person/name/address of the agent

Representative=s name: SCHOPPE, ZIMMERMANN, STOECKELER & ZINKLER, 82049 P

8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee