DE60312583D1 - Drucksensor und Verfahren zu seiner Herstellung - Google Patents
Drucksensor und Verfahren zu seiner HerstellungInfo
- Publication number
- DE60312583D1 DE60312583D1 DE60312583T DE60312583T DE60312583D1 DE 60312583 D1 DE60312583 D1 DE 60312583D1 DE 60312583 T DE60312583 T DE 60312583T DE 60312583 T DE60312583 T DE 60312583T DE 60312583 D1 DE60312583 D1 DE 60312583D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacture
- pressure sensor
- sensor
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
- G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US120944 | 2002-04-10 | ||
US10/120,944 US6662663B2 (en) | 2002-04-10 | 2002-04-10 | Pressure sensor with two membranes forming a capacitor |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60312583D1 true DE60312583D1 (de) | 2007-05-03 |
DE60312583T2 DE60312583T2 (de) | 2008-05-29 |
Family
ID=28454012
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60312583T Expired - Fee Related DE60312583T2 (de) | 2002-04-10 | 2003-04-02 | Drucksensor und Verfahren zu seiner Herstellung |
Country Status (5)
Country | Link |
---|---|
US (2) | US6662663B2 (de) |
EP (1) | EP1353161B1 (de) |
JP (1) | JP3682046B2 (de) |
DE (1) | DE60312583T2 (de) |
TW (1) | TW200305008A (de) |
Families Citing this family (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7420659B1 (en) * | 2000-06-02 | 2008-09-02 | Honeywell Interantional Inc. | Flow control system of a cartridge |
US7114397B2 (en) | 2004-03-12 | 2006-10-03 | General Electric Company | Microelectromechanical system pressure sensor and method for making and using |
US7222639B2 (en) * | 2004-12-29 | 2007-05-29 | Honeywell International Inc. | Electrostatically actuated gas valve |
US7328882B2 (en) * | 2005-01-06 | 2008-02-12 | Honeywell International Inc. | Microfluidic modulating valve |
US7445017B2 (en) * | 2005-01-28 | 2008-11-04 | Honeywell International Inc. | Mesovalve modulator |
US7517201B2 (en) * | 2005-07-14 | 2009-04-14 | Honeywell International Inc. | Asymmetric dual diaphragm pump |
US20070051415A1 (en) * | 2005-09-07 | 2007-03-08 | Honeywell International Inc. | Microvalve switching array |
US20070170528A1 (en) * | 2006-01-20 | 2007-07-26 | Aaron Partridge | Wafer encapsulated microelectromechanical structure and method of manufacturing same |
DK1818664T3 (da) * | 2006-02-13 | 2013-08-05 | Hoffmann La Roche | Apparat til erkendelse af en trykændring i et mikrodoseringsapparats væskebane |
US7543604B2 (en) * | 2006-09-11 | 2009-06-09 | Honeywell International Inc. | Control valve |
US7644731B2 (en) | 2006-11-30 | 2010-01-12 | Honeywell International Inc. | Gas valve with resilient seat |
US7360429B1 (en) | 2007-01-31 | 2008-04-22 | Brooks Automation, Inc. | High sensitivity pressure actuated switch based on MEMS-fabricated silicon diaphragm and having electrically adjustable switch point |
US7677107B2 (en) * | 2007-07-03 | 2010-03-16 | Endotronix, Inc. | Wireless pressure sensor and method for fabricating wireless pressure sensor for integration with an implantable device |
US8033177B2 (en) * | 2008-02-15 | 2011-10-11 | Pacesetter, Inc. | MEMS pressure sensor and housing therefor |
US8723276B2 (en) * | 2008-09-11 | 2014-05-13 | Infineon Technologies Ag | Semiconductor structure with lamella defined by singulation trench |
CN102442636B (zh) * | 2010-10-05 | 2015-05-27 | 英飞凌科技股份有限公司 | 具有由划片槽限定的薄片的半导体结构 |
US8518732B2 (en) | 2010-12-22 | 2013-08-27 | Infineon Technologies Ag | Method of providing a semiconductor structure with forming a sacrificial structure |
CN102442634B (zh) * | 2010-10-05 | 2016-04-20 | 英飞凌科技股份有限公司 | 通过形成牺牲结构而提供半导体结构的方法 |
US8631919B2 (en) * | 2010-12-17 | 2014-01-21 | GM Global Technology Operations LLC | Automatic transmission shift quality via selective use of closed-loop pressure feedback control |
US20120211805A1 (en) | 2011-02-22 | 2012-08-23 | Bernhard Winkler | Cavity structures for mems devices |
US9074770B2 (en) | 2011-12-15 | 2015-07-07 | Honeywell International Inc. | Gas valve with electronic valve proving system |
US8839815B2 (en) | 2011-12-15 | 2014-09-23 | Honeywell International Inc. | Gas valve with electronic cycle counter |
US9846440B2 (en) | 2011-12-15 | 2017-12-19 | Honeywell International Inc. | Valve controller configured to estimate fuel comsumption |
US9557059B2 (en) | 2011-12-15 | 2017-01-31 | Honeywell International Inc | Gas valve with communication link |
US9835265B2 (en) | 2011-12-15 | 2017-12-05 | Honeywell International Inc. | Valve with actuator diagnostics |
US9851103B2 (en) | 2011-12-15 | 2017-12-26 | Honeywell International Inc. | Gas valve with overpressure diagnostics |
US8947242B2 (en) | 2011-12-15 | 2015-02-03 | Honeywell International Inc. | Gas valve with valve leakage test |
US8905063B2 (en) | 2011-12-15 | 2014-12-09 | Honeywell International Inc. | Gas valve with fuel rate monitor |
US8899264B2 (en) | 2011-12-15 | 2014-12-02 | Honeywell International Inc. | Gas valve with electronic proof of closure system |
US9995486B2 (en) | 2011-12-15 | 2018-06-12 | Honeywell International Inc. | Gas valve with high/low gas pressure detection |
DE102012206531B4 (de) | 2012-04-17 | 2015-09-10 | Infineon Technologies Ag | Verfahren zur Erzeugung einer Kavität innerhalb eines Halbleitersubstrats |
US9234661B2 (en) | 2012-09-15 | 2016-01-12 | Honeywell International Inc. | Burner control system |
US10422531B2 (en) | 2012-09-15 | 2019-09-24 | Honeywell International Inc. | System and approach for controlling a combustion chamber |
US9136136B2 (en) | 2013-09-19 | 2015-09-15 | Infineon Technologies Dresden Gmbh | Method and structure for creating cavities with extreme aspect ratios |
EP2868970B1 (de) | 2013-10-29 | 2020-04-22 | Honeywell Technologies Sarl | Regelungsvorrichtung |
US10024439B2 (en) | 2013-12-16 | 2018-07-17 | Honeywell International Inc. | Valve over-travel mechanism |
US9733139B2 (en) | 2014-05-02 | 2017-08-15 | Silicon Microstructures, Inc. | Vertical membranes for pressure sensing applications |
US9841122B2 (en) | 2014-09-09 | 2017-12-12 | Honeywell International Inc. | Gas valve with electronic valve proving system |
US9645584B2 (en) | 2014-09-17 | 2017-05-09 | Honeywell International Inc. | Gas valve with electronic health monitoring |
JP6296031B2 (ja) * | 2015-09-28 | 2018-03-20 | 株式会社村田製作所 | 圧力センサ製造装置および圧力センサ製造方法 |
US10503181B2 (en) | 2016-01-13 | 2019-12-10 | Honeywell International Inc. | Pressure regulator |
US10564062B2 (en) | 2016-10-19 | 2020-02-18 | Honeywell International Inc. | Human-machine interface for gas valve |
US11615257B2 (en) | 2017-02-24 | 2023-03-28 | Endotronix, Inc. | Method for communicating with implant devices |
WO2018156930A1 (en) | 2017-02-24 | 2018-08-30 | Endotronix, Inc. | Wireless sensor reader assembly |
US11073281B2 (en) | 2017-12-29 | 2021-07-27 | Honeywell International Inc. | Closed-loop programming and control of a combustion appliance |
US10697815B2 (en) | 2018-06-09 | 2020-06-30 | Honeywell International Inc. | System and methods for mitigating condensation in a sensor module |
WO2019240791A1 (en) * | 2018-06-13 | 2019-12-19 | Hewlett-Packard Development Company, L.P. | Vacuum-based microphone sensor controller and indicator |
US11206494B2 (en) | 2018-10-05 | 2021-12-21 | Knowles Electronics, Llc | Microphone device with ingress protection |
CN112840676B (zh) | 2018-10-05 | 2022-05-03 | 美商楼氏电子有限公司 | 响应于声学信号来生成电信号的声学换能器和麦克风组件 |
WO2020072938A1 (en) | 2018-10-05 | 2020-04-09 | Knowles Electronics, Llc | Methods of forming mems diaphragms including corrugations |
CN111885469B (zh) * | 2020-07-09 | 2022-09-13 | 诺思(天津)微系统有限责任公司 | Mems扬声器及其制造方法 |
US11528546B2 (en) | 2021-04-05 | 2022-12-13 | Knowles Electronics, Llc | Sealed vacuum MEMS die |
US11540048B2 (en) | 2021-04-16 | 2022-12-27 | Knowles Electronics, Llc | Reduced noise MEMS device with force feedback |
US11649161B2 (en) | 2021-07-26 | 2023-05-16 | Knowles Electronics, Llc | Diaphragm assembly with non-uniform pillar distribution |
US11772961B2 (en) | 2021-08-26 | 2023-10-03 | Knowles Electronics, Llc | MEMS device with perimeter barometric relief pierce |
US11780726B2 (en) | 2021-11-03 | 2023-10-10 | Knowles Electronics, Llc | Dual-diaphragm assembly having center constraint |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4445383A (en) | 1982-06-18 | 1984-05-01 | General Signal Corporation | Multiple range capacitive pressure transducer |
DE3310643C2 (de) | 1983-03-24 | 1986-04-10 | Karlheinz Dr. 7801 Schallstadt Ziegler | Drucksensor |
FI71015C (fi) | 1984-02-21 | 1986-10-27 | Vaisala Oy | Temperaturoberoende kapacitiv tryckgivare |
FI69211C (fi) | 1984-02-21 | 1985-12-10 | Vaisala Oy | Kapacitiv styckgivare |
FI74350C (fi) | 1984-02-21 | 1988-01-11 | Vaisala Oy | Kapacitiv absoluttryckgivare. |
US4689999A (en) * | 1985-07-26 | 1987-09-01 | The Garrett Corporation | Temperature compensated pressure transducer |
US4943032A (en) | 1986-09-24 | 1990-07-24 | Stanford University | Integrated, microminiature electric to fluidic valve and pressure/flow regulator |
JPS6413158U (de) * | 1987-07-10 | 1989-01-24 | ||
JPH0368175A (ja) * | 1989-08-05 | 1991-03-25 | Mitsubishi Electric Corp | 半導体圧力センサ |
CN1018844B (zh) | 1990-06-02 | 1992-10-28 | 中国科学院兰州化学物理研究所 | 防锈干膜润滑剂 |
US5197330A (en) | 1990-07-19 | 1993-03-30 | Koganei, Ltd. | Regulator |
DE4106288C2 (de) * | 1991-02-28 | 2001-05-31 | Bosch Gmbh Robert | Sensor zur Messung von Drücken oder Beschleunigungen |
US5295247A (en) * | 1992-04-17 | 1994-03-15 | Micronics Computers, Inc. | Local IDE (integrated drive electronics) bus architecture |
US5264075A (en) * | 1992-11-06 | 1993-11-23 | Ford Motor Company | Fabrication methods for silicon/glass capacitive absolute pressure sensors |
FI93059C (fi) * | 1993-07-07 | 1995-02-10 | Vaisala Oy | Kapasitiivinen paineanturirakenne ja menetelmä sen valmistamiseksi |
US5381299A (en) * | 1994-01-28 | 1995-01-10 | United Technologies Corporation | Capacitive pressure sensor having a substrate with a curved mesa |
US5578843A (en) | 1994-10-06 | 1996-11-26 | Kavlico Corporation | Semiconductor sensor with a fusion bonded flexible structure |
US5833603A (en) | 1996-03-13 | 1998-11-10 | Lipomatrix, Inc. | Implantable biosensing transponder |
US6324914B1 (en) * | 1997-03-20 | 2001-12-04 | Alliedsignal, Inc. | Pressure sensor support base with cavity |
FR2762389B1 (fr) | 1997-04-17 | 1999-05-21 | Commissariat Energie Atomique | Microsysteme a membrane souple pour capteur de pression et procede de realisation |
JP3359871B2 (ja) * | 1998-06-24 | 2002-12-24 | 株式会社日立製作所 | 容量型圧力センサ及びその製造方法 |
JP2000002610A (ja) * | 1998-06-18 | 2000-01-07 | Denso Corp | 半導体圧力センサ及びその製造方法 |
JP2000121473A (ja) * | 1998-10-14 | 2000-04-28 | Fuji Electric Co Ltd | 静電容量式絶対圧検出器 |
US6388299B1 (en) * | 1998-12-10 | 2002-05-14 | Honeywell Inc. | Sensor assembly and method |
JP2001029772A (ja) * | 1999-07-27 | 2001-02-06 | Matsushita Electric Ind Co Ltd | 基板処理装置 |
JP4540775B2 (ja) * | 1999-10-27 | 2010-09-08 | キヤノンアネルバ株式会社 | サーボ式静電容量型真空センサ |
-
2002
- 2002-04-10 US US10/120,944 patent/US6662663B2/en not_active Expired - Lifetime
-
2003
- 2003-01-29 TW TW092102040A patent/TW200305008A/zh unknown
- 2003-03-06 JP JP2003060332A patent/JP3682046B2/ja not_active Expired - Fee Related
- 2003-04-02 DE DE60312583T patent/DE60312583T2/de not_active Expired - Fee Related
- 2003-04-02 EP EP03252097A patent/EP1353161B1/de not_active Expired - Fee Related
- 2003-09-18 US US10/666,609 patent/US7004034B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US7004034B2 (en) | 2006-02-28 |
EP1353161B1 (de) | 2007-03-21 |
DE60312583T2 (de) | 2008-05-29 |
JP3682046B2 (ja) | 2005-08-10 |
US20040060360A1 (en) | 2004-04-01 |
US20030192383A1 (en) | 2003-10-16 |
JP2003322576A (ja) | 2003-11-14 |
US6662663B2 (en) | 2003-12-16 |
EP1353161A1 (de) | 2003-10-15 |
TW200305008A (en) | 2003-10-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8327 | Change in the person/name/address of the patent owner |
Owner name: HEWLETT-PACKARD DEVELOPMENT CO., L.P., HOUSTON, US |
|
8328 | Change in the person/name/address of the agent |
Representative=s name: SCHOPPE, ZIMMERMANN, STOECKELER & ZINKLER, 82049 P |
|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |