Classifications

• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03M—CODING; DECODING; CODE CONVERSION IN GENERAL
  • H03M5/00—Conversion of the form of the representation of individual digits
  • H03M5/02—Conversion to or from representation by pulses
• • H—ELECTRICITY
  • H04—ELECTRIC COMMUNICATION TECHNIQUE
  • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
  • H04L25/00—Baseband systems
  • H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
  • H04L25/0264—Arrangements for coupling to transmission lines
  • H04L25/0266—Arrangements for providing Galvanic isolation, e.g. by means of magnetic or capacitive coupling
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
  • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
  • G01R31/317—Testing of digital circuits
  • G01R31/3181—Functional testing
  • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
  • G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
  • G01R31/318536—Scan chain arrangements, e.g. connections, test bus, analog signals
  • G01R31/318538—Topological or mechanical aspects
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
  • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
  • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Applications Claiming Priority (2)

Publications (1)

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Family Applications (1)

Country Status (10)

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Family Cites Families (19)

• 2003
  • 2003-08-06 AU AU2003255884A patent/AU2003255884A1/en not_active Abandoned
  • 2003-08-06 KR KR1020057004206A patent/KR20050043945A/ko not_active Application Discontinuation
  • 2003-08-06 WO PCT/IB2003/003496 patent/WO2004025838A1/en active Application Filing
  • 2003-08-06 CN CNB038217961A patent/CN100481731C/zh not_active Expired - Fee Related
  • 2003-08-06 AT AT03795107T patent/ATE424060T1/de not_active IP Right Cessation
  • 2003-08-06 EP EP03795107A patent/EP1540828B1/de not_active Expired - Lifetime
  • 2003-08-06 DE DE60326363T patent/DE60326363D1/de not_active Expired - Lifetime
  • 2003-08-06 US US10/527,551 patent/US7515074B2/en not_active Expired - Lifetime
  • 2003-08-06 JP JP2004535729A patent/JP2005538632A/ja active Pending
  • 2003-09-10 TW TW092125072A patent/TWI310594B/zh not_active IP Right Cessation

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