DE60327274D1 - Selbstjustiertes Mikro-Scharnier - Google Patents

Selbstjustiertes Mikro-Scharnier

Info

Publication number
DE60327274D1
DE60327274D1 DE60327274T DE60327274T DE60327274D1 DE 60327274 D1 DE60327274 D1 DE 60327274D1 DE 60327274 T DE60327274 T DE 60327274T DE 60327274 T DE60327274 T DE 60327274T DE 60327274 D1 DE60327274 D1 DE 60327274D1
Authority
DE
Germany
Prior art keywords
hinge
self
aligned micro
micro
aligned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60327274T
Other languages
English (en)
Inventor
Chuang-Chia Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xerox Corp
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xerox Corp filed Critical Xerox Corp
Application granted granted Critical
Publication of DE60327274D1 publication Critical patent/DE60327274D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B1/00—Layered products having a general shape other than plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00198—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising elements which are movable in relation to each other, e.g. comprising slidable or rotatable elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/042—Micromirrors, not used as optical switches
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
DE60327274T 2002-01-07 2003-01-02 Selbstjustiertes Mikro-Scharnier Expired - Lifetime DE60327274D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/040,687 US6755982B2 (en) 2002-01-07 2002-01-07 Self-aligned micro hinges

Publications (1)

Publication Number Publication Date
DE60327274D1 true DE60327274D1 (de) 2009-06-04

Family

ID=21912371

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60327274T Expired - Lifetime DE60327274D1 (de) 2002-01-07 2003-01-02 Selbstjustiertes Mikro-Scharnier

Country Status (4)

Country Link
US (1) US6755982B2 (de)
EP (1) EP1325885B1 (de)
JP (1) JP4313576B2 (de)
DE (1) DE60327274D1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6952042B2 (en) * 2002-06-17 2005-10-04 Honeywell International, Inc. Microelectromechanical device with integrated conductive shield
US7067892B1 (en) * 2002-10-17 2006-06-27 The United States Of America As Represented By The Secretary Of The Air Force Off substrate flip-chip apparatus
US7138694B2 (en) 2004-03-02 2006-11-21 Analog Devices, Inc. Single crystal silicon sensor with additional layer and method of producing the same
KR100605368B1 (ko) * 2004-10-20 2006-07-28 삼성전자주식회사 Ｓｏｉ기판, 그 제조방법, 그리고, 그 ｓｏｉ기판을이용한 부유 구조체 제조 방법
US7180650B2 (en) 2005-03-29 2007-02-20 Intel Corporation Electromechanical drives adapted to provide three degrees of mobility
US20090113889A1 (en) * 2006-02-28 2009-05-07 Subir Roychoudhury Catalytic burner for stirling engine
JP2008080444A (ja) * 2006-09-27 2008-04-10 Toshiba Corp Ｍｅｍｓ素子製造方法およびｍｅｍｓ素子
US20080208197A1 (en) * 2006-11-30 2008-08-28 Kelly Ammann Method and apparatus for performing an open wedge, high tibial osteotomy
JP2009291293A (ja) 2008-06-03 2009-12-17 Olympus Corp 積層構造体、光調節装置、及び積層構造体の製造方法
US20110062110A1 (en) * 2009-09-16 2011-03-17 Karthik Kumar Method for Fabricating a Micromirror with Self-Aligned Actuators
EP2312393A1 (de) * 2009-10-14 2011-04-20 Biocartis SA Verfahren zur Herstellung von Mikropartikeln
CN102234098B (zh) * 2010-04-21 2014-02-26 汉积科技股份有限公司 微机电结构的制造方法
CN102259820B (zh) * 2010-05-27 2013-12-18 上海华虹Nec电子有限公司 空腔结构和该结构的制备方法及压敏传感器的制作方法
CN102303843B (zh) * 2011-08-15 2014-07-16 中国科学技术大学 纳米流体通道及其制作方法
CN102320558B (zh) * 2011-09-13 2014-03-26 上海先进半导体制造股份有限公司 全硅基微流体器件的腔体的制造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5177661A (en) * 1989-01-13 1993-01-05 Kopin Corporation SOI diaphgram sensor
US5488862A (en) * 1993-10-18 1996-02-06 Armand P. Neukermans Monolithic silicon rate-gyro with integrated sensors
US5759870A (en) * 1995-08-28 1998-06-02 Bei Electronics, Inc. Method of making a surface micro-machined silicon pressure sensor
US5867297A (en) * 1997-02-07 1999-02-02 The Regents Of The University Of California Apparatus and method for optical scanning with an oscillatory microelectromechanical system
US6002507A (en) * 1998-12-01 1999-12-14 Xerox Corpoation Method and apparatus for an integrated laser beam scanner
US6586841B1 (en) * 2000-02-23 2003-07-01 Onix Microsystems, Inc. Mechanical landing pad formed on the underside of a MEMS device
US6300156B1 (en) * 2000-04-07 2001-10-09 Agere Systems Optoelectronics Guardian Corp. Process for fabricating micromechanical devices
US6479311B1 (en) * 2000-11-27 2002-11-12 Microscan Systems, Inc. Process for manufacturing micromechanical and microoptomechanical structures with pre-applied patterning

Also Published As

Publication number Publication date
US20030129374A1 (en) 2003-07-10
EP1325885A3 (de) 2004-12-08
EP1325885B1 (de) 2009-04-22
US6755982B2 (en) 2004-06-29
JP4313576B2 (ja) 2009-08-12
EP1325885A2 (de) 2003-07-09
JP2003260699A (ja) 2003-09-16

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Legal Events

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