DE60337027D1 - Transistoren mit bedeckten p-typ-schichten neben der sourcezone und herstellungsverfahren dafür - Google Patents

Transistoren mit bedeckten p-typ-schichten neben der sourcezone und herstellungsverfahren dafür

Info

Publication number
DE60337027D1
DE60337027D1 DE60337027T DE60337027T DE60337027D1 DE 60337027 D1 DE60337027 D1 DE 60337027D1 DE 60337027 T DE60337027 T DE 60337027T DE 60337027 T DE60337027 T DE 60337027T DE 60337027 D1 DE60337027 D1 DE 60337027D1
Authority
DE
Germany
Prior art keywords
source
transistors
covered
manufacturing
type conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60337027T
Other languages
English (en)
Inventor
Saptharishi Sriram
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wolfspeed Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Application granted granted Critical
Publication of DE60337027D1 publication Critical patent/DE60337027D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66848Unipolar field-effect transistors with a Schottky gate, i.e. MESFET
    • H01L29/66856Unipolar field-effect transistors with a Schottky gate, i.e. MESFET with an active layer made of a group 13/15 material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66053Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide
    • H01L29/66068Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/80Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
    • H01L29/812Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with a Schottky gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/80Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
    • H01L29/812Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with a Schottky gate
    • H01L29/8128Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with a Schottky gate with recessed gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
    • H01L29/1608Silicon carbide
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/20Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
    • H01L29/2003Nitride compounds
DE60337027T 2002-11-26 2003-10-02 Transistoren mit bedeckten p-typ-schichten neben der sourcezone und herstellungsverfahren dafür Expired - Lifetime DE60337027D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/304,272 US6956239B2 (en) 2002-11-26 2002-11-26 Transistors having buried p-type layers beneath the source region
PCT/US2003/031334 WO2004049454A1 (en) 2002-11-26 2003-10-02 Transistors having buried p-type layers beneath the source region and methods of fabricating the same

Publications (1)

Publication Number Publication Date
DE60337027D1 true DE60337027D1 (de) 2011-06-16

Family

ID=32325171

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60337027T Expired - Lifetime DE60337027D1 (de) 2002-11-26 2003-10-02 Transistoren mit bedeckten p-typ-schichten neben der sourcezone und herstellungsverfahren dafür

Country Status (11)

Country Link
US (2) US6956239B2 (de)
EP (1) EP1565946B1 (de)
JP (2) JP2006507683A (de)
KR (1) KR20050086758A (de)
CN (1) CN100517761C (de)
AT (1) ATE508477T1 (de)
AU (1) AU2003277252A1 (de)
CA (1) CA2502485A1 (de)
DE (1) DE60337027D1 (de)
TW (1) TWI329927B (de)
WO (1) WO2004049454A1 (de)

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TW200419803A (en) 2004-10-01
AU2003277252A1 (en) 2004-06-18
CA2502485A1 (en) 2004-06-10
JP2012080123A (ja) 2012-04-19
TWI329927B (en) 2010-09-01
CN1717811A (zh) 2006-01-04
EP1565946A1 (de) 2005-08-24
KR20050086758A (ko) 2005-08-30
WO2004049454A1 (en) 2004-06-10
US7297580B2 (en) 2007-11-20
US6956239B2 (en) 2005-10-18
EP1565946B1 (de) 2011-05-04
CN100517761C (zh) 2009-07-22
US20040099888A1 (en) 2004-05-27
JP5758796B2 (ja) 2015-08-05
ATE508477T1 (de) 2011-05-15
US20050224809A1 (en) 2005-10-13

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