DE68908341D1 - Verfahren zum montieren eines elektronischen bausteins und diesen verwendende speicherkarte. - Google Patents
Verfahren zum montieren eines elektronischen bausteins und diesen verwendende speicherkarte.Info
- Publication number
- DE68908341D1 DE68908341D1 DE8989202342T DE68908341T DE68908341D1 DE 68908341 D1 DE68908341 D1 DE 68908341D1 DE 8989202342 T DE8989202342 T DE 8989202342T DE 68908341 T DE68908341 T DE 68908341T DE 68908341 D1 DE68908341 D1 DE 68908341D1
- Authority
- DE
- Germany
- Prior art keywords
- layer
- mounting
- hole
- memory card
- electronic module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30105—Capacitance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BE8801103A BE1002529A6 (nl) | 1988-09-27 | 1988-09-27 | Methode om een elektronische component te monteren en geheugen kaart waarin deze wordt toegepast. |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68908341D1 true DE68908341D1 (de) | 1993-09-16 |
DE68908341T2 DE68908341T2 (de) | 1994-01-13 |
Family
ID=3883649
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE89202342T Expired - Fee Related DE68908341T2 (de) | 1988-09-27 | 1989-09-16 | Verfahren zum Montieren eines elektronischen Bausteins und diesen verwendende Speicherkarte. |
Country Status (7)
Country | Link |
---|---|
US (1) | US5042145A (de) |
EP (1) | EP0367311B1 (de) |
AT (1) | ATE93075T1 (de) |
AU (2) | AU617867B2 (de) |
BE (1) | BE1002529A6 (de) |
DE (1) | DE68908341T2 (de) |
ES (1) | ES2044061T3 (de) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5203078A (en) * | 1985-07-17 | 1993-04-20 | Ibiden Co., Ltd. | Printed wiring board for IC cards |
US5274570A (en) * | 1989-05-22 | 1993-12-28 | Mazda Motor Corporation | Integrated circuit having metal substrate |
CA2113906A1 (en) * | 1992-05-25 | 1993-12-09 | Jean-Claude Berney | Electronic tag |
DE4424396C2 (de) * | 1994-07-11 | 1996-12-12 | Ibm | Trägerelement zum Einbau in Chipkarten oder anderen Datenträgerkarten |
FR2731132B1 (fr) * | 1995-02-24 | 1997-04-04 | Solaic Sa | Procede pour implanter un element electronique, notamment un microcircuit, dans un corps de carte electronique, et corps de carte electronique comportant un element electronique ainsi implante |
SE9701612D0 (sv) | 1997-04-29 | 1997-04-29 | Johan Asplund | Smartcard and method for its manufacture |
US6531997B1 (en) | 1999-04-30 | 2003-03-11 | E Ink Corporation | Methods for addressing electrophoretic displays |
KR100890534B1 (ko) * | 2000-02-25 | 2009-03-27 | 이비덴 가부시키가이샤 | 다층프린트배선판 및 다층프린트배선판의 제조방법 |
KR101093471B1 (ko) | 2000-09-25 | 2011-12-13 | 이비덴 가부시키가이샤 | 반도체소자,반도체소자의 제조방법,다층프린트배선판 및 다층프린트배선판의 제조방법 |
EP1506635B1 (de) * | 2002-05-08 | 2011-02-16 | LaserCard Corporation | Verfahren zur herstellung einer sicheren persönlichen datenkarte |
FI20030293A (fi) * | 2003-02-26 | 2004-08-27 | Imbera Electronics Oy | Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli |
FI119583B (fi) * | 2003-02-26 | 2008-12-31 | Imbera Electronics Oy | Menetelmä elektroniikkamoduulin valmistamiseksi |
FI20031341A (fi) | 2003-09-18 | 2005-03-19 | Imbera Electronics Oy | Menetelmä elektroniikkamoduulin valmistamiseksi |
FI117814B (fi) * | 2004-06-15 | 2007-02-28 | Imbera Electronics Oy | Menetelmä elektroniikkamoduulin valmistamiseksi |
FI119714B (fi) | 2005-06-16 | 2009-02-13 | Imbera Electronics Oy | Piirilevyrakenne ja menetelmä piirilevyrakenteen valmistamiseksi |
JP2008544512A (ja) * | 2005-06-16 | 2008-12-04 | イムベラ エレクトロニクス オサケユキチュア | 回路基板構造体およびその製造方法 |
FI122128B (fi) * | 2005-06-16 | 2011-08-31 | Imbera Electronics Oy | Menetelmä piirilevyrakenteen valmistamiseksi |
FI20060256L (fi) | 2006-03-17 | 2006-03-20 | Imbera Electronics Oy | Piirilevyn valmistaminen ja komponentin sisältävä piirilevy |
US7836588B2 (en) * | 2006-07-06 | 2010-11-23 | Ideon Llc | Method for fabricating an electronic device |
GB0705287D0 (en) * | 2007-03-20 | 2007-04-25 | Conductive Inkjet Tech Ltd | Electrical connection of components |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1339660A (en) * | 1971-11-20 | 1973-12-05 | Ferranti Ltd | Supports for semiconductor devices |
JPS5231673A (en) * | 1975-09-04 | 1977-03-10 | Sharp Corp | Resin sealing method of semiconductor device |
JPS53149763A (en) * | 1977-06-01 | 1978-12-27 | Citizen Watch Co Ltd | Mounting method of semiconductor integrate circuit |
DE3248385A1 (de) * | 1982-12-28 | 1984-06-28 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit integriertem schaltkreis |
FR2584236B1 (fr) * | 1985-06-26 | 1988-04-29 | Bull Sa | Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques |
FR2584235B1 (fr) * | 1985-06-26 | 1988-04-22 | Bull Sa | Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques |
JPH074995B2 (ja) * | 1986-05-20 | 1995-01-25 | 株式会社東芝 | Icカ−ド及びその製造方法 |
FR2601477B1 (fr) * | 1986-07-11 | 1988-10-21 | Bull Cp8 | Procede de montage d'un circuit integre dans une carte a microcircuits electroniques, et carte en resultant |
FR2625067A1 (fr) * | 1987-12-22 | 1989-06-23 | Sgs Thomson Microelectronics | Procede pour fixer sur un support un composant electronique et ses contacts |
FR2631200B1 (fr) * | 1988-05-09 | 1991-02-08 | Bull Cp8 | Circuit imprime souple, notamment pour carte a microcircuits electroniques, et carte incorporant un tel circuit |
-
1988
- 1988-09-27 BE BE8801103A patent/BE1002529A6/nl not_active IP Right Cessation
-
1989
- 1989-09-16 AT AT89202342T patent/ATE93075T1/de not_active IP Right Cessation
- 1989-09-16 DE DE89202342T patent/DE68908341T2/de not_active Expired - Fee Related
- 1989-09-16 ES ES89202342T patent/ES2044061T3/es not_active Expired - Fee Related
- 1989-09-16 EP EP89202342A patent/EP0367311B1/de not_active Expired - Lifetime
- 1989-09-18 AU AU41427/89A patent/AU617867B2/en not_active Ceased
- 1989-12-06 US US07/446,529 patent/US5042145A/en not_active Expired - Fee Related
-
1991
- 1991-08-30 AU AU83531/91A patent/AU646284B2/en not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
AU4142789A (en) | 1990-04-05 |
ES2044061T3 (es) | 1994-01-01 |
BE1002529A6 (nl) | 1991-03-12 |
AU646284B2 (en) | 1994-02-17 |
US5042145A (en) | 1991-08-27 |
EP0367311A1 (de) | 1990-05-09 |
EP0367311B1 (de) | 1993-08-11 |
AU617867B2 (en) | 1991-12-05 |
AU8353191A (en) | 1991-11-07 |
ATE93075T1 (de) | 1993-08-15 |
DE68908341T2 (de) | 1994-01-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |