DE68908488T2 - Verfahren zur Vorbereitung von Polymeroberflächen für eine nachfolgende Plattierung, und daraus hergestellte metallplattierte Kunststoffartikel. - Google Patents
Verfahren zur Vorbereitung von Polymeroberflächen für eine nachfolgende Plattierung, und daraus hergestellte metallplattierte Kunststoffartikel.Info
- Publication number
- DE68908488T2 DE68908488T2 DE1989608488 DE68908488T DE68908488T2 DE 68908488 T2 DE68908488 T2 DE 68908488T2 DE 1989608488 DE1989608488 DE 1989608488 DE 68908488 T DE68908488 T DE 68908488T DE 68908488 T2 DE68908488 T2 DE 68908488T2
- Authority
- DE
- Germany
- Prior art keywords
- metal
- made therefrom
- articles made
- plastic articles
- polymer surfaces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
- Y10S205/924—Electrolytic coating substrate predominantly comprised of specified synthetic resin
- Y10S205/926—Polyamide or polyimide, e.g. nylon
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12389—All metal or with adjacent metals having variation in thickness
- Y10T428/12396—Discontinuous surface component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
- Y10T428/12569—Synthetic resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31725—Of polyamide
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/207,462 US4873136A (en) | 1988-06-16 | 1988-06-16 | Method for preparing polymer surfaces for subsequent plating thereon, and improved metal-plated plastic articles made therefrom |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68908488D1 DE68908488D1 (de) | 1993-09-23 |
DE68908488T2 true DE68908488T2 (de) | 1994-04-14 |
Family
ID=22770650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1989608488 Expired - Fee Related DE68908488T2 (de) | 1988-06-16 | 1989-05-23 | Verfahren zur Vorbereitung von Polymeroberflächen für eine nachfolgende Plattierung, und daraus hergestellte metallplattierte Kunststoffartikel. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4873136A (de) |
EP (1) | EP0346655B1 (de) |
JP (1) | JPH0243370A (de) |
CA (1) | CA1331542C (de) |
DE (1) | DE68908488T2 (de) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5015329A (en) * | 1988-11-07 | 1991-05-14 | Jp Laboratories, Inc. | Pre-swelling and etching of plastics for plating |
US5049230A (en) * | 1988-11-07 | 1991-09-17 | Jp Laboratories, Inc. | Single step pre-swelling and etching of plastics for plating |
JPH0653261B2 (ja) * | 1988-12-13 | 1994-07-20 | 日本ジーイープラスチックス株式会社 | 耐低温衝撃性を有する塗装された樹脂成形品及びそのような樹脂成形品の塗装方法 |
US4999251A (en) * | 1989-04-03 | 1991-03-12 | General Electric Company | Method for treating polyetherimide substrates and articles obtained therefrom |
US5108786A (en) * | 1989-05-01 | 1992-04-28 | Enthone-Omi, Inc. | Method of making printed circuit boards |
FR2646583B1 (fr) * | 1989-05-01 | 1992-01-24 | Enthone Corp | Procede pour fabriquer des plaquettes a circuits imprimes |
EP0419845A3 (en) * | 1989-09-05 | 1991-11-13 | General Electric Company | Method for preparing metallized polyimide composites |
NL8902886A (nl) * | 1989-11-22 | 1991-06-17 | Akzo Nv | Laminaat ten behoeve van stroomloze metallisering alsmede een daarvan voorziene gedrukte schakeling en een werkwijze ter vervaardiging van een dergelijk laminaat. |
US4959121A (en) * | 1990-01-05 | 1990-09-25 | General Electric Company | Method for treating a polyimide surface for subsequent plating thereon |
US5183534A (en) * | 1990-03-09 | 1993-02-02 | Amoco Corporation | Wet-etch process and composition |
US5213840A (en) * | 1990-05-01 | 1993-05-25 | Macdermid, Incorporated | Method for improving adhesion to polymide surfaces |
US5187241A (en) * | 1990-05-15 | 1993-02-16 | International Business Machines Corporation | Isoimide modifications of a polyimide and reaction thereof with nucleophiles |
US5133840A (en) * | 1990-05-15 | 1992-07-28 | International Business Machines Corporation | Surface midification of a polyimide |
US5441770A (en) * | 1990-05-18 | 1995-08-15 | Shipley Company Inc. | Conditioning process for electroless plating of polyetherimides |
US6110881A (en) * | 1990-11-05 | 2000-08-29 | Ekc Technology, Inc. | Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials |
US6000411A (en) * | 1990-11-05 | 1999-12-14 | Ekc Technology, Inc. | Cleaning compositions for removing etching residue and method of using |
US20040018949A1 (en) * | 1990-11-05 | 2004-01-29 | Wai Mun Lee | Semiconductor process residue removal composition and process |
US6121217A (en) | 1990-11-05 | 2000-09-19 | Ekc Technology, Inc. | Alkanolamine semiconductor process residue removal composition and process |
US7205265B2 (en) * | 1990-11-05 | 2007-04-17 | Ekc Technology, Inc. | Cleaning compositions and methods of use thereof |
US5279771A (en) * | 1990-11-05 | 1994-01-18 | Ekc Technology, Inc. | Stripping compositions comprising hydroxylamine and alkanolamine |
US6242400B1 (en) | 1990-11-05 | 2001-06-05 | Ekc Technology, Inc. | Method of stripping resists from substrates using hydroxylamine and alkanolamine |
DE4205190C2 (de) * | 1992-02-20 | 1994-07-14 | Blasberg Oberflaechentech | Verfahren und Mittel zur Konditionierung von Substraten oder Basismaterialien für die nachfolgende Metallisierung |
US5264248A (en) * | 1992-08-03 | 1993-11-23 | General Electric Company | Adhesion of metal coatings of polypyromellitimides |
JP3286744B2 (ja) * | 1993-05-24 | 2002-05-27 | 奥野製薬工業株式会社 | 非導電性材料表面に電気めっき層を直接形成する方法 |
US7144849B2 (en) * | 1993-06-21 | 2006-12-05 | Ekc Technology, Inc. | Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials |
AU5561696A (en) * | 1996-04-18 | 1997-11-07 | International Business Machines Corporation | Organic-metallic composite coating for copper surface protection |
ES2224507T3 (es) * | 1998-11-13 | 2005-03-01 | Lpw-Chemie Gmbh | Procedimiento para la metalizacion de una superficie de plastico. |
US6117250A (en) * | 1999-02-25 | 2000-09-12 | Morton International Inc. | Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions |
US6444140B2 (en) | 1999-03-17 | 2002-09-03 | Morton International Inc. | Micro-etch solution for producing metal surface topography |
US20040099637A1 (en) * | 2000-06-16 | 2004-05-27 | Shipley Company, L.L.C. | Composition for producing metal surface topography |
US20030178391A1 (en) * | 2000-06-16 | 2003-09-25 | Shipley Company, L.L.C. | Composition for producing metal surface topography |
US6569517B1 (en) | 2000-11-17 | 2003-05-27 | 3M Innovative Properties Company | Color tailorable pigmented optical bodies with surface metalization |
DE102004047423C5 (de) * | 2004-09-28 | 2011-04-21 | AHC-Oberflächentechnik GmbH & Co. OHG | Außenstromlos aufgebrachte Nickellegierung und ihre Verwendung |
US7393461B2 (en) * | 2005-08-23 | 2008-07-01 | Kesheng Feng | Microetching solution |
KR101317667B1 (ko) * | 2005-12-06 | 2013-10-15 | 가부시끼가이샤 제이씨유 | 팔라듐 착체 및 이것을 이용하는 촉매 부여 처리액 |
US8298620B2 (en) * | 2008-05-13 | 2012-10-30 | North Carolina Agricultural And Technical State University | Methods of preparing thin films by electroless plating |
MY156523A (en) * | 2009-06-08 | 2016-02-26 | Basf Se | Use of ionic fluids for pretreating plastic surfaces for metallization |
US9765288B2 (en) * | 2012-12-05 | 2017-09-19 | Entegris, Inc. | Compositions for cleaning III-V semiconductor materials and methods of using same |
US20140227446A1 (en) * | 2013-02-13 | 2014-08-14 | Seiren Co., Ltd. | Surface modifier for polyimide resin and surface-modifying method for polyimide resin |
JP2018104740A (ja) * | 2016-12-22 | 2018-07-05 | ローム・アンド・ハース電子材料株式会社 | 無電解めっき方法 |
WO2021133455A2 (en) * | 2019-10-07 | 2021-07-01 | State Research Institute Center For Physical Sciences And Technology | Method for increasing surface adhesion in polyetherimide substrates |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3149919A1 (de) * | 1981-12-11 | 1983-06-23 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Verfahren zum haftfesten metallisieren von polyimid |
DE3323476A1 (de) * | 1982-07-01 | 1984-01-05 | Kollmorgen Technologies Corp., 75201 Dallas, Tex. | Verbessertes verfahren zur galvanischen metallabscheidung auf nichtmetallischen oberflaechen |
US4425380A (en) * | 1982-11-19 | 1984-01-10 | Kollmorgen Technologies Corporation | Hole cleaning process for printed circuit boards using permanganate and caustic treating solutions |
US4528245A (en) * | 1984-02-27 | 1985-07-09 | Allied Corporation | Pretreatment of plastic materials for metal plating |
US4790912A (en) * | 1985-06-06 | 1988-12-13 | Techno-Instruments Investments Ltd. | Selective plating process for the electrolytic coating of circuit boards without an electroless metal coating |
JPS621877A (ja) * | 1985-06-27 | 1987-01-07 | Agency Of Ind Science & Technol | ポリエチレンテレフタレ−ト成形体の金属めつき方法 |
DE3612822A1 (de) * | 1986-04-14 | 1987-10-15 | Schering Ag | Verfahren zur haftfesten metallisierung von polyetherimid |
US4775449A (en) * | 1986-12-29 | 1988-10-04 | General Electric Company | Treatment of a polyimide surface to improve the adhesion of metal deposited thereon |
-
1988
- 1988-06-16 US US07/207,462 patent/US4873136A/en not_active Expired - Fee Related
-
1989
- 1989-05-18 CA CA 600122 patent/CA1331542C/en not_active Expired - Fee Related
- 1989-05-23 EP EP19890109276 patent/EP0346655B1/de not_active Expired - Lifetime
- 1989-05-23 DE DE1989608488 patent/DE68908488T2/de not_active Expired - Fee Related
- 1989-06-15 JP JP1150690A patent/JPH0243370A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0346655B1 (de) | 1993-08-18 |
US4873136A (en) | 1989-10-10 |
CA1331542C (en) | 1994-08-23 |
DE68908488D1 (de) | 1993-09-23 |
JPH0243370A (ja) | 1990-02-13 |
EP0346655A1 (de) | 1989-12-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |