DE68909111T2 - Elektronisches Modul, das Substratelemente enthält. - Google Patents

Elektronisches Modul, das Substratelemente enthält.

Info

Publication number: DE68909111T2
Authority: DE; Germany
Prior art keywords: electronic module; substrate elements; contains substrate; elements; module
Prior art date: 1988-05-27
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

DE89201273T

Other languages

English (en)

Other versions

DE68909111D1 (de

Inventor

Wilhelm Albert Sauerwald

Anwar Osseyran

Lars Arjen Raoul Eerenstein

Jong Franciscus Gerardus Ma De

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Koninklijke Philips NV

Original Assignee

Philips Gloeilampenfabrieken NV

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1988-05-27

Filing date

1989-05-22

Publication date

1994-03-31

1989-05-22 Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV

1993-10-21 Application granted granted Critical

1993-10-21 Publication of DE68909111D1 publication Critical patent/DE68909111D1/de

1994-03-31 Publication of DE68909111T2 publication Critical patent/DE68909111T2/de

2009-05-23 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Links

Classifications

- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
- G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
- G01R31/318536—Scan chain arrangements, e.g. connections, test bus, analog signals
- G01R31/318538—Topological or mechanical aspects

Landscapes

Engineering & Computer Science (AREA)
General Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Tests Of Electronic Circuits (AREA)

DE89201273T 1988-05-27 1989-05-22 Elektronisches Modul, das Substratelemente enthält. Expired - Fee Related DE68909111T2 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
NL8801362A NL8801362A (nl)	1988-05-27	1988-05-27	Elektronische module bevattende een eerste substraatelement met een funktioneel deel, alsmede een tweede substraatelement voor het testen van een interkonnektiefunktie, voet bevattende zo een tweede substraatelement, substraatelement te gebruiken als zo een tweede substraatelement en elektronisch apparaat bevattende een plaat met gedrukte bedrading en ten minste twee zulke elektronische modules.

Publications (2)

Publication Number	Publication Date
DE68909111D1 DE68909111D1 (de)	1993-10-21
DE68909111T2 true DE68909111T2 (de)	1994-03-31

Family

ID=19852363

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE89201273T Expired - Fee Related DE68909111T2 (de)	1988-05-27	1989-05-22	Elektronisches Modul, das Substratelemente enthält.

Country Status (6)

Country	Link
US (1)	US4967142A (de)
EP (1)	EP0344834B1 (de)
JP (1)	JP2857764B2 (de)
KR (1)	KR0163756B1 (de)
DE (1)	DE68909111T2 (de)
NL (1)	NL8801362A (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2561164B2 (ja) *	1990-02-26	1996-12-04	三菱電機株式会社	半導体集積回路
US5159598A (en) *	1990-05-03	1992-10-27	General Electric Company	Buffer integrated circuit providing testing interface
JPH04212524A (ja) *	1990-12-06	1992-08-04	Matsushita Electric Ind Co Ltd	半導体集積回路
TW216472B (de) *	1991-12-18	1993-11-21	Philips Nv
US5410551A (en) *	1992-01-02	1995-04-25	Andahl Corporation	Net verification method and apparatus
US5448166A (en) *	1992-01-03	1995-09-05	Hewlett-Packard Company	Powered testing of mixed conventional/boundary-scan logic
US5260649A (en) *	1992-01-03	1993-11-09	Hewlett-Packard Company	Powered testing of mixed conventional/boundary-scan logic
TW253097B (de) *	1992-03-02	1995-08-01	At & T Corp
US5285152A (en) *	1992-03-23	1994-02-08	Ministar Peripherals International Limited	Apparatus and methods for testing circuit board interconnect integrity
US5534774A (en) *	1992-04-23	1996-07-09	Intel Corporation	Apparatus for a test access architecture for testing of modules within integrated circuits
US5471481A (en) *	1992-05-18	1995-11-28	Sony Corporation	Testing method for electronic apparatus
US5809036A (en) *	1993-11-29	1998-09-15	Motorola, Inc.	Boundary-scan testable system and method
DE69433618T2 (de) *	1993-12-16	2005-02-03	Koninklijke Philips Electronics N.V.	Gerät zur prüfung der verbindung zwischen dem ausgang einer schaltung mit fester logischer ausgabe und dem eingang eines weiteren schaltkreises
US5787098A (en) *	1996-07-29	1998-07-28	International Business Machines Corporation	Complete chip I/O test through low contact testing using enhanced boundary scan
US5974578A (en) *	1996-08-06	1999-10-26	Matsushita Electronics Corporation	Integrated circuit and test method therefor
US6114870A (en) *	1996-10-04	2000-09-05	Texas Instruments Incorporated	Test system and process with a microcomputer at each test location
US6617872B2 (en) *	1996-10-04	2003-09-09	Texas Instruments Incorporated	Reduced cost, high speed integrated circuit test arrangement
US6199182B1 (en) *	1997-03-27	2001-03-06	Texas Instruments Incorporated	Probeless testing of pad buffers on wafer
US5963464A (en) *	1998-02-26	1999-10-05	International Business Machines Corporation	Stackable memory card
GB2344184A (en)	1998-11-26	2000-05-31	Ericsson Telefon Ab L M	Testing integrated circuits
JP4887552B2 (ja) *	2000-07-04	2012-02-29	富士通セミコンダクター株式会社	Ｌｓｉチップのレイアウト設計方法
US6731128B2 (en) *	2000-07-13	2004-05-04	International Business Machines Corporation	TFI probe I/O wrap test method
WO2002080268A1 (en) *	2001-03-30	2002-10-10	Infineon Technologies Ag	A substrate for mounting a semiconductor chip
JP2004519684A (ja) *	2001-04-09	2004-07-02	コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ	電源試験インタフェースを備えた集積回路
DE102004014242B4 (de) *	2004-03-24	2014-05-28	Qimonda Ag	Integrierter Baustein mit mehreren voneinander getrennten Substraten
JP2006200983A (ja) *	2005-01-19	2006-08-03	Denso Corp	半導体集積回路装置およびその試験方法
US8991829B2 (en)	2007-11-20	2015-03-31	The Timken Company	Non-contact labyrinth seal assembly and method of construction thereof
KR101014965B1 (ko)	2008-11-03	2011-02-16	유수엽	임베디드 보드 개발 및 교육용 보드유닛
JP2013142434A (ja)	2012-01-10	2013-07-22	Showa Corp	軸受構造体

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
IT1003048B (it) *	1972-03-17	1976-06-10	Honeywell Inf Systems	Dispositivo per verificare il cor retto comportamento di unita circui tali integrate sequenziali
US4145620A (en) *	1977-10-05	1979-03-20	Serel Corporation	Modular dynamic burn-in apparatus
US4567432A (en) *	1983-06-09	1986-01-28	Texas Instruments Incorporated	Apparatus for testing integrated circuits
DE3578224D1 (de) *	1984-07-27	1990-07-19	Fujitsu Ltd	Integrierte schaltung vom chip-auf-chip-typ.
FR2569411B1 (fr) *	1984-08-23	1986-11-21	Charbonnages Ste Chimique	Nouveau procede de fabrication de terpolymeres radicalaires de l'ethylene et de copolymeres radicalaires de l'ethylene
NL8502476A (nl) *	1985-09-11	1987-04-01	Philips Nv	Werkwijze voor het testen van dragers met meerdere digitaal-werkende geintegreerde schakelingen, drager voorzien van zulke schakelingen, geintegreerde schakeling geschikt voor het aanbrengen op zo'n drager, en testinrichting voor het testen van zulke dragers.
JPS63182585A (ja) *	1987-01-26	1988-07-27	Toshiba Corp	テスト容易化機能を備えた論理回路
JPS63286781A (ja) *	1987-05-19	1988-11-24	Mitsubishi Electric Corp	回路の試験方法

1988
- 1988-05-27 NL NL8801362A patent/NL8801362A/nl not_active Application Discontinuation
1989
- 1989-04-24 US US07/342,414 patent/US4967142A/en not_active Expired - Lifetime
- 1989-05-22 EP EP89201273A patent/EP0344834B1/de not_active Expired - Lifetime
- 1989-05-22 DE DE89201273T patent/DE68909111T2/de not_active Expired - Fee Related
- 1989-05-24 KR KR1019890006926A patent/KR0163756B1/ko not_active IP Right Cessation
- 1989-05-24 JP JP1131252A patent/JP2857764B2/ja not_active Expired - Fee Related

Also Published As

Publication number	Publication date
NL8801362A (nl)	1989-12-18
KR0163756B1 (ko)	1999-03-20
EP0344834B1 (de)	1993-09-15
KR890017546A (ko)	1989-12-16
EP0344834A1 (de)	1989-12-06
JP2857764B2 (ja)	1999-02-17
JPH0225774A (ja)	1990-01-29
US4967142A (en)	1990-10-30
DE68909111D1 (de)	1993-10-21

Legal Events

Date	Code	Title	Description
1994-10-13	8364	No opposition during term of opposition
1995-06-22	8327	Change in the person/name/address of the patent owner	Owner name: PHILIPS ELECTRONICS N.V., EINDHOVEN, NL
1999-12-16	8327	Change in the person/name/address of the patent owner	Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V., EINDHOVEN, N
2004-03-18	8339	Ceased/non-payment of the annual fee

Publication	Publication Date	Title
DE68909111D1 (de)	1993-10-21	Elektronisches Modul, das Substratelemente enthält.
DE58906492D1 (de)	1994-02-03	Halbleiterschaltung.
DE3774120D1 (de)	1991-11-28	Elektronisches neigungsmessgeraet.
DE3786861D1 (de)	1993-09-09	Halbleiteranordnung mit gehaeuse mit kuehlungsmitteln.
DE69013254D1 (de)	1994-11-17	Halbleiter-IC-Bauelement mit verbesserter Interkonnektionsstruktur.
DE3774893D1 (de)	1992-01-16	Speicherkarte mit eingebetteter, integrierter schaltung.
DE3769401D1 (de)	1991-05-23	Elektrolumineszierender flacher bildschirm.
DE68921088T2 (de)	1995-06-08	Integrierte Halbleiterschaltung.
DE3779705T2 (de)	1993-01-21	Integrierte speicherschaltung mit blockadressierung.
DE3783507T2 (de)	1993-07-29	Zusammengesetztes halbleiterbauelement.
DE68915018D1 (de)	1994-06-09	Halbleiterspeicherschaltung.
DE68923778T2 (de)	1996-04-11	Halbleitermodul.
DE3577967D1 (de)	1990-06-28	Modul-schaltkreis.
DE3784192D1 (de)	1993-03-25	Schaltungssubstrat.
DE69023971T2 (de)	1996-04-25	Schaltungsmodul.
DE68912794D1 (de)	1994-03-17	Integrierte Halbleiterschaltung.
DE68910445D1 (de)	1993-12-09	Integrierter Halbleiterschaltkreis.
DE3789944D1 (de)	1994-07-07	Elektronischer Rechner.
DE68920509T2 (de)	1995-09-07	Optisches Modul.
DE68910327T2 (de)	1994-05-19	Halbleiteranordnung.
DE68910675T2 (de)	1994-03-31	I/O Modul.
DE68923580D1 (de)	1995-08-31	Integrierte Halbleiterschaltungsanordnung.
DE3785682T2 (de)	1993-08-19	Integrierter schaltungschip mit mehreren integrierten schaltungszellen.
NO865257L (no)	1988-06-23	Elektronisk modul.
NO860559L (no)	1987-08-17	Elektronisk laaseenhet.