DE68911738T2 - Herstellungsverfahren von Speicherkarten und Karten, die nach diesem Verfahren hergestellt sind. - Google Patents

Herstellungsverfahren von Speicherkarten und Karten, die nach diesem Verfahren hergestellt sind.

Info

Publication number
DE68911738T2
DE68911738T2 DE89401173T DE68911738T DE68911738T2 DE 68911738 T2 DE68911738 T2 DE 68911738T2 DE 89401173 T DE89401173 T DE 89401173T DE 68911738 T DE68911738 T DE 68911738T DE 68911738 T2 DE68911738 T2 DE 68911738T2
Authority
DE
Germany
Prior art keywords
cards
manufacturing process
memory
memory cards
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Revoked
Application number
DE89401173T
Other languages
English (en)
Other versions
DE68911738D1 (de
Inventor
Rene Rose
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schlumberger SA
Original Assignee
Schlumberger SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26226631&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE68911738(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from FR8805671A external-priority patent/FR2630843B1/fr
Priority claimed from FR8812088A external-priority patent/FR2636755B1/fr
Application filed by Schlumberger SA filed Critical Schlumberger SA
Application granted granted Critical
Publication of DE68911738D1 publication Critical patent/DE68911738D1/de
Publication of DE68911738T2 publication Critical patent/DE68911738T2/de
Anticipated expiration legal-status Critical
Revoked legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14688—Coating articles provided with a decoration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14827—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using a transfer foil detachable from the insert
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
DE89401173T 1988-04-28 1989-04-25 Herstellungsverfahren von Speicherkarten und Karten, die nach diesem Verfahren hergestellt sind. Revoked DE68911738T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8805671A FR2630843B1 (fr) 1988-04-28 1988-04-28 Procede de realisation de cartes comportant des elements graphiques et cartes obtenues par ledit procede
FR8812088A FR2636755B1 (fr) 1988-09-16 1988-09-16 Procede de realisation de cartes a memoire et cartes obtenues par ledit procede

Publications (2)

Publication Number Publication Date
DE68911738D1 DE68911738D1 (de) 1994-02-10
DE68911738T2 true DE68911738T2 (de) 1994-05-05

Family

ID=26226631

Family Applications (1)

Application Number Title Priority Date Filing Date
DE89401173T Revoked DE68911738T2 (de) 1988-04-28 1989-04-25 Herstellungsverfahren von Speicherkarten und Karten, die nach diesem Verfahren hergestellt sind.

Country Status (5)

Country Link
US (2) US5030407A (de)
EP (2) EP0340099A1 (de)
JP (2) JP2812485B2 (de)
DE (1) DE68911738T2 (de)
ES (1) ES2049831T3 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10162450A1 (de) * 2001-12-19 2003-07-17 Giesecke & Devrient Gmbh Tragbarer Datenträger sowie Verfahren und Vorrichtung zur Herstellung

Families Citing this family (85)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5387306A (en) * 1988-06-21 1995-02-07 Gec Avery Limited Manufacturing integrated circuit cards
JPH0767874B2 (ja) * 1989-03-31 1995-07-26 リズム時計工業株式会社 Ｉｃカードの製造方法
US5244840A (en) * 1989-05-23 1993-09-14 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing an encapsulated IC card having a molded frame and a circuit board
FR2659157B2 (fr) * 1989-05-26 1994-09-30 Lemaire Gerard Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede.
US5417905A (en) * 1989-05-26 1995-05-23 Esec (Far East) Limited Method of making a card having decorations on both faces
FR2650530B1 (fr) * 1989-08-07 1991-11-29 Schlumberger Ind Sa Procede de realisation de corps de carte avec graphisme
DE3929299A1 (de) * 1989-08-11 1991-02-14 Kurz Leonhard Fa Verfahren zur herstellung von karten
DE3926578C1 (de) * 1989-08-11 1990-07-26 Leonhard Kurz Gmbh & Co, 8510 Fuerth, De
JP2602343B2 (ja) * 1990-05-07 1997-04-23 三菱電機株式会社 Ｉｃカード
JP2560895B2 (ja) * 1990-07-25 1996-12-04 三菱電機株式会社 Ｉｃカードの製造方法およびｉｃカード
US5446620A (en) * 1990-08-01 1995-08-29 Staktek Corporation Ultra high density integrated circuit packages
WO1992003035A1 (en) * 1990-08-01 1992-02-20 Staktek Corporation Ultra high density integrated circuit packages, method and apparatus
US5475920A (en) * 1990-08-01 1995-12-19 Burns; Carmen D. Method of assembling ultra high density integrated circuit packages
US5377077A (en) * 1990-08-01 1994-12-27 Staktek Corporation Ultra high density integrated circuit packages method and apparatus
US5367766A (en) * 1990-08-01 1994-11-29 Staktek Corporation Ultra high density integrated circuit packages method
FR2668096B1 (fr) * 1990-10-19 1993-01-22 Schlumberger Ind Sa Procede de fabrication de carte a memoire apte a recevoir une image photographique et carte ainsi obtenue.
DE4038126C2 (de) * 1990-11-27 1993-12-16 Mannesmann Ag Verfahren und Vorrichtung zur Herstellung einer dekorierten Chip-Karte
FR2673017A1 (fr) * 1991-02-18 1992-08-21 Schlumberger Ind Sa Procede de fabrication d'un module electronique pour carte a memoire et module electronique ainsi obtenu.
WO1992020506A1 (de) * 1991-05-10 1992-11-26 GAO Gesellschaft für Automation und Organisation mbH Verfahren und vorrichtung zum herstellen von kunststoff-formstücken mit bereichsweise reduzierter wandstärke
JPH05169885A (ja) * 1991-12-26 1993-07-09 Mitsubishi Electric Corp 薄型ｉｃカード
US5702985A (en) * 1992-06-26 1997-12-30 Staktek Corporation Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method
JP2774906B2 (ja) * 1992-09-17 1998-07-09 三菱電機株式会社 薄形半導体装置及びその製造方法
FR2702067B1 (fr) * 1993-02-23 1995-04-14 Schlumberger Ind Sa Procédé et dispositif de fabrication de cartes à mémoire.
FR2704961A1 (fr) * 1993-05-04 1994-11-10 Schlumberger Ind Sa Procédé de fabrication de cartes à mémoire.
EP0649719B1 (de) * 1993-10-26 1997-10-01 Siemens Aktiengesellschaft Verfahren zur Herstellung von Chipkarten mittels Spritzgiessen
EP0688650B1 (de) * 1994-01-13 2000-11-02 Citizen Watch Co. Ltd. Verfahren zum harzversiegeln von halbleiterbauteilen
US5916047A (en) * 1994-02-03 1999-06-29 Huffy Corporation Portable basketball goal support system with separate ballast tank
US5980400A (en) * 1994-02-03 1999-11-09 Huffy Corporation Compression molded basketball components with inmold graphics
US5626339A (en) * 1994-02-03 1997-05-06 Huffy Corporation Structural foam basketball backboard with inmold graphics
JP3442877B2 (ja) * 1994-02-21 2003-09-02 富士通株式会社 樹脂成形品及びその製造方法
DE4435802A1 (de) * 1994-10-06 1996-04-11 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Datenträgern mit eingebetteten Elementen und Vorrichtung zur Durchführung des Verfahrens
US5475919B1 (en) * 1994-10-07 2000-10-17 Three View Technology Co Ltd Pcmcia card manufacturing process
US5846477A (en) * 1994-12-08 1998-12-08 Nitto Denko Corporation Production method for encapsulating a semiconductor device
DE19504194C1 (de) * 1995-02-09 1996-04-04 Interlock Ag Verfahren zur Herstellung von Ausweiskarten und danach hergestellte Ausweiskarte
US5819394A (en) * 1995-02-22 1998-10-13 Transition Automation, Inc. Method of making board matched nested support fixture
JP3337847B2 (ja) * 1995-02-27 2002-10-28 株式会社東芝 電子部品内蔵カードの製造方法
DE19519899A1 (de) * 1995-05-31 1996-12-12 Richard Herbst Verfahren und Vorrichtung zum Herstellen einer Smart Card
DE19519901C2 (de) * 1995-05-31 1998-06-18 Richard Herbst Verfahren zum taktweisen Spritzgießen von Gegenständen aus Kunststoff und Halbzeug zur Verwendung bei diesem Verfahren
FR2735714B1 (fr) * 1995-06-21 1997-07-25 Schlumberger Ind Sa Procede pour imprimer un graphisme sur une carte a memoire
US6025642A (en) * 1995-08-17 2000-02-15 Staktek Corporation Ultra high density integrated circuit packages
GB9520072D0 (en) * 1995-10-02 1995-12-06 Dewhurst Plc Indicators and push-button members and method of forming the same
US5632408A (en) * 1995-11-21 1997-05-27 Mitchell; Jerry B. Apparatus for securing and dispensing currency
JP2001521649A (ja) * 1995-12-22 2001-11-06 センパック ソシエテ アノニム 非接触技術を用いたチップカードの製造方法
DE19607212C1 (de) * 1996-02-26 1997-04-10 Richard Herbst Verbundkörper, Verfahren und Kunststoff-Spritzgießwerkzeug zur Herstellung eines solchen
DE19625228C2 (de) * 1996-06-24 1998-05-14 Siemens Ag Systemträger für die Montage einer integrierten Schaltung in einem Spritzgußgehäuse
US6077022A (en) * 1997-02-18 2000-06-20 Zevatech Trading Ag Placement machine and a method to control a placement machine
US6157870A (en) * 1997-02-18 2000-12-05 Zevatech Trading Ag Apparatus supplying components to a placement machine with splice sensor
FR2760998B1 (fr) 1997-03-21 1999-05-21 Equisecurite Sa Procede d'inclusion d'une etiquette electronique dans un objet realise en plastique, au moment de la fabrication de l'objet
US5955021A (en) * 1997-05-19 1999-09-21 Cardxx, Llc Method of making smart cards
EP0890928A3 (de) * 1997-07-10 2001-06-13 Sarnoff Corporation Übertragungsvorrichtung und auf Abstand Identifizieren eines elektronisch kodierten Gegenstandes
US6025054A (en) * 1997-09-08 2000-02-15 Cardxx, Inc. Smart cards having glue-positioned electronic components
DE19758647A1 (de) * 1997-11-07 2001-01-25 Richard Herbst Verfahren und Vorrichtung zum Spritzgießen von Kunststoffteilen
EP0923111B1 (de) 1997-12-07 2007-05-02 Oerlikon Assembly Equipment AG, Steinhausen Halbleiter-Montageeinrichtung mit einem hin und her geführten Chipgreifer
US6031242A (en) * 1998-01-23 2000-02-29 Zevatech, Inc. Semiconductor die in-flight registration and orientation method and apparatus
SG71189A1 (en) * 1998-01-26 2000-03-21 Esec Sa Ultrasonic transducer with a flange for mounting on an ultrasonic welding device in particular on a wire bonder
US6256873B1 (en) 1998-03-17 2001-07-10 Cardxx, Inc. Method for making smart cards using isotropic thermoset adhesive materials
US6213341B1 (en) * 1998-09-09 2001-04-10 Brink's Incorporated Safe for holding and dispensing change
GB0024070D0 (en) * 2000-10-02 2000-11-15 Innavisions Ltd Mpulding apparatus and method
DE60205655D1 (de) * 2001-11-23 2005-09-22 Nagraid Sa Herstellungsverfahren für ein modul mit mindestens einem elektronischen element
FR2840253B1 (fr) * 2002-05-31 2005-03-11 Knauf Snc Procede de decoration d'un substrat en polycarbonate ou materiau similaire ainsi que substrat decore obtenu par la mise en oeuvre de ce procede
KR100484834B1 (ko) * 2002-11-28 2005-04-22 엘지전자 주식회사 세탁기의 디스플레이 패널용 사출금형
DE102004028218B4 (de) * 2004-06-09 2006-06-29 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines tragbaren Datenträgers
US7573048B2 (en) * 2004-10-08 2009-08-11 Patel Gordhanbhai N Tamper resistant self indicating instant alert radiation dosimeter
US7237724B2 (en) * 2005-04-06 2007-07-03 Robert Singleton Smart card and method for manufacturing a smart card
US7607249B2 (en) * 2005-07-15 2009-10-27 Innovatier Inc. RFID bracelet and method for manufacturing a RFID bracelet
EP1780662A1 (de) * 2005-10-27 2007-05-02 Axalto SA Verstärktes Chipkartenmodul und Herstellungsverfahren dafür
AU2007243634A1 (en) * 2006-04-10 2007-11-08 Innovatier, Inc. An electronic inlay module for electronic cards and tags, electronic card and methods for manufacturing such electronic inlay modules and cards
US20070290048A1 (en) * 2006-06-20 2007-12-20 Innovatier, Inc. Embedded electronic device and method for manufacturing an embedded electronic device
US20080160397A1 (en) * 2006-08-25 2008-07-03 Innovatier, Inc Battery powered device having a protective frame
US20080055824A1 (en) * 2006-08-25 2008-03-06 Innovatier, Inc. Battery powered device having a protective frame
JP2010522396A (ja) * 2007-03-23 2010-07-01 イノベイティア インコーポレイテッド ステップカードおよびステップカードの製造方法
JP2011501870A (ja) * 2007-05-08 2011-01-13 オッカム ポートフォリオ リミテッド ライアビリティ カンパニー はんだの無い電子組立体及びそれらの製造方法
US7926173B2 (en) 2007-07-05 2011-04-19 Occam Portfolio Llc Method of making a circuit assembly
JP2010527158A (ja) * 2007-05-08 2010-08-05 オッカム ポートフォリオ リミテッド ライアビリティ カンパニー 半田無し発光ダイオード組立品
US20080282540A1 (en) * 2007-05-14 2008-11-20 Innovatier, Inc. Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces
JP4706677B2 (ja) * 2007-09-03 2011-06-22 三菱電機株式会社 Ｒｆｉｄタグの製造方法
US20090096614A1 (en) * 2007-10-15 2009-04-16 Innovatier, Inc. Rfid power bracelet and method for manufacturing a rfid power bracelet
US20090181215A1 (en) * 2008-01-15 2009-07-16 Innovatier, Inc. Plastic card and method for making a plastic card
US7943434B2 (en) * 2008-03-21 2011-05-17 Occam Portfolio Llc Monolithic molded flexible electronic assemblies without solder and methods for their manufacture
KR20130069564A (ko) 2010-04-05 2013-06-26 이노배티어, 인코프레이티드 전자 카드 및 태그들을 위한 사전-적층 코어 및 사전-적층 코어 제조방법
DE102012000370B4 (de) 2012-01-11 2017-02-02 Pfanner Schutzbekleidung Gmbh Schutzhelm, insbesondere für Bergsteiger und Baumkletterer
JP6528198B2 (ja) * 2015-04-24 2019-06-12 パナソニックＩｐマネジメント株式会社 射出成形方法
US11034068B2 (en) 2018-04-30 2021-06-15 Raytheon Company Encapsulating electronics in high-performance thermoplastics
CN110696275B (zh) * 2019-10-31 2022-06-21 奇点新源国际技术开发(北京)有限公司 一种线缆节点的塑封方法
CN113276359B (zh) * 2020-02-19 2022-11-08 长鑫存储技术有限公司 注塑模具及注塑方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL255667A (de) * 1959-09-17
US3122598A (en) * 1960-11-03 1964-02-25 Foster Grant Co Inc Plastic decorating method
US3839129A (en) * 1970-09-25 1974-10-01 Pictorial Prod Inc Reflective foil and process
US3654062A (en) * 1970-09-28 1972-04-04 Standard Products Co Injection molded decorative plaques
US4216577A (en) * 1975-12-31 1980-08-12 Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) Portable standardized card adapted to provide access to a system for processing electrical signals and a method of manufacturing such a card
FR2442480A1 (fr) * 1978-11-21 1980-06-20 Ruwa Bell Sarl Procede de realisation de cartes personnalisees, dispositif pour la mise en oeuvre de ce procede, et carte ainsi obtenue
DE3029667A1 (de) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
DK146709C (da) * 1980-12-09 1984-05-21 Eskesen Brdr As Fremgangsmaade til fremstilling af sproejtestoebte plastemner med indstoebte folier med dekorative og/eller beskrivende tryk samt apparat til brug ved udoevelse af fremgangsmaaden
DE3153769C2 (de) * 1981-04-14 1995-10-26 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten
JPS5819740A (ja) * 1981-07-24 1983-02-04 Dainippon Printing Co Ltd 磁気カ−ド及びその製造方法
DE3466108D1 (en) * 1983-06-09 1987-10-15 Flonic Sa Method of producing memory cards, and cards obtained thereby
US4801561A (en) * 1984-07-05 1989-01-31 National Semiconductor Corporation Method for making a pre-testable semiconductor die package
FR2579799B1 (fr) * 1985-03-28 1990-06-22 Flonic Sa Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede
JPS62140896A (ja) * 1985-12-13 1987-06-24 日本写真印刷株式会社 Ｉｃカ−ドの製造方法
US4779145A (en) * 1986-02-03 1988-10-18 Lemelson Jerome H Record member for magnetic and optical recording
JPS62244139A (ja) * 1986-04-17 1987-10-24 Citizen Watch Co Ltd 樹脂封止型ピングリツドアレイ及びその製造方法
FR2605144B1 (fr) * 1986-10-14 1989-02-24 Flonic Sa Procede de realisation de cartes a memoire electronique et cartes obtenues par la mise en oeuvre dudit procede
FR2609821B1 (fr) * 1987-01-16 1989-03-31 Flonic Sa Procede de realisation de cartes a memoire et cartes obtenues par la mise en oeuvre dudit procede
JPS6442295A (en) * 1987-08-10 1989-02-14 Seiko Epson Corp Memory card mounting structure
JPH01159295A (ja) * 1987-12-16 1989-06-22 Dainippon Printing Co Ltd Ｉｃカード用カード基材の製造方法
US4812633A (en) * 1988-04-08 1989-03-14 Minnesota Mining And Manufacturing Company Optical data card

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10162450A1 (de) * 2001-12-19 2003-07-17 Giesecke & Devrient Gmbh Tragbarer Datenträger sowie Verfahren und Vorrichtung zur Herstellung
DE10162450B4 (de) * 2001-12-19 2008-06-05 Giesecke & Devrient Gmbh Tragbarer Datenträger sowie Verfahren und Vorrichtung zur Herstellung

Also Published As

Publication number Publication date
US4961893A (en) 1990-10-09
EP0340100B1 (de) 1993-12-29
EP0340100A1 (de) 1989-11-02
JPH0238099A (ja) 1990-02-07
ES2049831T3 (es) 1994-05-01
JP2812485B2 (ja) 1998-10-22
JPH0224197A (ja) 1990-01-26
EP0340099A1 (de) 1989-11-02
US5030407A (en) 1991-07-09
DE68911738D1 (de) 1994-02-10

Similar Documents

Publication Publication Date Title
DE68911738T2 (de) Herstellungsverfahren von Speicherkarten und Karten, die nach diesem Verfahren hergestellt sind.
DE69013220T2 (de) Herstellungsverfahren einer Chipkarte und Karte, erhalten nach diesem Verfahren.
DE68910385D1 (de) Herstellungsverfahren einer elektronischen Speicherkarte und elektronische Speicherkarte, die nach diesem Verfahren hergestellt ist.
DE69005417T2 (de) Herstellungsverfahren von Wasser enthaltender Schokolade.
DE3781224D1 (de) Traegerfoermiges prothesenteil, sowie herstellungsverfahren.
DE3780302T2 (de) Herstellungsverfahren und -apparat.
DE68905267T2 (de) Halbleiteranordnung von metallhoecker-typ und verfahren zu deren herstellung.
DE3783783T2 (de) Plastikumhuellter chiptraeger und verfahren zu dessen herstellung.
DE3861471D1 (de) Beschichtungsverfahren.
DE68919172T2 (de) MOSFET und dessen Herstellungsverfahren.
DE3877875D1 (de) Bestandteil zum erzeugen von halbleitergeraeten und verfahren zu dessen herstellung.
FI900684A0 (fi) Process foer framstaellning av polyaluminiumfoereningar.
BR8302931A (pt) Enxerto vascular sintetico,e processo e aparelho para fabricar o mesmo
FI920196A0 (fi) Miljoevaenligare process foer blekning av lignocellulosamaterial.
DE3774704D1 (de) Beschichtungsverfahren.
DE69015687T2 (de) Heterostrukturbauelement und dessen Herstellungsverfahren.
DE3578266D1 (de) Verfahren zum herstellen von halbleiteranordnungen und dadurch hergestellte anordnungen.
DE69016659D1 (de) Herstellungsverfahren von zellkunststoff.
DE68918177T2 (de) Feinstruktur-Herstellungsverfahren.
DE3784185D1 (de) Mehrschichtiger mikrowellenabsorber und verfahren zu seiner herstellung.
DE69013726T2 (de) Verbessertes Verfahren für die Herstellung von o-Carboxypyridyl- und o-Carboxychinolylimidazolinonen.
DE3765796D1 (de) Halbleiterbauelement und verfahren zu dessen herstellung.
DE3486264D1 (de) Herstellungsverfahren von urethanen.
ATA152888A (de) Verfahren zur verminderung des carbamatgehaltes von erzeugnissen, die aus cellulosecarbamat hergestellt sind
IT8723186A0 (it) Incannatrice.

Legal Events

Date Code Title Description
8363 Opposition against the patent
8331 Complete revocation