DE68916523T2 - Verfahren zur Vorbehandlung von Kunststoffsubstraten. - Google Patents
Verfahren zur Vorbehandlung von Kunststoffsubstraten.Info
- Publication number
- DE68916523T2 DE68916523T2 DE68916523T DE68916523T DE68916523T2 DE 68916523 T2 DE68916523 T2 DE 68916523T2 DE 68916523 T DE68916523 T DE 68916523T DE 68916523 T DE68916523 T DE 68916523T DE 68916523 T2 DE68916523 T2 DE 68916523T2
- Authority
- DE
- Germany
- Prior art keywords
- pretreatment
- plastic substrates
- substrates
- plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/166—Process features with two steps starting with addition of reducing agent followed by metal deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
- Y10S525/903—Interpenetrating network
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/290,486 US5242713A (en) | 1988-12-23 | 1988-12-23 | Method for conditioning an organic polymeric material |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68916523D1 DE68916523D1 (de) | 1994-08-04 |
DE68916523T2 true DE68916523T2 (de) | 1995-02-02 |
Family
ID=23116222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68916523T Expired - Fee Related DE68916523T2 (de) | 1988-12-23 | 1989-11-17 | Verfahren zur Vorbehandlung von Kunststoffsubstraten. |
Country Status (6)
Country | Link |
---|---|
US (2) | US5242713A (de) |
EP (1) | EP0374487B1 (de) |
JP (2) | JP2699311B2 (de) |
BR (1) | BR8906690A (de) |
CA (1) | CA1335340C (de) |
DE (1) | DE68916523T2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10052449A1 (de) * | 2000-10-20 | 2002-05-16 | Univ Dresden Tech | Verfahren zur Metallisierung von Polymeroberflächen |
Families Citing this family (32)
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---|---|---|---|---|
US5045159A (en) * | 1989-07-18 | 1991-09-03 | International Business Machines Corporation | Derivatives of compounds containing a carbonyl group conjugated to an aromatic moiety and electrophilic methods of fabrication thereof |
US5104944A (en) * | 1989-07-18 | 1992-04-14 | International Business Machines Corporation | Process for nucleophilic derivatization of materials having an imide group conjugated to an aromatic moiety |
US5021129A (en) * | 1989-09-25 | 1991-06-04 | International Business Machines Corporation | Multilayer structures of different electroactive materials and methods of fabrication thereof |
JP2524436B2 (ja) * | 1990-09-18 | 1996-08-14 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 表面処理方法 |
US5340451A (en) * | 1990-10-04 | 1994-08-23 | International Business Machines Corporation | Process for producing a metal organic polymer combination |
JPH04234437A (ja) * | 1990-10-04 | 1992-08-24 | Internatl Business Mach Corp <Ibm> | 金属−有機ポリマー結合体の製造方法 |
JP2768390B2 (ja) * | 1990-12-11 | 1998-06-25 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 無電解金属付着のために基体をコンディショニングする方法 |
FR2698631B1 (fr) * | 1992-12-01 | 1995-02-10 | Centre Nat Rech Scient | Copolymères à propriétés rédox et leur utilisation pour l'élaboration de matériaux à conduction mixte. |
US5883220A (en) * | 1992-01-12 | 1999-03-16 | Centre National De La Recherche Scientifique | Redox copolymers and their use in preparing mixed conduction materials |
US7368924B2 (en) * | 1993-04-30 | 2008-05-06 | International Business Machines Corporation | Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof |
KR0144290B1 (ko) * | 1993-09-28 | 1998-08-17 | 데이비드 엘. 해밀톤 | 마이크로전자칩에의 접착제의 사용방법 및 이 방법에 의한 반도체집적회로칩 및 캡슐화 반도체모듈 |
TW312079B (de) * | 1994-06-06 | 1997-08-01 | Ibm | |
JP3506172B2 (ja) * | 1997-03-13 | 2004-03-15 | 信越半導体株式会社 | 半導体ウェーハのエッチング方法 |
US6293012B1 (en) | 1997-07-21 | 2001-09-25 | Ysi Incorporated | Method of making a fluid flow module |
US5932799A (en) * | 1997-07-21 | 1999-08-03 | Ysi Incorporated | Microfluidic analyzer module |
US6073482A (en) * | 1997-07-21 | 2000-06-13 | Ysi Incorporated | Fluid flow module |
GB9722028D0 (en) * | 1997-10-17 | 1997-12-17 | Shipley Company Ll C | Plating of polymers |
US6016005A (en) * | 1998-02-09 | 2000-01-18 | Cellarosi; Mario J. | Multilayer, high density micro circuit module and method of manufacturing same |
US6951707B2 (en) * | 2001-03-08 | 2005-10-04 | Ppg Industries Ohio, Inc. | Process for creating vias for circuit assemblies |
US7000313B2 (en) * | 2001-03-08 | 2006-02-21 | Ppg Industries Ohio, Inc. | Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions |
US6713587B2 (en) | 2001-03-08 | 2004-03-30 | Ppg Industries Ohio, Inc. | Electrodepositable dielectric coating compositions and methods related thereto |
JP4491986B2 (ja) * | 2001-03-29 | 2010-06-30 | 宇部興産株式会社 | 表面処理方法および金属薄膜を有するポリイミドフィルム |
EP1367659B1 (de) * | 2002-05-21 | 2012-09-05 | Semiconductor Energy Laboratory Co., Ltd. | Organischer Feldeffekt-Transistor |
US6824959B2 (en) | 2002-06-27 | 2004-11-30 | Ppg Industries Ohio, Inc. | Process for creating holes in polymeric substrates |
US20060213685A1 (en) * | 2002-06-27 | 2006-09-28 | Wang Alan E | Single or multi-layer printed circuit board with improved edge via design |
JP2005531160A (ja) * | 2002-06-27 | 2005-10-13 | ピーピージー インダストリーズ オハイオ, インコーポレイテッド | 窪んだかまたは広がったブレイクアウェイタブを有する単層または多層のプリント回路基板およびその製造方法 |
KR100560209B1 (ko) * | 2002-07-09 | 2006-03-10 | 에스케이씨 주식회사 | 과충전 안전성이 우수한 전해질 조성물 |
US20050205999A1 (en) * | 2003-08-30 | 2005-09-22 | Visible Tech-Knowledgy, Inc. | Method for pattern metalization of substrates |
US20050263903A1 (en) * | 2003-08-30 | 2005-12-01 | Visible Tech-Knowledgy, Inc. | Method for pattern metalization of substrates |
GB2424421A (en) | 2005-03-22 | 2006-09-27 | Seiko Epson Corp | Dedoping of organic semiconductors |
JP2008231516A (ja) * | 2007-03-20 | 2008-10-02 | Toyota Motor Corp | 金属酸化物薄膜、コンデンサ、水素分離膜−電解質膜接合体および燃料電池の製造方法 |
US10590541B2 (en) * | 2018-06-15 | 2020-03-17 | Rohm And Haas Electronic Materials Llc | Electroless copper plating compositions and methods for electroless plating copper on substrates |
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US4774157A (en) * | 1987-05-19 | 1988-09-27 | E. I. Du Pont De Nemours And Company | Patterned metal interlayer in a matrix |
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US4889579A (en) * | 1988-07-06 | 1989-12-26 | E. I. Du Pont De Nemours And Company | Process for adhering aramid polymers |
-
1988
- 1988-12-23 US US07/290,486 patent/US5242713A/en not_active Expired - Fee Related
-
1989
- 1989-07-13 CA CA000605524A patent/CA1335340C/en not_active Expired - Fee Related
- 1989-11-17 EP EP89121299A patent/EP0374487B1/de not_active Expired - Lifetime
- 1989-11-17 DE DE68916523T patent/DE68916523T2/de not_active Expired - Fee Related
- 1989-11-22 JP JP1302295A patent/JP2699311B2/ja not_active Expired - Fee Related
- 1989-12-22 BR BR898906690A patent/BR8906690A/pt active Search and Examination
-
1993
- 1993-08-25 JP JP5210225A patent/JPH0784531B2/ja not_active Expired - Fee Related
-
1994
- 1994-04-25 US US08/232,417 patent/US5462628A/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10052449A1 (de) * | 2000-10-20 | 2002-05-16 | Univ Dresden Tech | Verfahren zur Metallisierung von Polymeroberflächen |
DE10052449B4 (de) * | 2000-10-20 | 2005-12-29 | Technische Universität Dresden | Verfahren zur Metallisierung von Polymeroberflächen |
Also Published As
Publication number | Publication date |
---|---|
JPH02190475A (ja) | 1990-07-26 |
US5242713A (en) | 1993-09-07 |
BR8906690A (pt) | 1990-09-11 |
EP0374487A2 (de) | 1990-06-27 |
CA1335340C (en) | 1995-04-25 |
JPH06322547A (ja) | 1994-11-22 |
EP0374487A3 (de) | 1991-03-13 |
DE68916523D1 (de) | 1994-08-04 |
US5462628A (en) | 1995-10-31 |
EP0374487B1 (de) | 1994-06-29 |
JP2699311B2 (ja) | 1998-01-19 |
JPH0784531B2 (ja) | 1995-09-13 |
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