DE68918156D1 - Flache Kühlungsstruktur für integrierte Schaltung. - Google Patents

Flache Kühlungsstruktur für integrierte Schaltung.

Info

Publication number
DE68918156D1
DE68918156D1 DE68918156T DE68918156T DE68918156D1 DE 68918156 D1 DE68918156 D1 DE 68918156D1 DE 68918156 T DE68918156 T DE 68918156T DE 68918156 T DE68918156 T DE 68918156T DE 68918156 D1 DE68918156 D1 DE 68918156D1
Authority
DE
Germany
Prior art keywords
integrated circuit
cooling structure
flat cooling
flat
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68918156T
Other languages
English (en)
Other versions
DE68918156T2 (de
Inventor
Kazuhiko Umezawa
Jun Kubokawa
Toshiaki Komatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63113222A external-priority patent/JP2845447B2/ja
Priority claimed from JP15552388A external-priority patent/JPH0732220B2/ja
Priority claimed from JP63253540A external-priority patent/JP2793204B2/ja
Priority claimed from JP63253539A external-priority patent/JPH0732222B2/ja
Priority claimed from JP1058720A external-priority patent/JPH0724349B2/ja
Application filed by NEC Corp filed Critical NEC Corp
Publication of DE68918156D1 publication Critical patent/DE68918156D1/de
Application granted granted Critical
Publication of DE68918156T2 publication Critical patent/DE68918156T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735Jet impingement
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
DE68918156T 1988-05-09 1989-05-08 Flache Kühlungsstruktur für integrierte Schaltung. Expired - Fee Related DE68918156T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP63113222A JP2845447B2 (ja) 1988-05-09 1988-05-09 集積回路の冷却構造
JP15552388A JPH0732220B2 (ja) 1988-06-22 1988-06-22 集積回路の冷却構造
JP63253540A JP2793204B2 (ja) 1988-10-06 1988-10-06 集積回路の冷却構造
JP63253539A JPH0732222B2 (ja) 1988-10-06 1988-10-06 集積回路の冷却構造
JP1058720A JPH0724349B2 (ja) 1989-03-10 1989-03-10 集積回路の冷却構造

Publications (2)

Publication Number Publication Date
DE68918156D1 true DE68918156D1 (de) 1994-10-20
DE68918156T2 DE68918156T2 (de) 1995-01-12

Family

ID=27523462

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68918156T Expired - Fee Related DE68918156T2 (de) 1988-05-09 1989-05-08 Flache Kühlungsstruktur für integrierte Schaltung.

Country Status (4)

Country Link
US (1) US5023695A (de)
EP (1) EP0341950B1 (de)
CA (1) CA1303238C (de)
DE (1) DE68918156T2 (de)

Families Citing this family (87)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5097385A (en) * 1990-04-18 1992-03-17 International Business Machines Corporation Super-position cooling
US5265670A (en) * 1990-04-27 1993-11-30 International Business Machines Corporation Convection transfer system
DE4121534C2 (de) * 1990-06-30 1998-10-08 Toshiba Kawasaki Kk Kühlvorrichtung
CA2053055C (en) * 1990-10-11 1997-02-25 Tsukasa Mizuno Liquid cooling system for lsi packages
JPH06342990A (ja) * 1991-02-04 1994-12-13 Internatl Business Mach Corp <Ibm> 統合冷却システム
US5294830A (en) * 1991-05-21 1994-03-15 International Business Machines Corporation Apparatus for indirect impingement cooling of integrated circuit chips
EP0516478A2 (de) * 1991-05-30 1992-12-02 Nec Corporation Kühlungsstruktur für integrierte Schaltungen
EP0516875B1 (de) * 1991-06-06 1995-08-23 International Business Machines Corporation Elektronischer Packungsmodul
JP2995590B2 (ja) * 1991-06-26 1999-12-27 株式会社日立製作所 半導体冷却装置
JP2748732B2 (ja) * 1991-07-19 1998-05-13 日本電気株式会社 液体冷媒循環システム
US5239200A (en) * 1991-08-21 1993-08-24 International Business Machines Corporation Apparatus for cooling integrated circuit chips
JP2728105B2 (ja) * 1991-10-21 1998-03-18 日本電気株式会社 集積回路用冷却装置
JP2852148B2 (ja) * 1991-10-21 1999-01-27 日本電気株式会社 集積回路パッケージの冷却構造
US5177667A (en) * 1991-10-25 1993-01-05 International Business Machines Corporation Thermal conduction module with integral impingement cooling
JP2792304B2 (ja) * 1992-01-22 1998-09-03 日本電気株式会社 集積回路用冷却装置
CA2088821C (en) * 1992-02-05 1999-09-07 Hironobu Ikeda Cooling structure for integrated circuit
DE69321501T2 (de) * 1992-02-10 1999-03-04 Nec Corp Kühlvorrichtung für Bauteile mit elektronischen Schaltungen
US5239443A (en) * 1992-04-23 1993-08-24 International Business Machines Corporation Blind hole cold plate cooling system
JPH06104358A (ja) * 1992-09-04 1994-04-15 Hitachi Ltd 液体により冷却される電子装置
CA2102662C (en) * 1992-11-09 1997-10-07 Shinya Akamatsu Structure for cooling an integrated circuit
US5313097A (en) * 1992-11-16 1994-05-17 International Business Machines, Corp. High density memory module
JP2500757B2 (ja) * 1993-06-21 1996-05-29 日本電気株式会社 集積回路の冷却構造
FR2716769B1 (fr) * 1994-02-28 1996-05-15 Peugeot Dispositif de commande et de contrôle d'un moteur électronique, support utilisable dans un tel dispositif et utilisation de ce support pour la réalisation d'une batterie d'éléments d'accumulateurs électriques.
JPH0853664A (ja) * 1994-08-10 1996-02-27 Fujitsu Ltd 熱伝導材料及びその製造方法、電子部品の冷却方法、回路基板の冷却方法、並びに電子部品の実装方法
US5757620A (en) * 1994-12-05 1998-05-26 International Business Machines Corporation Apparatus for cooling of chips using blind holes with customized depth
US5604978A (en) * 1994-12-05 1997-02-25 International Business Machines Corporation Method for cooling of chips using a plurality of materials
US5576932A (en) * 1995-08-31 1996-11-19 At&T Global Information Solutions Company Method and apparatus for cooling a heat source
GB2313960A (en) * 1996-06-08 1997-12-10 Marconi Gec Ltd Heat sink including a cooling pipe having a planar section
DE19626227C2 (de) * 1996-06-29 1998-07-02 Bosch Gmbh Robert Anordnung zur Wärmeableitung bei Chipmodulen auf Mehrschicht-Keramikträgern, insbesondere für Multichipmodule, und Verfahren zu ihrer Herstellung
US6052284A (en) * 1996-08-06 2000-04-18 Advantest Corporation Printed circuit board with electronic devices mounted thereon
US5907473A (en) * 1997-04-04 1999-05-25 Raytheon Company Environmentally isolated enclosure for electronic components
FR2777152B1 (fr) * 1998-04-02 2000-06-23 Steve Ingenierie Dispositif de refroidissement pour systeme electronique de puissance
US6111314A (en) * 1998-08-26 2000-08-29 International Business Machines Corporation Thermal cap with embedded particles
JP2000357766A (ja) * 1999-06-14 2000-12-26 Hitachi Ltd モジュール内への液体冷媒の封止方法
GB0011916D0 (en) * 2000-05-17 2000-07-05 Cambridge Consultants Printing
AT410881B (de) * 2000-12-20 2003-08-25 Cool Structures Production And Mikro-wärmetauscher
JP3857060B2 (ja) * 2001-02-09 2006-12-13 株式会社東芝 発熱体冷却装置
JP2003051689A (ja) * 2001-08-06 2003-02-21 Toshiba Corp 発熱素子用冷却装置
US7032392B2 (en) * 2001-12-19 2006-04-25 Intel Corporation Method and apparatus for cooling an integrated circuit package using a cooling fluid
US6980450B2 (en) * 2002-01-24 2005-12-27 Inverters Unlimited, Inc. High power density inverter and components thereof
US7775261B2 (en) * 2002-02-26 2010-08-17 Mikros Manufacturing, Inc. Capillary condenser/evaporator
US6778393B2 (en) * 2002-12-02 2004-08-17 International Business Machines Corporation Cooling device with multiple compliant elements
US6774482B2 (en) 2002-12-27 2004-08-10 International Business Machines Corporation Chip cooling
US6917099B2 (en) * 2003-08-27 2005-07-12 Hewlett-Packard Development Company, L.P. Die carrier with fluid chamber
US7084495B2 (en) * 2003-10-16 2006-08-01 Intel Corporation Electroosmotic pumps using porous frits for cooling integrated circuit stacks
JP2006245356A (ja) * 2005-03-04 2006-09-14 Hitachi Ltd 電子デバイスの冷却装置
US20060289523A1 (en) * 2005-06-21 2006-12-28 Neeraj Saxena Solder process system
US7515418B2 (en) * 2005-09-26 2009-04-07 Curtiss-Wright Controls, Inc. Adjustable height liquid cooler in liquid flow through plate
US7298618B2 (en) * 2005-10-25 2007-11-20 International Business Machines Corporation Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled
US7298617B2 (en) * 2005-10-25 2007-11-20 International Business Machines Corporation Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled
JP4649359B2 (ja) * 2006-04-06 2011-03-09 トヨタ自動車株式会社 冷却器
US7511957B2 (en) * 2006-05-25 2009-03-31 International Business Machines Corporation Methods for fabricating a cooled electronic module employing a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled
US20080006294A1 (en) * 2006-06-27 2008-01-10 Neeraj Saxena Solder cooling system
US8896335B2 (en) * 2007-07-30 2014-11-25 Advantest Corporation Thermal controller for electronic devices
US8081478B1 (en) * 2008-12-09 2011-12-20 Lockheed Martin Corporation Fluid cooled electronics module cover
US8369090B2 (en) 2009-05-12 2013-02-05 Iceotope Limited Cooled electronic system
US8077460B1 (en) 2010-07-19 2011-12-13 Toyota Motor Engineering & Manufacturing North America, Inc. Heat exchanger fluid distribution manifolds and power electronics modules incorporating the same
US8900927B2 (en) 2010-08-16 2014-12-02 International Business Machines Corporation Multichip electronic packages and methods of manufacture
US8659896B2 (en) 2010-09-13 2014-02-25 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules
US8199505B2 (en) 2010-09-13 2012-06-12 Toyota Motor Engineering & Manufacturing Norh America, Inc. Jet impingement heat exchanger apparatuses and power electronics modules
SG181180A1 (en) * 2010-11-12 2012-06-28 Semicaps Pte Ltd Apparatus and method for cooling a semiconductor device
US8427832B2 (en) 2011-01-05 2013-04-23 Toyota Motor Engineering & Manufacturing North America, Inc. Cold plate assemblies and power electronics modules
US8391008B2 (en) 2011-02-17 2013-03-05 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics modules and power electronics module assemblies
US8482919B2 (en) 2011-04-11 2013-07-09 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics card assemblies, power electronics modules, and power electronics devices
US8947873B2 (en) 2012-11-26 2015-02-03 International Business Machines Corporation Immersion-cooled and conduction-cooled electronic system
US8643173B1 (en) 2013-01-04 2014-02-04 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features
JP2014135396A (ja) * 2013-01-10 2014-07-24 Fujitsu Ltd 冷却ヘッド及び電子機器
US9131631B2 (en) * 2013-08-08 2015-09-08 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having enhanced heat transfer assemblies
US9282678B2 (en) 2013-10-21 2016-03-08 International Business Machines Corporation Field-replaceable bank of immersion-cooled electronic components and separable heat sinks
US9332674B2 (en) 2013-10-21 2016-05-03 International Business Machines Corporation Field-replaceable bank of immersion-cooled electronic components
JP2015082950A (ja) * 2013-10-24 2015-04-27 トヨタ自動車株式会社 冷却器及び電力変換装置
US9917034B2 (en) 2014-09-26 2018-03-13 Semicaps Pte Ltd Method and apparatus for cooling a semiconductor device
US9721870B2 (en) 2014-12-05 2017-08-01 International Business Machines Corporation Cooling structure for electronic boards
US9806003B2 (en) * 2016-01-30 2017-10-31 Intel Corporation Single base multi-floating surface cooling solution
CN108966583B (zh) 2017-05-17 2020-04-14 华为技术有限公司 散热器以及通信设备
CN109103154A (zh) * 2017-06-21 2018-12-28 华为技术有限公司 一种芯片封装结构
US10881019B2 (en) * 2018-03-09 2020-12-29 Fujitsu Limited Cooling apparatus
EP3767813A4 (de) * 2018-03-13 2021-03-10 Nissan Motor Co., Ltd. Stromwandler
US10976119B2 (en) * 2018-07-30 2021-04-13 The Boeing Company Heat transfer devices and methods of transfering heat
US10770369B2 (en) * 2018-08-24 2020-09-08 Advanced Semiconductor Engineering, Inc. Semiconductor device package
US11177192B2 (en) * 2018-09-27 2021-11-16 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device including heat dissipation structure and fabricating method of the same
US11139223B2 (en) * 2018-11-29 2021-10-05 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and manufacturing method thereof
US10798851B1 (en) 2019-05-24 2020-10-06 L3 Technologies, Inc. Systems and methods for implementing intelligent cooling interface archiectures for cooling systems
US11355418B2 (en) * 2019-09-29 2022-06-07 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure and manufacturing method thereof
US11574853B2 (en) * 2020-06-30 2023-02-07 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device
US11497137B2 (en) * 2020-12-18 2022-11-08 Hewlett Packard Enterprise Development Lp Method and apparatus for extended serial temperature control in a compute device
US20230071588A1 (en) * 2021-09-07 2023-03-09 Inventec (Pudong) Technology Corporation Heat dissipation system and electronic device

Family Cites Families (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2357706A (en) * 1942-06-29 1944-09-05 Rca Corp Heating and cooling system
NL198115A (de) * 1954-06-22
US2999034A (en) * 1960-10-21 1961-09-05 Wenczler & Heidenhain Method of manufacture of line plates, scales, and the like
US3205469A (en) * 1961-07-12 1965-09-07 Gen Precision Inc Pin board
US3211969A (en) * 1961-11-15 1965-10-12 Westinghouse Electric Corp High voltage rectifier
US3299946A (en) * 1965-06-04 1967-01-24 Scott Inc H H Mounting and heat sink device for electrical components
US3651865A (en) * 1970-08-21 1972-03-28 Us Air Force Cooled electronic equipment mounting plate
US3777220A (en) * 1972-06-30 1973-12-04 Ibm Circuit panel and method of construction
US3881181A (en) * 1973-02-22 1975-04-29 Rca Corp Semiconductor temperature sensor
US3827457A (en) * 1973-06-22 1974-08-06 Westinghouse Air Brake Co Fluid pressure system for converting digital signals to analog signals
US3912001A (en) * 1974-03-11 1975-10-14 Gen Electric Water cooled heat sink assembly
US3908188A (en) * 1974-08-14 1975-09-23 Us Air Force Heat sink for microstrip circuit
SU572951A1 (ru) * 1974-10-24 1977-09-15 Предприятие П/Я А-3162 Устройство дл охлаждени элементов радиоаппаратуры
US4110549A (en) * 1974-11-30 1978-08-29 Robert Bosch Gmbh Environmentally protected electronic housing and heat sink structure, particularly for automotive use
US4072188A (en) * 1975-07-02 1978-02-07 Honeywell Information Systems Inc. Fluid cooling systems for electronic systems
US3993123A (en) * 1975-10-28 1976-11-23 International Business Machines Corporation Gas encapsulated cooling module
US4204246A (en) * 1976-02-14 1980-05-20 Sony Corporation Cooling assembly for cooling electrical parts wherein a heat pipe is attached to a heat conducting portion of a heat conductive block
US4037270A (en) * 1976-05-24 1977-07-19 Control Data Corporation Circuit packaging and cooling
US4093971A (en) * 1976-12-10 1978-06-06 Burroughs Corporation D-I-P On island
US4115836A (en) * 1977-04-25 1978-09-19 Burroughs Corporation Cooling system for dual-in-line packages
JPS6011830B2 (ja) * 1977-05-24 1985-03-28 日本電気株式会社 電子部品の冷却装置
US4196775A (en) * 1977-09-19 1980-04-08 The Unites States Of America As Represented By The Secretary Of The Navy Shock-mounted, liquid cooled cold plate assembly
JPS5586130A (en) * 1978-12-25 1980-06-28 Hitachi Ltd Connection of semiconductor element
US4439918A (en) * 1979-03-12 1984-04-03 Western Electric Co., Inc. Methods of packaging an electronic device
US4282924A (en) * 1979-03-16 1981-08-11 Varian Associates, Inc. Apparatus for mechanically clamping semiconductor wafer against pliable thermally conductive surface
US4226281A (en) * 1979-06-11 1980-10-07 International Business Machines Corporation Thermal conduction module
US4245273A (en) * 1979-06-29 1981-01-13 International Business Machines Corporation Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices
JPS5612760A (en) * 1979-07-10 1981-02-07 Nec Corp Multi chip lsi package
JPS5670655A (en) * 1979-11-15 1981-06-12 Matsushita Electric Ind Co Ltd Manufacture of electronic circuit mounting device
US4588023A (en) * 1980-06-16 1986-05-13 Showa Aluminum Corporation Device for releasing heat
JPS57106062A (en) * 1980-12-24 1982-07-01 Hitachi Ltd Package for integrated circuit
FR2498814B1 (fr) * 1981-01-26 1985-12-20 Burroughs Corp Boitier pour circuit integre, moyen pour le montage et procede de fabrication
IT1218271B (it) * 1981-04-13 1990-04-12 Ates Componenti Elettron Procedimento per la fabbricazione di contenitori in plastica con dissipatore termico per circuiti integrati e combinazione di stampo e dissipatori utilizzabile con tale procedimento
US4381032A (en) * 1981-04-23 1983-04-26 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
US4468717A (en) * 1982-06-09 1984-08-28 Sperry Corporation Apparatus for cooling integrated circuit chips
US4493010A (en) * 1982-11-05 1985-01-08 Lockheed Corporation Electronic packaging module utilizing phase-change conductive cooling
US4498122A (en) * 1982-12-29 1985-02-05 At&T Bell Laboratories High-speed, high pin-out LSI chip package
JPS59130450A (ja) * 1983-01-17 1984-07-27 Nec Corp Icパツケ−ジの冷却構造
GB8304890D0 (en) * 1983-02-22 1983-03-23 Smiths Industries Plc Chip-carrier substrates
US4536824A (en) * 1983-03-28 1985-08-20 Goodyear Aerospace Corporation Indirect cooling of electronic circuits
CA1229155A (en) * 1983-03-29 1987-11-10 Toshihiko Watari High density lsi package for logic circuits
US4535385A (en) * 1983-04-22 1985-08-13 Cray Research, Inc. Circuit module with enhanced heat transfer and distribution
US4602678A (en) * 1983-09-02 1986-07-29 The Bergquist Company Interfacing of heat sinks with electrical devices, and the like
JPH0673364B2 (ja) * 1983-10-28 1994-09-14 株式会社日立製作所 集積回路チップ冷却装置
US4546410A (en) * 1983-10-31 1985-10-08 Kaufman Lance R Circuit package with membrane, containing thermoconductive material, ruptured against a heat sink
JPS60160150A (ja) * 1984-01-26 1985-08-21 Fujitsu Ltd 集積回路の冷却装置
JPS60160149A (ja) * 1984-01-26 1985-08-21 Fujitsu Ltd 集積回路装置の冷却方式
US4574879A (en) * 1984-02-29 1986-03-11 The Bergquist Company Mounting pad for solid-state devices
FR2564243B1 (fr) * 1984-05-11 1987-02-20 Europ Composants Electron Boitier a dissipation thermique d'encapsulation de circuits electriques
JPS60257156A (ja) * 1984-06-01 1985-12-18 Hitachi Ltd 熱伝導冷却モジユ−ル装置
US4666545A (en) * 1984-06-27 1987-05-19 The Bergquist Company Method of making a mounting base pad for semiconductor devices
US4628990A (en) * 1984-08-17 1986-12-16 Nec Corporation Cooling equipment for an integrated circuit chip
JPS61171157A (ja) * 1985-01-25 1986-08-01 Nec Corp 集積回路パツケ−ジ
JPS61189657A (ja) * 1985-02-18 1986-08-23 Fuji Photo Film Co Ltd 半導体素子温度制御装置
JPS61189658A (ja) * 1985-02-18 1986-08-23 Fuji Photo Film Co Ltd 半導体素子温度制御装置
JPH06101523B2 (ja) * 1985-03-04 1994-12-12 株式会社日立製作所 集積回路チツプ冷却装置
JPS61222242A (ja) * 1985-03-28 1986-10-02 Fujitsu Ltd 冷却装置
JPS61226946A (ja) * 1985-04-01 1986-10-08 Hitachi Ltd 集積回路チツプ冷却装置
FR2580060B1 (de) * 1985-04-05 1989-06-09 Nec Corp
US4602125A (en) * 1985-05-10 1986-07-22 The Bergquist Company Mounting pad with tubular projections for solid-state devices
JPS61276242A (ja) * 1985-05-30 1986-12-06 Hitachi Ltd 半導体モジユ−ル
JPS61292944A (ja) * 1985-06-20 1986-12-23 Nec Corp 集積回路パツケ−ジの液体冷却構造
US4748495A (en) * 1985-08-08 1988-05-31 Dypax Systems Corporation High density multi-chip interconnection and cooling package
US4724611A (en) * 1985-08-23 1988-02-16 Nec Corporation Method for producing semiconductor module
JPS6267844A (ja) * 1985-09-20 1987-03-27 Fujitsu Ltd 冷却構造
US4879632A (en) * 1985-10-04 1989-11-07 Fujitsu Limited Cooling system for an electronic circuit device
US4750086A (en) * 1985-12-11 1988-06-07 Unisys Corporation Apparatus for cooling integrated circuit chips with forced coolant jet
US4781244A (en) * 1986-02-25 1988-11-01 Nec Corporation Liquid cooling system for integrated circuit chips
JPS62238653A (ja) * 1986-04-09 1987-10-19 Nec Corp 冷却構造
JPS6381959A (ja) * 1986-09-26 1988-04-12 Hitachi Ltd 半導体装置
US4721996A (en) * 1986-10-14 1988-01-26 Unisys Corporation Spring loaded module for cooling integrated circuit packages directly with a liquid
JPS63157449A (ja) * 1986-12-22 1988-06-30 Nec Corp 集積回路の冷却構造
JPH07112033B2 (ja) * 1987-03-16 1995-11-29 富士通株式会社 冷却モジユ−ル構造
JPS63308943A (ja) * 1987-06-10 1988-12-16 Mitsubishi Electric Corp 半導体装置
US4942497A (en) * 1987-07-24 1990-07-17 Nec Corporation Cooling structure for heat generating electronic components mounted on a substrate
US4791983A (en) * 1987-10-13 1988-12-20 Unisys Corporation Self-aligning liquid-cooling assembly
CA1283225C (en) * 1987-11-09 1991-04-16 Shinji Mine Cooling system for three-dimensional ic package
US4809134A (en) * 1988-04-18 1989-02-28 Unisys Corporation Low stress liquid cooling assembly
US4975766A (en) * 1988-08-26 1990-12-04 Nec Corporation Structure for temperature detection in a package
JPH06100408B2 (ja) * 1988-09-09 1994-12-12 日本電気株式会社 冷却装置

Also Published As

Publication number Publication date
EP0341950A2 (de) 1989-11-15
US5023695A (en) 1991-06-11
EP0341950A3 (en) 1990-03-21
EP0341950B1 (de) 1994-09-14
DE68918156T2 (de) 1995-01-12
CA1303238C (en) 1992-06-09

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