DE68918576D1 - Verfahren zur erniedrigung der dielektrizitätskonstante von polyimiden mit hilfe von diaminosäurezusätzen. - Google Patents

Verfahren zur erniedrigung der dielektrizitätskonstante von polyimiden mit hilfe von diaminosäurezusätzen.

Info

Publication number
DE68918576D1
DE68918576D1 DE68918576A DE68918576A DE68918576D1 DE 68918576 D1 DE68918576 D1 DE 68918576D1 DE 68918576 A DE68918576 A DE 68918576A DE 68918576 A DE68918576 A DE 68918576A DE 68918576 D1 DE68918576 D1 DE 68918576D1
Authority
DE
Germany
Prior art keywords
polyimides
diamonic
reducing
acid
addition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68918576A
Other languages
English (en)
Other versions
DE68918576T2 (de
DE68918576T4 (de
Inventor
Diane Stoakley
Clair Anne St
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Aeronautics and Space Administration NASA
Original Assignee
National Aeronautics and Space Administration NASA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Aeronautics and Space Administration NASA filed Critical National Aeronautics and Space Administration NASA
Application granted granted Critical
Publication of DE68918576D1 publication Critical patent/DE68918576D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/38—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes condensation products of aldehydes with amines or amides
DE68918576A 1988-09-01 1989-08-23 Verfahren zur erniedrigung der dielektrizitätskonstante von polyimiden mit hilfe von diaminosäurezusätzen. Expired - Fee Related DE68918576D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/239,259 US4895972A (en) 1988-09-01 1988-09-01 Process for lowering the dielectric constant of polyimides using diamic acid additives
PCT/US1989/003575 WO1990002767A1 (en) 1988-09-01 1989-08-23 Process for lowering the dielectric constant of polyimides using diamic acid additives

Publications (1)

Publication Number Publication Date
DE68918576D1 true DE68918576D1 (de) 1994-11-03

Family

ID=22901356

Family Applications (2)

Application Number Title Priority Date Filing Date
DE68918576A Expired - Fee Related DE68918576D1 (de) 1988-09-01 1989-08-23 Verfahren zur erniedrigung der dielektrizitätskonstante von polyimiden mit hilfe von diaminosäurezusätzen.
DE68918576T Expired - Lifetime DE68918576T4 (de) 1988-09-01 1989-08-23 Verfahren zur erniedrigung der dielektrizitätskonstante von polyimiden mit hilfe von diaminosäurezusätzen.

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE68918576T Expired - Lifetime DE68918576T4 (de) 1988-09-01 1989-08-23 Verfahren zur erniedrigung der dielektrizitätskonstante von polyimiden mit hilfe von diaminosäurezusätzen.

Country Status (9)

Country Link
US (1) US4895972A (de)
EP (1) EP0386207B1 (de)
JP (1) JPH068360B2 (de)
KR (1) KR900701877A (de)
AT (1) ATE112294T1 (de)
AU (1) AU623684B2 (de)
CA (1) CA1334362C (de)
DE (2) DE68918576D1 (de)
WO (1) WO1990002767A1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5428102A (en) * 1987-07-15 1995-06-27 The United States Of America As Represented By The United States National Aeronautics And Space Administration Low dielectric polyimides
US5338826A (en) * 1987-07-15 1994-08-16 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administation Structures from low dielectric polyimides
US5137751A (en) * 1990-03-09 1992-08-11 Amoco Corporation Process for making thick multilayers of polyimide
CA2040994A1 (en) * 1990-05-08 1991-11-09 David D. Ngo Photoimageable polyimide coating
US5427862A (en) * 1990-05-08 1995-06-27 Amoco Corporation Photocurable polyimide coated glass fiber
US5147966A (en) * 1990-07-31 1992-09-15 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Polyimide molding powder, coating, adhesive and matrix resin
US5219977A (en) * 1990-12-17 1993-06-15 E. I. Du Pont De Nemours And Company Tetrapolyimide film containing oxydipthalic dianhydride
CA2057420A1 (en) * 1990-12-17 1992-06-18 John A. Kreuz Tetrapolyimide film containing oxydiphthalic dianhydride
US5243024A (en) * 1990-12-21 1993-09-07 Amoco Corporation High moduli polyimides
US5218077A (en) * 1991-08-26 1993-06-08 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Diphenylmethane-containing dianhydride and polyimides prepared therefrom
US5212283A (en) * 1992-03-03 1993-05-18 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Polyimides containing the cyclobutene-3, 4-dione moiety
US5502156A (en) * 1994-07-28 1996-03-26 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Electrically conducting polyimide film containing tin complexes
US5741883A (en) * 1994-12-16 1998-04-21 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Tough, soluble, aromatic, thermoplastic copolyimides
US5644022A (en) * 1995-02-14 1997-07-01 The United States Of America As Represented By The Admninistrator Of The National Aeronautics And Space Administration Copolyimides prepared from 3,4'-oxydianiline and 1,3-bis(3-aminophenoxy) benzene with 3,3'-4,4'-biphenylcarboxylic dianhydride having reactive endgroups
US5866676A (en) * 1995-02-14 1999-02-02 The United States Of America As Represented By The United States National Aeronautics And Space Administration Copolyimides prepared from 3,4'-oxydianiline and 1,3-bis(3-aminophenoxy) benzene with 3,3', 4, 4'-biphenylcarboxylic dianhydride
US6277203B1 (en) 1998-09-29 2001-08-21 Lam Research Corporation Method and apparatus for cleaning low K dielectric and metal wafer surfaces
WO2003087194A1 (en) * 2002-04-05 2003-10-23 United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Polyimides from 2,3,3',4'-biphenyltetracarboxylic dianhydride and aromatic diamines
WO2009003029A2 (en) 2007-06-25 2008-12-31 Brewer Science Inc. High-temperature spin-on temporary bonding compositions
KR101509831B1 (ko) 2010-12-31 2015-04-08 코오롱인더스트리 주식회사 폴리이미드 필름의 제조방법
KR101543478B1 (ko) 2010-12-31 2015-08-10 코오롱인더스트리 주식회사 투명 폴리이미드 필름 및 그 제조방법
US9910315B2 (en) 2013-05-08 2018-03-06 Empire Technology Development Llc Polarizing liquid crystal alignment layers and display
WO2015099478A1 (ko) 2013-12-26 2015-07-02 코오롱인더스트리 주식회사 투명 폴리아마이드-이미드 수지 및 이를 이용한 필름
KR102227672B1 (ko) 2014-12-31 2021-03-16 코오롱인더스트리 주식회사 폴리아마이드-이미드 전구체, 폴리아마이드-이미드 필름 및 이를 포함하는 표시소자
CN105601921B (zh) * 2016-01-26 2018-02-27 华南理工大学 低介电常数增强氧化石墨烯/聚酰亚胺复合膜的制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3356648A (en) * 1966-10-13 1967-12-05 Du Pont Polyamide-acids and polyimides from hexafluoropropylidine bridged diamine
US4180648A (en) * 1978-05-15 1979-12-25 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Crystalline polyimides
US4444979A (en) * 1983-02-25 1984-04-24 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Polyphenylene ethers with imide linking groups
US4595548A (en) * 1984-08-23 1986-06-17 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Process for preparing essentially colorless polyimide film containing phenoxy-linked diamines
US4687785A (en) * 1985-08-27 1987-08-18 Thermal Science, Inc. Thermally adaptive polymers and prepolymers and methods of making in which an imide is formed from a polyanhydride oligomer and an isocyanate
EP0299865B1 (de) * 1987-07-15 1998-01-07 National Aeronautics And Space Administration Verfahren zur Herstellung von wenig dielektrischen Polyimiden
US4937316A (en) * 1988-02-25 1990-06-26 Amdahl Corporation Process for preparing polyimides
US5041520A (en) * 1988-07-05 1991-08-20 Mitsui Toatsu Chemicals, Inc. Process for preparing polyimide having excellent high temperature stability

Also Published As

Publication number Publication date
EP0386207A1 (de) 1990-09-12
DE68918576T2 (de) 1995-05-11
AU4180789A (en) 1990-04-02
CA1334362C (en) 1995-02-14
US4895972A (en) 1990-01-23
ATE112294T1 (de) 1994-10-15
DE68918576T4 (de) 1995-10-12
KR900701877A (ko) 1990-12-04
JPH068360B2 (ja) 1994-02-02
JPH03503065A (ja) 1991-07-11
AU623684B2 (en) 1992-05-21
EP0386207B1 (de) 1994-09-28
EP0386207A4 (en) 1992-01-29
WO1990002767A1 (en) 1990-03-22

Similar Documents

Publication Publication Date Title
DE68918576T2 (de) Verfahren zur erniedrigung der dielektrizitätskonstante von polyimiden mit hilfe von diaminosäurezusätzen.
DE69220892D1 (de) Verfahren zur Herstellung von mehrschichtigen Leiterplatten aus Polyimid
DE3750684D1 (de) Verfahren zur Herstellung von keramischen Mehrschichtstrukturen mit interner Anordnung von Kupferleitern.
NO934517D0 (no) Bearbeidbare former for elektrisk ledende polyaniliner og legende produkter dannet fra disse
ATE8559T1 (de) Verfahren zur aufbringung von elektrisch leitenden bahnen auf einen traeger aus isolierstoff.
GB1063038A (en) Polyamides
GB1028927A (en) Linear polymeric amide-modified polyimides
DE68928687T2 (de) Verfahren zur Herstellung von Polyimidharz-Schicht- stoffen mit verbesserten Gleiteigenschaften
CH502049A (de) Verfahren zur Herstellung von mit Leiterbahnen versehenen Schaltungsplatten mit metallisierten Bohrungen unter Verwendung metallkaschierter Isolierstoffplatten
ATE22627T1 (de) Vorrichtung zur kontaktlosen uebertragung von informationen zwischen relativ zueinander rotierenden bauteilen.
DE68926551T2 (de) Verfahren zur Herstellung von Polyimid mit ausgezeichneter Temperaturstabilität
ATE15429T1 (de) Verfahren zur herstellung von metallisierten substraten fuer gedruckte schaltungen.
BR8106307A (pt) Processo para obtencao de produtos de policondensacao contendo grupos amida e imida endureciveis pelo calor e aplicacao dos mesmos
GB1397261A (en) Electrical insulating material and electrical conductors insulated therewith
ATE110891T1 (de) Leitende schiene.
KR840007648A (ko) 자기접착성 에나멜(enamele) 전선과 이것을 사용한 밀폐형 압축기 모우터
PT87577A (pt) Verfahren zur herstellung einer elektrisch leitenden beschichtungsmasse
DE69014990D1 (de) Auf Dioxydiphthalsäureanhydrid basierende Polyimide und Co-Polyimide.
DE3575630D1 (de) Isolieroel fuer elektrische geraete.
KR840001761A (ko) 전기기기의 절연처리 방법
JPS5565227A (en) Production of polyimide solution
DE69131710T2 (de) Verfahren zur Herstellung eines elektrischen Leiters mit anorganischer Isolierung
DE58909623D1 (de) Prüfstecker für Schaltungen in SMD-Technik und dessen Herstellungsverfahren.
KR900006999A (ko) 절연전선 및 그 제조방법
RU1774435C (ru) Способ изолировани пазов магнитопровода

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee