DE68921849T2 - Verfahren zur Oberflächenbehandlung von Polyimidgegenständen. - Google Patents

Verfahren zur Oberflächenbehandlung von Polyimidgegenständen.

Info

Publication number
DE68921849T2
DE68921849T2 DE68921849T DE68921849T DE68921849T2 DE 68921849 T2 DE68921849 T2 DE 68921849T2 DE 68921849 T DE68921849 T DE 68921849T DE 68921849 T DE68921849 T DE 68921849T DE 68921849 T2 DE68921849 T2 DE 68921849T2
Authority
DE
Germany
Prior art keywords
polyimide
objects
surface treatment
treatment
polyimide objects
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68921849T
Other languages
English (en)
Other versions
DE68921849D1 (de
Inventor
Morris Anschel
Walter Paul Pawlowski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE68921849D1 publication Critical patent/DE68921849D1/de
Application granted granted Critical
Publication of DE68921849T2 publication Critical patent/DE68921849T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12Chemical modification
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • C23C14/20Metallic material, boron or silicon on organic substrates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
DE68921849T 1988-11-25 1989-10-28 Verfahren zur Oberflächenbehandlung von Polyimidgegenständen. Expired - Fee Related DE68921849T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/275,825 US4931310A (en) 1988-11-25 1988-11-25 Process for treating the surface of polyimides to improve properties to receive metal layer

Publications (2)

Publication Number Publication Date
DE68921849D1 DE68921849D1 (de) 1995-04-27
DE68921849T2 true DE68921849T2 (de) 1995-10-12

Family

ID=23053955

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68921849T Expired - Fee Related DE68921849T2 (de) 1988-11-25 1989-10-28 Verfahren zur Oberflächenbehandlung von Polyimidgegenständen.

Country Status (5)

Country Link
US (1) US4931310A (de)
EP (1) EP0370269B1 (de)
JP (1) JPH02173129A (de)
CA (1) CA1330020C (de)
DE (1) DE68921849T2 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5135779A (en) * 1988-12-23 1992-08-04 International Business Machines Corporation Method for conditioning an organic polymeric material
US5187241A (en) * 1990-05-15 1993-02-16 International Business Machines Corporation Isoimide modifications of a polyimide and reaction thereof with nucleophiles
JPH0427472A (ja) * 1990-05-21 1992-01-30 Nippon Parkerizing Co Ltd 樹脂成型品の洗浄方法
US5178914A (en) * 1990-10-30 1993-01-12 International Business Machines Corp. Means of seeding and metallizing polymide
US5151304A (en) * 1991-01-22 1992-09-29 International Business Machines Corporation Structure and method for enhancing adhesion to a polyimide surface
US5248760A (en) * 1991-01-25 1993-09-28 Unc At Charlotte Chemically cured low temperature polyimides
US5156710A (en) * 1991-05-06 1992-10-20 International Business Machines Corporation Method of laminating polyimide to thin sheet metal
US5427848A (en) * 1991-05-06 1995-06-27 International Business Machines Corporation Stress balanced composite laminate material
US5183692A (en) * 1991-07-01 1993-02-02 Motorola, Inc. Polyimide coating having electroless metal plate
US5290597A (en) * 1992-04-27 1994-03-01 General Electric Company Method of treating halogenated polyimide substrates for increasing adhesion of metal layer thereon
EP0949277A3 (de) * 1995-06-22 2000-12-27 Yuri Gudimenko Oberflächenmodifizierung von Polymeren und Kohlenstoffhaltigen Materialen
US6171714B1 (en) 1996-04-18 2001-01-09 Gould Electronics Inc. Adhesiveless flexible laminate and process for making adhesiveless flexible laminate
KR100383399B1 (ko) * 2001-02-28 2003-05-12 이걸주 포터블 진공포장기
JP2006028484A (ja) * 2004-06-18 2006-02-02 Mec Kk 樹脂表面処理剤および樹脂表面処理法
CN116056576A (zh) 2020-08-11 2023-05-02 巴斯夫欧洲公司 嗜球果伞素类型化合物防除在线粒体细胞色素b蛋白中含有赋予对Qo抑制剂VIII的耐受性的氨基酸替代F129L的植物病原性真菌的用途
EP3970494A1 (de) 2020-09-21 2022-03-23 Basf Se Verwendung von verbindungen vom strobilurintyp zur bekämpfung von phytopathogenen pilzen, die eine aminosäuresubstitution f129l in dem mitochondrialen cytochrom-b-protein enthalten, das resistenz gegenüber qo-inhibitoren viii verleiht

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US29134A (en) * 1860-07-17 Improvement in seed-planters
US3179633A (en) * 1962-01-26 1965-04-20 Du Pont Aromatic polyimides from meta-phenylene diamine and para-phenylene diamine
US3505168A (en) * 1964-09-04 1970-04-07 Du Pont Heat-sealable laminar structures of polyimides and methods of laminating
US3361589A (en) * 1964-10-05 1968-01-02 Du Pont Process for treating polyimide surface with basic compounds, and polyimide surface having thin layer of polyamide acid
US3416994A (en) * 1967-01-12 1968-12-17 Du Pont Cross-linked polyimide
US3770573A (en) * 1971-06-08 1973-11-06 Du Pont Interdiffusionally bonded structures of polyimide polymeric material
US3770528A (en) * 1971-09-29 1973-11-06 Martin Processing Co Inc Method for the surface treatment of polyimide materials
CA1053994A (en) * 1974-07-03 1979-05-08 Amp Incorporated Sensitization of polyimide polymer for electroless metal deposition
US4543295A (en) * 1980-09-22 1985-09-24 The United States Of America As Represented By The Director Of The National Aeronautics And Space Administration High temperature polyimide film laminates and process for preparation thereof
US4424095A (en) * 1981-01-12 1984-01-03 Kollmorgen Technologies Corporation Radiation stress relieving of polymer articles
JPS57209608A (en) * 1981-06-22 1982-12-23 Ube Ind Ltd Preparation of composite polyimide separation film
JPS60206639A (ja) * 1984-03-31 1985-10-18 日東電工株式会社 ポリイミド−金属箔複合フイルムの製造方法
US4668755A (en) * 1984-08-10 1987-05-26 General Electric Company High molecular weight siloxane polyimides, intermediates therefor, and methods for their preparation and use
US4775449A (en) * 1986-12-29 1988-10-04 General Electric Company Treatment of a polyimide surface to improve the adhesion of metal deposited thereon
US4842946A (en) * 1987-09-28 1989-06-27 General Electric Company Method for treating a polyimide surface to improve the adhesion of metal deposited thereon, and articles produced thereby

Also Published As

Publication number Publication date
JPH0559136B2 (de) 1993-08-30
EP0370269A3 (de) 1991-09-25
DE68921849D1 (de) 1995-04-27
JPH02173129A (ja) 1990-07-04
US4931310A (en) 1990-06-05
EP0370269A2 (de) 1990-05-30
EP0370269B1 (de) 1995-03-22
CA1330020C (en) 1994-06-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee