DE68923740T2 - Elektronische Vorrichtung mit Wärmeverteilungskörper. - Google Patents

Elektronische Vorrichtung mit Wärmeverteilungskörper.

Info

Publication number
DE68923740T2
DE68923740T2 DE68923740T DE68923740T DE68923740T2 DE 68923740 T2 DE68923740 T2 DE 68923740T2 DE 68923740 T DE68923740 T DE 68923740T DE 68923740 T DE68923740 T DE 68923740T DE 68923740 T2 DE68923740 T2 DE 68923740T2
Authority
DE
Germany
Prior art keywords
heat
substrate
heat sink
attached
chrome
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68923740T
Other languages
English (en)
Other versions
DE68923740D1 (de
Inventor
Morris Anschel
Bahgat Ghaleb Sammakia
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE68923740D1 publication Critical patent/DE68923740D1/de
Publication of DE68923740T2 publication Critical patent/DE68923740T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
DE68923740T 1988-07-13 1989-05-13 Elektronische Vorrichtung mit Wärmeverteilungskörper. Expired - Fee Related DE68923740T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/218,725 US4914551A (en) 1988-07-13 1988-07-13 Electronic package with heat spreader member

Publications (2)

Publication Number Publication Date
DE68923740D1 DE68923740D1 (de) 1995-09-14
DE68923740T2 true DE68923740T2 (de) 1996-04-18

Family

ID=22816253

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68923740T Expired - Fee Related DE68923740T2 (de) 1988-07-13 1989-05-13 Elektronische Vorrichtung mit Wärmeverteilungskörper.

Country Status (7)

Country Link
US (1) US4914551A (de)
EP (1) EP0350593B1 (de)
JP (1) JPH0240942A (de)
AT (1) ATE126396T1 (de)
BR (1) BR8903415A (de)
CA (1) CA1287929C (de)
DE (1) DE68923740T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007052397A1 (de) * 2007-10-31 2009-05-07 GE Fanuc Intelligent Platforms Embedded Systems, Inc. (n.d.Ges.d. Staates Delaware) Kühlvorrichtung zur verbesserten thermischen Kontaktierung zwischen Halbleiterchip und Kühlkörper

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007052397A1 (de) * 2007-10-31 2009-05-07 GE Fanuc Intelligent Platforms Embedded Systems, Inc. (n.d.Ges.d. Staates Delaware) Kühlvorrichtung zur verbesserten thermischen Kontaktierung zwischen Halbleiterchip und Kühlkörper
DE102007052397B4 (de) * 2007-10-31 2009-09-24 GE Fanuc Intelligent Platforms Embedded Systems, Inc. (n.d.Ges.d. Staates Delaware) Kühlanordnung zur thermischen Kontaktierung zwischen elektronischem Bauelement und Kühlkörper

Also Published As

Publication number Publication date
CA1287929C (en) 1991-08-20
JPH0240942A (ja) 1990-02-09
ATE126396T1 (de) 1995-08-15
BR8903415A (pt) 1990-02-13
US4914551A (en) 1990-04-03
EP0350593A2 (de) 1990-01-17
EP0350593A3 (en) 1990-12-05
DE68923740D1 (de) 1995-09-14
EP0350593B1 (de) 1995-08-09

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