DE68927116T2 - Poliermasse - Google Patents

Poliermasse

Info

Publication number
DE68927116T2
DE68927116T2 DE68927116T DE68927116T DE68927116T2 DE 68927116 T2 DE68927116 T2 DE 68927116T2 DE 68927116 T DE68927116 T DE 68927116T DE 68927116 T DE68927116 T DE 68927116T DE 68927116 T2 DE68927116 T2 DE 68927116T2
Authority
DE
Germany
Prior art keywords
polishing compound
polishing
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68927116T
Other languages
English (en)
Other versions
DE68927116D1 (de
Inventor
Tsutomu Yamada
Taizo Okajima
Kouichi Ootani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimi Inc
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63009385A external-priority patent/JP2632889B2/ja
Priority claimed from JP63027941A external-priority patent/JP2632898B2/ja
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of DE68927116D1 publication Critical patent/DE68927116D1/de
Application granted granted Critical
Publication of DE68927116T2 publication Critical patent/DE68927116T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
DE68927116T 1988-01-19 1989-01-18 Poliermasse Expired - Fee Related DE68927116T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63009385A JP2632889B2 (ja) 1988-01-19 1988-01-19 研磨用組成物
JP63027941A JP2632898B2 (ja) 1988-02-09 1988-02-09 研磨用組成物

Publications (2)

Publication Number Publication Date
DE68927116D1 DE68927116D1 (de) 1996-10-17
DE68927116T2 true DE68927116T2 (de) 1997-02-06

Family

ID=26344086

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68927116T Expired - Fee Related DE68927116T2 (de) 1988-01-19 1989-01-18 Poliermasse

Country Status (4)

Country Link
US (1) US4956015A (de)
EP (1) EP0325232B1 (de)
KR (1) KR0141694B1 (de)
DE (1) DE68927116T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008039671A1 (de) * 2008-08-26 2010-03-04 Melos Gmbh Verwendung eines Granulats als Einstreugranulat für Kunstrasen

Families Citing this family (62)

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JPH0781132B2 (ja) * 1990-08-29 1995-08-30 株式会社フジミインコーポレーテッド 研磨剤組成物
AU650382B2 (en) * 1992-02-05 1994-06-16 Norton Company Nano-sized alpha alumina particles
US6258137B1 (en) 1992-02-05 2001-07-10 Saint-Gobain Industrial Ceramics, Inc. CMP products
US5334335A (en) * 1992-10-19 1994-08-02 Clearfix Corporation Compositions and methods for repairing and removing scratches and other imperfections from plastic surfaces
US5389194A (en) * 1993-02-05 1995-02-14 Lsi Logic Corporation Methods of cleaning semiconductor substrates after polishing
US5433650A (en) * 1993-05-03 1995-07-18 Motorola, Inc. Method for polishing a substrate
US5580407A (en) * 1993-07-13 1996-12-03 U.S. Philips Corporation Method of bonding two objects, at least one of which comprises organic materials
US5575885A (en) * 1993-12-14 1996-11-19 Kabushiki Kaisha Toshiba Copper-based metal polishing solution and method for manufacturing semiconductor device
DE69529775T2 (de) * 1994-08-05 2003-10-16 Ibm Verfahren zur Herstellung einer Damaszenstruktur mit einer WGe Polierstoppschicht
US5693239A (en) * 1995-10-10 1997-12-02 Rodel, Inc. Polishing slurries comprising two abrasive components and methods for their use
JPH09139368A (ja) * 1995-11-14 1997-05-27 Sony Corp 化学的機械研磨方法
US5700383A (en) * 1995-12-21 1997-12-23 Intel Corporation Slurries and methods for chemical mechanical polish of aluminum and titanium aluminide
US5769689A (en) * 1996-02-28 1998-06-23 Rodel, Inc. Compositions and methods for polishing silica, silicates, and silicon nitride
US6336945B1 (en) * 1996-11-14 2002-01-08 Kao Corporation Abrasive composition for the base of magnetic recording medium and process for producing the base by using the same
US5958288A (en) * 1996-11-26 1999-09-28 Cabot Corporation Composition and slurry useful for metal CMP
JP4141514B2 (ja) * 1996-11-26 2008-08-27 株式会社フジミインコーポレーテッド リンス用組成物
US5865620A (en) * 1997-06-12 1999-02-02 Kreativ, Inc. Abrasive dental composition and method for use
TW419518B (en) * 1998-02-20 2001-01-21 Ind Tech Res Inst Non-Newtonian-fluid-behaviored formulation
JP3998813B2 (ja) * 1998-06-15 2007-10-31 株式会社フジミインコーポレーテッド 研磨用組成物
CN1126152C (zh) * 1998-08-31 2003-10-29 长兴化学工业股份有限公司 半导体制程用的化学机械研磨组合物
EP1137056B1 (de) * 1998-08-31 2013-07-31 Hitachi Chemical Company, Ltd. Flüssiges schleifmedium für metall und polierverfahren
JP2000109816A (ja) * 1998-10-05 2000-04-18 Okamoto Machine Tool Works Ltd 研磨剤スラリ−の調製方法
KR100324311B1 (ko) 1998-10-26 2002-05-13 김영환 반도체소자의화학기계연마공정용슬러리제조방법
US6274063B1 (en) * 1998-11-06 2001-08-14 Hmt Technology Corporation Metal polishing composition
US6569216B1 (en) * 1998-11-27 2003-05-27 Kao Corporation Abrasive fluid compositions
JP4428473B2 (ja) * 1999-01-18 2010-03-10 株式会社東芝 気相法無機酸化物粒子の含水固体状物質及び研磨用スラリーの製造方法
EP1166264A1 (de) 1999-02-12 2002-01-02 General Electric Company Datenaufzeichnungsmedium
US7179551B2 (en) 1999-02-12 2007-02-20 General Electric Company Poly(arylene ether) data storage media
US6162268A (en) * 1999-05-03 2000-12-19 Praxair S. T. Technology, Inc. Polishing slurry
US6221119B1 (en) * 1999-07-14 2001-04-24 Komag, Inc. Slurry composition for polishing a glass ceramic substrate
EP1223609A4 (de) * 1999-08-26 2006-03-15 Hitachi Chemical Co Ltd Polirmittel für cmp und poliermethode
US6258140B1 (en) * 1999-09-27 2001-07-10 Fujimi America Inc. Polishing composition
US6488729B1 (en) 1999-09-30 2002-12-03 Showa Denko K.K. Polishing composition and method
EP1252247A1 (de) 1999-12-14 2002-10-30 Rodel Holdings, Inc. Polierzusammensetzungen für halbleitersubstrate
US20020111027A1 (en) * 1999-12-14 2002-08-15 Vikas Sachan Polishing compositions for noble metals
US20030006396A1 (en) * 1999-12-14 2003-01-09 Hongyu Wang Polishing composition for CMP having abrasive particles
US20020039839A1 (en) * 1999-12-14 2002-04-04 Thomas Terence M. Polishing compositions for noble metals
US6299795B1 (en) 2000-01-18 2001-10-09 Praxair S.T. Technology, Inc. Polishing slurry
US6261476B1 (en) 2000-03-21 2001-07-17 Praxair S. T. Technology, Inc. Hybrid polishing slurry
JP3945964B2 (ja) * 2000-06-01 2007-07-18 株式会社ルネサステクノロジ 研磨剤、研磨方法及び半導体装置の製造方法
JP2002259965A (ja) * 2001-02-26 2002-09-13 Sony Corp 画像ノイズ低減方法及び装置
MY144587A (en) * 2001-06-21 2011-10-14 Kao Corp Polishing composition
US6953389B2 (en) * 2001-08-09 2005-10-11 Cheil Industries, Inc. Metal CMP slurry compositions that favor mechanical removal of oxides with reduced susceptibility to micro-scratching
TW591089B (en) * 2001-08-09 2004-06-11 Cheil Ind Inc Slurry composition for use in chemical mechanical polishing of metal wiring
US20040216388A1 (en) * 2003-03-17 2004-11-04 Sharad Mathur Slurry compositions for use in a chemical-mechanical planarization process
JP4219722B2 (ja) * 2003-03-31 2009-02-04 株式会社フジミインコーポレーテッド 研磨用組成物
US7285229B2 (en) * 2003-11-07 2007-10-23 Mec Company, Ltd. Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the same
US20050104048A1 (en) * 2003-11-13 2005-05-19 Thomas Terence M. Compositions and methods for polishing copper
US20050109980A1 (en) * 2003-11-25 2005-05-26 Hongyu Wang Polishing composition for CMP having abrasive particles
JP4249008B2 (ja) * 2003-12-25 2009-04-02 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
JP2005268666A (ja) * 2004-03-19 2005-09-29 Fujimi Inc 研磨用組成物
JP4541796B2 (ja) * 2004-07-30 2010-09-08 ルネサスエレクトロニクス株式会社 研磨スラリーの製造方法
US20060108325A1 (en) * 2004-11-19 2006-05-25 Everson William J Polishing process for producing damage free surfaces on semi-insulating silicon carbide wafers
US20060283093A1 (en) * 2005-06-15 2006-12-21 Ivan Petrovic Planarization composition
CA2618915C (en) 2005-08-19 2014-09-23 Houghton Metal Finishing Company Methods and compositions for acid treatment of a metal surface
KR101267971B1 (ko) * 2005-08-31 2013-05-27 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 연마 방법
BRPI0716218A2 (pt) * 2006-08-30 2013-10-15 Saint Gobain Ceramics Composições de pastas fluidas abrasivas concentradas, métodos de produção, e métodos de utilização delas.
CN101541476A (zh) * 2007-02-20 2009-09-23 住友电气工业株式会社 研磨浆料、制备研磨浆料的方法、氮化物晶体材料以及氮化物晶体材料的表面研磨方法
CN105538076A (zh) * 2016-02-05 2016-05-04 刘汝河 一种玻璃用抛光膏及玻璃抛光修复方法
KR20200058017A (ko) 2018-11-19 2020-05-27 삼성전자주식회사 연마 슬러리 및 반도체 소자의 제조 방법
JP7457586B2 (ja) * 2020-06-18 2024-03-28 株式会社フジミインコーポレーテッド 研磨用組成物の濃縮液およびこれを用いた研磨方法
CN113755842B (zh) * 2021-10-18 2024-04-02 德米特（苏州）电子环保材料有限公司 一种金属抛光液及其制备方法和应用

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5489389A (en) * 1977-12-27 1979-07-16 Fujimi Kenmazai Kougiyou Kk Composition for polishing of moldings in synthetic resin
DD252091A3 (de) * 1985-05-23 1987-12-09 Hermsdorf Keramik Veb Poliermittel
JPS61278587A (ja) * 1985-06-04 1986-12-09 Fujimi Kenmazai Kogyo Kk 研磨用組成物
US4769046A (en) * 1985-07-25 1988-09-06 Fujimi Kanmazai Kogyo Kabushiki Kaisha Of Japan Process for polishing surface of memory hard disc
JPS6225187A (ja) * 1985-07-25 1987-02-03 Fujimi Kenmazai Kogyo Kk メモリ−ハ−ドデイスクの研磨用組成物
JPH0284485A (ja) * 1988-09-20 1990-03-26 Showa Denko Kk アルミニウム磁気ディスク研磨用組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008039671A1 (de) * 2008-08-26 2010-03-04 Melos Gmbh Verwendung eines Granulats als Einstreugranulat für Kunstrasen

Also Published As

Publication number Publication date
KR890011970A (ko) 1989-08-23
EP0325232A2 (de) 1989-07-26
EP0325232B1 (de) 1996-09-11
EP0325232A3 (de) 1991-08-28
KR0141694B1 (ko) 1998-06-15
US4956015A (en) 1990-09-11
DE68927116D1 (de) 1996-10-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee