DE68928633T2 - Verfahren zur Herstellung elektrischer Verbindungsteile - Google Patents

Verfahren zur Herstellung elektrischer Verbindungsteile

Info

Publication number
DE68928633T2
DE68928633T2 DE68928633T DE68928633T DE68928633T2 DE 68928633 T2 DE68928633 T2 DE 68928633T2 DE 68928633 T DE68928633 T DE 68928633T DE 68928633 T DE68928633 T DE 68928633T DE 68928633 T2 DE68928633 T2 DE 68928633T2
Authority
DE
Germany
Prior art keywords
electrical connectors
making electrical
making
connectors
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68928633T
Other languages
English (en)
Other versions
DE68928633D1 (de
Inventor
Tetsuno Yoshizawa
Yoshimi Terayama
Hiroshi Kondo
Takashi Sakaki
Shunichi Haga
Yasuteru Ichida
Masaki Konishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE68928633D1 publication Critical patent/DE68928633D1/de
Application granted granted Critical
Publication of DE68928633T2 publication Critical patent/DE68928633T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01025—Manganese [Mn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
DE68928633T 1988-05-31 1989-05-30 Verfahren zur Herstellung elektrischer Verbindungsteile Expired - Fee Related DE68928633T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63133401A JP2702507B2 (ja) 1988-05-31 1988-05-31 電気的接続部材及びその製造方法

Publications (2)

Publication Number Publication Date
DE68928633D1 DE68928633D1 (de) 1998-05-14
DE68928633T2 true DE68928633T2 (de) 1998-09-17

Family

ID=15103885

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68928633T Expired - Fee Related DE68928633T2 (de) 1988-05-31 1989-05-30 Verfahren zur Herstellung elektrischer Verbindungsteile

Country Status (4)

Country Link
US (1) US4926549A (de)
EP (1) EP0344720B1 (de)
JP (1) JP2702507B2 (de)
DE (1) DE68928633T2 (de)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5502889A (en) * 1988-06-10 1996-04-02 Sheldahl, Inc. Method for electrically and mechanically connecting at least two conductive layers
US5798780A (en) * 1988-07-03 1998-08-25 Canon Kabushiki Kaisha Recording element driving unit having extra driving element to facilitate assembly and apparatus using same
US5160779A (en) * 1989-11-30 1992-11-03 Hoya Corporation Microprobe provided circuit substrate and method for producing the same
US5135606A (en) * 1989-12-08 1992-08-04 Canon Kabushiki Kaisha Process for preparing electrical connecting member
US5379515A (en) * 1989-12-11 1995-01-10 Canon Kabushiki Kaisha Process for preparing electrical connecting member
US5145552A (en) * 1989-12-21 1992-09-08 Canon Kabushiki Kaisha Process for preparing electrical connecting member
US5819406A (en) * 1990-08-29 1998-10-13 Canon Kabushiki Kaisha Method for forming an electrical circuit member
DE69233232T2 (de) * 1991-02-22 2004-08-05 Canon K.K. Elektrischer Verbindungskörper und Herstellungsverfahren dafür
DE69216658T2 (de) * 1991-02-25 1997-08-07 Canon Kk Vorrichtung und Verfahren zur Verbindung elektrischer Bauelemente
EP0501361B1 (de) * 1991-02-25 2002-05-15 Canon Kabushiki Kaisha Elektrischer Verbindungskörper und Herstellungsverfahren dafür
DE69233088T2 (de) * 1991-02-25 2003-12-24 Canon Kk Elektrisches Verbindungsteil und sein Herstellungsverfahren
US5379191A (en) * 1991-02-26 1995-01-03 Microelectronics And Computer Technology Corporation Compact adapter package providing peripheral to area translation for an integrated circuit chip
US5108541A (en) * 1991-03-06 1992-04-28 International Business Machines Corp. Processes for electrically conductive decals filled with inorganic insulator material
US5116459A (en) * 1991-03-06 1992-05-26 International Business Machines Corporation Processes for electrically conductive decals filled with organic insulator material
US5306872A (en) * 1991-03-06 1994-04-26 International Business Machines Corporation Structures for electrically conductive decals filled with organic insulator material
US5338900A (en) * 1991-03-06 1994-08-16 International Business Machines Corporation Structures for electrically conductive decals filled with inorganic insulator material
US5519332A (en) * 1991-06-04 1996-05-21 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
US5129833A (en) * 1991-06-26 1992-07-14 Amp Incorporated Low-force, high-density gel connector
US5515604A (en) * 1992-10-07 1996-05-14 Fujitsu Limited Methods for making high-density/long-via laminated connectors
US5727310A (en) * 1993-01-08 1998-03-17 Sheldahl, Inc. Method of manufacturing a multilayer electronic circuit
US5387329A (en) * 1993-04-09 1995-02-07 Ciba Corning Diagnostics Corp. Extended use planar sensors
US5428190A (en) * 1993-07-02 1995-06-27 Sheldahl, Inc. Rigid-flex board with anisotropic interconnect and method of manufacture
US5527998A (en) * 1993-10-22 1996-06-18 Sheldahl, Inc. Flexible multilayer printed circuit boards and methods of manufacture
US5455390A (en) * 1994-02-01 1995-10-03 Tessera, Inc. Microelectronics unit mounting with multiple lead bonding
US5912597A (en) * 1994-03-31 1999-06-15 Canon Kabushiki Kaisha Printed circuit board
JP3363651B2 (ja) * 1994-04-21 2003-01-08 キヤノン株式会社 プリント配線板およびその設計方法
JP2984205B2 (ja) * 1996-01-10 1999-11-29 日東電工株式会社 異方導電フィルム
JP3376218B2 (ja) * 1996-08-30 2003-02-10 キヤノン株式会社 回路基板接続装置
US6133072A (en) 1996-12-13 2000-10-17 Tessera, Inc. Microelectronic connector with planar elastomer sockets
JPH10282144A (ja) * 1997-04-07 1998-10-23 Micronics Japan Co Ltd 平板状被検査体試験用プローブユニット
JPH1123615A (ja) 1997-05-09 1999-01-29 Hitachi Ltd 接続装置および検査システム
JPH1127859A (ja) 1997-06-30 1999-01-29 Nec Corp 電源回路
SG82591A1 (en) * 1998-12-17 2001-08-21 Eriston Technologies Pte Ltd Bumpless flip chip assembly with solder via
US6036809A (en) * 1999-02-16 2000-03-14 International Business Machines Corporation Process for releasing a thin-film structure from a substrate
US6627998B1 (en) * 2000-07-27 2003-09-30 International Business Machines Corporation Wafer scale thin film package
US6840777B2 (en) 2000-11-30 2005-01-11 Intel Corporation Solderless electronics packaging
US6694846B2 (en) * 2002-02-28 2004-02-24 Shimano Inc. Bicycle pedal
EP1637261A4 (de) 2003-06-06 2009-03-11 Sumitomo Electric Industries Gebohrtes poröses harzbasismaterial und verfahren zur herstellung von porösem harzbasismaterial mit einer leitenden gebohrten innenwandfläche
JP2005340687A (ja) * 2004-05-31 2005-12-08 Fujitsu Ltd 積層基板及びその製造方法、かかる積層基板を有する電子機器
JP4380466B2 (ja) 2004-08-23 2009-12-09 住友電気工業株式会社 穿孔された多孔質樹脂基材及び穿孔の内壁面を導電化した多孔質樹脂基材の製造方法
JP4665848B2 (ja) * 2006-03-15 2011-04-06 日立電線株式会社 コネクタ構造
US7425134B1 (en) * 2007-05-21 2008-09-16 Amphenol Corporation Compression mat for an electrical connector
JP5588851B2 (ja) * 2010-12-14 2014-09-10 株式会社日本マイクロニクス 電気的接続装置及びその製造方法
JP2012233723A (ja) * 2011-04-28 2012-11-29 Micronics Japan Co Ltd プローブ装置及びプローブユニット
JP6520343B2 (ja) * 2015-04-17 2019-05-29 大日本印刷株式会社 電極シートおよび電極シートの製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2961746A (en) * 1956-06-18 1960-11-29 Aladdin Ind Inc Printed circuits
US3193789A (en) * 1962-08-01 1965-07-06 Sperry Rand Corp Electrical circuitry
US3541222A (en) * 1969-01-13 1970-11-17 Bunker Ramo Connector screen for interconnecting adjacent surfaces of laminar circuits and method of making
US3778900A (en) * 1970-09-04 1973-12-18 Ibm Method for forming interconnections between circuit layers of a multi-layer package
US3680037A (en) * 1970-11-05 1972-07-25 Tech Wire Prod Inc Electrical interconnector
US3971610A (en) * 1974-05-10 1976-07-27 Technical Wire Products, Inc. Conductive elastomeric contacts and connectors
US4050756A (en) * 1975-12-22 1977-09-27 International Telephone And Telegraph Corporation Conductive elastomer connector and method of making same
US4067945A (en) * 1976-03-24 1978-01-10 Essex International, Inc. Method of making a multi-circuit electrical interconnector
US4240198A (en) * 1979-02-21 1980-12-23 International Telephone And Telegraph Corporation Method of making conductive elastomer connector
JPS55138294A (en) * 1979-04-11 1980-10-28 Matsushita Electric Ind Co Ltd Method of forming through hole connector
US4480288A (en) * 1982-12-27 1984-10-30 International Business Machines Corporation Multi-layer flexible film module
JPS6059683A (ja) * 1983-09-10 1985-04-06 ジェイエスアール株式会社 コネクタ−の製造方法
DK291184D0 (da) * 1984-06-13 1984-06-13 Boeegh Petersen Allan Fremgangsmaade og indretning til test af kredsloebsplader
JPS61239576A (ja) * 1985-04-16 1986-10-24 シチズン時計株式会社 コネクタ−の製造方法
US4628406A (en) * 1985-05-20 1986-12-09 Tektronix, Inc. Method of packaging integrated circuit chips, and integrated circuit package

Also Published As

Publication number Publication date
EP0344720B1 (de) 1998-04-08
EP0344720A2 (de) 1989-12-06
EP0344720A3 (de) 1991-10-16
DE68928633D1 (de) 1998-05-14
JP2702507B2 (ja) 1998-01-21
JPH0249385A (ja) 1990-02-19
US4926549A (en) 1990-05-22

Similar Documents

Publication Publication Date Title
DE68928633T2 (de) Verfahren zur Herstellung elektrischer Verbindungsteile
DE68927314D1 (de) Verfahren zur Herstellung eines elektrischen Verbindungsgehäuses
DE3787907D1 (de) Elektrischer Verbinder für Oberflächenmontage und Verfahren zu dessen Herstellung.
DE3856228D1 (de) Elektrischer Steckverbinder
DE69316453T2 (de) Versiegelter elektrischer Stecker und Verfahren zu seiner Herstellung
DE3886129D1 (de) Verfahren zur schaltstossarmen Leistungssteuerung elektrischer Lasten.
DE68923732D1 (de) Verfahren zur Herstellung einer elektrischen Vorrichtung.
DE69014077T2 (de) Elektrische Verbindereinrichtung und Verfahren zur Herstellung einer derartigen Verbindereinrichtung.
DE59005028D1 (de) Lötverbinder und Verfahren zur Herstellung einer elektrischen Schaltung mit diesem Lötverbinder.
DE69215971D1 (de) Elektrischen Stecker und Verfahren zur Herstellung eines elektrischen Steckers
DE3869682D1 (de) Verfahren zur herstellung elektrischer isolationszonen fuer cmos-integrierte schaltungen.
DE69311926D1 (de) Verfahren zur Herstellung einer elektrisch leitenden Organosiloxanzusammensetzung
ATA53886A (de) Verfahren zur herstellung von chlordioxid
DE69117631D1 (de) Hochohmiges elektrisches Kabel und Verfahren zur Herstellung
DE69124467T2 (de) Elektrischer Verbinder aus leitfähigem Faserstoff und Verfahren zur Herstellung
DE3861834D1 (de) Verfahren zur herstellung elektrischer isolationszonen fuer eine cmos-integrierte schaltung.
DE69821547D1 (de) Verfahren zur Herstellung von elektrischen Verbindern und Verbinder
ATE105648T1 (de) Elektrischer isolator und verfahren zu dessen herstellung.
DE69315420T2 (de) Abgeschirmter elektrischer Verbinder und Verfahren zur Herstellung
DE69018748D1 (de) Verfahren zur Herstellung einer elektrischen Klemme.
DE68926086T2 (de) Verfahren zum Herstellen elektrischer Anordnungen
DE3856385D1 (de) Verfahren zur Herstellung einer elektrischen Isolierölzusammensetzung
AT379391B (de) Verfahren zur herstellung cyanaethylierter benzodiazepine
DE69030331T2 (de) Verfahren zur Herstellung organischer elektrischer Leiter
ATA183586A (de) Verfahren zur herstellung von elektrischen flaechenheizelementen

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee