DE69000153T2 - Tragbare, mit bausteinen verbindbare elektronik. - Google Patents
Tragbare, mit bausteinen verbindbare elektronik.Info
- Publication number
- DE69000153T2 DE69000153T2 DE9090402931T DE69000153T DE69000153T2 DE 69000153 T2 DE69000153 T2 DE 69000153T2 DE 9090402931 T DE9090402931 T DE 9090402931T DE 69000153 T DE69000153 T DE 69000153T DE 69000153 T2 DE69000153 T2 DE 69000153T2
- Authority
- DE
- Germany
- Prior art keywords
- blocks
- portable electronics
- electronics connectable
- connectable
- portable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8913755A FR2653601B1 (fr) | 1989-10-20 | 1989-10-20 | Electronique portable connectable a puces. |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69000153D1 DE69000153D1 (de) | 1992-07-23 |
DE69000153T2 true DE69000153T2 (de) | 1992-12-24 |
Family
ID=9386609
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE9090402931T Expired - Fee Related DE69000153T2 (de) | 1989-10-20 | 1990-10-18 | Tragbare, mit bausteinen verbindbare elektronik. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5311396A (de) |
EP (1) | EP0424262B1 (de) |
DE (1) | DE69000153T2 (de) |
FR (1) | FR2653601B1 (de) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5880769A (en) * | 1994-01-19 | 1999-03-09 | Smarttv Co. | Interactive smart card system for integrating the provision of remote and local services |
US5594493A (en) * | 1994-01-19 | 1997-01-14 | Nemirofsky; Frank R. | Television signal activated interactive smart card system |
US6298441B1 (en) | 1994-03-10 | 2001-10-02 | News Datacom Ltd. | Secure document access system |
IL111151A (en) * | 1994-10-03 | 1998-09-24 | News Datacom Ltd | Secure access systems |
US5480842A (en) * | 1994-04-11 | 1996-01-02 | At&T Corp. | Method for fabricating thin, strong, and flexible die for smart cards |
JP3589726B2 (ja) * | 1995-01-31 | 2004-11-17 | 株式会社ルネサスソリューションズ | エミュレータプローブ |
US6022761A (en) * | 1996-05-28 | 2000-02-08 | Motorola, Inc. | Method for coupling substrates and structure |
US5786988A (en) * | 1996-07-02 | 1998-07-28 | Sandisk Corporation | Integrated circuit chips made bendable by forming indentations in their back surfaces flexible packages thereof and methods of manufacture |
US6008538A (en) | 1996-10-08 | 1999-12-28 | Micron Technology, Inc. | Method and apparatus providing redundancy for fabricating highly reliable memory modules |
DE19708615C1 (de) * | 1997-03-03 | 1998-07-23 | Siemens Ag | Chipkartenmodul und diesen umfassende Chipkarte |
US6064116A (en) * | 1997-06-06 | 2000-05-16 | Micron Technology, Inc. | Device for electrically or thermally coupling to the backsides of integrated circuit dice in chip-on-board applications |
US6049463A (en) * | 1997-07-25 | 2000-04-11 | Motorola, Inc. | Microelectronic assembly including an antenna element embedded within a polymeric card, and method for forming same |
KR100269947B1 (ko) * | 1997-09-13 | 2000-10-16 | 윤종용 | 인쇄회로기판및이를이용한엘씨디모듈 |
US6055592A (en) * | 1998-02-09 | 2000-04-25 | Motorola, Inc. | Smart card authentication system comprising means for converting user identification and digital signature to pointing device position data and vice versa using lut |
US6241153B1 (en) | 1998-03-17 | 2001-06-05 | Cardxx, Inc. | Method for making tamper-preventing, contact-type, smart cards |
US6200265B1 (en) | 1999-04-16 | 2001-03-13 | Medtronic, Inc. | Peripheral memory patch and access method for use with an implantable medical device |
KR100309161B1 (ko) * | 1999-10-11 | 2001-11-02 | 윤종용 | 메모리 카드 및 그 제조방법 |
US6690959B2 (en) | 2000-09-01 | 2004-02-10 | Medtronic, Inc. | Skin-mounted electrodes with nano spikes |
EP1871218B1 (de) * | 2005-03-09 | 2012-05-16 | Coloplast A/S | Dreidimensionale klebevorrichtung mit darin eingebettetem mikroelektronischem system |
CN101163440B (zh) * | 2005-03-09 | 2010-06-16 | 库蒂森斯股份公司 | 嵌入有微电子系统的三维粘合剂器件 |
US8012809B2 (en) * | 2005-03-23 | 2011-09-06 | Cardxx, Inc. | Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4766371A (en) * | 1982-07-24 | 1988-08-23 | Risho Kogyo Co., Ltd. | Test board for semiconductor packages |
DE3231056A1 (de) * | 1982-08-20 | 1984-02-23 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum aufbringen von unbedrahteten bauelementen auf leiterplatten |
GB2134338B (en) * | 1983-01-26 | 1986-07-16 | Int Computers Ltd | Soldering integrated-circuit package to p.c.b |
DE3321694A1 (de) * | 1983-06-15 | 1984-12-20 | Walter Dipl.-Ing. 2000 Hamburg Kundler | Leiterplatte zum aufloeten von integrierten miniaturschaltungen |
US4688150A (en) * | 1984-06-15 | 1987-08-18 | Texas Instruments Incorporated | High pin count chip carrier package |
US4642889A (en) * | 1985-04-29 | 1987-02-17 | Amp Incorporated | Compliant interconnection and method therefor |
US4697858A (en) * | 1986-02-07 | 1987-10-06 | National Semiconductor Corporation | Active bus backplane |
DE3705868A1 (de) * | 1987-02-24 | 1988-09-01 | Siemens Ag | Kondensator im kunststoffbecher und verfahren zu seiner herstellung |
GB8705543D0 (en) * | 1987-03-10 | 1987-04-15 | Int Computers Ltd | Printed circuit board |
FR2619276A1 (fr) * | 1987-08-07 | 1989-02-10 | Cit Alcatel | Carte de circuit imprime mixte double face ou multicouches |
-
1989
- 1989-10-20 FR FR8913755A patent/FR2653601B1/fr not_active Expired - Fee Related
-
1990
- 1990-10-18 EP EP19900402931 patent/EP0424262B1/de not_active Expired - Lifetime
- 1990-10-18 DE DE9090402931T patent/DE69000153T2/de not_active Expired - Fee Related
-
1992
- 1992-08-31 US US07/937,438 patent/US5311396A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
FR2653601B1 (fr) | 1993-10-22 |
FR2653601A1 (fr) | 1991-04-26 |
US5311396A (en) | 1994-05-10 |
EP0424262A1 (de) | 1991-04-24 |
DE69000153D1 (de) | 1992-07-23 |
EP0424262B1 (de) | 1992-06-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |