DE69025410D1 - Vernetzbare fluorhaltige polymerzusammensetzungen - Google Patents
Vernetzbare fluorhaltige polymerzusammensetzungenInfo
- Publication number
- DE69025410D1 DE69025410D1 DE69025410T DE69025410T DE69025410D1 DE 69025410 D1 DE69025410 D1 DE 69025410D1 DE 69025410 T DE69025410 T DE 69025410T DE 69025410 T DE69025410 T DE 69025410T DE 69025410 D1 DE69025410 D1 DE 69025410D1
- Authority
- DE
- Germany
- Prior art keywords
- polymer compositions
- fluorine polymer
- crosslinkable fluorine
- image
- arylene ether
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/5329—Insulating materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
- C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
- C08G65/4006—(I) or (II) containing elements other than carbon, oxygen, hydrogen or halogen as leaving group (X)
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
- C08G75/20—Polysulfones
- C08G75/23—Polyethersulfones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
- C08K5/27—Compounds containing a nitrogen atom bound to two other nitrogen atoms, e.g. diazoamino-compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/06—Polysulfones; Polyethersulfones
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterized by the type of post-polymerisation functionalisation
- C08G2650/20—Cross-linking
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
- C08G2650/46—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing halogen
- C08G2650/48—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing halogen containing fluorine, e.g. perfluropolyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2312/00—Crosslinking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/034—Organic insulating material consisting of one material containing halogen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US44775089A | 1989-12-08 | 1989-12-08 | |
US51038690A | 1990-04-17 | 1990-04-17 | |
US51035390A | 1990-04-17 | 1990-04-17 | |
US07/583,897 US5155175A (en) | 1989-12-08 | 1990-09-17 | Crosslinkable fluorinated polyarylene ether composition |
PCT/US1990/007213 WO1991009081A1 (en) | 1989-12-08 | 1990-12-07 | Crosslinkable fluorinated polymer compositions |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69025410D1 true DE69025410D1 (de) | 1996-03-28 |
DE69025410T2 DE69025410T2 (de) | 1996-07-04 |
Family
ID=27503948
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69025410T Expired - Fee Related DE69025410T2 (de) | 1989-12-08 | 1990-12-07 | Vernetzbare fluorhaltige polymerzusammensetzungen |
Country Status (10)
Country | Link |
---|---|
US (1) | US5155175A (de) |
EP (1) | EP0504265B1 (de) |
JP (1) | JP3064011B2 (de) |
AT (1) | ATE134208T1 (de) |
CA (1) | CA2070809C (de) |
DE (1) | DE69025410T2 (de) |
DK (1) | DK0504265T3 (de) |
ES (1) | ES2082963T3 (de) |
GR (1) | GR3019738T3 (de) |
WO (1) | WO1991009081A1 (de) |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5270453A (en) * | 1989-12-08 | 1993-12-14 | Raychem Corporation | Aromatic bistriazene compounds |
US5235044A (en) * | 1992-09-09 | 1993-08-10 | Raychem Corporation | Compounds having oxadiazole and triazene moieties, crosslinkable polymers therefrom, and methods therefor |
US5250667A (en) * | 1992-09-09 | 1993-10-05 | Raychem Corporation | 1-[(hydroxyphenoxy)phenylene]triazenes, polymers crosslinked therewith, and methods therefor |
US5670603A (en) * | 1993-03-08 | 1997-09-23 | Alliedsignal Inc. | Polymers exhibiting nonlinear optical properties |
CA2128342C (en) * | 1993-07-22 | 1997-06-24 | Jochen Dauth | Organosilicon compounds having triazene groups |
US5827907A (en) * | 1993-08-30 | 1998-10-27 | Ibm Corporation | Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin |
US5874516A (en) * | 1995-07-13 | 1999-02-23 | Air Products And Chemicals, Inc. | Nonfunctionalized poly(arylene ethers) |
US5658994A (en) * | 1995-07-13 | 1997-08-19 | Air Products And Chemicals, Inc. | Nonfunctionalized poly(arylene ether) dielectrics |
DE59607034D1 (de) * | 1995-08-31 | 2001-07-12 | Infineon Technologies Ag | Verfahren zur Herstellung von Poly-o-hydroxyamiden und Poly-o-mercaptoamiden |
US5925420A (en) * | 1996-07-16 | 1999-07-20 | Wj Semiconductor Equipment Group, Inc. | Method for preparing crosslinked aromatic polymers as low κ dielectrics |
KR19990024596A (ko) * | 1997-09-04 | 1999-04-06 | 윤종용 | 광통신용 폴리아릴렌에테르 |
TW386256B (en) * | 1997-12-24 | 2000-04-01 | United Microelectronics Corp | Method for removing photoresistor |
IL143207A0 (en) | 1998-11-24 | 2002-04-21 | Dow Chemical Co | A composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefrom |
US6509259B1 (en) * | 1999-06-09 | 2003-01-21 | Alliedsignal Inc. | Process of using siloxane dielectric films in the integration of organic dielectric films in electronic devices |
US6359091B1 (en) | 1999-11-22 | 2002-03-19 | The Dow Chemical Company | Polyarylene compositions with enhanced modulus profiles |
US7115531B2 (en) * | 2000-08-21 | 2006-10-03 | Dow Global Technologies Inc. | Organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices |
US6593155B2 (en) | 2000-12-28 | 2003-07-15 | Dow Global Technologies Inc. | Method for determination of cure and oxidation of spin-on dielectric polymers |
US6821884B2 (en) * | 2001-02-15 | 2004-11-23 | Interuniversitair Microelektronica Centrum (Imec) | Method of fabricating a semiconductor device |
CN100519623C (zh) * | 2001-07-12 | 2009-07-29 | 旭硝子株式会社 | 含氟芳香族聚合物及其用途 |
WO2003099907A1 (en) * | 2002-05-28 | 2003-12-04 | National Research Council Of Canada | Techniques for the preparation of highly fluorinated polyethers |
DE10228770A1 (de) | 2002-06-27 | 2004-02-12 | Infineon Technologies Ag | Dielektrikum mit Sperrwirkung gegen Kupferdiffusion |
TW200505966A (en) * | 2003-04-02 | 2005-02-16 | Dow Global Technologies Inc | Organosilicate resin formulation for use in microelectronic devices |
US7488549B2 (en) * | 2003-05-03 | 2009-02-10 | Korea Chungang Educational Foundation | Proton conducting polymer, polymer membrane comprising the same, method of manufacturing the polymer membrane, and fuel cell using the polymer membrane |
US20040253442A1 (en) * | 2003-06-11 | 2004-12-16 | Ervin Mubarekyan | Method of forming a nanoporous film and compositions useful in such methods |
JP4501391B2 (ja) | 2003-09-30 | 2010-07-14 | 旭硝子株式会社 | 架橋性含フッ素芳香族プレポリマー及びその用途 |
US20050245693A1 (en) * | 2004-05-03 | 2005-11-03 | Bhatt Sanjiv M | Fluorinated aromatic polymers |
US20060239806A1 (en) * | 2005-03-14 | 2006-10-26 | Yelton James E | Mobile material placer and conveying system and method of placing and conveying material utilizing the same |
JP5549900B2 (ja) * | 2005-06-24 | 2014-07-16 | 旭硝子株式会社 | 架橋性含フッ素芳香族プレポリマー及びその用途 |
ATE518901T1 (de) * | 2006-06-02 | 2011-08-15 | Asahi Glass Co Ltd | Vernetzbares prepolymer, herstellungsverfahren dafür und verwendung davon |
US9006353B2 (en) * | 2011-11-18 | 2015-04-14 | Delsper LP | Crosslinking compounds for high glass transition temperature polymers |
SG11201503164QA (en) * | 2012-10-22 | 2015-06-29 | Delsper LP | Cross-Linked Organic Polymer Compositions and Methods for Controlling Cross-Linking Reaction Rate and of Modifying Same to Enhance Processability |
US9269623B2 (en) | 2012-10-25 | 2016-02-23 | Rohm And Haas Electronic Materials Llc | Ephemeral bonding |
US9273215B2 (en) | 2012-10-30 | 2016-03-01 | Rohm And Haas Electronic Materials Llc | Adhesion promoter |
CA2899324C (en) | 2013-01-28 | 2021-06-15 | Delsper LP | Anti-extrusion compositions for sealing and wear components |
US9109075B2 (en) * | 2013-03-15 | 2015-08-18 | Delsper LP | Cross-linked organic polymers for use as elastomers in high temperature applications |
US9153357B1 (en) | 2014-03-27 | 2015-10-06 | Rohm And Haas Electronic Materials Llc | Adhesion promoter |
WO2016137445A1 (en) | 2015-02-24 | 2016-09-01 | South Dakota Board Of Regents | Polycarbonates having superior dielectric properties suitable for energy dense capacitors |
KR102543985B1 (ko) * | 2015-10-27 | 2023-06-14 | 삼성전자주식회사 | 전도막 및 이를 포함하는 전자 소자 |
WO2019043140A1 (en) * | 2017-09-04 | 2019-03-07 | Solvay Specialty Polymers Italy S.P.A. | POLYARYLENE-ETHER FLUORÉ RETICULABLE |
TWI740485B (zh) * | 2020-05-04 | 2021-09-21 | 台灣中油股份有限公司 | 寡聚(2,6-二甲基苯醚)、其製備方法與固化物 |
KR20230163489A (ko) | 2021-03-30 | 2023-11-30 | 닛산 가가쿠 가부시키가이샤 | 접착제 조성물, 적층체, 적층체의 제조 방법, 및 가공된 기판의 제조 방법 |
JPWO2022210241A1 (de) | 2021-03-31 | 2022-10-06 | ||
WO2022210262A1 (ja) | 2021-03-31 | 2022-10-06 | 日産化学株式会社 | 積層体、剥離剤組成物及び加工された半導体基板の製造方法 |
EP4306609A1 (de) | 2021-03-31 | 2024-01-17 | Nissan Chemical Corporation | Laminat, trennmittelzusammensetzung und verfahren zur herstellung eines verarbeiteten halbleitersubstrats |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3332909A (en) * | 1965-07-15 | 1967-07-25 | Union Carbide Corp | Polyarylene polyethers |
CH482789A (de) * | 1967-03-16 | 1969-12-15 | Ciba Geigy | Verfahren zur Herstellung neuer Disazofarbstoffpigmente |
DE1793115A1 (de) * | 1968-08-03 | 1972-02-03 | Bayer Ag | Neue Triazenderivate |
US4272429A (en) * | 1979-05-01 | 1981-06-09 | E. I. Du Pont De Nemours And Company | Thermally stable, flame-retardant polymers and selected oligomers useful therein |
DE3479463D1 (en) * | 1983-03-29 | 1989-09-21 | Nec Corp | High density lsi package for logic circuits |
DE3570931D1 (en) * | 1984-08-10 | 1989-07-13 | Siemens Ag | Thermostable polymer system, cross-linkable by irradiation, for microelectronic use |
US4835197A (en) * | 1985-01-04 | 1989-05-30 | Raychem Corporation | Aromatic polymer compositions |
-
1990
- 1990-09-17 US US07/583,897 patent/US5155175A/en not_active Expired - Lifetime
- 1990-12-07 WO PCT/US1990/007213 patent/WO1991009081A1/en active IP Right Grant
- 1990-12-07 JP JP3501617A patent/JP3064011B2/ja not_active Expired - Fee Related
- 1990-12-07 AT AT91901188T patent/ATE134208T1/de not_active IP Right Cessation
- 1990-12-07 EP EP91901188A patent/EP0504265B1/de not_active Expired - Lifetime
- 1990-12-07 DE DE69025410T patent/DE69025410T2/de not_active Expired - Fee Related
- 1990-12-07 ES ES91901188T patent/ES2082963T3/es not_active Expired - Lifetime
- 1990-12-07 CA CA002070809A patent/CA2070809C/en not_active Expired - Fee Related
- 1990-12-07 DK DK91901188.2T patent/DK0504265T3/da active
-
1996
- 1996-04-24 GR GR960401126T patent/GR3019738T3/el unknown
Also Published As
Publication number | Publication date |
---|---|
EP0504265B1 (de) | 1996-02-14 |
DK0504265T3 (da) | 1996-03-11 |
JP3064011B2 (ja) | 2000-07-12 |
CA2070809C (en) | 2003-05-20 |
WO1991009081A1 (en) | 1991-06-27 |
JPH05502257A (ja) | 1993-04-22 |
GR3019738T3 (en) | 1996-07-31 |
DE69025410T2 (de) | 1996-07-04 |
CA2070809A1 (en) | 1991-06-09 |
EP0504265A1 (de) | 1992-09-23 |
US5155175A (en) | 1992-10-13 |
ATE134208T1 (de) | 1996-02-15 |
ES2082963T3 (es) | 1996-04-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |