DE69027171T2 - Elektrische Inspektionseinheit mit einer anisotropischen elektrisch leitenden Schicht und Verfahren zur Herstellung der anisotropischen elektrisch leitenden Schicht - Google Patents
Elektrische Inspektionseinheit mit einer anisotropischen elektrisch leitenden Schicht und Verfahren zur Herstellung der anisotropischen elektrisch leitenden SchichtInfo
- Publication number
- DE69027171T2 DE69027171T2 DE69027171T DE69027171T DE69027171T2 DE 69027171 T2 DE69027171 T2 DE 69027171T2 DE 69027171 T DE69027171 T DE 69027171T DE 69027171 T DE69027171 T DE 69027171T DE 69027171 T2 DE69027171 T2 DE 69027171T2
- Authority
- DE
- Germany
- Prior art keywords
- conductive layer
- electrically conductive
- anisotropic electrically
- producing
- inspection unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25221489 | 1989-09-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69027171D1 DE69027171D1 (de) | 1996-07-04 |
DE69027171T2 true DE69027171T2 (de) | 1996-10-10 |
Family
ID=17234096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69027171T Expired - Lifetime DE69027171T2 (de) | 1989-09-29 | 1990-09-28 | Elektrische Inspektionseinheit mit einer anisotropischen elektrisch leitenden Schicht und Verfahren zur Herstellung der anisotropischen elektrisch leitenden Schicht |
Country Status (5)
Country | Link |
---|---|
US (2) | US5132058A (de) |
EP (1) | EP0420690B1 (de) |
JP (3) | JP3087294B2 (de) |
KR (1) | KR910006733A (de) |
DE (1) | DE69027171T2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015212565A1 (de) * | 2015-07-06 | 2017-01-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung und Verfahren zur reversiblen Kontaktierung |
Families Citing this family (74)
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JP2720688B2 (ja) * | 1992-01-31 | 1998-03-04 | ジェイエスアール株式会社 | 回路基板の検査方法 |
US20050062492A1 (en) * | 2001-08-03 | 2005-03-24 | Beaman Brian Samuel | High density integrated circuit apparatus, test probe and methods of use thereof |
US5983363A (en) | 1992-11-20 | 1999-11-09 | Micron Communications, Inc. | In-sheet transceiver testing |
US6058497A (en) | 1992-11-20 | 2000-05-02 | Micron Technology, Inc. | Testing and burn-in of IC chips using radio frequency transmission |
JP2833402B2 (ja) * | 1993-03-02 | 1998-12-09 | ジェイエスアール株式会社 | 被検査電極板の検査方法 |
US5786701A (en) * | 1993-07-02 | 1998-07-28 | Mitel Semiconductor Limited | Bare die testing |
US5596282A (en) * | 1993-12-10 | 1997-01-21 | Texas Instruments Incorporated | Tester for integrated circuits |
KR0140034B1 (ko) * | 1993-12-16 | 1998-07-15 | 모리시다 요이치 | 반도체 웨이퍼 수납기, 반도체 웨이퍼의 검사용 집적회로 단자와 프로브 단자와의 접속방법 및 그 장치, 반도체 집적회로의 검사방법, 프로브카드 및 그 제조방법 |
JPH07174788A (ja) * | 1993-12-17 | 1995-07-14 | Nhk Spring Co Ltd | 導電性接触子 |
JP3442137B2 (ja) * | 1993-12-17 | 2003-09-02 | 日本発条株式会社 | 導電性接触子ユニット |
GB2289069B (en) * | 1994-03-31 | 1997-12-17 | Toppan Moore Kk | Microcapsule-containing oil-based coating liquid,ink,coated sheet,and method of prepring the same |
US6577148B1 (en) | 1994-08-31 | 2003-06-10 | Motorola, Inc. | Apparatus, method, and wafer used for testing integrated circuits formed on a product wafer |
US5543724A (en) * | 1994-10-03 | 1996-08-06 | Motorola, Inc. | Method and apparatus for locating conductive features and testing semiconductor devices |
JP2632136B2 (ja) * | 1994-10-17 | 1997-07-23 | 日本電子材料株式会社 | 高温測定用プローブカード |
KR100324059B1 (ko) * | 1994-11-15 | 2002-04-17 | 이고르 와이. 칸드로스 | 초소형 전자 부품용 상호 접속 요소 |
US5497103A (en) * | 1995-01-25 | 1996-03-05 | International Business Machines Corporation | Test apparatus for circuitized substrate |
US6327487B1 (en) | 1995-05-04 | 2001-12-04 | Robert A. Stratbucker | Bioelectric interface |
US5938597A (en) * | 1995-05-04 | 1999-08-17 | Stratbucker; Robert A. | Electrocardiograph bioelectric interface system and method of use |
US5678545A (en) * | 1995-05-04 | 1997-10-21 | Stratbucker; Robert A. | Anisotropic adhesive multiple electrode system, and method of use |
US5661042A (en) * | 1995-08-28 | 1997-08-26 | Motorola, Inc. | Process for electrically connecting electrical devices using a conductive anisotropic material |
US5764071A (en) * | 1996-01-05 | 1998-06-09 | International Business Machines Corporation | Method and system for testing an electronic module mounted on a printed circuit board |
US6181149B1 (en) * | 1996-09-26 | 2001-01-30 | Delaware Capital Formation, Inc. | Grid array package test contactor |
JPH10197591A (ja) * | 1997-01-09 | 1998-07-31 | Jsr Corp | 回路基板検査装置 |
US6064218A (en) * | 1997-03-11 | 2000-05-16 | Primeyield Systems, Inc. | Peripherally leaded package test contactor |
EP0910985A1 (de) | 1997-10-20 | 1999-04-28 | Robert Allen Stratbucker | Bioelektrische Schnittstelleneinrichtung für Elektrokardiogramm und Verfahren dessen Verwendung |
EP0922960A1 (de) * | 1997-12-12 | 1999-06-16 | Padar Tecnologie di Riccioni Roberto S.a.s. | Prüfgerät für Mikroschaltungen |
US6119255A (en) | 1998-01-21 | 2000-09-12 | Micron Technology, Inc. | Testing system for evaluating integrated circuits, a burn-in testing system, and a method for testing an integrated circuit |
US6174449B1 (en) | 1998-05-14 | 2001-01-16 | Micron Technology, Inc. | Magnetically patterned etch mask |
JP3730428B2 (ja) | 1998-12-22 | 2006-01-05 | 富士通株式会社 | 半導体装置試験用コンタクタの製造方法 |
JP2000206169A (ja) * | 1999-01-11 | 2000-07-28 | Hioki Ee Corp | 回路基板検査装置 |
JP2000258495A (ja) * | 1999-03-12 | 2000-09-22 | Oki Electric Ind Co Ltd | 半導体デバイス試験装置 |
JP3285568B2 (ja) * | 1999-05-24 | 2002-05-27 | 日本電産リード株式会社 | 基板の配線検査装置および配線検査方法 |
US6714121B1 (en) | 1999-08-09 | 2004-03-30 | Micron Technology, Inc. | RFID material tracking method and apparatus |
JP3427086B2 (ja) * | 2000-02-23 | 2003-07-14 | Necエレクトロニクス株式会社 | Icソケット |
US6462568B1 (en) * | 2000-08-31 | 2002-10-08 | Micron Technology, Inc. | Conductive polymer contact system and test method for semiconductor components |
EP1396050B1 (de) * | 2001-06-14 | 2010-09-29 | Paricon Technologies Corporation | Steckerkomponente mit vorbelasteten anisotropen leitfähigen elastomermaterialien |
JP4767450B2 (ja) * | 2001-08-09 | 2011-09-07 | ポリマテック株式会社 | コネクタおよびその製造方法 |
US7059874B2 (en) * | 2002-03-19 | 2006-06-13 | Paricon Technologies, Inc. | Anisotropic conductive elastomer based electrical interconnect with enhanced dynamic range |
DE10221100C1 (de) * | 2002-05-03 | 2003-06-05 | Neuhaus Elektronik Gmbh | Elektrisch leitfähige Dichtung sowie Verfahren und Vorrichtung zu deren Herstellung |
CN100359659C (zh) * | 2003-02-18 | 2008-01-02 | Jsr株式会社 | 各向异性导电连接器、探测部件和晶片检测设备以及晶片检测方法 |
US20050012514A1 (en) * | 2003-07-16 | 2005-01-20 | Sun Microsystems, Inc. | Test system including an apparatus for conveying signals between a first circuit board and a second circuit board |
US7202678B2 (en) * | 2003-12-18 | 2007-04-10 | Lecroy Corporation | Resistive probe tips |
JP3705288B2 (ja) * | 2004-02-24 | 2005-10-12 | Jsr株式会社 | 回路基板検査用アダプターおよび回路基板検査装置 |
US7282932B2 (en) * | 2004-03-02 | 2007-10-16 | Micron Technology, Inc. | Compliant contact pin assembly, card system and methods thereof |
CN100549708C (zh) * | 2004-07-15 | 2009-10-14 | Jsr株式会社 | 电路基板的检查装置以及电路基板的检查方法 |
JP2006194620A (ja) | 2005-01-11 | 2006-07-27 | Tokyo Electron Ltd | プローブカード及び検査用接触構造体 |
DE102005019920A1 (de) * | 2005-04-27 | 2006-11-16 | Leonhard Kurz Gmbh & Co. Kg | Verfahren zur Erzeugung einer partiell ausgeformten elektrisch leitfähigen Struktur |
JP4590314B2 (ja) * | 2005-06-22 | 2010-12-01 | 三菱電機株式会社 | ウェハキャリア |
JP2007005246A (ja) * | 2005-06-27 | 2007-01-11 | Sumitomo Electric Ind Ltd | 多孔質樹脂基材及び多層基板 |
TW200716994A (en) * | 2005-09-02 | 2007-05-01 | Jsr Corp | Circuit board inspecting apparatus and circuit board inspecting method |
JP2007071699A (ja) * | 2005-09-07 | 2007-03-22 | Rika Denshi Co Ltd | 垂直型プローブカード |
US7585174B2 (en) * | 2006-06-08 | 2009-09-08 | Lotes Co., Ltd. | Conductive component, electrical connector, and chip module |
JP5008005B2 (ja) | 2006-07-10 | 2012-08-22 | 東京エレクトロン株式会社 | プローブカード |
US9579483B2 (en) * | 2006-12-29 | 2017-02-28 | St. Jude Medical, Atrial Fibrillation Division, Inc. | Pressure-sensitive conductive composite contact sensor and method for contact sensing |
US8623265B2 (en) * | 2007-02-06 | 2014-01-07 | World Properties, Inc. | Conductive polymer foams, method of manufacture, and articles thereof |
US20090226696A1 (en) * | 2008-02-06 | 2009-09-10 | World Properties, Inc. | Conductive Polymer Foams, Method of Manufacture, And Uses Thereof |
GB2458067B (en) * | 2007-02-06 | 2011-10-05 | World Properties Inc | Conductive polymer foams, method of manufacture, and uses thereof |
US8356657B2 (en) * | 2007-12-19 | 2013-01-22 | Teledyne Scientific & Imaging, Llc | Heat pipe system |
US9011752B2 (en) * | 2008-03-03 | 2015-04-21 | Nokia Corporation | Electromagnetic wave transmission lines using magnetic nanoparticle composites |
CN102017115B (zh) * | 2008-04-25 | 2012-07-25 | 爱德万测试株式会社 | 测试系统及探针装置 |
JP5542313B2 (ja) * | 2008-06-18 | 2014-07-09 | 協立化学産業株式会社 | パターン形成方法 |
WO2011082058A1 (en) * | 2009-12-29 | 2011-07-07 | Rogers Corporation | Conductive polymer foams, method of manufacture, and uses thereof |
JP2011150838A (ja) * | 2010-01-20 | 2011-08-04 | Jsr Corp | 回路接続部材、導電性粒子および導電性粒子の製造方法 |
JP2012208038A (ja) * | 2011-03-30 | 2012-10-25 | Fujikura Rubber Ltd | 感圧抵抗部材および感圧センサ |
US9365749B2 (en) * | 2013-05-31 | 2016-06-14 | Sunray Scientific, Llc | Anisotropic conductive adhesive with reduced migration |
US9777197B2 (en) | 2013-10-23 | 2017-10-03 | Sunray Scientific, Llc | UV-curable anisotropic conductive adhesive |
DE102014204655A1 (de) | 2014-03-13 | 2015-09-17 | Robert Bosch Gmbh | Inspektionseinheit für eine elektrische Schaltung sowie Herstellungsverfahren derselben |
JP2018073577A (ja) | 2016-10-27 | 2018-05-10 | 株式会社エンプラス | 異方導電性シート及びその製造方法 |
KR20180049839A (ko) * | 2016-11-03 | 2018-05-14 | 솔브레인멤시스(주) | 이방 도전성 시트 |
JP6918518B2 (ja) * | 2017-02-27 | 2021-08-11 | デクセリアルズ株式会社 | 電気特性の検査冶具 |
JP2019060817A (ja) * | 2017-09-28 | 2019-04-18 | 日本特殊陶業株式会社 | 電子部品検査装置用配線基板 |
TWI651740B (zh) * | 2017-11-02 | 2019-02-21 | 弘鄴科技有限公司 | 應用於電子元件之線材導體成型方法 |
JP7405337B2 (ja) * | 2018-10-11 | 2023-12-26 | 積水ポリマテック株式会社 | 電気接続シート、及び端子付きガラス板構造 |
KR20230151389A (ko) * | 2022-04-25 | 2023-11-01 | 주식회사 아이에스시 | 도전성 입자의 제조방법, 도전성 입자 및 전기접속용 커넥터 |
Family Cites Families (17)
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US2584441A (en) * | 1946-05-03 | 1952-02-05 | Rca Corp | Viewing screen |
US4209481A (en) * | 1976-04-19 | 1980-06-24 | Toray Industries, Inc. | Process for producing an anisotropically electroconductive sheet |
US4292261A (en) * | 1976-06-30 | 1981-09-29 | Japan Synthetic Rubber Company Limited | Pressure sensitive conductor and method of manufacturing the same |
DE2703759A1 (de) * | 1977-01-29 | 1978-08-03 | Bosch Gmbh Robert | Kontaktkoerper zur verwendung in einem elektrischen stromkreis |
JPS5951112B2 (ja) * | 1979-02-08 | 1984-12-12 | 信越ポリマ−株式会社 | コネクタ−の製造方法 |
JPS5740874A (en) * | 1980-08-22 | 1982-03-06 | Shinetsu Polymer Co | Pressure contact holding type connector |
US4571542A (en) * | 1982-06-30 | 1986-02-18 | Japan Synthetic Rubber Co., Ltd. | Method and unit for inspecting printed wiring boards |
US4500757A (en) * | 1982-07-07 | 1985-02-19 | Engineering Research Applications, Inc. | Momentary digital encoding device for keyboards |
DK291184D0 (da) * | 1984-06-13 | 1984-06-13 | Boeegh Petersen Allan | Fremgangsmaade og indretning til test af kredsloebsplader |
JPS61250906A (ja) * | 1985-04-26 | 1986-11-08 | ジェイエスアール株式会社 | 導電性エラストマ−シ−ト |
US4737112A (en) * | 1986-09-05 | 1988-04-12 | American Telephone And Telegraph Company, At&T Bell Laboratories | Anisotropically conductive composite medium |
US4927368A (en) * | 1986-10-13 | 1990-05-22 | Sharp Kabushiki Kaisha | Connector |
US4863757A (en) * | 1987-02-06 | 1989-09-05 | Key-Tech, Inc. | Printed circuit board |
JP2528112B2 (ja) * | 1987-03-13 | 1996-08-28 | キヤノン株式会社 | 電気的接続部材及びそれを用いた電気回路部材 |
US4838347A (en) * | 1987-07-02 | 1989-06-13 | American Telephone And Telegraph Company At&T Bell Laboratories | Thermal conductor assembly |
US4778635A (en) * | 1987-09-18 | 1988-10-18 | American Telephone And Telegraph Company | Method and apparatus for fabricating anisotropically conductive material |
DE3838413A1 (de) * | 1988-11-12 | 1990-05-17 | Mania Gmbh | Adapter fuer elektronische pruefvorrichtungen fuer leiterplatten und dergl. |
-
1990
- 1990-09-25 JP JP02251777A patent/JP3087294B2/ja not_active Expired - Lifetime
- 1990-09-25 JP JP02251778A patent/JP3038859B2/ja not_active Expired - Lifetime
- 1990-09-27 US US07/588,944 patent/US5132058A/en not_active Expired - Lifetime
- 1990-09-28 EP EP90310679A patent/EP0420690B1/de not_active Expired - Lifetime
- 1990-09-28 KR KR1019900015511A patent/KR910006733A/ko not_active Application Discontinuation
- 1990-09-28 DE DE69027171T patent/DE69027171T2/de not_active Expired - Lifetime
-
1992
- 1992-02-11 US US07/833,729 patent/US5317255A/en not_active Expired - Lifetime
-
1999
- 1999-04-21 JP JP11352799A patent/JP3332006B2/ja not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015212565A1 (de) * | 2015-07-06 | 2017-01-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung und Verfahren zur reversiblen Kontaktierung |
Also Published As
Publication number | Publication date |
---|---|
EP0420690B1 (de) | 1996-05-29 |
JP3087294B2 (ja) | 2000-09-11 |
JPH03183974A (ja) | 1991-08-09 |
KR910006733A (ko) | 1991-04-29 |
JP3332006B2 (ja) | 2002-10-07 |
JPH11353948A (ja) | 1999-12-24 |
US5132058A (en) | 1992-07-21 |
DE69027171D1 (de) | 1996-07-04 |
US5317255A (en) | 1994-05-31 |
EP0420690A2 (de) | 1991-04-03 |
EP0420690A3 (en) | 1992-03-11 |
JP3038859B2 (ja) | 2000-05-08 |
JPH03196416A (ja) | 1991-08-27 |
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