DE69106909T2 - Elektronische Baugruppe auf mehreren Ebenen mit Kühlungsmitteln. - Google Patents
Elektronische Baugruppe auf mehreren Ebenen mit Kühlungsmitteln.Info
- Publication number
- DE69106909T2 DE69106909T2 DE69106909T DE69106909T DE69106909T2 DE 69106909 T2 DE69106909 T2 DE 69106909T2 DE 69106909 T DE69106909 T DE 69106909T DE 69106909 T DE69106909 T DE 69106909T DE 69106909 T2 DE69106909 T2 DE 69106909T2
- Authority
- DE
- Germany
- Prior art keywords
- coolants
- electronic assembly
- level electronic
- level
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/495,863 US5063475A (en) | 1990-03-19 | 1990-03-19 | Multileveled electronic assembly with cooling means |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69106909D1 DE69106909D1 (de) | 1995-03-09 |
DE69106909T2 true DE69106909T2 (de) | 1995-08-10 |
Family
ID=23970290
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69106909T Expired - Fee Related DE69106909T2 (de) | 1990-03-19 | 1991-02-20 | Elektronische Baugruppe auf mehreren Ebenen mit Kühlungsmitteln. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5063475A (de) |
EP (1) | EP0447819B1 (de) |
JP (1) | JPH088424B2 (de) |
DE (1) | DE69106909T2 (de) |
Families Citing this family (62)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5260850A (en) * | 1991-03-08 | 1993-11-09 | Cray Computer Corporation | Logic module assembly for confining and directing the flow of cooling fluid |
US5150279A (en) * | 1991-03-18 | 1992-09-22 | International Business Machines Corporation | High performance computer system with platters and unidirectional storage modules therebetween |
EP0506224A3 (en) * | 1991-03-26 | 1994-05-11 | Ibm | Computer system package |
WO1992019013A1 (en) * | 1991-04-16 | 1992-10-29 | Arthur Iversen | Power semiconductor packaging |
USRE35807E (en) * | 1991-04-16 | 1998-05-26 | Iversen Arthur H | Power semiconductor packaging |
US5278495A (en) * | 1991-11-08 | 1994-01-11 | Ncr Corporation | Memory and apparatus for a thermally accelerated reliability testing |
GB9301049D0 (en) * | 1993-01-20 | 1993-03-10 | The Technology Partnership Plc | Mounting assembly |
US5339214A (en) * | 1993-02-12 | 1994-08-16 | Intel Corporation | Multiple-fan microprocessor cooling through a finned heat pipe |
US5289694A (en) * | 1993-02-26 | 1994-03-01 | At&T Bell Laboratories | Circuit card mounting assembly |
US5471850A (en) * | 1993-07-09 | 1995-12-05 | Acurex Corporation | Refrigeration system and method for very large scale integrated circuits |
US5497288A (en) * | 1994-08-31 | 1996-03-05 | International Business Machines Corporation | Apparatus for tilted serial cooling in an electronic system |
FR2728116A1 (fr) * | 1994-12-12 | 1996-06-14 | Valeo Thermique Habitacle | Equipement regulateur de puissance pour moteur electrique et ventilateur centrifuge muni d'un tel equipement |
US5513070A (en) * | 1994-12-16 | 1996-04-30 | Intel Corporation | Dissipation of heat through keyboard using a heat pipe |
US5784255A (en) * | 1995-12-04 | 1998-07-21 | Integrated Device Technology, Inc. | Device and method for convective cooling of an electronic component |
US5909357A (en) * | 1997-04-24 | 1999-06-01 | Orr; Tom | Vertically stacked computer modules shaped to indicate compatibility with vertical cooling shaft extending throughout |
US5953930A (en) * | 1998-03-31 | 1999-09-21 | International Business Machines Corporation | Evaporator for use in an extended air cooling system for electronic components |
US6223810B1 (en) | 1998-03-31 | 2001-05-01 | International Business Machines | Extended air cooling with heat loop for dense or compact configurations of electronic components |
US6657121B2 (en) * | 2001-06-27 | 2003-12-02 | Thermal Corp. | Thermal management system and method for electronics system |
US6536510B2 (en) | 2001-07-10 | 2003-03-25 | Thermal Corp. | Thermal bus for cabinets housing high power electronics equipment |
US6388882B1 (en) | 2001-07-19 | 2002-05-14 | Thermal Corp. | Integrated thermal architecture for thermal management of high power electronics |
US6856037B2 (en) * | 2001-11-26 | 2005-02-15 | Sony Corporation | Method and apparatus for converting dissipated heat to work energy |
TW592029B (en) * | 2003-04-11 | 2004-06-11 | Delta Electronics Inc | Electronic apparatus with natural convection structure |
JP2005019562A (ja) * | 2003-06-24 | 2005-01-20 | Hitachi Ltd | 電子機器の冷却構造 |
WO2005031549A2 (de) * | 2003-09-29 | 2005-04-07 | Universität Zürich | Parallele datenverarbeitungseinrichtung |
TW200741470A (en) * | 2006-04-19 | 2007-11-01 | Tyan Computer Corp | Multi-processor system and tubelike computer architecture thereof |
DE102006018709B3 (de) * | 2006-04-20 | 2007-10-11 | Nft Nanofiltertechnik Gmbh | Wärmetauscher |
US7918799B2 (en) * | 2008-02-18 | 2011-04-05 | General Electric Company | Method and interface for cooling electronics that generate heat |
FR2929482B1 (fr) * | 2008-04-01 | 2013-07-05 | Thales Sa | Calculateur a l'agencement simplifie, destine a l'aeronautique |
US8773864B2 (en) * | 2008-06-18 | 2014-07-08 | Lockheed Martin Corporation | Enclosure assembly housing at least one electronic board assembly and systems using same |
US8189345B2 (en) * | 2008-06-18 | 2012-05-29 | Lockheed Martin Corporation | Electronics module, enclosure assembly housing same, and related systems and methods |
CN201229538Y (zh) * | 2008-07-04 | 2009-04-29 | 鸿富锦精密工业(深圳)有限公司 | 电脑机箱 |
US8659901B2 (en) * | 2010-02-04 | 2014-02-25 | P-Wave-Holdings, LLC | Active antenna array heatsink |
US8279597B2 (en) | 2010-05-27 | 2012-10-02 | International Business Machines Corporation | Heatsink allowing in-situ maintenance in a stackable module |
US8174826B2 (en) | 2010-05-27 | 2012-05-08 | International Business Machines Corporation | Liquid cooling system for stackable modules in energy-efficient computing systems |
US8179674B2 (en) * | 2010-05-28 | 2012-05-15 | International Business Machines Corporation | Scalable space-optimized and energy-efficient computing system |
US8358503B2 (en) | 2010-05-28 | 2013-01-22 | International Business Machines Corporation | Stackable module for energy-efficient computing systems |
US10209003B2 (en) | 2012-02-21 | 2019-02-19 | Thermal Corp. | Electronics cabinet and rack cooling system and method |
FR2989861A1 (fr) * | 2012-04-20 | 2013-10-25 | No Rack | Baie de serveurs informatiques |
US9521766B2 (en) * | 2012-06-27 | 2016-12-13 | CommScope Connectivity Belgium BVBA | High density telecommunications systems with cable management and heat dissipation features |
US8842432B2 (en) * | 2012-09-22 | 2014-09-23 | Facebook, Inc. | Arrangement of computing assets in a data center |
JP6070331B2 (ja) * | 2013-03-25 | 2017-02-01 | 日本電気株式会社 | ラック |
CN104125729A (zh) * | 2014-08-11 | 2014-10-29 | 国家电网公司 | 机房围式机柜 |
TWI539894B (zh) * | 2014-11-28 | 2016-06-21 | 財團法人工業技術研究院 | 功率模組 |
US9532488B2 (en) | 2015-03-09 | 2016-12-27 | Vapor IO Inc. | Rack for computing equipment |
US10833940B2 (en) | 2015-03-09 | 2020-11-10 | Vapor IO Inc. | Autonomous distributed workload and infrastructure scheduling |
US10404523B2 (en) | 2015-03-09 | 2019-09-03 | Vapor IO Inc. | Data center management with rack-controllers |
US10257268B2 (en) | 2015-03-09 | 2019-04-09 | Vapor IO Inc. | Distributed peer-to-peer data center management |
US10039211B2 (en) | 2015-03-09 | 2018-07-31 | Vapor IO Inc. | Rack for computing equipment |
TWM520229U (zh) * | 2015-07-16 | 2016-04-11 | 鋐寶科技股份有限公司 | 電子裝置 |
US10454772B2 (en) | 2015-10-30 | 2019-10-22 | Vapor IO Inc. | Compact uninteruptable power supply |
US9985842B2 (en) | 2015-10-30 | 2018-05-29 | Vapor IO Inc. | Bus bar power adapter for AC-input, hot-swap power supplies |
CN105592644A (zh) * | 2016-03-16 | 2016-05-18 | 厦门特欧普材料科技有限公司 | 一种户外安全柱形组合柜 |
AU2016397980A1 (en) * | 2016-03-16 | 2018-10-04 | Xiamen Toppla Material Technology Co., Ltd. | Safe cylindrical combined cabinet for outdoor use |
JP6644907B2 (ja) | 2016-11-12 | 2020-02-12 | 株式会社ExaScaler | 液浸冷却用電子機器、及び電源ユニット、並びに冷却システム |
FR3074011B1 (fr) * | 2017-11-21 | 2019-12-20 | Safran Electronics & Defense | Module electrique de puissance |
US10853460B2 (en) * | 2017-12-04 | 2020-12-01 | Vapor IO Inc. | Modular data center |
US10499524B2 (en) | 2017-12-20 | 2019-12-03 | Capital One Services, Llc | Apparatus for mounting a processor for cluster computing |
US10334760B1 (en) * | 2018-01-12 | 2019-06-25 | Jed A. Darland | System and method for helical cooling tower for efficient cooling |
US10746084B2 (en) * | 2018-12-13 | 2020-08-18 | General Electric Company | Liquid driven thermal module and thermal management system |
US11071221B2 (en) * | 2018-12-26 | 2021-07-20 | General Dynamics Mission Systems, Inc. | Multi-card subsystem for embedded computing systems |
TWI714037B (zh) * | 2019-03-26 | 2020-12-21 | 緯創資通股份有限公司 | 用於儲液槽體的氣流產生系統、具有其之浸沒式冷卻設備以及其操作方法 |
CN115015577B (zh) * | 2022-07-04 | 2023-03-24 | 武汉新烽光电股份有限公司 | 一种双光束激光多普勒测速仪 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3434014A (en) * | 1967-06-13 | 1969-03-18 | Rca Corp | Packaging of electrical equipment |
FR96241E (fr) * | 1967-07-28 | 1972-05-19 | Ibm | Assemblage de circuits. |
US4417295A (en) * | 1977-06-30 | 1983-11-22 | International Business Machines Corporation | Air jet powered cooling system for electronic assemblies |
US4335781A (en) * | 1978-10-02 | 1982-06-22 | Motorola Inc. | High power cooler and method thereof |
JPS5720458A (en) * | 1980-07-10 | 1982-02-02 | Nec Corp | Cooling system for package of electronic circuit |
DE3028340A1 (de) * | 1980-07-25 | 1982-02-25 | Fa. Dr. Willmar Schwabe, 7500 Karlsruhe | Amino-desoxy-1.4;3.6-dianhydro-hexit-nitrate |
JPS5796557A (en) * | 1980-12-08 | 1982-06-15 | Toshiba Corp | Cooling supporting base for semiconductor substrate |
US4590538A (en) * | 1982-11-18 | 1986-05-20 | Cray Research, Inc. | Immersion cooled high density electronic assembly |
US4502100A (en) * | 1982-11-24 | 1985-02-26 | International Business Machines Corporation | Cooling system with counter flow of coolant |
DE8420362U1 (de) * | 1984-07-06 | 1984-11-15 | Siemens AG, 1000 Berlin und 8000 München | Lüftungsanordnung mit einer Luftführungsvorrichtung |
US4633371A (en) * | 1984-09-17 | 1986-12-30 | Amdahl Corporation | Heat pipe heat exchanger for large scale integrated circuits |
US4674004A (en) * | 1986-07-03 | 1987-06-16 | Burroughs Corporation | Parallel-flow air system for cooling electronic equipment |
US4733293A (en) * | 1987-02-13 | 1988-03-22 | Unisys Corporation | Heat sink device assembly for encumbered IC package |
US4894749A (en) * | 1987-08-31 | 1990-01-16 | AT&T Information Systems Inc American Telephone and Telegraph Company | Option slot filler board |
-
1990
- 1990-03-19 US US07/495,863 patent/US5063475A/en not_active Expired - Lifetime
-
1991
- 1991-02-20 EP EP91102392A patent/EP0447819B1/de not_active Expired - Lifetime
- 1991-02-20 DE DE69106909T patent/DE69106909T2/de not_active Expired - Fee Related
- 1991-03-04 JP JP3061037A patent/JPH088424B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH04221898A (ja) | 1992-08-12 |
EP0447819A2 (de) | 1991-09-25 |
US5063475A (en) | 1991-11-05 |
EP0447819A3 (en) | 1991-12-11 |
DE69106909D1 (de) | 1995-03-09 |
EP0447819B1 (de) | 1995-01-25 |
JPH088424B2 (ja) | 1996-01-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |