DE69108908D1 - Vorrichtung zur behandlung einer einzelnen waferscheibe. - Google Patents
Vorrichtung zur behandlung einer einzelnen waferscheibe.Info
- Publication number
- DE69108908D1 DE69108908D1 DE69108908T DE69108908T DE69108908D1 DE 69108908 D1 DE69108908 D1 DE 69108908D1 DE 69108908 T DE69108908 T DE 69108908T DE 69108908 T DE69108908 T DE 69108908T DE 69108908 D1 DE69108908 D1 DE 69108908D1
- Authority
- DE
- Germany
- Prior art keywords
- wafer
- processing
- portable
- processing head
- movable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 235000012431 wafers Nutrition 0.000 abstract 6
- 230000000712 assembly Effects 0.000 abstract 1
- 238000000429 assembly Methods 0.000 abstract 1
- 230000000295 complement effect Effects 0.000 abstract 1
- 239000012530 fluid Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 238000012544 monitoring process Methods 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/526,243 US5168887A (en) | 1990-05-18 | 1990-05-18 | Single wafer processor apparatus |
| PCT/US1991/002817 WO1991018414A1 (en) | 1990-05-18 | 1991-04-24 | Single wafer processor apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69108908D1 true DE69108908D1 (de) | 1995-05-18 |
| DE69108908T2 DE69108908T2 (de) | 1995-11-16 |
Family
ID=24096519
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE0644580T Pending DE644580T1 (de) | 1990-05-18 | 1991-04-24 | Ein Halbleiterscheibenbearbeiter. |
| DE69108908T Expired - Fee Related DE69108908T2 (de) | 1990-05-18 | 1991-04-24 | Vorrichtung zur behandlung einer einzelnen waferscheibe. |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE0644580T Pending DE644580T1 (de) | 1990-05-18 | 1991-04-24 | Ein Halbleiterscheibenbearbeiter. |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5168887A (de) |
| EP (4) | EP0530230B1 (de) |
| JP (2) | JP3190331B2 (de) |
| AT (1) | ATE121220T1 (de) |
| AU (1) | AU7794891A (de) |
| DE (2) | DE644580T1 (de) |
| WO (1) | WO1991018414A1 (de) |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6375741B2 (en) | 1991-03-06 | 2002-04-23 | Timothy J. Reardon | Semiconductor processing spray coating apparatus |
| US5658387A (en) * | 1991-03-06 | 1997-08-19 | Semitool, Inc. | Semiconductor processing spray coating apparatus |
| US5222310A (en) * | 1990-05-18 | 1993-06-29 | Semitool, Inc. | Single wafer processor with a frame |
| JPH07245285A (ja) * | 1994-03-03 | 1995-09-19 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| US5664337A (en) * | 1996-03-26 | 1997-09-09 | Semitool, Inc. | Automated semiconductor processing systems |
| AT405225B (de) * | 1995-05-02 | 1999-06-25 | Sez Semiconduct Equip Zubehoer | Vorrichtung zum behandeln annähernd runder oder kreisscheibenförmiger gegenstände, insbesondere siliziumwafer |
| US5744417A (en) * | 1996-05-02 | 1998-04-28 | Lyondell Petrochemical Company | Supported catalyst |
| US5731678A (en) * | 1996-07-15 | 1998-03-24 | Semitool, Inc. | Processing head for semiconductor processing machines |
| US6001234A (en) * | 1997-09-30 | 1999-12-14 | Semitool, Inc. | Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot |
| US6599412B1 (en) * | 1997-09-30 | 2003-07-29 | Semitool, Inc. | In-situ cleaning processes for semiconductor electroplating electrodes |
| US6203582B1 (en) | 1996-07-15 | 2001-03-20 | Semitool, Inc. | Modular semiconductor workpiece processing tool |
| US7087143B1 (en) | 1996-07-15 | 2006-08-08 | Semitool, Inc. | Plating system for semiconductor materials |
| US6091498A (en) | 1996-07-15 | 2000-07-18 | Semitool, Inc. | Semiconductor processing apparatus having lift and tilt mechanism |
| US5980706A (en) * | 1996-07-15 | 1999-11-09 | Semitool, Inc. | Electrode semiconductor workpiece holder |
| US6672820B1 (en) | 1996-07-15 | 2004-01-06 | Semitool, Inc. | Semiconductor processing apparatus having linear conveyer system |
| US6805778B1 (en) * | 1996-07-15 | 2004-10-19 | Semitool, Inc. | Contact assembly for supplying power to workpieces during electrochemical processing |
| US6645355B2 (en) | 1996-07-15 | 2003-11-11 | Semitool, Inc. | Semiconductor processing apparatus having lift and tilt mechanism |
| US6358388B1 (en) * | 1996-07-15 | 2002-03-19 | Semitool, Inc. | Plating system workpiece support having workpiece-engaging electrodes with distal contact-part and dielectric cover |
| US6228231B1 (en) | 1997-05-29 | 2001-05-08 | International Business Machines Corporation | Electroplating workpiece fixture having liquid gap spacer |
| US6921468B2 (en) * | 1997-09-30 | 2005-07-26 | Semitool, Inc. | Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
| US6090711A (en) * | 1997-09-30 | 2000-07-18 | Semitool, Inc. | Methods for controlling semiconductor workpiece surface exposure to processing liquids |
| WO1999016936A1 (en) | 1997-09-30 | 1999-04-08 | Semitool, Inc. | Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
| US6261433B1 (en) | 1998-04-21 | 2001-07-17 | Applied Materials, Inc. | Electro-chemical deposition system and method of electroplating on substrates |
| US6416647B1 (en) * | 1998-04-21 | 2002-07-09 | Applied Materials, Inc. | Electro-chemical deposition cell for face-up processing of single semiconductor substrates |
| DE19825381B4 (de) * | 1998-05-28 | 2004-10-28 | Institut für Halbleiterphysik Frankfurt (Oder) GmbH | Verfahren zur Handhabung von Wafern großen Durchmessers während eines Temperprozesses |
| US6071388A (en) * | 1998-05-29 | 2000-06-06 | International Business Machines Corporation | Electroplating workpiece fixture having liquid gap spacer |
| US6494984B2 (en) | 1999-01-14 | 2002-12-17 | Semitool, Inc. | Flat media processing machine |
| US6190103B1 (en) * | 1999-03-31 | 2001-02-20 | Gasonics International Corporation | Wafer transfer device and method |
| US6557237B1 (en) * | 1999-04-08 | 2003-05-06 | Applied Materials, Inc. | Removable modular cell for electro-chemical plating and method |
| US7160421B2 (en) * | 1999-04-13 | 2007-01-09 | Semitool, Inc. | Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| TW499696B (en) * | 1999-04-27 | 2002-08-21 | Tokyo Electron Ltd | Processing apparatus and processing method |
| JP3367476B2 (ja) | 1999-07-07 | 2003-01-14 | 住友電気工業株式会社 | 路上送信装置 |
| US6796517B1 (en) | 2000-03-09 | 2004-09-28 | Advanced Micro Devices, Inc. | Apparatus for the application of developing solution to a semiconductor wafer |
| US20040178065A1 (en) * | 2001-03-16 | 2004-09-16 | Semitool, Inc. | Electrode semiconductor workpiece holder and processing methods |
| US6645344B2 (en) | 2001-05-18 | 2003-11-11 | Tokyo Electron Limited | Universal backplane assembly and methods |
| US7247223B2 (en) | 2002-05-29 | 2007-07-24 | Semitool, Inc. | Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces |
| US7114903B2 (en) | 2002-07-16 | 2006-10-03 | Semitool, Inc. | Apparatuses and method for transferring and/or pre-processing microelectronic workpieces |
| US20040118694A1 (en) * | 2002-12-19 | 2004-06-24 | Applied Materials, Inc. | Multi-chemistry electrochemical processing system |
| US20040255442A1 (en) * | 2003-06-19 | 2004-12-23 | Mcdiarmid James | Methods and apparatus for processing workpieces |
| JP4265306B2 (ja) * | 2003-06-27 | 2009-05-20 | 株式会社東京精密 | ウェーハ受渡し装置 |
| US20050077182A1 (en) * | 2003-10-10 | 2005-04-14 | Applied Materials, Inc. | Volume measurement apparatus and method |
| KR100829923B1 (ko) * | 2006-08-30 | 2008-05-16 | 세메스 주식회사 | 스핀헤드 및 이를 이용하는 기판처리방법 |
| FR2912210B1 (fr) | 2007-02-05 | 2013-01-11 | Frisquet Sa | Echangeur thermique pour chaudiere, chaudiere equipee d'un tel echangeur et procede de fabrication d'un tel echangeur |
| US8309045B2 (en) | 2011-02-11 | 2012-11-13 | General Electric Company | System and method for controlling emissions in a combustion system |
| US9421617B2 (en) | 2011-06-22 | 2016-08-23 | Tel Nexx, Inc. | Substrate holder |
| US8613474B2 (en) | 2011-07-06 | 2013-12-24 | Tel Nexx, Inc. | Substrate loader and unloader having a Bernoulli support |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4161356A (en) * | 1977-01-21 | 1979-07-17 | Burchard John S | Apparatus for in-situ processing of photoplates |
| JPS57166250A (en) * | 1981-04-03 | 1982-10-13 | Dainippon Screen Mfg Co Ltd | Conveyance positioning device of sheet material |
| US4339297A (en) * | 1981-04-14 | 1982-07-13 | Seiichiro Aigo | Apparatus for etching of oxide film on semiconductor wafer |
| US4429983A (en) * | 1982-03-22 | 1984-02-07 | International Business Machines Corporation | Developing apparatus for exposed photoresist coated wafers |
| JPS59124591A (ja) * | 1982-12-30 | 1984-07-18 | 大日本スクリ−ン製造株式会社 | 薄板物の移送装置 |
| JPS59201782A (ja) * | 1983-04-23 | 1984-11-15 | 大日本スクリ−ン製造株式会社 | ウエハ等の薄板物搬送装置 |
| US4439261A (en) * | 1983-08-26 | 1984-03-27 | International Business Machines Corporation | Composite pallet |
| US4519846A (en) * | 1984-03-08 | 1985-05-28 | Seiichiro Aigo | Process for washing and drying a semiconductor element |
| US4745422A (en) * | 1985-11-18 | 1988-05-17 | Kabushiki Kaisha Toshiba | Automatic developing apparatus |
| US4724317A (en) * | 1985-12-05 | 1988-02-09 | Baxter Travenol Laboratories, Inc. | Optical data collection apparatus and method used with moving members |
| US4651440A (en) * | 1986-05-16 | 1987-03-24 | Eastman Kodak Company | Spin drying apparatus |
| JPS6314434A (ja) * | 1986-07-04 | 1988-01-21 | Dainippon Screen Mfg Co Ltd | 基板表面処理方法および装置 |
| US4788994A (en) * | 1986-08-13 | 1988-12-06 | Dainippon Screen Mfg. Co. | Wafer holding mechanism |
| JPH0834205B2 (ja) * | 1986-11-21 | 1996-03-29 | 株式会社東芝 | ドライエツチング装置 |
| JPS63133545A (ja) * | 1986-11-25 | 1988-06-06 | Dainippon Screen Mfg Co Ltd | 熱処理装置の基板移載搬送装置 |
| US4817556A (en) * | 1987-05-04 | 1989-04-04 | Varian Associates, Inc. | Apparatus for retaining wafers |
| JPH0617295Y2 (ja) * | 1987-11-27 | 1994-05-02 | 大日本スクリーン製造株式会社 | 基板受け渡し装置 |
| JPH01304732A (ja) * | 1988-06-01 | 1989-12-08 | Nec Corp | 半導体ウェハの洗浄装置 |
| SU1734865A1 (ru) * | 1988-07-18 | 1992-05-23 | Московское научно-производственное объединение "Биофизприбор" | Устройство дл контрол центрифуги |
-
1990
- 1990-05-18 US US07/526,243 patent/US5168887A/en not_active Expired - Lifetime
-
1991
- 1991-04-24 JP JP50885991A patent/JP3190331B2/ja not_active Expired - Fee Related
- 1991-04-24 WO PCT/US1991/002817 patent/WO1991018414A1/en active IP Right Grant
- 1991-04-24 EP EP91909105A patent/EP0530230B1/de not_active Expired - Lifetime
- 1991-04-24 EP EP94115503A patent/EP0635872A2/de not_active Withdrawn
- 1991-04-24 DE DE0644580T patent/DE644580T1/de active Pending
- 1991-04-24 AT AT91909105T patent/ATE121220T1/de not_active IP Right Cessation
- 1991-04-24 AU AU77948/91A patent/AU7794891A/en not_active Abandoned
- 1991-04-24 EP EP00101989A patent/EP1028454A3/de not_active Withdrawn
- 1991-04-24 EP EP94115502A patent/EP0644580A3/de not_active Withdrawn
- 1991-04-24 DE DE69108908T patent/DE69108908T2/de not_active Expired - Fee Related
-
2001
- 2001-02-21 JP JP2001045043A patent/JP3545713B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP0530230B1 (de) | 1995-04-12 |
| US5168887A (en) | 1992-12-08 |
| EP1028454A2 (de) | 2000-08-16 |
| JP3190331B2 (ja) | 2001-07-23 |
| EP0644580A3 (de) | 1995-05-24 |
| EP0644580A2 (de) | 1995-03-22 |
| JP3545713B2 (ja) | 2004-07-21 |
| JPH05507179A (ja) | 1993-10-14 |
| DE69108908T2 (de) | 1995-11-16 |
| EP1028454A3 (de) | 2003-09-24 |
| EP0530230A1 (de) | 1993-03-10 |
| AU7794891A (en) | 1991-12-10 |
| ATE121220T1 (de) | 1995-04-15 |
| DE644580T1 (de) | 1995-11-09 |
| EP0635872A3 (de) | 1995-03-01 |
| WO1991018414A1 (en) | 1991-11-28 |
| EP0635872A2 (de) | 1995-01-25 |
| JP2001291692A (ja) | 2001-10-19 |
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