DE69112756D1 - Verfahren zur Untersuchung von Drahtverbindungen. - Google Patents
Verfahren zur Untersuchung von Drahtverbindungen.Info
- Publication number
- DE69112756D1 DE69112756D1 DE69112756T DE69112756T DE69112756D1 DE 69112756 D1 DE69112756 D1 DE 69112756D1 DE 69112756 T DE69112756 T DE 69112756T DE 69112756 T DE69112756 T DE 69112756T DE 69112756 D1 DE69112756 D1 DE 69112756D1
- Authority
- DE
- Germany
- Prior art keywords
- procedure
- wire connections
- examining
- examining wire
- connections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/304—Contactless testing of printed or hybrid circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/52—Testing for short-circuits, leakage current or ground faults
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/54—Testing for continuity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/58—Testing of lines, cables or conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2273771A JP2851151B2 (ja) | 1990-10-12 | 1990-10-12 | ワイヤボンディング検査装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69112756D1 true DE69112756D1 (de) | 1995-10-12 |
DE69112756T2 DE69112756T2 (de) | 1996-03-21 |
Family
ID=17532355
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69112756T Expired - Fee Related DE69112756T2 (de) | 1990-10-12 | 1991-10-11 | Verfahren zur Untersuchung von Drahtverbindungen. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5170062A (de) |
EP (1) | EP0480452B1 (de) |
JP (1) | JP2851151B2 (de) |
KR (1) | KR960001824B1 (de) |
DE (1) | DE69112756T2 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2913565B2 (ja) * | 1991-01-31 | 1999-06-28 | 株式会社新川 | ワイヤループ曲がり検査方法及びその装置 |
JP3105098B2 (ja) * | 1992-12-28 | 2000-10-30 | 株式会社東芝 | ボンディングワイヤのボンディング位置の検査装置 |
US5548326A (en) * | 1993-10-06 | 1996-08-20 | Cognex Corporation | Efficient image registration |
US5640199A (en) * | 1993-10-06 | 1997-06-17 | Cognex Corporation | Automated optical inspection apparatus |
US5532739A (en) * | 1993-10-06 | 1996-07-02 | Cognex Corporation | Automated optical inspection apparatus |
JP2541489B2 (ja) * | 1993-12-06 | 1996-10-09 | 日本電気株式会社 | ワイヤボンディング装置 |
US5519496A (en) * | 1994-01-07 | 1996-05-21 | Applied Intelligent Systems, Inc. | Illumination system and method for generating an image of an object |
US5642158A (en) * | 1994-05-02 | 1997-06-24 | Cognex Corporation | Method and apparatus to detect capillary indentations |
US5581632A (en) * | 1994-05-02 | 1996-12-03 | Cognex Corporation | Method and apparatus for ball bond inspection system |
US6061467A (en) * | 1994-05-02 | 2000-05-09 | Cognex Corporation | Automated optical inspection apparatus using nearest neighbor interpolation |
US5566877A (en) * | 1995-05-01 | 1996-10-22 | Motorola Inc. | Method for inspecting a semiconductor device |
US6035066A (en) * | 1995-06-02 | 2000-03-07 | Cognex Corporation | Boundary tracking method and apparatus to find leads |
JPH0982740A (ja) * | 1995-09-14 | 1997-03-28 | Tsukuba Seiko Kk | ボンディングワイヤ高さ測定装置 |
US6590670B1 (en) | 1997-03-13 | 2003-07-08 | Tsukuba Seiko Ltd. | Method and apparatus for measuring heights of test parts of object to be measured |
KR100317599B1 (ko) * | 2000-02-17 | 2001-12-24 | 서경석 | 와이어 본딩 위치 인식방법 |
JP4530984B2 (ja) | 2005-12-28 | 2010-08-25 | 株式会社新川 | ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法 |
JP6445943B2 (ja) * | 2015-08-24 | 2018-12-26 | 東芝メモリ株式会社 | 半導体装置の測定方法 |
CN109155069A (zh) * | 2016-03-09 | 2019-01-04 | 新加坡科技研究局 | 用于自动光学引线接合检验的自确定检验方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4389669A (en) * | 1981-02-27 | 1983-06-21 | Ilc Data Device Corporation | Opto-video inspection system |
JPS59171129A (ja) * | 1983-03-17 | 1984-09-27 | Fujitsu Ltd | 自動配線検査装置 |
EP0123229B1 (de) * | 1983-04-15 | 1988-11-09 | Hitachi, Ltd. | Verfahren und Einrichtung zur Detektion von Fehlern in gedruckten Schaltungsmustern |
JPS62195509A (ja) * | 1986-02-24 | 1987-08-28 | Mitsubishi Electric Corp | 電子部品形状検査装置 |
US4872052A (en) * | 1986-12-03 | 1989-10-03 | View Engineering, Inc. | Semiconductor device inspection system |
JPH06101686B2 (ja) * | 1986-12-26 | 1994-12-12 | 沖電気工業株式会社 | 多数決復号化装置 |
JPH0666370B2 (ja) * | 1987-04-14 | 1994-08-24 | 株式会社東芝 | 半導体デバイス用外観検査装置 |
JP2688361B2 (ja) * | 1988-08-02 | 1997-12-10 | 正己 山川 | 光電センサ |
US5113565A (en) * | 1990-07-06 | 1992-05-19 | International Business Machines Corp. | Apparatus and method for inspection and alignment of semiconductor chips and conductive lead frames |
-
1990
- 1990-10-12 JP JP2273771A patent/JP2851151B2/ja not_active Expired - Fee Related
-
1991
- 1991-10-11 US US07/774,886 patent/US5170062A/en not_active Expired - Lifetime
- 1991-10-11 KR KR1019910017856A patent/KR960001824B1/ko not_active IP Right Cessation
- 1991-10-11 DE DE69112756T patent/DE69112756T2/de not_active Expired - Fee Related
- 1991-10-11 EP EP91117371A patent/EP0480452B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR920008484A (ko) | 1992-05-28 |
KR960001824B1 (ko) | 1996-02-05 |
EP0480452A1 (de) | 1992-04-15 |
EP0480452B1 (de) | 1995-09-06 |
JP2851151B2 (ja) | 1999-01-27 |
DE69112756T2 (de) | 1996-03-21 |
US5170062A (en) | 1992-12-08 |
JPH04148544A (ja) | 1992-05-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) | ||
8339 | Ceased/non-payment of the annual fee |