DE69115996T2 - Bindung durch eine vorübergehende flüssige Phase aus Au-Sn in Hochleistungslaminaten - Google Patents
Bindung durch eine vorübergehende flüssige Phase aus Au-Sn in HochleistungslaminatenInfo
- Publication number
- DE69115996T2 DE69115996T2 DE69115996T DE69115996T DE69115996T2 DE 69115996 T2 DE69115996 T2 DE 69115996T2 DE 69115996 T DE69115996 T DE 69115996T DE 69115996 T DE69115996 T DE 69115996T DE 69115996 T2 DE69115996 T2 DE 69115996T2
- Authority
- DE
- Germany
- Prior art keywords
- binding
- liquid phase
- phase made
- temporary liquid
- performance laminates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3013—Au as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1056—Perforating lamina
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/536,145 US5280414A (en) | 1990-06-11 | 1990-06-11 | Au-Sn transient liquid bonding in high performance laminates |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69115996D1 DE69115996D1 (de) | 1996-02-15 |
DE69115996T2 true DE69115996T2 (de) | 1996-07-11 |
Family
ID=24137344
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69115996T Expired - Fee Related DE69115996T2 (de) | 1990-06-11 | 1991-04-30 | Bindung durch eine vorübergehende flüssige Phase aus Au-Sn in Hochleistungslaminaten |
Country Status (4)
Country | Link |
---|---|
US (2) | US5280414A (de) |
EP (1) | EP0461378B1 (de) |
JP (1) | JP2584147B2 (de) |
DE (1) | DE69115996T2 (de) |
Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5259110A (en) * | 1992-04-03 | 1993-11-09 | International Business Machines Corporation | Method for forming a multilayer microelectronic wiring module |
JPH0828583B2 (ja) * | 1992-12-23 | 1996-03-21 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 多層プリント回路基板およびその製作方法、およびボール・ディスペンサ |
US5306670A (en) * | 1993-02-09 | 1994-04-26 | Texas Instruments Incorporated | Multi-chip integrated circuit module and method for fabrication thereof |
DE69426090T2 (de) * | 1993-04-27 | 2001-03-01 | Nec Corp | Verfahren zur Herstellung einer optische Halbleitervorrichtung |
US5347710A (en) | 1993-07-27 | 1994-09-20 | International Business Machines Corporation | Parallel processor and method of fabrication |
US5432998A (en) * | 1993-07-27 | 1995-07-18 | International Business Machines, Corporation | Method of solder bonding processor package |
US5359767A (en) * | 1993-08-26 | 1994-11-01 | International Business Machines Corporation | Method of making multilayered circuit board |
US5446247A (en) * | 1993-11-19 | 1995-08-29 | Motorola, Inc. | Electrical contact and method for making an electrical contact |
AU1182295A (en) * | 1993-11-19 | 1995-06-06 | Cts Corporation | Metallurgically bonded polymer vias |
US5424492A (en) * | 1994-01-06 | 1995-06-13 | Dell Usa, L.P. | Optimal PCB routing methodology for high I/O density interconnect devices |
US5579207A (en) * | 1994-10-20 | 1996-11-26 | Hughes Electronics | Three-dimensional integrated circuit stacking |
WO1996015283A1 (en) * | 1994-11-15 | 1996-05-23 | Tosoh Smd, Inc. | Method of bonding targets to backing plate member |
US5522535A (en) * | 1994-11-15 | 1996-06-04 | Tosoh Smd, Inc. | Methods and structural combinations providing for backing plate reuse in sputter target/backing plate assemblies |
US5593082A (en) * | 1994-11-15 | 1997-01-14 | Tosoh Smd, Inc. | Methods of bonding targets to backing plate members using solder pastes and target/backing plate assemblies bonded thereby |
US5509200A (en) * | 1994-11-21 | 1996-04-23 | International Business Machines Corporation | Method of making laminar stackable circuit board structure |
US5587342A (en) * | 1995-04-03 | 1996-12-24 | Motorola, Inc. | Method of forming an electrical interconnect |
US5574630A (en) * | 1995-05-11 | 1996-11-12 | International Business Machines Corporation | Laminated electronic package including a power/ground assembly |
US5736679A (en) * | 1995-12-26 | 1998-04-07 | International Business Machines Corporation | Deformable interconnect structure for connecting an internal plane to a through-hole in a multilayer circuit board |
US5792375A (en) * | 1997-02-28 | 1998-08-11 | International Business Machines Corporation | Method for bonding copper-containing surfaces together |
US6036081A (en) * | 1997-12-24 | 2000-03-14 | Wyman Gordon | Fabrication of metallic articles using precursor sheets |
US6016005A (en) | 1998-02-09 | 2000-01-18 | Cellarosi; Mario J. | Multilayer, high density micro circuit module and method of manufacturing same |
DE69941764D1 (de) * | 1998-03-30 | 2010-01-21 | Yamatake Corp | Lotmaterial zum verbinden von chips |
US6342442B1 (en) * | 1998-11-20 | 2002-01-29 | Agere Systems Guardian Corp. | Kinetically controlled solder bonding |
US6555762B2 (en) * | 1999-07-01 | 2003-04-29 | International Business Machines Corporation | Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition |
US7059049B2 (en) * | 1999-07-02 | 2006-06-13 | International Business Machines Corporation | Electronic package with optimized lamination process |
KR100865424B1 (ko) * | 2000-03-10 | 2008-10-24 | 스태츠 칩팩, 엘티디. | 패키징 구조와 그 방법 |
ATE400392T1 (de) * | 2000-05-08 | 2008-07-15 | Univ Brigham Young | Drehendes rohrschweissen mittels eines superabrasiven werkzeuges |
JP2002289768A (ja) * | 2000-07-17 | 2002-10-04 | Rohm Co Ltd | 半導体装置およびその製法 |
FR2818870B1 (fr) * | 2000-12-21 | 2005-08-26 | Thomson Csf | Procede de realisation d'interconnexion dans un circuit imprime multicouches |
JP3473601B2 (ja) * | 2000-12-26 | 2003-12-08 | 株式会社デンソー | プリント基板およびその製造方法 |
US6800169B2 (en) * | 2001-01-08 | 2004-10-05 | Fujitsu Limited | Method for joining conductive structures and an electrical conductive article |
US6884313B2 (en) * | 2001-01-08 | 2005-04-26 | Fujitsu Limited | Method and system for joining and an ultra-high density interconnect |
US6486415B2 (en) * | 2001-01-16 | 2002-11-26 | International Business Machines Corporation | Compliant layer for encapsulated columns |
US6644983B2 (en) | 2001-02-09 | 2003-11-11 | International Business Machines Corporation | Contact assembly, connector assembly utilizing same, and electronic assembly |
US6634543B2 (en) | 2002-01-07 | 2003-10-21 | International Business Machines Corporation | Method of forming metallic z-interconnects for laminate chip packages and boards |
US6660548B2 (en) * | 2002-03-27 | 2003-12-09 | Intel Corporation | Packaging of multiple active optical devices |
US7168608B2 (en) | 2002-12-24 | 2007-01-30 | Avago Technologies General Ip (Singapore) Pte. Ltd. | System and method for hermetic seal formation |
US20050098613A1 (en) * | 2003-11-07 | 2005-05-12 | Barker William W. | Method for diffusion bond welding for use in a multilayer electronic assembly |
TWI229911B (en) * | 2003-12-16 | 2005-03-21 | Univ Nat Central | Method for controlling the bond microstructures |
US7498392B2 (en) * | 2005-01-19 | 2009-03-03 | Nelson Kevin G | Methods and compositions for dielectric materials |
JP2007234782A (ja) * | 2006-02-28 | 2007-09-13 | Toyota Industries Corp | 複合回路基板 |
WO2007119571A1 (ja) * | 2006-04-17 | 2007-10-25 | Dowa Electronics Materials Co., Ltd. | 半田層及びそれを用いたデバイス接合用基板並びに該デバイス接合用基板の製造方法 |
US20090306625A1 (en) * | 2007-03-09 | 2009-12-10 | Angiodynamics, Inc. | Treatment systems and methods for renal-related diseases |
US20090004500A1 (en) * | 2007-06-26 | 2009-01-01 | Daewoong Suh | Multilayer preform for fast transient liquid phase bonding |
GB2465825A (en) * | 2008-12-03 | 2010-06-09 | Thales Holdings Uk Plc | Integrated circuit package using diffusion bonding |
CH701507A1 (fr) * | 2009-07-31 | 2011-01-31 | Roth & Genta Haute Horlogerie | Procédé d'assemblage de pièces en alliage d'or. |
US9673163B2 (en) * | 2011-10-18 | 2017-06-06 | Rohm Co., Ltd. | Semiconductor device with flip chip structure and fabrication method of the semiconductor device |
FR2984073B1 (fr) * | 2011-12-13 | 2014-09-12 | Thales Sa | Procede de realisation de carte imprimee |
US9761506B2 (en) * | 2012-02-23 | 2017-09-12 | Rohm Co., Ltd. | Semiconductor device and fabrication method for the same |
CN102912175B (zh) * | 2012-08-23 | 2014-07-02 | 云南大学 | 一种金锡合金钎料箔材的制备方法 |
US9024205B2 (en) * | 2012-12-03 | 2015-05-05 | Invensas Corporation | Advanced device assembly structures and methods |
US20160339538A1 (en) * | 2015-05-18 | 2016-11-24 | Toyota Motor Engineering & Manufacturing North America, Inc. | High temperature bonding processes incorporating traces |
US11000915B2 (en) * | 2016-03-31 | 2021-05-11 | Texas Instruments Incorporated | Stabilized transient liquid phase metal bonding material for hermetic wafer level packaging of MEMS devices |
JP2020077772A (ja) * | 2018-11-08 | 2020-05-21 | 富士通株式会社 | 配線基板及び電子装置 |
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FR1052958A (fr) * | 1952-03-18 | 1954-01-29 | Csf | Procédé de brasure métal-métal, notamment pour la fermeture des tubes électroniques |
NL6516882A (de) * | 1965-01-06 | 1966-07-07 | ||
US3417461A (en) * | 1965-12-15 | 1968-12-24 | Northrop Corp | Thin-film diffusion brazing of titanium members utilizing copper intermediates |
GB1204052A (en) * | 1968-04-23 | 1970-09-03 | Engelhard Ind Ltd | Improvements in or relating to soft-solder coated wire, strip or tape |
US3648357A (en) * | 1969-07-31 | 1972-03-14 | Gen Dynamics Corp | Method for sealing microelectronic device packages |
US3660726A (en) * | 1970-10-12 | 1972-05-02 | Elfab Corp | Multi-layer printed circuit board and method of manufacture |
US3678570A (en) * | 1971-04-01 | 1972-07-25 | United Aircraft Corp | Diffusion bonding utilizing transient liquid phase |
DE2306236C2 (de) * | 1973-02-08 | 1982-11-25 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Herstellung von Schichtschaltungen mit leitenden Schichten auf beiden Seiten eines Keramiksubstrates |
GB1485051A (en) * | 1974-01-04 | 1977-09-08 | Fulmer Res Inst Ltd | Diffusion bonding of aluminium alloy parts |
JPS5357481A (en) * | 1976-11-04 | 1978-05-24 | Canon Inc | Connecting process |
US4077558A (en) * | 1976-12-06 | 1978-03-07 | International Business Machines Corporation | Diffusion bonding of crystals |
DE3316017A1 (de) * | 1983-05-03 | 1984-11-08 | Siegert GmbH, 8501 Cadolzburg | Verfahren zur herstellung elektrischer verbindungen an multisubstratschaltungen, sowie hiernach hergestellte multisubstratschaltungen |
JPS60166163A (ja) * | 1984-02-09 | 1985-08-29 | Nec Kansai Ltd | ロウ付け方法 |
US4727633A (en) * | 1985-08-08 | 1988-03-01 | Tektronix, Inc. | Method of securing metallic members together |
US4875617A (en) * | 1987-01-20 | 1989-10-24 | Citowsky Elya L | Gold-tin eutectic lead bonding method and structure |
US4788766A (en) * | 1987-05-20 | 1988-12-06 | Loral Corporation | Method of fabricating a multilayer circuit board assembly |
US4935584A (en) * | 1988-05-24 | 1990-06-19 | Tektronix, Inc. | Method of fabricating a printed circuit board and the PCB produced |
JPH0272642A (ja) * | 1988-09-07 | 1990-03-12 | Nec Corp | 基板の接続構造および接続方法 |
US5008997A (en) * | 1988-09-16 | 1991-04-23 | National Semiconductor | Gold/tin eutectic bonding for tape automated bonding process |
US5038996A (en) * | 1988-10-12 | 1991-08-13 | International Business Machines Corporation | Bonding of metallic surfaces |
US5031308A (en) * | 1988-12-29 | 1991-07-16 | Japan Radio Co., Ltd. | Method of manufacturing multilayered printed-wiring-board |
US5090609A (en) * | 1989-04-28 | 1992-02-25 | Hitachi, Ltd. | Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals |
US4965702A (en) * | 1989-06-19 | 1990-10-23 | E. I. Du Pont De Nemours And Company | Chip carrier package and method of manufacture |
JPH0793401B2 (ja) * | 1989-08-01 | 1995-10-09 | 住友特殊金属株式会社 | 電子回路基板のリード片接合方法及び電子回路基板 |
-
1990
- 1990-06-11 US US07/536,145 patent/US5280414A/en not_active Expired - Lifetime
-
1991
- 1991-04-16 JP JP3135408A patent/JP2584147B2/ja not_active Expired - Lifetime
- 1991-04-30 EP EP91106995A patent/EP0461378B1/de not_active Expired - Lifetime
- 1991-04-30 DE DE69115996T patent/DE69115996T2/de not_active Expired - Fee Related
-
1993
- 1993-10-12 US US08/134,994 patent/US5421507A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH05190245A (ja) | 1993-07-30 |
US5280414A (en) | 1994-01-18 |
EP0461378B1 (de) | 1996-01-03 |
EP0461378A3 (en) | 1992-10-21 |
JP2584147B2 (ja) | 1997-02-19 |
EP0461378A2 (de) | 1991-12-18 |
US5421507A (en) | 1995-06-06 |
DE69115996D1 (de) | 1996-02-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |